CN1926179A - 蚀刻的聚碳酸酯膜 - Google Patents

蚀刻的聚碳酸酯膜 Download PDF

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Publication number
CN1926179A
CN1926179A CNA2004800425928A CN200480042592A CN1926179A CN 1926179 A CN1926179 A CN 1926179A CN A2004800425928 A CNA2004800425928 A CN A2004800425928A CN 200480042592 A CN200480042592 A CN 200480042592A CN 1926179 A CN1926179 A CN 1926179A
Authority
CN
China
Prior art keywords
polycarbonate
weight
etching
film
goods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800425928A
Other languages
English (en)
Chinese (zh)
Inventor
毛国平
杨瑞
约翰·C·舒尔茨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1926179A publication Critical patent/CN1926179A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
CNA2004800425928A 2004-02-23 2004-12-22 蚀刻的聚碳酸酯膜 Pending CN1926179A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/784,398 2004-02-23
US10/784,398 US20050186404A1 (en) 2004-02-23 2004-02-23 Etched polycarbonate films

Publications (1)

Publication Number Publication Date
CN1926179A true CN1926179A (zh) 2007-03-07

Family

ID=34861455

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800425928A Pending CN1926179A (zh) 2004-02-23 2004-12-22 蚀刻的聚碳酸酯膜

Country Status (7)

Country Link
US (2) US20050186404A1 (enExample)
EP (1) EP1718694A1 (enExample)
JP (1) JP2007523255A (enExample)
KR (1) KR20070004642A (enExample)
CN (1) CN1926179A (enExample)
CA (1) CA2557124A1 (enExample)
WO (1) WO2005082983A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103189470A (zh) * 2010-11-03 2013-07-03 3M创新有限公司 聚合物蚀刻剂及其使用方法
CN108473755A (zh) * 2016-01-04 2018-08-31 住友精化株式会社 树脂表面粗糙化用组合物
CN112912466A (zh) * 2018-10-24 2021-06-04 三菱制纸株式会社 树脂组合物的蚀刻液及蚀刻方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070120089A1 (en) * 2005-11-28 2007-05-31 3M Innovative Properties Company Polymer etchant and method of using same
US8049112B2 (en) * 2007-04-13 2011-11-01 3M Innovative Properties Company Flexible circuit with cover layer
JP4883376B2 (ja) * 2009-06-30 2012-02-22 カシオ計算機株式会社 蛍光体基板及び光源装置、プロジェクタ

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL263837A (enExample) * 1961-02-16
US3526504A (en) * 1966-07-07 1970-09-01 Du Pont Photocrosslinkable elements and processes
US3448098A (en) * 1966-09-27 1969-06-03 Merck & Co Inc Production of guanylic acid
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
US3673017A (en) * 1970-07-09 1972-06-27 Gen Electric Particle track etching method
GB1345748A (en) * 1970-10-09 1974-02-06 Du Pont Surface-patterned surface-activated polymer film
US3867153A (en) * 1972-09-11 1975-02-18 Du Pont Photohardenable element
US4941940A (en) * 1988-11-07 1990-07-17 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
US5015329A (en) * 1988-11-07 1991-05-14 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
US4898275A (en) * 1989-05-25 1990-02-06 Minnesota Mining And Manufacturing Company Non nesting component carrier tape
US5187496A (en) * 1990-10-29 1993-02-16 Xerox Corporation Flexible electrographic imaging member
US5227008A (en) * 1992-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method for making flexible circuits
US5609969A (en) * 1995-06-30 1997-03-11 Minnesota Mining And Manufacturing Company Static dissipative electronic packaging article
US6214519B1 (en) * 1995-08-22 2001-04-10 Mitsubishi Chemical Corporation Optical recording medium
US6218022B1 (en) * 1996-09-20 2001-04-17 Toray Engineering Co., Ltd. Resin etching solution and process for etching polyimide resins
US6500885B1 (en) * 1997-02-28 2002-12-31 Candescent Technologies Corporation Polycarbonate-containing liquid chemical formulation and methods for making and using polycarbonate film
US5914150A (en) * 1997-02-28 1999-06-22 Candescent Technologies Corporation Formation of polycarbonate film with apertures determined by etching charged-particle tracks
US6180698B1 (en) * 1997-02-28 2001-01-30 Candescent Technologies Corporation Polycarbonate-containing liquid chemical formulation and method for making polycarbonate film
US6150071A (en) * 1998-10-15 2000-11-21 3M Innovative Properties Company Fabrication process for flex circuit applications
US6403211B1 (en) * 2000-07-18 2002-06-11 3M Innovative Properties Company Liquid crystal polymer for flexible circuits
US6696163B2 (en) * 2000-07-18 2004-02-24 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
US6923919B2 (en) * 2000-07-18 2005-08-02 3M Innovative Properties Company Liquid crystal polymers for flexible circuits

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103189470A (zh) * 2010-11-03 2013-07-03 3M创新有限公司 聚合物蚀刻剂及其使用方法
CN108473755A (zh) * 2016-01-04 2018-08-31 住友精化株式会社 树脂表面粗糙化用组合物
US11084915B2 (en) 2016-01-04 2021-08-10 Sumitomo Seika Chemicals Co., Ltd. Composition for resin surface roughening
CN112912466A (zh) * 2018-10-24 2021-06-04 三菱制纸株式会社 树脂组合物的蚀刻液及蚀刻方法

Also Published As

Publication number Publication date
KR20070004642A (ko) 2007-01-09
EP1718694A1 (en) 2006-11-08
US20050186404A1 (en) 2005-08-25
WO2005082983A1 (en) 2005-09-09
JP2007523255A (ja) 2007-08-16
WO2005082983A9 (en) 2007-03-01
US20060127653A1 (en) 2006-06-15
CA2557124A1 (en) 2005-09-09

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned
C20 Patent right or utility model deemed to be abandoned or is abandoned