CN1901630A - 影像感测单元及其应用的cmos影像感测装置与阵列 - Google Patents
影像感测单元及其应用的cmos影像感测装置与阵列 Download PDFInfo
- Publication number
- CN1901630A CN1901630A CNA2006101035450A CN200610103545A CN1901630A CN 1901630 A CN1901630 A CN 1901630A CN A2006101035450 A CNA2006101035450 A CN A2006101035450A CN 200610103545 A CN200610103545 A CN 200610103545A CN 1901630 A CN1901630 A CN 1901630A
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- pixel
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- hexagonal
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Links
- 230000006698 induction Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 19
- 238000005516 engineering process Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70171305P | 2005-07-22 | 2005-07-22 | |
US60/701,713 | 2005-07-22 | ||
US11/213,186 US20070018073A1 (en) | 2005-07-22 | 2005-08-25 | CMOS image sensor device with beehive pattern color sensor cell array |
US11/213,186 | 2005-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1901630A true CN1901630A (zh) | 2007-01-24 |
Family
ID=37678201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2006101035450A Pending CN1901630A (zh) | 2005-07-22 | 2006-07-21 | 影像感测单元及其应用的cmos影像感测装置与阵列 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070018073A1 (ko) |
KR (1) | KR100815889B1 (ko) |
CN (1) | CN1901630A (ko) |
TW (1) | TW200717784A (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103856700A (zh) * | 2012-11-29 | 2014-06-11 | 佳能株式会社 | 摄像元件、摄像设备和摄像系统 |
TWI567958B (zh) * | 2013-11-11 | 2017-01-21 | 豪威科技股份有限公司 | 雙像素大小彩色影像感測器及其製造方法 |
CN107005640A (zh) * | 2014-12-04 | 2017-08-01 | 汤姆逊许可公司 | 图像传感器单元和成像装置 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202007019236U1 (de) | 2007-11-02 | 2011-11-09 | Valentina Anzupowa | Farbteiler-Bildwandler-Gruppe mit teildurchlässigen Spiegeln und Mosaikfarbfiltern |
US7781716B2 (en) | 2008-03-17 | 2010-08-24 | Eastman Kodak Company | Stacked image sensor with shared diffusion regions in respective dropped pixel positions of a pixel array |
US7745773B1 (en) * | 2008-04-11 | 2010-06-29 | Foveon, Inc. | Multi-color CMOS pixel sensor with shared row wiring and dual output lines |
US8466000B2 (en) | 2011-04-14 | 2013-06-18 | United Microelectronics Corp. | Backside-illuminated image sensor and fabricating method thereof |
US9312292B2 (en) | 2011-10-26 | 2016-04-12 | United Microelectronics Corp. | Back side illumination image sensor and manufacturing method thereof |
US8318579B1 (en) | 2011-12-01 | 2012-11-27 | United Microelectronics Corp. | Method for fabricating semiconductor device |
US8815102B2 (en) | 2012-03-23 | 2014-08-26 | United Microelectronics Corporation | Method for fabricating patterned dichroic film |
US9401441B2 (en) | 2012-06-14 | 2016-07-26 | United Microelectronics Corporation | Back-illuminated image sensor with dishing depression surface |
US8779344B2 (en) | 2012-07-11 | 2014-07-15 | United Microelectronics Corp. | Image sensor including a deep trench isolation (DTI)that does not contact a connecting element physically |
US8828779B2 (en) | 2012-11-01 | 2014-09-09 | United Microelectronics Corp. | Backside illumination (BSI) CMOS image sensor process |
US8779484B2 (en) | 2012-11-29 | 2014-07-15 | United Microelectronics Corp. | Image sensor and process thereof |
US9279923B2 (en) | 2013-03-26 | 2016-03-08 | United Microelectronics Corporation | Color filter layer and method of fabricating the same |
US9537040B2 (en) | 2013-05-09 | 2017-01-03 | United Microelectronics Corp. | Complementary metal-oxide-semiconductor image sensor and manufacturing method thereof |
US9129876B2 (en) | 2013-05-28 | 2015-09-08 | United Microelectronics Corp. | Image sensor and process thereof |
JP2015060121A (ja) | 2013-09-19 | 2015-03-30 | 株式会社東芝 | カラーフィルタアレイおよび固体撮像素子 |
US9054106B2 (en) | 2013-11-13 | 2015-06-09 | United Microelectronics Corp. | Semiconductor structure and method for manufacturing the same |
US9841319B2 (en) | 2013-11-19 | 2017-12-12 | United Microelectronics Corp. | Light detecting device |
KR102242563B1 (ko) | 2015-03-11 | 2021-04-20 | 삼성전자주식회사 | 픽셀 패턴 및 이를 포함하는 이미지 센서 |
US9953574B2 (en) | 2015-04-28 | 2018-04-24 | Microsoft Technology Licensing, Llc | Sub-pixel compensation |
US10593712B2 (en) | 2017-08-23 | 2020-03-17 | Semiconductor Components Industries, Llc | Image sensors with high dynamic range and infrared imaging toroidal pixels |
US10931902B2 (en) | 2018-05-08 | 2021-02-23 | Semiconductor Components Industries, Llc | Image sensors with non-rectilinear image pixel arrays |
KR102171814B1 (ko) * | 2018-12-28 | 2020-10-29 | 한국광기술원 | 분할 성형 지원형 광경화 3d 프린터 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5311337A (en) | 1992-09-23 | 1994-05-10 | Honeywell Inc. | Color mosaic matrix display having expanded or reduced hexagonal dot pattern |
US6252218B1 (en) * | 1999-02-02 | 2001-06-26 | Agilent Technologies, Inc | Amorphous silicon active pixel sensor with rectangular readout layer in a hexagonal grid layout |
US6750912B1 (en) * | 1999-09-30 | 2004-06-15 | Ess Technology, Inc. | Active-passive imager pixel array with small groups of pixels having short common bus lines |
JP4434530B2 (ja) * | 2001-09-17 | 2010-03-17 | ソニー株式会社 | 固体撮像装置 |
-
2005
- 2005-08-25 US US11/213,186 patent/US20070018073A1/en not_active Abandoned
-
2006
- 2006-07-21 TW TW095126716A patent/TW200717784A/zh unknown
- 2006-07-21 CN CNA2006101035450A patent/CN1901630A/zh active Pending
- 2006-07-21 KR KR1020060068502A patent/KR100815889B1/ko active IP Right Grant
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103856700A (zh) * | 2012-11-29 | 2014-06-11 | 佳能株式会社 | 摄像元件、摄像设备和摄像系统 |
US9450006B2 (en) | 2012-11-29 | 2016-09-20 | Canon Kabushiki Kaisha | Image pickup element, image pickup apparatus, and image pickup system |
CN103856700B (zh) * | 2012-11-29 | 2017-03-01 | 佳能株式会社 | 摄像元件、摄像设备和摄像系统 |
TWI567958B (zh) * | 2013-11-11 | 2017-01-21 | 豪威科技股份有限公司 | 雙像素大小彩色影像感測器及其製造方法 |
CN107005640A (zh) * | 2014-12-04 | 2017-08-01 | 汤姆逊许可公司 | 图像传感器单元和成像装置 |
CN107005640B (zh) * | 2014-12-04 | 2020-06-26 | 交互数字Ce专利控股公司 | 图像传感器单元和成像装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20070012261A (ko) | 2007-01-25 |
KR100815889B1 (ko) | 2008-03-21 |
US20070018073A1 (en) | 2007-01-25 |
TW200717784A (en) | 2007-05-01 |
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