CN1891143A - High-density electrode array and its making method - Google Patents
High-density electrode array and its making method Download PDFInfo
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- CN1891143A CN1891143A CN 200510012103 CN200510012103A CN1891143A CN 1891143 A CN1891143 A CN 1891143A CN 200510012103 CN200510012103 CN 200510012103 CN 200510012103 A CN200510012103 A CN 200510012103A CN 1891143 A CN1891143 A CN 1891143A
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- array
- electrode
- microwell array
- lead
- wire
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 210000003298 dental enamel Anatomy 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000003491 array Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 210000005013 brain tissue Anatomy 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 210000005036 nerve Anatomy 0.000 description 1
- 210000002569 neuron Anatomy 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 208000037816 tissue injury Diseases 0.000 description 1
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Abstract
The present invention belongs to the field of high-density electrode array technology, in particular, it relates to a high-density electrode array and its making method. Said high-density electrode array is formed from microhole array, single electrode, fixing resin and interface board, in which the single electrode is placed in vertical hole of microhole array; on the tail portion of said single electrode a lead wire is welded, the head portion of the single electrode is made into tip form, and is extended from the vertical hole of microhole array; the tail portion of said single electrode and upper surface of said microhole array are sealed by coating fixing resin and fixed together; and the tail end of said lead wire is welded with interface board. Besides, said invention also provides the concrete steps of its making method.
Description
Technical field
The present invention relates to the high-density electrode array technical field, particularly a kind of high-density electrode array and manufacture method thereof.
Background technology
Electrod-array is to form array at the integrated a plurality of microelectrodes of substrate, implants the multiple electrode array of cortex, can read the active detailed information of neuron colony in the brain.Aspect the neuroscience basic research, multiple electrode array begins to become a kind of important nerve information detection means, and aspect medical application, multiple electrode array becomes the interface of neuroscience towards medical application.
1981, people such as U.S. scientist Kruger became multiple electrode array with the fixing a plurality of microelectrodes of ceramic material on the grid of 250 microns of spacings, and this method efficient is low, and the electrode length and the depth of parallelism are wayward.Multiple improvement multiple electrode array manufacture method has appearred later on, electrod-array as You Ta university is directly to carve a plurality of electrode tip with saw blade on silicon chip, make finished product through technologies such as insulation, bonding wires again, this class methods problem is that the size of electrode tip can not do too carefully, and too thick electrode pair brain tissue injury is bigger, also is difficult to make the high multiple electrode array of density simultaneously.Adopt planar integrated circuit manufacturing process such as photoengraving, ion sputtering to make flaky multi-electrode in addition in addition, be built up multiple electrode array again, as the electrod-array of Univ Michigan-Ann Arbor USA, but this class electrod-array still need improve yet not commercialization at present aspect combination property.
Summary of the invention
The objective of the invention is to provide a kind of high-density electrode array and manufacture method thereof.
Provide a kind of electrode diameter very thin, be easy to realize highdensity multiple electrode array manufacture method.
For achieving the above object, solution of the present invention provides a kind of high-density electrode array, is made up of microwell array, single electrode, lead-in wire, fixing resin and interface, and its single electrode is a square, places the upright opening of microwell array; Unipolar afterbody is than head length, horizontal-extending, and unipolar head is pointed, stretches out the upright opening of microwell array; Above the upper surface of unipolar part of horizontal afterbody and microwell array, fixing resin is arranged.
The present invention is the single electrode that superfine wire electrode is made, and lead-in wire is inserted in the microwell array then on the electrode afterbody welds in advance, forms multiple electrode array.It is leaded that this method is assembled out the electrod-array back side, saved the higher technology at array back side solder taul of difficulty.A kind of high-density electrode array is made up of microwell array, single electrode, lead-in wire, fixing resin and interface board, it is characterized in that, single electrode is a square, places the upright opening of microwell array; Unipolar afterbody is welded with lead-in wire, and unipolar head is pointed, stretches out the upright opening of microwell array; Above the upper surface of unipolar afterbody and microwell array, fixing resin is arranged; Lead terminal is welded on the interface board.
A kind of manufacture method of multiple electrode array comprises the steps:
A) on resin substrate, make microwell array with photoetching process;
B) be welding lead on the tinsel single electrode of tip shape at head;
C) single electrode is inserted in the upright opening of microwell array, the head of electrode stretches out upright opening;
D) be locked togather with the upper surface of fixing resin unipolar afterbody and microwell array;
E) lead terminal is welded on the interface board;
F) make finished product.
Described lead-in wire is enamel covered wire or the enamel-cover silver line or the enamel-cover gold thread of 0.01 millimeter ~ 0.03 mm dia.
The present invention uses the single electrode that is welded with lead-in wire in advance, can assemble out a lot of arrays of electrodeplate, and electrode spacing also can be very little, is easy to produce high-density electrode array.
Description of drawings
Fig. 1 is the single electrode sketch map of high-density electrode array of the present invention.
Fig. 2 is the microwell array sketch map of high-density electrode array of the present invention.
Fig. 3 is the microwell array scheme of installation of high-density electrode array of the present invention.
The specific embodiment
See Fig. 1, be equipped with 150 microns in about 25 microns in aperture, 1 millimeter of hole depth, pitch of holes, 15 * 15 microwell array 2.Be equipped with diameter and be 20 microns totally 225 of single electrodes 1, locate to go between 3 in the welding at 2.5 millimeters at electrode 1 end, operation is gone into micropore array 2 holes with single electrode 1, after all electrode 1 is gone into, drip resin 42 of microwell arrays, fixed electrode 1 and lead solder-joint, 3 ends that go between are soldered to interface board 5.
Fig. 2, the microwell array structure of high-density electrode array has a plurality of holes in microwell array 2, in order to the insertion of electrode 1.
Fig. 3, the mounting structure sketch map in the microwell array 2 of high-density electrode array behind the insertion electrode 1.
Claims (4)
1, a kind of high-density electrode array is made up of microwell array, single electrode, lead-in wire, fixing resin and interface board, it is characterized in that, single electrode is a square, places the upright opening of microwell array; Unipolar afterbody is welded with lead-in wire, and unipolar head is pointed, stretches out the upright opening of microwell array; Above the upper surface of unipolar afterbody and microwell array, fixing resin is arranged; Lead terminal is welded on the interface board.
2, a kind of high-density electrode manufacture method is characterized in that, comprises the steps:
A) on resin substrate, make microwell array with photoetching process;
B) be welding lead on the tinsel single electrode of tip shape at head;
C) single electrode is inserted in the upright opening of microwell array, the head of electrode stretches out upright opening;
D) be locked togather with the upper surface of fixing resin unipolar afterbody and microwell array;
E) lead terminal is welded on the interface board;
F) make finished product.
3, high-density electrode array according to claim 1 is characterized in that, described lead-in wire is enamel covered wire or the enamel-cover silver line or the enamel-cover gold thread of 0.01 millimeter ~ 0.03 mm dia.
4, high-density electrode manufacture method according to claim 2 is characterized in that, described lead-in wire is enamel covered wire or the enamel-cover silver line or the enamel-cover gold thread of 0.01 millimeter ~ 0.03 mm dia.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200510012103 CN1891143A (en) | 2005-07-07 | 2005-07-07 | High-density electrode array and its making method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200510012103 CN1891143A (en) | 2005-07-07 | 2005-07-07 | High-density electrode array and its making method |
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CN1891143A true CN1891143A (en) | 2007-01-10 |
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CN 200510012103 Pending CN1891143A (en) | 2005-07-07 | 2005-07-07 | High-density electrode array and its making method |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102525569A (en) * | 2011-12-28 | 2012-07-04 | 浙江省肿瘤医院 | Array type microdialysis probe |
CN108042129A (en) * | 2017-12-29 | 2018-05-18 | 广东省中医院 | A kind of three-dimensional tiny array electrode for being used to detect cardiac muscular tissue's electric signal |
CN111398898A (en) * | 2020-04-08 | 2020-07-10 | 中国科学院长春光学精密机械与物理研究所 | Neural mimicry bionic curved surface compound eye system for large-field-of-view three-dimensional motion detection |
WO2021008222A1 (en) * | 2019-07-17 | 2021-01-21 | 杭州暖芯迦电子科技有限公司 | High-density array free-form surface miniature electrode and manufacturing method therefor |
-
2005
- 2005-07-07 CN CN 200510012103 patent/CN1891143A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102525569A (en) * | 2011-12-28 | 2012-07-04 | 浙江省肿瘤医院 | Array type microdialysis probe |
CN102525569B (en) * | 2011-12-28 | 2013-12-25 | 浙江省肿瘤医院 | Array type microdialysis probe |
CN108042129A (en) * | 2017-12-29 | 2018-05-18 | 广东省中医院 | A kind of three-dimensional tiny array electrode for being used to detect cardiac muscular tissue's electric signal |
WO2021008222A1 (en) * | 2019-07-17 | 2021-01-21 | 杭州暖芯迦电子科技有限公司 | High-density array free-form surface miniature electrode and manufacturing method therefor |
CN111398898A (en) * | 2020-04-08 | 2020-07-10 | 中国科学院长春光学精密机械与物理研究所 | Neural mimicry bionic curved surface compound eye system for large-field-of-view three-dimensional motion detection |
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