CN110845772A - Mold moistening adhesive tape without sodium ions and manufacturing process of mold moistening adhesive tape - Google Patents
Mold moistening adhesive tape without sodium ions and manufacturing process of mold moistening adhesive tape Download PDFInfo
- Publication number
- CN110845772A CN110845772A CN201911155205.6A CN201911155205A CN110845772A CN 110845772 A CN110845772 A CN 110845772A CN 201911155205 A CN201911155205 A CN 201911155205A CN 110845772 A CN110845772 A CN 110845772A
- Authority
- CN
- China
- Prior art keywords
- mold
- rubber
- minutes
- adhesive tape
- moistening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001415 sodium ion Inorganic materials 0.000 title claims abstract description 36
- 239000002390 adhesive tape Substances 0.000 title claims description 45
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229920001971 elastomer Polymers 0.000 claims abstract description 75
- 239000005060 rubber Substances 0.000 claims abstract description 75
- 239000004033 plastic Substances 0.000 claims abstract description 53
- 229920003023 plastic Polymers 0.000 claims abstract description 53
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 27
- 239000002131 composite material Substances 0.000 claims abstract description 25
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 24
- 239000001993 wax Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000000314 lubricant Substances 0.000 claims abstract description 20
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000011593 sulfur Substances 0.000 claims abstract description 19
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 19
- 239000000945 filler Substances 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims abstract description 18
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 230000001050 lubricating effect Effects 0.000 claims description 25
- 238000006243 chemical reaction Methods 0.000 claims description 22
- 239000011259 mixed solution Substances 0.000 claims description 21
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 18
- 238000012858 packaging process Methods 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000012188 paraffin wax Substances 0.000 claims description 8
- 244000043261 Hevea brasiliensis Species 0.000 claims description 6
- 229920000459 Nitrile rubber Polymers 0.000 claims description 6
- 239000005062 Polybutadiene Substances 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 229920003052 natural elastomer Polymers 0.000 claims description 6
- 229920001194 natural rubber Polymers 0.000 claims description 6
- 229920002857 polybutadiene Polymers 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 5
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims description 5
- 238000001125 extrusion Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 3
- BTJLAYMZRRMMKQ-UHFFFAOYSA-N C(CCCCC(=O)O)(=O)O.C(CCCCCCC)OCCCCCCCC Chemical compound C(CCCCC(=O)O)(=O)O.C(CCCCCCC)OCCCCCCCC BTJLAYMZRRMMKQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- NWGKJDSIEKMTRX-AAZCQSIUSA-N Sorbitan monooleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O NWGKJDSIEKMTRX-AAZCQSIUSA-N 0.000 claims description 3
- 235000021355 Stearic acid Nutrition 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 230000003712 anti-aging effect Effects 0.000 claims description 3
- 238000005187 foaming Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229940113115 polyethylene glycol 200 Drugs 0.000 claims description 3
- 235000010482 polyoxyethylene sorbitan monooleate Nutrition 0.000 claims description 3
- 229920000053 polysorbate 80 Polymers 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- 239000008117 stearic acid Substances 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 19
- 150000001875 compounds Chemical class 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 10
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract description 8
- 239000011734 sodium Substances 0.000 abstract description 8
- 229910052708 sodium Inorganic materials 0.000 abstract description 8
- 238000012545 processing Methods 0.000 abstract description 5
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005461 lubrication Methods 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 description 22
- 238000004140 cleaning Methods 0.000 description 21
- 238000002955 isolation Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 229920000877 Melamine resin Polymers 0.000 description 5
- 230000009471 action Effects 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 5
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 239000012459 cleaning agent Substances 0.000 description 3
- 238000004134 energy conservation Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 229920006336 epoxy molding compound Polymers 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000019832 sodium triphosphate Nutrition 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012384 transportation and delivery Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L7/00—Compositions of natural rubber
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/02—Copolymers with acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/06—Copolymers with styrene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to a mold moistening rubber strip without sodium ions, which comprises a base material, a filler, a lubricant and a curing agent. Because the filler is silicon dioxide, the mass proportion of the components of the silicon dioxide is 15 to 45 percent; the lubricant is wax; the wax content is 1 to 2 percent; the proportion of the composite rubber component is 35 to 45 percent, and the mass proportion of the sulfur component is 0.5 to 1.5 percent. The mold moistening rubber strip is made of composite rubber, wax, silicon dioxide and sulfur, so that any component substance in the formed mold moistening rubber strip does not contain sodium ions or sodium molecular substances or compounds, the problem that the sodium ions or sodium molecular substances or compounds exist in the mold moistening rubber strip is solved fundamentally, the phenomenon that the surface quality is reduced after demolding due to the fact that the sodium ion substances corrode the surface of a plastic package mold is avoided, and the effect that the phenomenon that the surface of an electronic component or the surface of an IC chip is short-circuited due to the fact that sodium ions remain on the surface of the electronic component or the surface of the IC chip after lubrication in the plastic package process is avoided. The invention also has the functions of simple operation and convenient processing.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of semiconductor packaging processes, in particular to a mold moistening adhesive tape without sodium ions and a manufacturing process of the mold moistening adhesive tape, wherein the mold moistening adhesive tape is used for demolding a mold in a plastic packaging process of a packaging process.
[ background of the invention ]
With the wide application and popularization of microprocessors and PCs in the fields of communications, industrial control, consumer electronics, and the like, the IC industry has begun to enter a stage of customer-oriented, and it is difficult for an IC with standardized functions to meet the requirements of a complete machine customer on system cost, reliability, and the like, and meanwhile, the complete machine customer requires an increasing level of IC integration, thereby improving security, reducing chip area, reducing system volume, reducing cost, improving product performance, and enhancing product market competitiveness. Semiconductor packaging processes are important processing steps in the fabrication of IC products or microprocessors. The semiconductor packaging process comprises the following steps: the production process comprises the steps of scribing, loading, bonding, plastic packaging, deburring, electroplating, printing, rib cutting and forming, appearance inspection, finished product testing and packaging and delivery. In the plastic packaging process, whether the plastic packaging mold can process the surface quality of a high-precision product or not plays a key role in the quality of the lubricating effect of the plastic packaging mold. However, in the plastic packaging process in the prior art, in order to achieve a good lubricating effect when the plastic packaging mold is demolded in the plastic packaging process, the melamine mold cake is generally used for lubricating the plastic packaging mold. Although the melamine die cake can achieve the effect of lubricating the surface of the plastic package mold, the melamine die cake can be used under the condition of heating or preheating under the cooperation of the copper frame, and multiple times of lubricating actions are needed, so that the melamine die cake brings inconvenience and time consumption to an operator when lubricating the plastic package mold, and the material cost is high. A tasteless mold moistening material for a semiconductor packaging mold is provided, and although the mold moistening material can conveniently lubricate and care the surface of a plastic packaging mold during cleaning, the mold moistening material is convenient to use, has the technical advantages of low cost and the like, the mold moistening material or the filling material contains salt substances such as sodium hydroxide, sodium carbonate, sodium tripolyphosphate and the like, and the salt substances carry a large amount of sodium ions, so that after the mold moistening material lubricates the plastic packaging mold, a large amount of sodium ions are remained on the surface of the plastic packaging mold or the surface of an IC chip or an electronic component, and are accumulated in the sun and the moon, and a layer of sodium ion substances are easily remained on the surface of the plastic packaging mold. Because the sodium ion substance has strong corrosive performance, the short circuit phenomenon is easy to occur on the surface of the electronic component or the surface of the IC chip after the electronic component or the IC chip is lubricated in the plastic packaging process. And the surface quality after demoulding is reduced due to the fact that sodium ion substances corrode the surface of the plastic package mould.
[ summary of the invention ]
In view of the above, the technical purpose of the present invention is to provide a mold moistening adhesive tape without sodium ions and corrosiveness for solving the problems in the prior art, where the mold moistening adhesive tape not only can avoid the phenomenon of surface quality reduction after demolding due to corrosion of the surface of the plastic package mold by sodium ions, but also can avoid the effect of short circuit phenomenon easily occurring on the surface of an electronic component or the surface of an IC chip after lubrication in the process of the plastic package process.
The invention also aims to provide a manufacturing process of the mold moistening rubber strip, which is simple to operate and convenient to process.
Therefore, the technical scheme of the invention provides a mold moistening adhesive tape without sodium ions, which is used for demolding a mold in a plastic packaging process in a semiconductor packaging process and comprises a base material, a curing agent and an additive; the base material is composed of composite rubber, the composite rubber comprises unvulcanized natural rubber, butadiene acrylonitrile rubber, butadiene rubber, high benzene rubber and styrene butadiene rubber, and the curing agent is sulfur; the lubricant also comprises a lubricant and a filler, wherein the filler is silicon dioxide, and the component proportion of the silicon dioxide is 15-45%; the lubricant is wax; the mass proportion of the wax is 1 to 2 percent; the proportion of the composite rubber component is 35-45%, and the proportion of the sulfur component is 0.5-1.5%.
A manufacturing process of a mould moistening adhesive tape without sodium ions comprises the following process steps: firstly, adding 20 kg of natural rubber, 20 kg of butadiene-acrylonitrile rubber, 20 kg of butadiene rubber, 20 kg of high benzene rubber and 20 kg of styrene butadiene rubber into an internal mixer, starting a stirrer, and fully stirring for 20 minutes to fully perform chemical reaction to form an intermediate A;
then, 0.1 kg of butyl glycidyl ether is added into a reaction kettle, 0.1 kg of Tween 80, 0.1 kg of span-80 and 0.1 kg of low-foaming surfactant CF-32 are slowly added, and the mixture is fully stirred for 20 minutes to prepare an intermediate B;
then, 0.1 kg of anti-aging agent, 0.1 kg of zinc oxide, 0.1 kg of stearic acid, 0.5 kg of paraffin and 3 kg of titanium dioxide are added into a reaction kettle and stirred for 30 minutes to prepare an intermediate C;
adding 1 kg of ethylene glycol, 1 kg of polyethylene glycol 200, 1 kg of triethanolamine and 5 kg of dioctyl ether adipate into a reaction kettle, and starting stirring to react for 10 minutes to prepare an intermediate D;
then, adding 50 kg of silicon dioxide, 2 kg of KH550, 0.5 kg of sulfur and 3 kg of polyethylene wax into the reaction kettle, and starting stirring for 15 minutes to react to prepare an intermediate E;
then, respectively adding the prepared intermediate A and the intermediate C into a first internal mixer, starting a stirrer, fully stirring at 120 ℃ for 5 minutes, and generating a first mixed solution; then, adding the prepared intermediate B and the prepared intermediate D into a reaction kettle respectively, so that a chemical reaction is fully generated, wherein the reaction time is 5 minutes, and a second mixed solution is generated; then, the first mixed solution and the second mixed solution are respectively added into a second internal mixer, the temperature is 120 ℃ and the time is 5 minutes, then the intermediate E is added into the second internal mixer, the temperature is 60 ℃ and the time is 5 minutes, so that the third mixed solution is fully mixed and stirred to form a third mixed solution, then the third mixed solution is poured into an open mill to form a solid lubricating rubber strip liquid, the three-angle wrapping process is respectively carried out for 3 times, then extrusion is carried out through a calender, a solid lubricating rubber strip plate body is extruded, and finally the strip lubricating rubber strip body is cut into strips through a slitter.
The invention has the beneficial technical effects that: the components of the mould moistening colloid also comprise a lubricant and a filler, wherein the filler is silicon dioxide, and the component proportion of the silicon dioxide is 15-45%; the lubricant is wax; the wax content ratio is 1% to 2%; the proportion of the composite rubber component is 35-45%, and the proportion of the sulfur component is 0.5-1.5%. The mold moistening rubber strip is made of composite rubber, wax, silicon dioxide and sulfur, so that any component substance in the formed mold moistening rubber strip does not contain sodium ions or sodium molecular substances or compounds, the problem that the sodium ions or the sodium molecular substances or compounds exist in the mold moistening rubber strip is solved fundamentally, sodium ions are prevented from being left on the surface of a plastic package mold after mold moistening, the surface of an electronic component and the surface of an IC chip respectively, and therefore the phenomenon that the surface quality is reduced after demolding due to the fact that the sodium ions corrode the surface of the plastic package mold is avoided, and the effect that the phenomenon of short circuit is easily caused due to the fact that the sodium ions remain on the surface of the electronic component or the surface of the IC chip after lubrication in the process of a plastic package working procedure is avoided. Meanwhile, the mold moistening adhesive tape also has the functions of energy conservation and environmental protection. Compared with the similar mold moistening adhesive tape manufacturing process in the prior art, the method has the advantages of simple operation and convenient processing.
For a further understanding of the objects, structural features and functions of the present invention, reference will now be made in detail to the embodiments illustrated in the accompanying drawings and described below:
[ detailed description ] embodiments
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention clearer and more obvious, the present invention is further described in detail below with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following description will explain a mold-wetting adhesive tape without sodium ions, which is mainly used for mold stripping in a plastic packaging process in a semiconductor packaging process, and comprises a base material, a curing agent, an additive, a filler, and a lubricant.
The base material is composed of composite rubber. The composite rubber comprises unvulcanized natural rubber, nitrile rubber, butadiene rubber, high benzene rubber and styrene butadiene rubber, and the curing agent is sulfur. The proportion of the composite rubber component is 35-45%, and the proportion of the sulfur component is 0.5-1.5%.
The filler is silicon dioxide, and the component proportion of the silicon dioxide is 15 to 45 percent; the lubricant is wax; the wax content is 1% to 2%.
A manufacturing process of a mould moistening adhesive tape without sodium ions comprises the following process steps: firstly, 20 kg of natural rubber, 20 kg of butadiene-acrylonitrile rubber, 20 kg of butadiene rubber, 20 kg of high benzene rubber and 20 kg of styrene butadiene rubber are added into an internal mixer, a stirrer is started, and the mixture is fully stirred for 20 minutes, so that the chemical reaction is fully performed to form the intermediate A.
Then, 0.1 kg of butyl glycidyl ether was added to the reaction vessel, and 0.1 kg of Tween 80, 0.1 kg of span-80 and 0.1 kg of low-foaming surfactant CF-32 were slowly added thereto, followed by stirring for 20 minutes, thereby obtaining an intermediate B.
Then, 0.1 kg of anti-aging agent, 0.1 kg of zinc oxide, 0.1 kg of stearic acid, 0.5 kg of paraffin and 3 kg of titanium dioxide are added into a reaction kettle and stirred for 30 minutes to prepare an intermediate C.
Then, 1 kg of ethylene glycol, 1 kg of polyethylene glycol 200, 1 kg of triethanolamine and 5 kg of dioctyl ether adipate were added to the reaction vessel, and a reaction was started with stirring for 10 minutes to prepare an intermediate D.
Subsequently, 50 kg of silica, 2 kg of KH550, 0.5 kg of sulfur and 3 kg of polyethylene wax were put into a reaction vessel, and stirred for 15 minutes to prepare an intermediate E.
Then, respectively adding the prepared intermediate A and the intermediate C into a first internal mixer, starting a stirrer, fully stirring at 120 ℃ for 5 minutes, and generating a first mixed solution; then, adding the prepared intermediate B and the prepared intermediate D into a reaction kettle respectively, so that a chemical reaction is fully generated, wherein the reaction time is 5 minutes, and a second mixed solution is generated; then, the first mixed solution and the second mixed solution are respectively added into a second internal mixer, the temperature is 120 ℃ and the time is 5 minutes, then the intermediate E is added into the second internal mixer, the temperature is 60 ℃ and the time is 5 minutes, so that the third mixed solution is fully mixed and stirred to form a third mixed solution, then the third mixed solution is poured into an open mill to form a solid lubricating rubber strip liquid, the three-angle wrapping process is respectively carried out for 3 times, then extrusion is carried out through a calender, a solid lubricating rubber strip plate body is extruded, and finally the strip lubricating rubber strip body is cut into strips through a slitter.
The components of the mold moistening colloid do not contain sodium ions and have no corrosive performance. When the surface of the packaging mold is maintained under the high-temperature action of the plastic package mold, the compounded rubber starts to be vulcanized, so that the packaging mold and the surface of the compounded rubber are integrated, and the compounded rubber covers the whole surface of the plastic package mold. The silica and KH550 in the filler are mainly used for enhancing the vulcanization coverage strength of the composite rubber, and meanwhile, when the composite rubber is extruded in the mold moistening process, the lubricating and demolding effects on the surface of the plastic package mold are enhanced. The curing agent is composed of sulfur, and the compound rubber starts to be vulcanized under the action of temperature and pressure in the mold moistening process, so that the packaging mold and the rubber are integrated. The composite rubber is mainly used for lubricating a carrier, the wax is mainly used for forming a lubricating protection function on the surface of a mould, the silica is mainly used for increasing the lubricating strength, and the sulfur is mainly used for curing the rubber.
The mold-moistening adhesive tape is a mold release agent taking rubber as a base material, and is used for lubricating and maintaining the surface of a mold cavity after mold cleaning of a plastic package mold is completed, recovering the automatic demolding capacity of the mold cavity and preventing the mold from being stuck in the packaging operation. The lubricating agent that moist mould adhesive tape contained, wax can form the one deck isolation layer on the die cavity surface in this lubricating agent, and this isolation layer can let the plastic envelope mould smoothly not have the adhesive film problem when drawing of patterns in the plastic envelope process, realizes playing lubricated guard action to the die cavity.
In the implementation, the mold-moistening colloid comprises a base material, a curing agent, an additive, a filler and a lubricant. The base material is composite rubber, the curing agent is sulfur, the filler is silicon dioxide, and the lubricant is wax. And (3) compounding rubber in the mold moistening colloid, vulcanizing the compounded rubber under the action of the temperature and the pressure of the mold cleaning process, so that the dirt in the plastic package mold and the vulcanized compounded rubber are integrated into a dirt solution, and removing the dirt solution when the mold is released. The mold cleaning adhesive tape contains silica filler, the silica can enhance the strength and tear resistance of the composite rubber, and simultaneously plays a role in grinding the dirt solution in the extrusion and diffusion processes in the mold cleaning process. In the mould cleaning adhesive tape, an additive which is composed of an ammonia composition and has a specific dirt-philic functional group is used as a cleaning agent, so that the composite rubber and the dirt can be firmly combined together, and a better mould cleaning effect is achieved. The composite rubber is suitable for cleaning a semiconductor packaging mold and removing stains formed in a cavity in the epoxy molding compound resin packaging process.
The mold moistening adhesive tape is a compound rubber containing paraffin in a mold cleaning process of a plastic packaging procedure, and is used for lubricating and protecting the surface of a mold after the mold cleaning of the mold moistening adhesive tape. The main function is to lubricate and protect the mold cavity. And after the mold is cleaned by the mold cleaning adhesive tape, the surface of the mold is clean but no protective layer is formed. If the packaging operation is directly performed, the mold cavity is easy to stick plastic packaging materials due to lack of a lubricating protective layer. In the packaging process, the surface of the mold begins to slowly accumulate to form plastic packaging material oxidized substances, so that the working period is short, and mold cleaning or mold replacement is required to be carried out again in a short time. After the mold moistening adhesive tape is used, the mold moistening effect is achieved on the surface of the plastic package mold, a protective layer is formed on the surface of wax contained in the mold moistening adhesive tape, the contact between the surface of the plastic package mold and a plastic package material is isolated to a certain extent, and the plastic package material is convenient to package and demold, so that the packaging aging and the working efficiency are prolonged, and the mold is protected. Under the action of temperature and pressure, rubber begins to be vulcanized, so that dirty rubber is fully filled on the surface of the die cavity. The main component of the contained lubricant is paraffin, and the paraffin can form an isolation protective layer on the surface of the die cavity, so that the die cavity is lubricated and protected, and the plastic package die can be smoothly packaged and demoulded without adhesive film. The curing agent contained in the adhesive tape can harden the adhesive tape and change the adhesive tape into toughness, thereby being beneficial to demoulding.
The difference between the mold moistening adhesive tape and the mold cleaning adhesive tape in the prior art is that the mold cleaning adhesive tape contains a cleaning agent adsorbent, and the mold moistening adhesive tape does not contain the cleaning agent adsorbent. The die cleaning adhesive tape does not contain a lubricant, and the die moistening adhesive tape contains a lubricant. The main component of the lubricant is paraffin, and the paraffin can form an isolation protective layer on the surface of a die cavity of the plastic package die. The isolation protection layer plays a role in lubricating and protecting the surface of the die cavity, and can ensure that the plastic package die is smooth and free of adhesive film during packaging and demoulding. When the mould cleaning adhesive tape is used, the existing mould cleaning adhesive tape and the mould moistening adhesive tape are matched for use, and the mould moistening adhesive tape is used after the mould cleaning adhesive tape is used. The mold cleaning rubber strip is mainly made of composite rubber with a cleaning function, and mainly removes stains formed in a cavity in the epoxy molding compound resin packaging process, so that the cavity is cleaned. And after the die cleaning adhesive tape cleans the die, lubricating the surface of the plastic package die by using the die lubricating adhesive tape. The surface of the plastic package mold is lubricated, the contained wax forms a layer of protective isolation layer on the surface, the surface of the plastic package mold is isolated from the contact of the plastic package material to a certain extent, and the plastic package material is convenient for packaging and demolding, so that the packaging aging is prolonged, and the mold is protected.
In the mold moistening process, the mold moistening rubber strip is made of composite rubber, wax, silicon dioxide and sulfur, so that any component substance in the formed mold moistening rubber strip does not contain sodium ions or sodium molecule substances or compounds, the problem that the sodium ions or the sodium molecule substances or compounds exist in the mold moistening rubber strip is fundamentally solved, sodium ions are prevented from being left on the surfaces of a plastic package mold after mold moistening, an IC chip arranged on the package mold and an electronic component respectively, and therefore the short circuit phenomenon between the electronic component and the electronic component caused by the fact that the sodium ions corrode the surfaces of the package mold and the electronic component of the IC chip arranged on the surface of the package mold is avoided. Meanwhile, the mold moistening adhesive tape also has the functions of energy conservation and environmental protection. Compared with the similar mold moistening adhesive tape manufacturing process in the prior art, the method has the advantages of simple operation and convenient processing. In addition, compared with the existing melamine mold moistening material and the existing mold moistening material, the mold moistening rubber strip has the advantages that the mold is demoulded for 1-2 times in general due to the fact that the composite rubber is high in viscosity ratio.
In summary, the components of the mold-moistening colloid further comprise a filler and a filler, wherein the filler is silica, and the proportion of the silica is 15-45%; the filler is wax; the cost proportion of the wax is 1% to 2%; the proportion of the composite rubber component is 35-45%, and the proportion of the sulfur component is 0.5-1.5%. The mold moistening rubber strip is made of composite rubber, wax, silicon dioxide and sulfur, so that any component substance in the formed mold moistening rubber strip does not contain sodium ions or sodium molecular substances or compounds, the problem that the sodium ions or the sodium molecular substances or compounds exist in the mold moistening rubber strip is solved fundamentally, sodium ions are prevented from being left on the surface of a plastic package mold after mold moistening, the surface of an electronic component and the surface of an IC chip respectively, and therefore the phenomenon that the surface quality is reduced after demolding due to the fact that the sodium ions corrode the surface of the plastic package mold is avoided, and the effect that the phenomenon of short circuit is easily caused due to the fact that the sodium ions remain on the surface of the electronic component or the surface of the IC chip after lubrication in the process of a plastic package working procedure is avoided. Meanwhile, the mold moistening adhesive tape also has the functions of energy conservation and environmental protection. Compared with the similar mold moistening adhesive tape manufacturing process in the prior art, the method has the advantages of simple operation and convenient processing.
The foregoing description of the preferred embodiments of the present invention is not intended to limit the scope of the invention. Any modifications, equivalents and improvements which may occur to those skilled in the art without departing from the scope and spirit of the present invention are intended to be within the scope of the claims.
Claims (2)
1. A mould moistening adhesive tape without sodium ions is used for demoulding a mould in a plastic packaging process in a semiconductor packaging process and comprises a base material, a curing agent and an additive; the base material is composed of composite rubber, the composite rubber comprises unvulcanized natural rubber, butadiene acrylonitrile rubber, butadiene rubber, high benzene rubber and styrene butadiene rubber, and the curing agent is sulfur; the method is characterized in that: the lubricant also comprises a lubricant and a filler, wherein the filler is silicon dioxide, and the component proportion of the silicon dioxide is 15-45%; the lubricant is wax; the mass proportion of the wax is 1 to 2 percent; the proportion of the composite rubber component is 35-45%, and the proportion of the sulfur component is 0.5-1.5%.
2. The process for manufacturing the mold-moistening rubber strip without sodium ions according to claim 1, which comprises the following steps:
firstly, adding 20 kg of natural rubber, 20 kg of butadiene-acrylonitrile rubber, 20 kg of butadiene rubber, 20 kg of high benzene rubber and 20 kg of styrene butadiene rubber into an internal mixer, starting a stirrer, and fully stirring for 20 minutes to fully perform chemical reaction to form an intermediate A;
then, 0.1 kg of butyl glycidyl ether is added into a reaction kettle, 0.1 kg of Tween 80, 0.1 kg of span-80 and 0.1 kg of low-foaming surfactant CF-32 are slowly added, and the mixture is fully stirred for 20 minutes to prepare an intermediate B;
then, 0.1 kg of anti-aging agent, 0.1 kg of zinc oxide, 0.1 kg of stearic acid, 0.5 kg of paraffin and 3 kg of titanium dioxide are added into a reaction kettle and stirred for 30 minutes to prepare an intermediate C;
adding 1 kg of ethylene glycol, 1 kg of polyethylene glycol 200, 1 kg of triethanolamine and 5 kg of dioctyl ether adipate into a reaction kettle, and starting stirring to react for 10 minutes to prepare an intermediate D;
then, adding 50 kg of silicon dioxide, 2 kg of KH550, 0.5 kg of sulfur and 3 kg of polyethylene wax into the reaction kettle, and starting stirring for 15 minutes to react to prepare an intermediate E;
then, respectively adding the prepared intermediate A and the intermediate C into a first internal mixer, starting a stirrer, fully stirring at 120 ℃ for 5 minutes, and generating a first mixed solution; then, adding the prepared intermediate B and the prepared intermediate D into a reaction kettle respectively, so that a chemical reaction is fully generated, wherein the reaction time is 5 minutes, and a second mixed solution is generated; then, the first mixed solution and the second mixed solution are respectively added into a second internal mixer, the temperature is 120 ℃ and the time is 5 minutes, then the intermediate E is added into the second internal mixer, the temperature is 60 ℃ and the time is 5 minutes, so that the third mixed solution is fully mixed and stirred to form a third mixed solution, then the third mixed solution is poured into an open mill to form a solid lubricating rubber strip liquid, the three-angle wrapping process is respectively carried out for 3 times, then extrusion is carried out through a calender, a solid lubricating rubber strip plate body is extruded, and finally the strip lubricating rubber strip body is cut into strips through a slitter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911155205.6A CN110845772A (en) | 2019-11-22 | 2019-11-22 | Mold moistening adhesive tape without sodium ions and manufacturing process of mold moistening adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911155205.6A CN110845772A (en) | 2019-11-22 | 2019-11-22 | Mold moistening adhesive tape without sodium ions and manufacturing process of mold moistening adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110845772A true CN110845772A (en) | 2020-02-28 |
Family
ID=69603531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911155205.6A Pending CN110845772A (en) | 2019-11-22 | 2019-11-22 | Mold moistening adhesive tape without sodium ions and manufacturing process of mold moistening adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110845772A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112430366A (en) * | 2020-10-26 | 2021-03-02 | 西安科悦电子材料有限公司 | Molybdenum disulfide-containing dual-function mold lubricating adhesive |
| CN114736442A (en) * | 2022-04-15 | 2022-07-12 | 池州市鼎弘半导体科技有限公司 | Mould moistening rubber strip without sodium ions |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0546516A2 (en) * | 1991-12-10 | 1993-06-16 | Bridgestone Corporation | Rubber composition for cleaning metal mold and method for cleaning |
| CN102786725A (en) * | 2012-08-07 | 2012-11-21 | 天津德高化成电子材料有限公司 | Tasteless double-functional material for cleaning and lubricating semiconductor packaging mold |
| CN103205032A (en) * | 2013-03-14 | 2013-07-17 | 西北工业大学 | Mold cleaning rubber for in-place mold cleaning and preparation method of mold cleaning rubber |
| CN107011553A (en) * | 2017-05-04 | 2017-08-04 | 天津德高化成新材料股份有限公司 | A kind of rubber mould exempts from dismounting mold cleaning material and preparation method thereof with online |
| CN108047694A (en) * | 2017-12-27 | 2018-05-18 | 东莞市浦元电子有限公司 | Semiconductor packaging mold cleaning material and preparation method thereof |
| CN109337134A (en) * | 2018-10-19 | 2019-02-15 | 深圳市硕立特科技有限公司 | Without sodium ion and non-corrosive clear mould adhesive tape and the adhesive tape processing method |
-
2019
- 2019-11-22 CN CN201911155205.6A patent/CN110845772A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0546516A2 (en) * | 1991-12-10 | 1993-06-16 | Bridgestone Corporation | Rubber composition for cleaning metal mold and method for cleaning |
| CN102786725A (en) * | 2012-08-07 | 2012-11-21 | 天津德高化成电子材料有限公司 | Tasteless double-functional material for cleaning and lubricating semiconductor packaging mold |
| CN103205032A (en) * | 2013-03-14 | 2013-07-17 | 西北工业大学 | Mold cleaning rubber for in-place mold cleaning and preparation method of mold cleaning rubber |
| CN107011553A (en) * | 2017-05-04 | 2017-08-04 | 天津德高化成新材料股份有限公司 | A kind of rubber mould exempts from dismounting mold cleaning material and preparation method thereof with online |
| CN108047694A (en) * | 2017-12-27 | 2018-05-18 | 东莞市浦元电子有限公司 | Semiconductor packaging mold cleaning material and preparation method thereof |
| CN109337134A (en) * | 2018-10-19 | 2019-02-15 | 深圳市硕立特科技有限公司 | Without sodium ion and non-corrosive clear mould adhesive tape and the adhesive tape processing method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112430366A (en) * | 2020-10-26 | 2021-03-02 | 西安科悦电子材料有限公司 | Molybdenum disulfide-containing dual-function mold lubricating adhesive |
| CN114736442A (en) * | 2022-04-15 | 2022-07-12 | 池州市鼎弘半导体科技有限公司 | Mould moistening rubber strip without sodium ions |
| CN114736442B (en) * | 2022-04-15 | 2024-02-02 | 池州市鼎弘半导体科技有限公司 | Sodium ion-free mold wetting adhesive tape |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110845772A (en) | Mold moistening adhesive tape without sodium ions and manufacturing process of mold moistening adhesive tape | |
| EP0847843B1 (en) | Cleaning composition for mold for molding semiconductor device and method of cleaning mold using the same | |
| CN109337134A (en) | Without sodium ion and non-corrosive clear mould adhesive tape and the adhesive tape processing method | |
| KR20070114036A (en) | Mold cleaning composition | |
| CN112898687A (en) | Mold cleaning material for semiconductor packaging mold and preparation method thereof | |
| CN100567453C (en) | A kind of chip-removing solution for integrated circuit packaging after treatment | |
| KR950012839B1 (en) | Mold cleaning composition sheet for cleaning mold and method for cleaning mold using said cleaning sheet | |
| CN103720083A (en) | Method for manufacturing anti-skid rubber glove | |
| CN109501075A (en) | A kind of clear mould method of mold | |
| CN103817836B (en) | The clear modeling method of a kind of semiconductor dies | |
| CN106799377A (en) | The cleaning method of plastics injection mould | |
| KR100944501B1 (en) | Rubber sheet for coating of semiconductor mold | |
| CN105619666B (en) | A kind of preparation of the reusable aqueous release agent with rheological characteristic | |
| JP2010149358A (en) | Sheet for mold releasing and mold releasing method using the same | |
| CN114633408B (en) | Foaming mold-moistening adhesive for semiconductor packaging mold and preparation method thereof | |
| CN114085437A (en) | Mold moistening glue with durable mold moistening capability for semiconductor packaging mold | |
| CN1952032A (en) | Integrated circuit package molding die cleaning materials | |
| CN111303557B (en) | PVC waste material wax injection plug for automobile manufacturing and preparation method thereof | |
| CN111098445A (en) | Processing and manufacturing method of aluminum alloy and resin combination | |
| JPS61271340A (en) | Production of rubbery composition | |
| CN212883704U (en) | Sterilizing equipment for green small plug plastic mold | |
| CN108453970A (en) | A kind of manufacturing method of chemical mechanical polishing pads and products thereof and mold | |
| CN115194998A (en) | Sealing cap forming die for packaging, forming method and packaging method | |
| CN111978919A (en) | Formula and preparation process of glue oil for light rail tire molding drum brush | |
| US20240138062A1 (en) | Devices, systems, and methods for making and using circuit assemblies having patterns of deformable conductive material formed therein |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200228 |