CN104119817A - A mold-clearing adhesive tape of an electronic discrete device plastic package mold - Google Patents
A mold-clearing adhesive tape of an electronic discrete device plastic package mold Download PDFInfo
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- CN104119817A CN104119817A CN201410328719.8A CN201410328719A CN104119817A CN 104119817 A CN104119817 A CN 104119817A CN 201410328719 A CN201410328719 A CN 201410328719A CN 104119817 A CN104119817 A CN 104119817A
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Abstract
A mold-clearing adhesive tape of an electronic discrete device plastic package mold is disclosed. The mold-clearing adhesive tape comprises following raw materials by mass: 100 parts of synthetic rubber, 20-30 parts of carboxyl-terminated rubber, 15-20 parts of a nitrogen-containing heterocyclic compound, 20-40 parts of silica powder, 3-5 parts of a curing agent, and 5-8 parts of a curing accelerator. Through movement, striking and grinding of dirt by a silicon dioxide filling material in the mold-clearing adhesive tape after pressurization, bonding of the dirt and the rubber can be achieved by utilization of the dirt-affine functional groups of the synthetic rubber and the carboxyl-terminated rubber. Through the adhesive function of the rubber, effects of pulling the dirt out from mold surfaces and cleaning are achieved.
Description
Technical field
The present invention relates to Electronic Packaging mold cleaning technical field, the clear mould adhesive tape of espespecially a kind of electronics discrete device plastic package die.
Background technology
In electronic industry, in the transfer formation encapsulation process adopting at electronics discrete device, the clear mould of plastic package die is one and seems unimportant, is actually very important operation.On the one hand, in continuously shaped operation, a part of composition that comes from plastic cement and releasing agent is oxidized under the effect of high temperature (170 DEG C～180 DEG C), and is attached to die surface, forms the dirt that is difficult to removal.If do not removed in time, release difficulty and package macroscopic irregularity not only can cause encapsulation time, and can cause damage to cavity surface.On the other hand, 1～2h at least that every day, customary clear mold process consumed, the time of 3h at most, for current most domestic package test factory, the production capacity that seems awkward with respect to quantity on order, is definitely an abnormal very long process.Traditional clear modeling method, often consuming time very long, also consume a large amount of lead frames simultaneously, for addressing this problem, clear mould film is gradually by encapsulation factory is adopted.
Summary of the invention
The clear mould adhesive tape of a kind of electronics discrete device plastic package die of the present invention, it is characterized in that, by the motion of silica filler after pressurization in clear mould adhesive tape, clash into and grinding dirt, utilize the close dirt functional group of synthetic rubber and end carboxylic rubber to complete the combination of dirt and rubber, and by the cohesive action of rubber, realize the object that dirt is drawn except and cleared up from die surface.
To achieve these goals, technical solution of the present invention is: the clear mould adhesive tape of a kind of electronics discrete device plastic package die comprises the raw material of following mass parts: 100 parts of synthetic rubber, 20～30 parts of carboxylic rubbers of end, 15～20 parts of nitrogen-containing heterocycle compounds, 20～40 parts of silicon powders, 3～5 parts, solidifying agent, 5～8 parts of curing catalysts;
Further, described synthetic rubber does not preferably vulcanize cis-1,4-polybutadiene rubber and ethylene-propylene rubber(EPR);
Described end carboxylic rubber is preferably held carboxyl liquid polybutene rubber, end carboxyl liquid butadiene-propylene nitrile rubber and carboxyl end of the liquid acrylonitrile-butadiene rubber;
Described nitrogen-containing heterocycle compound is s-triazine derivative compound and alcohol amine salt thereof, preferably 2,4,6-tri-(amino caproyl)-s-triazine, 2,4, the alcohol amine salt and 2 of 6-tri-(amino caproyl)-s-triazine, 4,6-tri-(amino caproyl)-s-triazine reacts the acid amides generating with hydramine; Further, described 2,4, the alcohol amine salt of 6-tri-(amino caproyl)-s-triazine, its hydramine is selected from trolamine, tri-isopropanolamine, and the mol ratio of hydramine and 2,4,6-tri-(amino caproyl)-s-triazine is 3 ﹕ 1; Described 2,4,6-tri-(amino caproyl)-s-triazine reacts the acid amides generating with hydramine, its hydramine is selected from monoethanolamine, diethanolamine, single second α-amino isopropyl alcohol, diisopropanolamine (DIPA), hydramine and 2, the mol ratio of 4,6-tri-(amino caproyl)-s-triazine is 3 ﹕ 1.；
The preferred 2-mercaptobenzothiazole of described curing catalyst, ethylene thiocarbamide, diphenyl thiourea and N, N-di-n-butyl thiocarbamide;
Described solidifying agent is organo-peroxide, preferably dicumyl peroxide, benzoyl peroxide, tertbutyl peroxide and ditertiary butyl peroxide;
The preparation method of the clear mould adhesive tape of a kind of electronics discrete device of the present invention plastic package die is: the synthetic rubber that by mass parts is 100 parts, mass parts is the end carboxylic rubber of 20～30 parts, mass parts is the nitrogen-containing heterocycle compound of 15～20 parts, mass parts is the silicon powder of 20～40 parts, mass parts is that the solidifying agent of 3～5 parts and mass parts are after the curing catalyst of 5～8 parts mixes, join in mixing roll, mixing 0.5～1 hour in 80 DEG C, obtain colloid, again colloid is flattened through rolling press, thin-pass is made the clear mould adhesive tape for electronics discrete device plastic package die for several times, and pack with plastic bag sealing.
When use, open plastic package die, with the residuals on air cannon cleaning upper die and lower die, the clear mould adhesive tape of peelling off outer packaging is lain against between the cavity of upper die and lower die, by manual pressing mold, in 170 DEG C～180 DEG C, be 300～400 seconds set time, after a clear mould cycle completes, open the upper die and lower die of plastic package die, blow 3～10 seconds with air cannon on surface in clear mould adhesive tape, and the curing adhesive tape after clear mould is taken off from mould, so repeats clearly mould 2～4 times.
Advantage and disadvantage of the present invention is: by the motion of silica filler after pressurization in clear mould adhesive tape, clash into and grinding dirt, utilize the close dirt functional group of synthetic rubber and end carboxylic rubber to complete the combination of dirt and rubber, and by the cohesive action of rubber, reach the effect that dirt is drawn except and cleared up from die surface.
Embodiment
Embodiment 1
The clear mould adhesive tape of a kind of electronics discrete device plastic package die comprises the raw material of following mass parts: do not vulcanize 100 parts, ethylene-propylene rubber(EPR), hold 20 parts of carboxyl liquid butadiene-propylene nitrile rubbers, 2,4,15 parts of the tri-isopropanolamine salt of 6-tri-(amino caproyl)-s-triazine, 20 parts of silicon powders, 3 parts, dicumyl peroxide solidifying agent, 5 parts of ethylene thiocarbamide curing catalysts.
Its preparation method is: the not sulfuration ethylene-propylene rubber(EPR) that by mass parts is 100 parts, mass parts is the end carboxyl liquid butadiene-propylene nitrile rubber of 20 parts, mass parts be 15 parts 2, 4, the tri-isopropanolamine salt of 6-tri-(amino caproyl)-s-triazine, mass parts is the silicon powder of 20 parts, mass parts be the dicumyl peroxide solidifying agent of 3 parts and mass parts be 5 parts 1, after 2-ethylene thiourea curing catalyst mixes, join in mixing roll, mixing 0.5～1 hour in 80 DEG C, obtain colloid, again colloid is flattened through rolling press, thin-pass is made the clear mould adhesive tape for electronics discrete device plastic package die for several times, and pack with plastic bag sealing.
When use, open plastic package die, with the residuals on air cannon cleaning upper die and lower die, the clear mould adhesive tape of peelling off outer packaging is lain against between the cavity of upper die and lower die, by manual pressing mold, in 170 DEG C～180 DEG C, be 300～400 seconds set time, after a clear mould cycle completes, open the upper die and lower die of plastic package die, blow 3～10 seconds with air cannon on surface in clear mould adhesive tape, and the curing adhesive tape after clear mould is taken off from mould, so repeats clearly mould 2～4 times.
Embodiment 2
The clear mould adhesive tape of a kind of electronics discrete device plastic package die comprises the raw material of following mass parts: do not vulcanize 25 parts of 100 parts of cis-1,4-polybutadiene rubbers, carboxyl end of the liquid acrylonitrile-butadiene rubber, 2,4,6-tri-(amino caproyl)-18 parts of s-triazine, 30 parts of silicon powders, 4 parts, benzoyl peroxide solidifying agent, 7 parts of 2-mercaptobenzothiazole curing catalysts.
Its preparation method is: the not sulfuration cis-1,4-polybutadiene rubber that by mass parts is 100 parts, mass parts is the carboxyl end of the liquid acrylonitrile-butadiene rubber of 25 parts, mass parts be 18 parts 2, 4, 6-tri-(amino caproyl)-s-triazine, mass parts is the silicon powder of 30 parts, mass parts is that the benzoyl peroxide solidifying agent of 4 parts and mass parts are after the 2-mercaptobenzothiazole curing catalyst of 7 parts mixes, join in mixing roll, mixing 0.5～1 hour in 80 DEG C, obtain colloid, again colloid is flattened through rolling press, thin-pass is made the clear mould adhesive tape for electronics discrete device plastic package die for several times, and pack with plastic bag sealing.
When use, open plastic package die, with the residuals on air cannon cleaning upper die and lower die, the clear mould adhesive tape of peelling off outer packaging is lain against between the cavity of upper die and lower die, by manual pressing mold, in 170 DEG C～180 DEG C, be 300～400 seconds set time, after a clear mould cycle completes, open the upper die and lower die of plastic package die, blow 3～10 seconds with air cannon on surface in clear mould adhesive tape, and the curing adhesive tape after clear mould is taken off from mould, so repeats clearly mould 2～4 times.
Embodiment 3
The clear mould adhesive tape of a kind of electronics discrete device plastic package die comprises the raw material of following mass parts: do not vulcanize 100 parts of cis-1,4-polybutadiene rubbers, hold 30 parts of carboxyl liquid polybutene rubber, 2,4,6-tri-(amino caproyl)-s-triazine reacts 5 parts of the acid amides, 2 that generate with diethanolamine, 4,6-tri-(amino caproyl)-s-triazine reacts 40 parts of 15 parts, alcohol amine salt, the silicon powders, 5 parts, two (t-butylperoxy) hexanaphthene solidifying agent, the N that generate, 5 parts of N-di-n-butyl thiocarbamide curing catalysts with trolamine.
Its preparation method is: the not sulfuration cis-1,4-polybutadiene rubber that by mass parts is 100 parts, mass parts is the end carboxyl liquid polybutene rubber of 30 parts, mass parts be 5 parts 2, 4, 6-tri-(amino caproyl)-s-triazine reacts the acid amides generating with diethanolamine, mass parts be 15 parts 2, 4, 6-tri-(amino caproyl)-s-triazine reacts the alcohol amine salt generating with trolamine, mass parts is the silicon powder of 40 parts, mass parts is that two (t-butylperoxy) the hexanaphthene solidifying agent of 5 parts and mass parts are 8 parts, N, after N-di-n-butyl thiocarbamide curing catalyst mixes, join in mixing roll, mixing 0.5～1 hour in 80 DEG C, obtain colloid, again colloid is flattened through rolling press, thin-pass is made the clear mould adhesive tape for electronics discrete device plastic package die for several times, and pack with plastic bag sealing.
When use, open plastic package die, with the residuals on air cannon cleaning upper die and lower die, the clear mould adhesive tape of peelling off outer packaging is lain against between the cavity of upper die and lower die, by manual pressing mold, in 170 DEG C～180 DEG C, be 300～400 seconds set time, after a clear mould cycle completes, open the upper die and lower die of plastic package die, blow 3～10 seconds with air cannon on surface in clear mould adhesive tape, and the curing adhesive tape after clear mould is taken off from mould, so repeats clearly mould 2～4 times.
The above; embodiment is only that the preferred embodiment of the present invention is described; not scope of the present invention is limited; under the prerequisite of spirit that does not depart from the technology of the present invention; various distortion and improvement that this area engineering technical personnel make technical scheme of the present invention, all should fall in the definite protection domain of claims of the present invention.
Claims (5)
1. the clear mould adhesive tape of electronics discrete device plastic package die, is characterized in that: the described clear mould adhesive tape of a kind of electronics discrete device plastic package die comprises the raw material of following mass parts: 100 parts of synthetic rubber, 20～30 parts of carboxylic rubbers of end, 15～20 parts of nitrogen-containing heterocycle compounds, 20～40 parts of silicon powders, 3～5 parts, solidifying agent, 5～8 parts of curing catalysts.
2. the clear mould adhesive tape of a kind of electronics discrete device plastic package die according to claim 1, it is characterized in that: the preparation method of the described clear mould adhesive tape of a kind of electronics discrete device plastic package die is: the synthetic rubber that by mass parts is 100 parts, mass parts is the end carboxylic rubber of 20～30 parts, mass parts is the nitrogen-containing heterocycle compound of 15～20 parts, mass parts is the silicon powder of 20～40 parts, mass parts is that the solidifying agent of 3～5 parts and mass parts are after the curing catalyst of 5～8 parts mixes, join in mixing roll, mixing 0.5～1 hour in 80 DEG C, obtain colloid, again colloid is flattened through rolling press, thin-pass is made the clear mould adhesive tape for electronics discrete device plastic package die for several times, and pack with plastic bag sealing.
3. the clear mould adhesive tape of a kind of electronics discrete device plastic package die according to claim 1, is characterized in that: described synthetic rubber does not preferably vulcanize cis-1,4-polybutadiene rubber and ethylene-propylene rubber(EPR); Described end carboxylic rubber is preferably held carboxyl liquid polybutene rubber, end carboxyl liquid butadiene-propylene nitrile rubber and carboxyl end of the liquid acrylonitrile-butadiene rubber; Described nitrogen-containing heterocycle compound is s-triazine derivative compound and alcohol amine salt thereof, preferably 2,4,6-tri-(amino caproyl)-s-triazine, 2,4, the alcohol amine salt and 2 of 6-tri-(amino caproyl)-s-triazine, 4,6-tri-(amino caproyl)-s-triazine reacts the acid amides generating with hydramine; The preferred 2-mercaptobenzothiazole of described curing catalyst, ethylene thiocarbamide, diphenyl thiourea and N, N-di-n-butyl thiocarbamide; Described solidifying agent is organo-peroxide, preferably dicumyl peroxide, benzoyl peroxide, tertbutyl peroxide and ditertiary butyl peroxide.
4. according to claim 32,4, the alcohol amine salt of 6-tri-(amino caproyl)-s-triazine, is characterized in that: described hydramine is selected from trolamine, tri-isopropanolamine, and the mol ratio of hydramine and 2,4,6-tri-(amino caproyl)-s-triazine is 3 ﹕ 1.
5. according to claim 32,4,6-tri-(amino caproyl)-s-triazine reacts the acid amides generating with hydramine, it is characterized in that: described hydramine is selected from monoethanolamine, diethanolamine, single second α-amino isopropyl alcohol, diisopropanolamine (DIPA), the mol ratio of hydramine and 2,4,6-tri-(amino caproyl)-s-triazine is 3 ﹕ 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410328719.8A CN104119817A (en) | 2014-07-11 | 2014-07-11 | A mold-clearing adhesive tape of an electronic discrete device plastic package mold |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410328719.8A CN104119817A (en) | 2014-07-11 | 2014-07-11 | A mold-clearing adhesive tape of an electronic discrete device plastic package mold |
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| CN104119817A true CN104119817A (en) | 2014-10-29 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103817836A (en) * | 2014-02-18 | 2014-05-28 | 成都先进功率半导体股份有限公司 | Semiconductor die cleaning method |
| CN104804241A (en) * | 2015-04-29 | 2015-07-29 | 海太半导体（无锡）有限公司 | Semiconductor high-viscosity film injection cleaning material |
-
2014
- 2014-07-11 CN CN201410328719.8A patent/CN104119817A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103817836A (en) * | 2014-02-18 | 2014-05-28 | 成都先进功率半导体股份有限公司 | Semiconductor die cleaning method |
| CN103817836B (en) * | 2014-02-18 | 2016-04-06 | 成都先进功率半导体股份有限公司 | The clear modeling method of a kind of semiconductor dies |
| CN104804241A (en) * | 2015-04-29 | 2015-07-29 | 海太半导体（无锡）有限公司 | Semiconductor high-viscosity film injection cleaning material |
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