CN1929955B - 绝缘衬垫调整器及其使用方法 - Google Patents

绝缘衬垫调整器及其使用方法 Download PDF

Info

Publication number
CN1929955B
CN1929955B CN2005800077568A CN200580007756A CN1929955B CN 1929955 B CN1929955 B CN 1929955B CN 2005800077568 A CN2005800077568 A CN 2005800077568A CN 200580007756 A CN200580007756 A CN 200580007756A CN 1929955 B CN1929955 B CN 1929955B
Authority
CN
China
Prior art keywords
electrode
abradant surface
carrier
polishing pad
adjustment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2005800077568A
Other languages
English (en)
Chinese (zh)
Other versions
CN1929955A (zh
Inventor
加里·M·帕尔姆格伦
布赖恩·D·格斯
道格拉斯·J·皮谢尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1929955A publication Critical patent/CN1929955A/zh
Application granted granted Critical
Publication of CN1929955B publication Critical patent/CN1929955B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • General Preparation And Processing Of Foods (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Weting (AREA)
CN2005800077568A 2004-03-09 2005-01-25 绝缘衬垫调整器及其使用方法 Expired - Fee Related CN1929955B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/797,890 2004-03-09
US10/797,890 US7125324B2 (en) 2004-03-09 2004-03-09 Insulated pad conditioner and method of using same
PCT/US2005/002309 WO2005095055A1 (en) 2004-03-09 2005-01-25 Insulated pad conditioner and method of using same

Publications (2)

Publication Number Publication Date
CN1929955A CN1929955A (zh) 2007-03-14
CN1929955B true CN1929955B (zh) 2010-06-16

Family

ID=34920153

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005800077568A Expired - Fee Related CN1929955B (zh) 2004-03-09 2005-01-25 绝缘衬垫调整器及其使用方法

Country Status (10)

Country Link
US (2) US7125324B2 (ko)
EP (1) EP1722925B1 (ko)
JP (1) JP2007528299A (ko)
KR (1) KR20090130084A (ko)
CN (1) CN1929955B (ko)
AT (1) ATE480367T1 (ko)
DE (1) DE602005023419D1 (ko)
MY (1) MY135125A (ko)
TW (2) TW201017721A (ko)
WO (1) WO2005095055A1 (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US7427337B2 (en) * 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US8974270B2 (en) 2011-05-23 2015-03-10 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US20080061985A1 (en) * 2006-08-31 2008-03-13 Symbol Technologies, Inc. Visual display of RFID tag content via laser projection display
TWI388402B (en) * 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
US8496511B2 (en) * 2010-07-15 2013-07-30 3M Innovative Properties Company Cathodically-protected pad conditioner and method of use
CN102601722A (zh) * 2011-01-20 2012-07-25 中芯国际集成电路制造(上海)有限公司 一种研磨方法和研磨装置
KR101311330B1 (ko) * 2012-06-12 2013-09-25 주식회사 덕성 반도체 씨엠피 가공장치용 템플레이트 어셈블리
US9227294B2 (en) * 2013-12-31 2016-01-05 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for chemical mechanical polishing
US10967478B2 (en) * 2017-09-29 2021-04-06 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
WO2019210278A1 (en) 2018-04-27 2019-10-31 Saint-Gobain Ceramics & Plastics, Inc. Material including boron suboxide and method of forming same
CN111421462B (zh) * 2019-01-08 2022-03-22 中芯国际集成电路制造(上海)有限公司 化学机械研磨方法
CN110328607B (zh) * 2019-08-05 2020-05-29 衢州学院 一种利用电场效应增强加工区域酸碱度的锗平面镜化学抛光方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US6001008A (en) * 1998-04-22 1999-12-14 Fujimori Technology Laboratory Inc. Abrasive dresser for polishing disc of chemical-mechanical polisher
US6123612A (en) * 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6176992B1 (en) * 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
CN1349446A (zh) * 1999-04-20 2002-05-15 Memc电子材料有限公司 调节晶片抛光垫的方法
CN1362907A (zh) * 1999-04-01 2002-08-07 皇家菲利浦电子有限公司 双重cmp垫调节器

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196353A (en) * 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
JP3036348B2 (ja) * 1994-03-23 2000-04-24 三菱マテリアル株式会社 ウェーハ研磨パッドのツルーイング装置
US5637031A (en) * 1996-06-07 1997-06-10 Industrial Technology Research Institute Electrochemical simulator for chemical-mechanical polishing (CMP)
US5807165A (en) * 1997-03-26 1998-09-15 International Business Machines Corporation Method of electrochemical mechanical planarization
AU1468199A (en) 1997-11-25 1999-06-15 Johns Hopkins University, The Electrochemical-control of abrasive polishing and machining rates
US6328872B1 (en) 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6263605B1 (en) * 1998-12-21 2001-07-24 Motorola, Inc. Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
JP3387858B2 (ja) * 1999-08-25 2003-03-17 理化学研究所 ポリッシングパッドコンディショナー
US6379223B1 (en) * 1999-11-29 2002-04-30 Applied Materials, Inc. Method and apparatus for electrochemical-mechanical planarization
US6666754B1 (en) * 2000-01-18 2003-12-23 Advanced Micro Devices, Inc. Method and apparatus for determining CMP pad conditioner effectiveness
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US6991526B2 (en) * 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US6517424B2 (en) * 2000-03-10 2003-02-11 Abrasive Technology, Inc. Protective coatings for CMP conditioning disk
KR100360469B1 (ko) * 2000-05-09 2002-11-08 삼성전자 주식회사 화학기계적 연마장치의 연마패드 컨디셔닝 장치
US6494765B2 (en) * 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
US20020042200A1 (en) * 2000-10-02 2002-04-11 Clyde Fawcett Method for conditioning polishing pads
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US6932896B2 (en) * 2001-03-30 2005-08-23 Nutool, Inc. Method and apparatus for avoiding particle accumulation in electrodeposition
WO2003072672A1 (en) * 2002-02-26 2003-09-04 Applied Materials, Inc. Method and composition for polishing a substrate
US7011566B2 (en) * 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
US6722948B1 (en) * 2003-04-25 2004-04-20 Lsi Logic Corporation Pad conditioning monitor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US6123612A (en) * 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6001008A (en) * 1998-04-22 1999-12-14 Fujimori Technology Laboratory Inc. Abrasive dresser for polishing disc of chemical-mechanical polisher
US6176992B1 (en) * 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
CN1362907A (zh) * 1999-04-01 2002-08-07 皇家菲利浦电子有限公司 双重cmp垫调节器
CN1349446A (zh) * 1999-04-20 2002-05-15 Memc电子材料有限公司 调节晶片抛光垫的方法

Also Published As

Publication number Publication date
US7125324B2 (en) 2006-10-24
DE602005023419D1 (de) 2010-10-21
KR20090130084A (ko) 2009-12-17
ATE480367T1 (de) 2010-09-15
CN1929955A (zh) 2007-03-14
US20060189140A1 (en) 2006-08-24
MY135125A (en) 2008-02-29
WO2005095055A1 (en) 2005-10-13
JP2007528299A (ja) 2007-10-11
TW200539255A (en) 2005-12-01
EP1722925A1 (en) 2006-11-22
TW201017721A (en) 2010-05-01
EP1722925B1 (en) 2010-09-08
US20050202676A1 (en) 2005-09-15
US7247577B2 (en) 2007-07-24

Similar Documents

Publication Publication Date Title
CN1929955B (zh) 绝缘衬垫调整器及其使用方法
US20060030156A1 (en) Abrasive conductive polishing article for electrochemical mechanical polishing
JP2896657B2 (ja) ドレッサ及びその製造方法
CN109877657B (zh) 一种电化学增稠抛光方法
KR100408932B1 (ko) 반도체장치의 연마방법
CN202952159U (zh) 化学机械研磨修整器
WO2003099519A1 (en) Polishing pad for electrochemical-mechanical polishing and methods to manufacture it
US7504018B2 (en) Electrochemical method for Ecmp polishing pad conditioning
KR19990072939A (ko) 성형경면연삭방법및장치
JP4737492B2 (ja) メタルレスボンド砥石とそれによる電解ドレッシング研削方法及び装置
WO2001036138A1 (en) Combined electrolytic polishing and abrasive super-finishing process
KR20070015919A (ko) 절연된 패드 컨디셔너 및 이를 이용하는 방법
JP3802884B2 (ja) Ｃｍｐコンディショナ
JP3845209B2 (ja) レンズ研磨方法とその装置
CN209754801U (zh) 一种电化学增稠抛光加工装置
JP2000246646A (ja) 電着砥石
WO2000013870A1 (fr) Procede et dispositif de coupe et de polissage miroir de carbure de silicium monocristallin
Prabhu et al. Nano-surface generation using electrolytic in-process dressing (ELID) technique in grinding process
WO2004083494A1 (ja) 複合加工装置及び方法
JP2000006034A (ja) 研削工具
JP2001088016A (ja) 電気泳動用研磨剤及びこれを用いた成形体の製造方法及び光学装置
JPH08174419A (ja) 磁界を用いた研削方法及び装置
Bandyopadhyay et al. Highly Efficient and Ultraprecision Fabrication of Structural Ceramic Parts with the Application of Electrolytic In-Process Dressing Grinding
Tucker Equipment used in cmp processes
Doi et al. Polishing technology

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100616

Termination date: 20220125