CN1891359A - Silicon wafter surface particle fixed-point cleaning system and method - Google Patents
Silicon wafter surface particle fixed-point cleaning system and method Download PDFInfo
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- CN1891359A CN1891359A CN 200510027550 CN200510027550A CN1891359A CN 1891359 A CN1891359 A CN 1891359A CN 200510027550 CN200510027550 CN 200510027550 CN 200510027550 A CN200510027550 A CN 200510027550A CN 1891359 A CN1891359 A CN 1891359A
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Abstract
This invention discloses a definite point cleaning system for particles of silicon plate surfaces including a scanning object lens, a height and azimuth angle adjusting device, a level cleaning gas flow output device and a directional energy device mounted on the height adjusting device and translates up and down against the lens and rotates around it horizontally and the directional energy device is aimed at the surface of the silicon plate along the almost the horizontal direction, besides, this device also includes a method by determining positions of particles with a scanning lens then the directional device emits radiation waves to separate the particles from the plate.
Description
Technical field
The present invention relates to a kind of silicon chip surface particle scavenge system.The invention still further relates to this system of a kind of usefulness and carry out the silicon wafter surface particle fixed-point cleaning method.
Background technology
Existing silicon chip clearance of particles technology comprises by the method for chemistry (as cleaning liquid), acoustics (as ultrasonic wave) and machinery (as brush) cleans the full wafer silicon chip.This technology is applicable to the particle of the various separate sources of mass disposal.Continuous progress along with semiconductor technology, particle on the silicon chip is fewer and fewerily quantitatively controlled, even the defective on a slice silicon chip and amounts of particles are to the degree that can manually check, this large-area cleaning method not only seems gradually, and some is unnecessary, and they can become significantly relatively to the damage of silicon chip.
Summary of the invention
Technical problem to be solved by this invention provides a kind of silicon wafter surface particle fixed-point cleaning system, and the particle of silicon chip surface is carried out targeted elimination one by one, reduces the damage of clearance of particles to silicon chip to greatest extent.The present invention also provides a kind of this system that uses to carry out the method that silicon chip surface particle carries out targeted elimination.
For solving the problems of the technologies described above, the technical scheme of a kind of silicon wafter surface particle fixed-point cleaning system of the present invention is, comprise scanning objective, height and azimuth adjustment device, horizontal cleaning gas tream output device, and DIRECTED ENERGY DEVICE, described DIRECTED ENERGY DEVICE is installed on the arrangement for adjusting height, and but the relative scanning object lens are done up and down translation and do around scanning objective and to horizontally rotate, the alignment lens of scanning objective will carry out the silicon chip of clearance of particles, DIRECTED ENERGY DEVICE is aimed at silicon chip surface along nearly horizontal direction, scanning objective is connected by data wire and interlock circuit with DIRECTED ENERGY DEVICE, the air-flow output of horizontal cleaning gas tream output device is towards silicon chip, and the air-flow that blows out is close to silicon chip surface and parallel with it.
The present invention also provides a kind of method of using this system to carry out silicon wafter surface particle fixed-point cleaning, its technical scheme is, at first detect particle position by scanning with scanning objective, by data wire particle position is transferred to DIRECTED ENERGY DEVICE, DIRECTED ENERGY DEVICE is regulated the radiated wave energy, is selected the horizontal angle of departure and aim at particle emitted radiation ripple then, particle and silicon chip are broken away from, and the directed cleaning gas tream of the horizontal direction that is blown out by horizontal cleaning gas tream output device takes away particle, at last with the scanning objective imaging to determine that particle is eliminated.
The present invention adopts radiated wave that particle and silicon chip are broken away from, and has realized the purpose that silicon chip surface particle is removed.The present invention has exempted cleaning back multiple scanning to confirm the operation of cleaning performance, has saved machine time, has shortened the silicon chip production cycle, and can avoid the damage of traditional large tracts of land cleaning to silicon chip, has improved the operating efficiency that silicon chip cleans greatly.For hydrophobic insulation material, the dry method targeted elimination also can be avoided water stain (watermark) problem of bringing because of wet-cleaning.
Description of drawings
Below in conjunction with drawings and Examples the present invention is further described:
Fig. 1 uses the structural representation of pulse laser for a kind of silicon wafter surface particle fixed-point cleaning system of the present invention;
Fig. 2 uses hyperacoustic structural representation for a kind of silicon wafter surface particle fixed-point cleaning system of the present invention;
Fig. 3 regulates the schematic perspective view of DIRECTED ENERGY DEVICE emission angle for a kind of silicon wafter surface particle fixed-point cleaning system of the present invention.
The specific embodiment
As shown in Figure 1, a kind of silicon wafter surface particle fixed-point cleaning system of the present invention, comprise scanning objective, height and azimuth adjustment device and DIRECTED ENERGY DEVICE, described DIRECTED ENERGY DEVICE is installed on the arrangement for adjusting height, and but the relative scanning object lens are done up and down translation and do around scanning objective and to horizontally rotate, DIRECTED ENERGY DEVICE can adopt pulse laser, and shines silicon chip surface by optical mirror along nearly horizontal direction, and scanning objective is connected by data wire with DIRECTED ENERGY DEVICE.
Fig. 2 uses hyperacoustic structural representation for a kind of silicon wafter surface particle fixed-point cleaning system of the present invention; What the content that is disclosed with Fig. 1 was different is that what its DIRECTED ENERGY DEVICE adopted is supersonic generator, and is transmitted into silicon chip surface by the ultrasonic transducer along continuous straight runs.
The present invention also provides a kind of method of silicon wafter surface particle fixed-point cleaning, at first detect particle position by scanning with scanning objective, by data wire particle position is transferred to DIRECTED ENERGY DEVICE, when being necessary, also silicon chip surface can be carried out imaging, manually determine the position of particle then.DIRECTED ENERGY DEVICE is aimed at particle emitted radiation ripple then, and particle and silicon chip are broken away from, and the directed cleaning gas tream of the horizontal direction that is blown out by horizontal cleaning gas tream output device takes away particle, is eliminated with definite particle with the object lens imaging at last.
DIRECTED ENERGY DEVICE radiation emitted ripple can be a pulse laser, also can be ultrasonic wave.
DIRECTED ENERGY DEVICE is regulated radiated wave horizontal emission angle according to particle in silicon chip surface pattern position by height and azimuth adjustment and control device.As shown in Figure 3, the directional energy emitter is walked always emitted radiation ripple along the lines of silicon chip surface, to improve elimination efficiency.In addition, DIRECTED ENERGY DEVICE can also be selected the emission level transmit direction according to the particle space distribution situation that scanning objective detected, and can improve elimination efficiency equally.
Claims (8)
1. silicon wafter surface particle fixed-point cleaning system, it is characterized in that, comprise scanning objective, height and azimuth adjustment device, horizontal cleaning gas tream output device, and DIRECTED ENERGY DEVICE, described DIRECTED ENERGY DEVICE is installed on the arrangement for adjusting height, and but the relative scanning object lens are done up and down translation and do around scanning objective and to horizontally rotate, the alignment lens of scanning objective will carry out the silicon chip of clearance of particles, DIRECTED ENERGY DEVICE is aimed at silicon chip surface along nearly horizontal direction, scanning objective is connected by data wire and interlock circuit with DIRECTED ENERGY DEVICE, the air-flow output of horizontal cleaning gas tream output device is towards silicon chip, and the air-flow that blows out is close to silicon chip surface and parallel with it.
2. a kind of silicon wafter surface particle fixed-point cleaning system according to claim 1 is characterized in that, described DIRECTED ENERGY DEVICE can be a pulse laser, and by optical path and optical mirror with pulsed laser irradiation to silicon chip surface.
3. a kind of silicon wafter surface particle fixed-point cleaning system according to claim 1 is characterized in that described DIRECTED ENERGY DEVICE can be a supersonic generator, and emits ultrasonic acoustic waves into silicon chip surface by ultrasonic transducer.
4. method of utilizing the described system of claim 1 to realize silicon wafter surface particle fixed-point cleaning, it is characterized in that, at first detect particle position by scanning with scanning objective, by data wire particle position is transferred to DIRECTED ENERGY DEVICE, DIRECTED ENERGY DEVICE is regulated the radiated wave energy, is selected the horizontal angle of departure and aim at particle emitted radiation ripple then, particle and silicon chip are broken away from, and the directed cleaning gas tream of the horizontal direction that is blown out by horizontal cleaning gas tream output device takes away particle, at last with the scanning objective imaging to determine that particle is eliminated.
5. the method for a kind of silicon wafter surface particle fixed-point cleaning according to claim 4 is characterized in that, when scanning objective detects particle position, silicon chip surface can also be carried out imaging, manually determines the position of particle then.
6. the method for a kind of silicon wafter surface particle fixed-point cleaning according to claim 4, it is characterized in that, described DIRECTED ENERGY DEVICE can be selected the emission level transmit direction according to particle space distribution situation that scanning objective detected or according to the configuration of surface of silicon chip, and realizes this operation by height and azimuth adjustment and control device.
7. the method for a kind of silicon wafter surface particle fixed-point cleaning according to claim 4 is characterized in that, the radiated wave that DIRECTED ENERGY DEVICE sent is the pulse laser that focuses on, and is projected on the particle by optical mirror.
8. the method for a kind of silicon wafter surface particle fixed-point cleaning according to claim 4 is characterized in that, the radiated wave that DIRECTED ENERGY DEVICE sent is a ultrasonic wave, and is focused on the particle by ultrasonic transducer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510027550 CN1891359A (en) | 2005-07-06 | 2005-07-06 | Silicon wafter surface particle fixed-point cleaning system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510027550 CN1891359A (en) | 2005-07-06 | 2005-07-06 | Silicon wafter surface particle fixed-point cleaning system and method |
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| CN1891359A true CN1891359A (en) | 2007-01-10 |
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| CN 200510027550 Pending CN1891359A (en) | 2005-07-06 | 2005-07-06 | Silicon wafter surface particle fixed-point cleaning system and method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103962347A (en) * | 2013-01-24 | 2014-08-06 | 北京京东方光电科技有限公司 | Cleaning system and method |
| CN105405741A (en) * | 2014-07-18 | 2016-03-16 | 无锡华瑛微电子技术有限公司 | Local cleaning device and method for wafer |
-
2005
- 2005-07-06 CN CN 200510027550 patent/CN1891359A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103962347A (en) * | 2013-01-24 | 2014-08-06 | 北京京东方光电科技有限公司 | Cleaning system and method |
| CN103962347B (en) * | 2013-01-24 | 2016-05-11 | 北京京东方光电科技有限公司 | A kind of cleaning systems and method |
| CN105405741A (en) * | 2014-07-18 | 2016-03-16 | 无锡华瑛微电子技术有限公司 | Local cleaning device and method for wafer |
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Open date: 20070110 |