CN1952032A - Integrated circuit package molding die cleaning materials - Google Patents
Integrated circuit package molding die cleaning materials Download PDFInfo
- Publication number
- CN1952032A CN1952032A CN 200610096269 CN200610096269A CN1952032A CN 1952032 A CN1952032 A CN 1952032A CN 200610096269 CN200610096269 CN 200610096269 CN 200610096269 A CN200610096269 A CN 200610096269A CN 1952032 A CN1952032 A CN 1952032A
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- die cleaning
- cleaning material
- parts
- colloid
- integrated circuit
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention relates to a kind of cleaning material which is used to enclose the integrated circuit, specifically speaking, it's an accessory material that can clean the remnants in the tootings of the integrated circuit to keep the tootings clean. The producing procedure comprises the following steps: adding liquid aminoalcohol, silicon powder and organic superoxide to the synthetic rubber and mixing them uniformly; compounding them in ambient temperature and discharging the materials when the mixtures are in the state of uniform collid; flattening the collids with calender and opening the pellets to form the products in collid strip form. The invention has the following advantages: reducing the adhesive power of the remnants that attach to the tootings and absorbing the remnants that have permeated in the solidified ruber; decreasing the cost of raw materials; needing not to use the fuse frame; increasing the efficiency and seperating the clean-tooting material and stripping material; needing not to pre-heating; needing not to solidifying in ambient temperature; simple cleaning method, high-efficiency and environmental-pollution-free (no flavors and smokes).
Description
Technical field
The present invention relates to a kind of die cleaning material of unicircuit encapsulation usefulness, specifically clear up the resistates on the large-scale integrated circuit encapsulating mould, keep the material of mould cleaning, belong to the subsidiary material in the large-scale integrated circuit production.
Background technology
Along with development of integrated circuits, moulding the fat encapsulated integrated circuit with epoxy has become main flow.Mould the fat encapsulated integrated circuit after certain quantity with epoxy, its die surface produces incrustation, the product surface obfuscation, the serious sticking to mould of wanting, mold damage, mould is an indispensable important step in the plastic package process to use clear, releasing agent to carry out clearly, its effect guarantees to produce normal.It has played the effect that guarantees plastic packaged integrated circuit reliability and visual appearance and prolong die life.
Before the present invention makes, in prior art, the large-scale integrated circuit packaging mould surface is produced the following method cleaning of the general employing of incrustation: 1, liquid spray; 2, aminoresin is matrix resin, and the inorganic mineral fine powder is a main stuffing, and cooperates clear, the releasing agent of multiple additives; 3, have clear, the releasing agent of the complementary thermosetting material of identical Shooting Technique with epoxy resin encapsulating material, its main composition is melamine resin, fibrous packing, granular filler, and part lubricant and solidifying agent; 4, use trimeric cyanamide and condition mixture as clear, releasing agent; Adopt aforesaid method to clear up mould following problems are generally arranged: need machine to shut down when 1, using; 2, the particle because of the reparation of die production line can cause environmental pollution; 3, irritating smell can cause environmental pollution.Be convenient in demoulding in the time of will taking into account reworking simultaneously when adopting above-mentioned materials cleaning mould, often can not make the best of both worlds.
Summary of the invention
The objective of the invention is to overcome above-mentioned weak point, thereby provide a kind of synthetic rubber of selecting for use as tackiness agent; Selecting liquid amino alcohol for use is sanitising agent, by osmosis, can reduce the clinging power that stains thing that is bonded at die surface; Select for use silica flour as sorbent material, absorption has penetrated into the thing of staining on curing rubber sheet surface; Selecting organo-peroxide for use is elastomeric solidifying agent; , non-environmental-pollution easy to use, efficient, easy by the die cleaning material that the organic assembling of above-mentioned component is made, and the material of clear mould and the material of the demoulding can be separated.
Main solution of the present invention is achieved in that
Its composition of die cleaning material and the proportioning of unicircuit encapsulation usefulness of the present invention by umber are:
The die cleaning material of unicircuit encapsulation usefulness of the present invention is characterized in that: adopt following processing step to make:
Get 40～50 parts of synthetic rubber earlier, add 3～6 parts of liquid amino alcohols, 50～55 parts of silica flours, organo-peroxide and stir for 2～3 parts, mixing at normal temperatures, discharge after mixture forms even colloid; Mixing time: 30～45 minutes; Above-mentioned mixing colloid is flattened, hacks and make colloid bar finished product through rolling press.
Colloid stick die cleaning material length of the present invention is: 170～220mm; Width is: 10～15mm; Thickness is; 5～10mm.
Organo-peroxide employing peroxidation phenylformic acid of the present invention or dibenzoyl peroxide are as the solidifying agent of sheet rubber.
Compared with the prior art the present invention has the following advantages:
The present invention can reduce the clinging power that stains thing that is bonded at die surface, and absorption has penetrated into the thing of staining on curing rubber sheet surface; The material cost of using is low; Need not use lead frame; Can enhance productivity, compare with the mold cleaner that uses epoxy resin encapsulating material to have the complementary thermosetting material of identical Shooting Technique, scavenging period can shorten about 70%; The material of clear mould and the material of the demoulding can be separated, realize making the best of both worlds; Need not preheating; Need not self-vulcanizing; Purging method is simple and easy, efficient, non-environmental-pollution (tasteless smokeless); As long as adhesive tape is put behind the die surface matched moulds 3-5 time, can finish mold cleaning work when using mold cleaner cleaning mould, convenient, fast.
Embodiment
Following the present invention will be further described in conjunction with the embodiments:
Embodiment one:
The die cleaning material of unicircuit encapsulation usefulness adopts following processing step to make among the present invention:
At first taking adhesive is 40 parts of synthetic rubber, adds 3 parts of the liquid amino alcohols of sanitising agent, by osmosis, reduces the clinging power that stains thing that is bonded at die surface.Add 55 parts of sorbent material silica flours, absorption has penetrated into the thing of staining on curing rubber sheet surface.Add the solidifying agent organo-peroxide of sheet rubber, organo-peroxide is got 2 parts in peroxidation phenylformic acid.
With said mixture stir carry out again mixing, mixing time: 30 minutes; Mixing at normal temperatures, mixture forms even colloid discharge; Above-mentioned mixing colloid is flattened, hacks and make colloid stick die cleaning material through rolling press; Colloid stick die cleaning material length of the present invention is: 210mm; Width is: 10mm; Thickness is: 8mm.
Embodiment two:
The die cleaning material of unicircuit encapsulation usefulness adopts following processing step to make among the present invention:
At first taking adhesive is 45 parts of synthetic rubber, adds 3 parts of the liquid amino alcohols of sanitising agent, by osmosis, reduces the clinging power that stains thing that is bonded at die surface.Add 55 parts of sorbent material silica flours, absorption has penetrated into the thing of staining on curing rubber sheet surface.Add the solidifying agent organo-peroxide of sheet rubber, the machine superoxide is got 2 parts in peroxidation phenylformic acid.Said mixture stirred carry out mixingly, mixing time: 40 minutes, mixing at normal temperatures, mixture formed even colloid discharge; Above-mentioned mixing colloid is flattened, hacks and make colloid stick die cleaning material through rolling press;
Colloid stick die cleaning material length of the present invention is: 200mm; Width is: 12; Thickness is: 7mm.
Embodiment three:
The die cleaning material of unicircuit encapsulation usefulness adopts following processing step to make among the present invention:
At first taking adhesive is 43 parts of synthetic rubber, adds 4 parts of the liquid amino alcohols of sanitising agent, by osmosis, reduces the clinging power that stains thing that is bonded at die surface.Add 51 parts of sorbent material silica flours, absorption has penetrated into the thing of staining on curing rubber sheet surface.Add the solidifying agent organo-peroxide of sheet rubber, the machine superoxide is got 2 parts in peroxidation phenylformic acid.Said mixture stirred carry out mixingly, mixing time: 45 minutes, mixing at normal temperatures, mixture formed even colloid discharge; Above-mentioned mixing colloid is flattened, hacks and make colloid stick die cleaning material through rolling press;
Colloid stick die cleaning material length of the present invention is: 190mm; Width is: 10mm; Thickness is: 9mm.
The die cleaning material physical features that adopts different prescriptions to make among three embodiment of the present invention is: proportion: 1.25～1.40g/cc; Mooney viscosity: 115～175; Tensile strength: 〉=35Kgf/sq cm; Extensibility: 〉=40%; Its die cleaning material color: white.
The present invention clears up mould and operates according to the following steps:
Mold pressure was made as when 1, the present invention used: 50～60kgf/cm2; Die temperature is: 175～200 ℃; Be set time: 360～400 seconds; Adopt automatic or MGP formula press, clear mould adhesive tape is put die surface, trigger " compression cleaning interval " then.As when adopting manual type (common) press, adhesive tape put die surface after, press the counterdie button that makes progress and make, counterdie is matched moulds immediately, and presses lower punch and make it to descend.After the operation, timing register set time on the control panel begins to count up to whole end cycle like this.
2, after clear mould end cycle and upper and lower mould are thrown off, to 3～5 seconds of curing rubber sheet surface hydro-peening, disperse smell and smog with spray gun.
3, be with gloves, injection air takes off the curing rubber sheet from die surface, and it is very easy to take off sheet rubber with the spray gun use from die surface.As solidify film viscous, cracked, film not phenomenon such as gel should improve die temperature, reduce mold pressure, prolong gel time.
4, check whether die surface has the resistates that attaches, and checks simultaneously whether the curing rubber sheet has the alveolus filling incomplete.As filling full situation in alveolus takes place should increase adhesive tape thickness.
5, promptly finish the cleaning work of mould with (actual matched moulds number of times can change according to the clean level of mould) behind the mold cleaner matched moulds 3～5 times.
Adopt conventional equipment to use among the present invention, starting material are purchased by market.
Claims (4)
1, a kind of die cleaning material of unicircuit encapsulation usefulness, it is characterized in that: adopt following processing step to make: to get 40～50 parts of synthetic rubber, adding 3～6 parts of liquid amino alcohols, 50～55 parts of silica flours, organo-peroxide stirs for 2～3 parts, mixing at normal temperatures, discharge after mixture forms even colloid; Mixing time: 30～45 minutes; Above-mentioned mixing colloid is flattened, hacks and make colloid bar finished product through rolling press.
2, the die cleaning material of a kind of unicircuit encapsulation usefulness according to claim 1 is characterized in that described colloid bar length is: 170mm～220mm; Width is: 10～15mm; Thickness is: 5～10mm.
3, the die cleaning material of a kind of unicircuit encapsulation usefulness according to claim 1 is characterized in that described organo-peroxide adopts peroxidation phenylformic acid or dibenzoyl peroxide.
4, the die cleaning material of a kind of unicircuit encapsulation usefulness according to claim 1 is characterized in that described die cleaning material color is white.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610096269 CN1952032A (en) | 2006-09-28 | 2006-09-28 | Integrated circuit package molding die cleaning materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610096269 CN1952032A (en) | 2006-09-28 | 2006-09-28 | Integrated circuit package molding die cleaning materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1952032A true CN1952032A (en) | 2007-04-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610096269 Pending CN1952032A (en) | 2006-09-28 | 2006-09-28 | Integrated circuit package molding die cleaning materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1952032A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104086827A (en) * | 2014-07-29 | 2014-10-08 | 南通大学 | Preparation method of electronic package mould cleaning rubber |
| CN104804241A (en) * | 2015-04-29 | 2015-07-29 | 海太半导体（无锡）有限公司 | Semiconductor high-viscosity film injection cleaning material |
| CN108395632A (en) * | 2018-03-29 | 2018-08-14 | 电子科技大学中山学院 | A kind of mold cleaning material and preparation method thereof |
-
2006
- 2006-09-28 CN CN 200610096269 patent/CN1952032A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104086827A (en) * | 2014-07-29 | 2014-10-08 | 南通大学 | Preparation method of electronic package mould cleaning rubber |
| CN104086827B (en) * | 2014-07-29 | 2016-06-15 | 南通大学 | A kind of preparation method of Electronic Packaging mold cleaning rubber |
| CN104804241A (en) * | 2015-04-29 | 2015-07-29 | 海太半导体（无锡）有限公司 | Semiconductor high-viscosity film injection cleaning material |
| CN108395632A (en) * | 2018-03-29 | 2018-08-14 | 电子科技大学中山学院 | A kind of mold cleaning material and preparation method thereof |
| CN108395632B (en) * | 2018-03-29 | 2020-06-09 | 电子科技大学中山学院 | Mold cleaning material and preparation method thereof |
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