CN114633408B - Foaming mold-moistening adhesive for semiconductor packaging mold and preparation method thereof - Google Patents
Foaming mold-moistening adhesive for semiconductor packaging mold and preparation method thereof Download PDFInfo
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- CN114633408B CN114633408B CN202210559638.3A CN202210559638A CN114633408B CN 114633408 B CN114633408 B CN 114633408B CN 202210559638 A CN202210559638 A CN 202210559638A CN 114633408 B CN114633408 B CN 114633408B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/60—Releasing, lubricating or separating agents
- B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/60—Releasing, lubricating or separating agents
- B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
- B29C33/64—Silicone
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
The invention relates to a mold moistening adhesive, in particular to a foaming mold moistening adhesive for a semiconductor packaging mold, which comprises the following raw materials in parts by weight: 20-40 parts of EPDM (ethylene-propylene-diene monomer), 60-80 parts of BR (BR), 30-70 parts of reinforcing filler, 1-5 parts of foaming agent, 1-10 parts of auxiliary foaming agent, 10-60 parts of mold lubricant and 1-5 parts of curing agent. In addition, the applicant can effectively fill a die cavity, greatly reduce the using amount of the die cavity and remarkably reduce the cost by preparing the die moistening adhesive into a foaming material, and is beneficial to the migration of the die moistening agent to a contact surface with the die cavity through a self cell structure, so that the die moistening adhesive is easy to separate from the die cavity of the die.
Description
Technical Field
The invention relates to a mold moistening adhesive, in particular to an IPC class number C08K, and more particularly relates to a foaming mold moistening adhesive for a semiconductor packaging mold and a preparation method thereof.
Background
At present, a certain demoulding material is often required to be added to smoothly demould when a semiconductor packaging mould is used for packaging a chip, and the demoulding material generally comprises a mould moistening glue taking a high polymer material as a carrier, a canned liquid wax or silicone oil series demoulding agent, wherein the phenomenon of uneven spraying exists in the using process of the canned liquid wax or silicone oil series demoulding agent, and the appearance quality of a product is influenced.
In addition, due to the compatibility problem of the rubber material carrier and the release agent system, the usage amount of the release agent in the mold moistening glue is very high, so that the mold moistening glue is easy to remain in a mold, the usage amount of the common mold moistening glue is large, and the usage cost is very high. Chinese patent CN201610002955.X discloses a solvent-type wax release agent and a preparation method thereof, the prepared solvent-type wax release agent has good high-temperature resistance and coating performance, can enable poured parts to be smoothly demoulded after high-temperature curing, and has a flawless and bright surface, however, the wax release agent still has large usage amount in the using process and high use cost.
Disclosure of Invention
In view of the above-mentioned technical problems, the invention provides a foaming mold moistening adhesive for a semiconductor packaging mold, which comprises the following raw materials in parts by weight: 20-40 parts of EPDM (ethylene-propylene-diene monomer), 60-80 parts of BR (BR), 30-70 parts of reinforcing filler, 2-5 parts of foaming agent, 1-10 parts of auxiliary foaming agent, 10-40 parts of mold lubricant and 1-5 parts of curing agent.
In some embodiments, the reinforcing filler is white carbon.
In some embodiments, the silica has a specific surface area of 150 to 200m 2 /g。
Preferably, the specific surface area of the white carbon black is 155-190m 2 /g。
More preferably, the white carbon black is Sulfurvedo sub-Zeosil 175GR.
In some embodiments, the blowing agent comprises an amide blowing agent.
Preferably, the blowing agent comprises an azodicarbonamide blowing agent.
In some embodiments, the co-blowing agent comprises stearic acid.
In some embodiments, the emollient comprises oxidized polyethylene wax and/or polyethylene wax.
Preferably, the mold lubricant comprises oxidized polyethylene wax and polyethylene wax, and the weight ratio of the oxidized polyethylene wax to the polyethylene wax is (0) - (1.5).
In some embodiments, the oxidized polyethylene wax has an acid value of from 10 to 40 mgKOH/g.
Preferably, the oxidized polyethylene wax is commercially available, including but not limited to, the oxidized polyethylene wax is available from Qingdao Sainuo New materials, inc. under model number OPE822.
In some embodiments, the polyethylene wax has an acid number of from 10 to 40 mgKOH/g.
Preferably, the polyethylene wax has an acid value of 15 mgKOH/g.
More preferably, the polyethylene wax is commercially available, including but not limited to, the polyethylene wax is available from Qingdao Sainuo New materials, inc. under model number PE629.
In some embodiments, the feedstock further comprises 4 to 10 parts by weight of an adjuvant.
Preferably, the raw material further comprises 8 parts by weight of an auxiliary agent.
In some embodiments, the adjunct includes a cleaning aid and/or a silane coupling agent.
Preferably, the auxiliary agent comprises a cleaning assistant and a silane coupling agent.
More preferably, the auxiliary includes 5 parts by weight of a cleaning aid and 3 parts by weight of a silane coupling agent.
In some embodiments, the co-cleaner comprises polyethylene glycol.
Preferably, the polyethylene glycol is of the grade lentian PEG4000.
In some embodiments, the silane coupling agent is available from Jeccard chemical Co., ltd, hangzhou under the model number KH-151.
In some embodiments, the curing agent is 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane or di-t-butylperoxydiisopropylbenzene.
Preferably, the curing agent is 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane.
In the electronic industry, plastic encapsulation is a necessary process for manufacturing electronic components, namely, encapsulating materials and semiconductor chips are bonded together, so that the electronic components can be effectively prevented from being affected by the problems of dust, moisture, short circuit and the like. The method for cleaning the mold lubricating rubber is widely applied as an effective mode, dirt can be taken out after the mold lubricating rubber is torn after being coated inside a mold cavity, but the type of raw rubber in the mold lubricating rubber has a remarkable influence on the mold lubricating effect of the mold lubricating rubber, the applicant finds that the mold lubricating rubber has less pollution and excellent heat resistance and weather resistance after being vulcanized, but finds that the EPDM has relatively poor viscosity after being added, and is not beneficial to the exertion of the mold lubricating effect of the EPDM, the applicant adopts BR and EPDM with a specific ratio in a body system after a large amount of research, and adds a reinforcing filler with a specific surface area to endow the mold lubricating rubber with excellent adhesive force.
The invention also provides a preparation method of the foaming mold moistening glue for the semiconductor packaging mold, which at least comprises the following steps:
(1) Putting EPDM and BR into an internal mixer for plasticating to be higher than 60 ℃, and then adding a reinforcing filler, a mold lubricant and an auxiliary agent for mixing to obtain a mixture A;
(2) Adding a foaming agent, a curing agent and a co-foaming agent into the mixture A, continuously mixing and discharging rubber to obtain rubber compound;
(3) And extruding, rolling and cutting the rubber compound to obtain the foaming mold-moistening rubber strip.
In some embodiments, the mixing time in step (1) is 1-5min.
Preferably, the mixing time in the step (1) is 3min.
In some embodiments, the temperature of the discharging of the gel in the step (2) is 115-125 ℃.
More preferably, the temperature of the rubber discharge in the step (2) is 120 ℃.
Has the advantages that: according to the invention, BR and EPDM with a specific proportion are adopted, and a reinforcing filler with a specific surface area is added, so that excellent adhesion force can be given to the mold lubricant, in addition, a specific mold lubricant and a cleaning assistant are adopted, particularly, the acid value of the mold lubricant is 10-40mgKOH/g, and when the cleaning assistant is PEG4000, the mold lubricant can effectively swell epoxy resin and dirt and also gives a system better fluidity, so that the mold lubricating effect is improved.
Detailed Description
Examples
The information on the raw materials used in the examples is shown in table 1:
TABLE 1
Examples 1-6 and comparative examples 1-2 each provide a foaming molding compound for a semiconductor package mold, and the raw materials for preparation are shown in table 2.
TABLE 2
The preparation method of the foaming mold-moistening glue described in examples 1-6 and comparative examples 1-2 comprises the following steps:
(1) Putting EPDM and BR into an internal mixer for plastifying to 65 ℃, and then adding white carbon black, oxidized polyethylene wax, polyethylene glycol 4000 and a silane coupling agent for mixing for 3min to obtain a mixture A;
(2) Adding an azodicarbonamide foaming agent, 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hexane and stearic acid into the mixture A, continuously mixing until the temperature reaches 120 ℃ and discharging rubber to obtain rubber compound;
(3) And extruding, rolling and cutting the rubber compound to obtain the foaming mold moistening rubber strip.
If the weight portion is 0, no addition is made.
Evaluation of Performance
1. Effect of moistening mould
After the mold-wetting glues provided in examples 1 to 6 and comparative examples 1 to 2 were respectively molded, the degree of mold-sticking at the time of sealing the article was visually observed and classified into excellent, good, and moderate in terms of the effect, wherein the more slight the mold-sticking was, the more excellent the effect was, and less than the moderate one could not be used, and the evaluation results are reported in table 3.
TABLE 3
Claims (3)
1. The foaming mold moistening glue for the semiconductor packaging mold is characterized by comprising the following raw materials in parts by weight: 40 parts of EPDM (ethylene-propylene-diene monomer), 60 parts of BR (BR), 5 parts of a foaming agent, 3 parts of a blowing assistant agent, 60 parts of a reinforcing filler, 30 parts of a mold lubricant and 1.5 parts of a curing agent, wherein the foaming agent is azodicarbonamide; the auxiliary foaming agent is stearic acid;
the mold lubricant comprises 15 parts of oxidized polyethylene wax and 15 parts of polyethylene wax;
the raw materials also comprise 8 parts by weight of auxiliary agents, and the auxiliary agents comprise 3 parts of silane coupling agents and 5 parts of cleaning aids;
the cleaning assistant is PEG4000;
the acid value of the oxidized polyethylene wax is 10-40mgKOH/g; the acid value of the polyethylene wax is 15mgKOH/g;
the reinforcing filler is white carbon black; the specific surface area of the white carbon black is 155-190m 2 /g；
The curing agent is 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hexane.
2. The foaming mold moistening glue for the semiconductor packaging mold is characterized by comprising the following raw materials in parts by weight: 40 parts of EPDM (ethylene-propylene-diene monomer), 60 parts of BR (BR), 5 parts of a foaming agent, 3 parts of a co-foaming agent, 60 parts of a reinforcing filler, 30 parts of a mold lubricant and 1.5 parts of a curing agent, wherein the foaming agent is azodicarbonamide; the auxiliary foaming agent is stearic acid;
the mold lubricant comprises 10 parts of oxidized polyethylene wax and 20 parts of polyethylene wax;
the raw materials also comprise 8 parts by weight of auxiliary agents, and the auxiliary agents comprise 3 parts of silane coupling agents and 5 parts of cleaning aids;
the cleaning assistant is PEG4000;
the acid value of the oxidized polyethylene wax is 10-40mgKOH/g; the acid value of the polyethylene wax is 15mgKOH/g;
the reinforcing filler is white carbon black; the specific surface area of the white carbon black is 155-190m 2 /g；
The curing agent is 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hexane.
3. The method for preparing the foaming mold lubricant for the semiconductor packaging mold according to any one of claims 1 or 2, characterized by at least comprising the following steps:
(1) Adding EPDM and butadiene rubber into an internal mixer for plasticating to be above 60 ℃, and then adding a reinforcing filler, a mold lubricant and an auxiliary agent for mixing to obtain a mixture A;
(2) Adding a foaming agent, a curing agent and a co-foaming agent into the mixture A, continuously mixing and discharging rubber to obtain rubber compound;
(3) And extruding, rolling and cutting the rubber compound to obtain the foaming mold-moistening rubber strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210559638.3A CN114633408B (en) | 2022-05-23 | 2022-05-23 | Foaming mold-moistening adhesive for semiconductor packaging mold and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210559638.3A CN114633408B (en) | 2022-05-23 | 2022-05-23 | Foaming mold-moistening adhesive for semiconductor packaging mold and preparation method thereof |
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| CN114633408A CN114633408A (en) | 2022-06-17 |
| CN114633408B true CN114633408B (en) | 2022-10-11 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7157313B2 (en) * | 2003-01-17 | 2007-01-02 | Sumitomo Bakelite Co., Ltd. | Epoxy resin composition and semiconductor device using thereof |
| CN102786725B (en) * | 2012-08-07 | 2014-03-19 | 天津德高化成电子材料有限公司 | Tasteless double-functional material for cleaning and lubricating semiconductor packaging mold |
| JP6534992B2 (en) * | 2014-03-31 | 2019-06-26 | ダウ・東レ株式会社 | Silicone rubber composition for mold surface release treatment, and method of forming silicone cured product |
| JP6812750B2 (en) * | 2016-10-25 | 2021-01-13 | 東洋インキＳｃホールディングス株式会社 | Cleaning agent for resin molding machines |
| CN107011553A (en) * | 2017-05-04 | 2017-08-04 | 天津德高化成新材料股份有限公司 | A kind of rubber mould exempts from dismounting mold cleaning material and preparation method thereof with online |
| WO2020036606A1 (en) * | 2018-08-17 | 2020-02-20 | Chem-Trend Limited Partnership | Purge composition and method of cleaning |
| CN112847970B (en) * | 2020-12-24 | 2022-09-30 | 天津德高化成新材料股份有限公司 | Foaming mold cleaning adhesive tape without carcinogenic, mutagenic or reproductive toxic components |
| CN114292435A (en) * | 2022-02-18 | 2022-04-08 | 天津德高化成新材料股份有限公司 | Preparation method of mold moistening sponge for semiconductor packaging mold |
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