CN1931521A - Slant grinding and polishing process of wafer - Google Patents

Abstract

The present invention belongs to the field of optoelectronic and optical technology, and is especially technical process of machining the chamfered slant of wafer. In some special grinding and polishing apparatus, the chamfered slant of wafer is ground or polished fast and stably with corresponding abrasive paste or polishing paste. The special grinding and polishing apparatus has the structure as shown, and may be used in the slant grinding and polishing with replaceable grinding head and grinding material. The present invention has shortened grinding period and polishing period, and lowered wafer production cost.

Description

A kind of circular wafer bevel grinds and finishing method

Technical field

The invention belongs to the grinding on the chamfering inclined-plane of the artificial wafer that photoelectron and optics industry use, the Machining Technology field of polishing.

Background technology

Artificial lens (as sapphire) is the important basic material of modern industry, and various circular wafers (as polarization wafer, laser wafer, optical crystal chip) have been widely used in fields such as photoelectron, microelectronics, optics, laser, superconduction, national defence at present.In the manufacture process of wafer, collapsing rim charge and can making the plane lapping and the quality of finish variation of wafer of wafer for fear of the limit that collapses of wafer, usually in the wafer plane first being processed, carried out chamfering to wafer earlier, and fillet surface ground and polishes.Existing wafer chamfering equipment mainly is equipment for grinding, does not also have special-purpose chamfering bevel ground and polissoir.Existing wafer bevel grinds and polishing mainly is the armrest construction method, in process of production the following problem of ubiquity: scale error is big after 1, the grinding of wafer bevel, the polishing; 2, the angle uniformity after the grinding of wafer bevel, the polishing is poor; 3, the grinding of wafer bevel, polishing efficiency are low.

Summary of the invention

For grinding, the quality of finish that improves wafer bevel, improve grinding, polishing efficiency.Invent circular wafer bevel and ground and polished special equipment and processing technology.

The operation principle of this circle wafer bevel grinding and polishing special equipment as shown in Figure 1.

The present invention is further described as follows below in conjunction with the kinematic sketch of accompanying drawing 1:

Wafer 2 is rotated by Motor Drive by main shaft 1, bistrique 3 is done reverse rotation by grinding spindle 5 by the another one Motor Drive, bistrique 3 is in rotation, driving transverse slat 6 by partial gear 9 is made horizontal reciprocating movement, the horizontal reciprocating movement of transverse slat 6 drives bistrique 3 by universal joint 4 and swings, thereby the fillet surface of realizing 3 pairs of wafers 2 of bistrique grinds or the fillet surface polishing, and the wafer side after the feasible simultaneously processing is near taper seat.

By adding the size that equilibrant force F regulates grinding or polishing force.

An application example of the wafer bevel grinding and polishing mechanism that accompanying drawing 2 is, wafer 2 is to be bonded on the supporting slice 14 by sky wax among the figure, supporting slice 14 is inhaled on main shaft 1 by vavuum pump, bistrique 3 is driven by motor 26 by the band transmission, drive tooth bar 8 by partial gear 9, drive transverse slat 6 again and make horizontal reciprocating movement.By the size that grinding or polishing force are regulated in the position of mobile balanced block 27, regulate the speed that wafer bevel grinds and polishes by the rotating speed of regulating motor 26 again; By controlling the width dimensions after the time of grinding and polishing is controlled wafer bevel grinding and polishing.

Before processing, earlier wafer is placed on the grinding shaft, utilize sphere bistrique contact gently with wafer, thus with the wafer self-centering, again by vavuum pump with chip sucking on grinding shaft, thereby location and the clamping of realization wafer on grinding shaft.

When carrying out bevel ground and polishing for the wafer of different-diameter (D), only need to select the sphere grinding head of corresponding with it radius (R), the relation between them is $R=\frac{\mathrm{<figure-callout\; id="2"\; label="D"\; filenames="A20061010438600152.png,A20061010438600231.png"\; state="\{\{state\}\}">D</figure-callout>}}{2}\sin \mathrm{\&alpha;},$ Wherein α is the angle of chamfer.

The present invention both can be used for the bevel ground of wafer, also can be used for the polishing inclined plane of wafer, just needed to change bistrique and auxiliary material.

For bevel ground, with the grinding head that spheroidal graphite cast-iron is made, in grinding head, coat abrasive pastes, the prescription of abrasive pastes is: 90% sodium base grease, 9% granularity are the micro mist of W7,1% stabilizing agent (polyethylene glycol).The material of micro mist is determined according to the material of wafer, for sapphire wafer, is selected diadust for use; For monocrystalline silicon, quartzy wafer, select alumina powder for use.

For polishing inclined plane, use the epoxy resin rubbing head, in rubbing head, coat antiscuffing paste, the prescription of antiscuffing paste is: 90% sodium base grease, 9% granularity are the micro mist of W0.5,1% stabilizing agent (polyethylene glycol).The material of micro mist is determined according to the material of wafer, for sapphire wafer, is selected silicon carbide micro-powder for use; For monocrystalline silicon, quartzy wafer, select the cerium oxide micro mist for use.

Description of drawings

1, Fig. 1 is the kinematic sketch that circular wafer bevel ground and polished special equipment.Wafer 2 is rotated by Motor Drive by main shaft 1, bistrique 3 is rotated by the another one Motor Drive by grinding spindle 5, the rotation of partial gear 9 drives transverse slat 6 and makes horizontal reciprocating movement, drives bistrique 3 and swings, and the wafer side after the feasible processing is near taper seat.

2, Fig. 2 is the installation diagram of circular wafer bevel polisher lapper.It is a figure who dwindles, and Fig. 3～Fig. 7 is the part figure of this installation diagram.

3, Fig. 3 is the structure chart of the upper left of this installation diagram.Wafer 2 is bonded at holds on the sheet plate 14, to hold sheet plate 14 by vavuum pump is fixed on the extension bar 16, main shaft 1 drives rotation by motor by belt pulley 20, and bistrique 3 links to each other with grinding spindle 5 by universal joint 4, and grinding spindle 5 drives rotation by belt pulley 13 by motor 26.

4, Fig. 4 is the upper right portion of this installation diagram, and the rotation of partial gear 9 drives transverse slat 6 and move back and forth motion as level on the swallow-tail form slide block, and the horizontal reciprocating movement of transverse slat 6 drives bistrique 3 by universal joint 4 and swings.By the position of mobile balanced block 27, regulate grind or polishing process in bistrique 3 be applied to the size of the power on the wafer 2.

5, Fig. 5 is the latter half of this installation diagram.It is the vertical view of wafer bevel polisher lapper.

6, Fig. 6 is that the k of this installation diagram is to figure.Regulate the height up and down of grinding spindle 5 by mounting hole and bolt 25, with the wafer that adapts to different-diameter grind and polishing process in the bistrique of the different spherical radius of use.

7, Fig. 7 is the A-A partial sectional view in this installation diagram.Moving horizontally of transverse slat 6 of reflection is to carry out in dovetail groove.

8, Fig. 8 is the structure chart of main shaft 1, by rolling bearing 18 main shaft 1 is installed on the frame, and main shaft 1 center is a hollow hole, so that vacuumize.

9, Fig. 9 is the structure chart of grinding spindle 5, links to each other with grinding axle sleeve 31 by two rolling bearings 29.

10, Figure 10 is the structure chart of partial gear 9, and its modulus is 2.5 millimeters, and the number of teeth is 3.

11, Figure 11 is the structure chart of tooth bar 8.It and partial gear 9 are meshing with each other, and drive transverse slat 6 and move as left and right horizontal.

12, Figure 12 is back support plate 28 structure charts; Be weldment, be used to install motor 26 and balance weight 27;

13, Figure 13 is the structure chart of bistrique 3.Working portion is an Internal Spherical Surface, and when wafer 2 ground, bistrique was made with spheroidal graphite cast-iron; During wafer 2 polishings, bistrique is made with epoxy resin.

14, Figure 14 is the structure chart of balance weight 27.When balance weight 27 is adjusted to certain correct position, balance weight 27 is fixed on the rear support bracket 28 by holding screw.

15, Figure 15 is the structure chart of cross-pin type joint 34.There are two up and down, are used, can be formed in freely rotating of two vertical direction with the multi-directional ball 4 of Figure 16.

16, Figure 17 is the structure chart that grinds axle sleeve 31, and Figure 18 grinds the A of axle sleeve to left view.It connects grinding spindle 5 and transverse slat 6, regulates the height up and down of grinding spindle 5 by mounting hole and bolt 25.

17, Figure 19 is the structure chart of extension bar 16.Be stained with rubber blanket 15 on it, be used for placing and hold sheet plate 14, it links to each other with main shaft 1 with sealing ring by screw thread down, and extension bar 16 centers are hollow holes, so that vacuumize.

18, Figure 20 is the structure chart of bearing block 30.It is used for fixing the turning cylinder 35 of transverse slat 6, and bearing block 30 is installed on the vertical support plate 31.Realize freely swinging of transverse slat 6.

19, Figure 21 is the structure chart of vertical support plate 31.Be used to place bearing block 30 above it, link to each other with the dovetail balladeur train below, realize moving horizontally of transverse slat 6.

20, Figure 22 is the structure chart of transverse slat 6.Its left side is used to install grinding spindle cover 31, is used to install back support plate 28 above, is installed in below on the turning cylinder 35.

21, Figure 23 is the structure chart of transverse slat bolster 35.Its two ends link to each other with bearing block 30 by rolling bearing.

The specific embodiment

2 the specific embodiment of the present invention are described in conjunction with the accompanying drawings:

1, artificial lens is round as a ball, section;

2, wafer 2 is bonded at holds on the sheet plate 14, will hold sheet plate 14 and be placed on the extension bar 16, will hold sheet plate 14 by vavuum pump and be fixed on the extension bar 16;

3, main shaft 1 drives rotation by motor by belt pulley 20;

4, bistrique 3 links to each other with grinding spindle 5 by universal joint 4, and grinding spindle 5 drives rotation by motor 26 by belt pulley 13, and its rotation direction is opposite with the rotation direction of main shaft 1, thereby realizes the grinding or the polishing of 3 pairs of wafers 2 of bistrique;

5, the rotation of partial gear 9 drives transverse slat 6 and make horizontal reciprocating movement on the swallow-tail form slide block, and the horizontal reciprocating movement of transverse slat 6 drives bistrique 3 by universal joint 4 and swings, thereby the fillet surface of realizing 3 pairs of wafers 2 of bistrique grinds or the fillet surface polishing;

6, the position by mobile balanced block 27, regulate grind or polishing process in bistrique 3 be applied to the size of the power on the wafer 3.

The invention effect

The invention has the beneficial effects as follows: can be so that broad-ruler after the grinding on the chamfering inclined-plane of artificial wafer, polishing Very little stable, angle is consistent, can make the roughness on polishing inclined-plane＜0.4 micron, can avoid artificial wafer to exist Produce in follow-up plane lapping and the polishing processing and collapse the limit, thereby improve the crudy of artificial wafer. With The time the present invention can shorten grinding, the polishing time on the chamfering inclined-plane of artificial wafer, reduce production costs.

Claims (5)

1. circular wafer bevel grinds and polishing technology is made up of the several sections such as prescription of grinding and polishing mechanism, abrasive pastes and antiscuffing paste.

2. the feature of circular wafer bevel grinding and polishing mechanism is: utilize the rotation and the feed motion of swing as grinding tool of the sphere bistrique of indent; Drive tooth bar by partial gear, realize swinging of sphere bistrique; By the sphere bistrique with the wafer self-centering, again by vavuum pump with chip sucking on grinding shaft, realize location and the clamping of wafer on grinding shaft.

3. when carrying out bevel ground and polishing for the wafer of different-diameter (D), only need to select the sphere grinding head of respective radius (R), the relation between them is $R=\frac{D}{2}\sin \mathrm{\&alpha;},$ Wherein α is the angle of chamfer.

4. grind for wafer bevel, use the spheroidal graphite cast-iron grinding head, coat abrasive pastes in grinding head, the prescription of abrasive pastes is: 90% sodium base grease, 9% granularity are the micro mist of W7,1% stabilizing agent (polyethylene glycol).The material of micro mist is determined according to the material of wafer, for sapphire wafer, is selected diadust for use; For monocrystalline silicon, quartzy wafer, select alumina powder for use.

5. for the wafer bevel polishing, use the epoxy resin rubbing head, coat antiscuffing paste in rubbing head, the prescription of antiscuffing paste is: 90% sodium base grease, 9% granularity are the micro mist of W0.5,1% stabilizing agent (polyethylene glycol).The material of micro mist is determined according to the material of wafer, for sapphire wafer, is selected silicon carbide micro-powder for use; For monocrystalline silicon, quartzy wafer, select the cerium oxide micro mist for use.

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