CN1890339A - Anisotropic conductive adhesive sheet and coupling structure - Google Patents
Anisotropic conductive adhesive sheet and coupling structure Download PDFInfo
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- CN1890339A CN1890339A CNA2004800359659A CN200480035965A CN1890339A CN 1890339 A CN1890339 A CN 1890339A CN A2004800359659 A CNA2004800359659 A CN A2004800359659A CN 200480035965 A CN200480035965 A CN 200480035965A CN 1890339 A CN1890339 A CN 1890339A
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- adhesive sheet
- conductive particle
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
Abstract
An anisotropic conductive adhesive sheet comprising at least a curing agent, a curable insulating resin and conductive particles, wherein in a region extending from a one-side surface of the anisotropic conductive adhesive sheet along the thickness direction to a position of not greater than 2.0 times the average diameter of the conductive particles, 90% or more of the sum of conductive particles are present, the 90% or more of the sum of conductive particles being present without contact with other conductive particles, and wherein the average diameter of conductive particles is in the range of 1 to 8 mu m, the average particle distance between adjacent conductive particles being in the range of 1 to 5 times the average particle diameter and not greater than 20 mu m, and wherein the thickness of the anisotropic conductive adhesive sheet is at least 1.5 times the average particle distance but not greater than 40 mu m.
Description
Technical field
The present invention relates to have the anisotropic conductive adhesive sheet and the syndeton body of excellent microcircuit switching performance.
Background technology
Up to now, for the anisotropic conductive adhesive sheet that is used for connecting microcircuit,, multiple conductive particle and anisotropic conductive adhesive composition are studied in order to improve switching performance and to prevent short circuit.For example, currently known methods up to now comprises following method: will have the method (seeing patent documentation 1) that the insulated particle of same coefficient of thermal expansion cooperates with conductive particle; In order to prevent short circuit, with the lip-deep method (see patent documentation 2) of insulated particle attached to conductive particle; Method (seeing patent documentation 3) with the surface of electric insulation resin lining conductive particle; The layer that will comprise and not comprise conductive particle carries out the method (see patent documentation 4) of lamination to prevent to be short-circuited between adjacent circuit; The terminal circuit is covered with photoresist, rest part except that the connection portion is carried out selectivity curing so that this part does not have binding property, and with conductive particle attached to having on the fusible part, be covered with the method (seeing patent documentation 5) that prevents to be short-circuited between adjacent circuit with resin of binding property then; Be pre-formed the wadding that peels off, single or multiple conductive particles be arranged in the described recess with recess, and with it attached to the method (seeing patent documentation 6) to prepare anisotropic conductive adhesive sheet on the bonding coat; With sheet material that can be biaxial stretch-formed with the conductive particle lining, described coated sheet material is stretched in the scope that is no more than described conductive particle particle diameter, and isolating conductive particle is transferred to the method (seeing patent documentation 7) to prepare anisotropic conductive adhesive sheet in the bonding coat.
Yet, give therein in the routine techniquess with insulating property such as conductive particle, insulativity is covered or there is restriction in the microminiaturization of the conductive particle that the insulativity particle adheres to being used for, and in the situation that microcircuit connects, for guarantee insulating property with guarantee to be connected number of particles all can not be satisfactory.And, forming by tackiness agent in the routine techniques that prevents short circuit, in the situation that microcircuit connects, can not guarantee insulating property and electrical connection properties simultaneously satisfactorily.And, in patent documentation 6, have peeling off wadding and single or multiple conductive particles being arranged in embodiment in the described recess of recess although disclose to be pre-formed, and unexposed with its attached on the bonding coat to form the embodiment of anisotropic conductive adhesive sheet.In fact, be difficult to one conductive particle is arranged in than in more shallow each recess of the particle diameter of described conductive particle.On the contrary, although single conductive particle can be arranged in, also be difficult to attached on the described bonding coat than in darker each recess of the particle diameter of described conductive particle.As a result of, the anisotropic electroconductive binder of gained can not satisfy and guarantees insulating property simultaneously and be connected number of particles.And, because disclosed anisotropic conductive adhesive sheet is based on by conductive particle is clipped in and guarantees electroconductibility between the terminal in patent documentation 7, guarantee the technological thought of insulating property simultaneously by fixing conductive particle, the spacing between the particle diameter of conductive particle, the adjacent conductive particle and the film thickness of anisotropic conductive adhesive sheet are necessary for essentially identical value.Therefore, in the slit transversely of terminal to be connected, do not fill insulating resin, and insulating property can not be satisfactory.Because the amount of resin is few, the switching performance between terminal can not be satisfactory.From guaranteeing the angle of electroconductibility, the spacing between the adjacent conductive particle can not surpass the particle diameter of described conductive particle, particularly under the situation that microcircuit connects, is difficult to satisfy simultaneously and guarantees insulating property and guarantee electrical connection properties.
Patent documentation 1: the spy opens flat 6-349339 communique
Patent documentation 2: specially permit communique No. 2895872
Patent documentation 3: specially permit communique No. 2062735
Patent documentation 4: the spy opens flat 6-45024 communique
Patent documentation 5: specially permit communique No. 3165477
Patent documentation 6: special table 2002-519473 communique
Patent documentation 7: specially permit flat 2-117980 communique
Summary of the invention
The purpose of this invention is to provide a kind of anisotropic conductive adhesive sheet, this sheet material can be realized good electrical connection properties, and can not damage the insulating property between the adjacent circuit of microcircuit, and its preparation method is provided and has used its syndeton body.
As the result of further investigation to address the above problem, discoveries such as the inventor can solve described problem by using anisotropic conductive adhesive sheet, this sheet material is characterised in that the conductive particle with specific median size is present in the specified range, and can not contact with the conductive particle of specified proportion at least.Particularly, the invention provides following aspect:
(1) a kind of anisotropic conductive adhesive sheet, this sheet material comprises solidifying agent, solidified nature insulating resin and conductive particle at least, wherein, number is present in 2.0 times the zone of median size that the thickness that extends along thickness direction from a surface of described anisotropic conductive adhesive sheet is less than or equal to described conductive particle more than or equal to 90% described conductive particle, and number does not contact with other conductive particle more than or equal to 90% described conductive particle and exists; The median size of described conductive particle is 1 μ m～8 μ m, and the average grain spacing between the adjacent conductive particle is at least 1 times～5 times of described median size and is less than or equal to 20 μ m; The thickness of described anisotropic conductive adhesive sheet is at least 1.5 times of described average grain spacing but is less than or equal to 40 μ m.
(2) according to (1) described anisotropic conductive adhesive sheet, wherein said conductive particle is at least a particle that is selected from by in the alloying pellet of the metallic particles of the resin particle of precious metal lining, precious metal lining, metallic particles, precious metal lining and the group that alloying pellet is formed.
(3) a kind of method for preparing anisotropic conductive adhesive sheet, this method be included in can be biaxial stretch-formed film on bonding coat is set to form laminate, the conductive particle of filling median size thick and fast and be 1 μ m～8 μ m on described laminate is to form the conductive particle coherent film, biaxial stretch-formed and keep described conductive particle coherent film, so that the average grain spacing between the adjacent conductive particle is at least 1 times～5 times of median size of described conductive particle and is less than or equal to 20 μ m, and described conductive particle transferred on the adhesive sheet, described adhesive sheet comprises solidifying agent and solidified nature insulating resin and thickness at least and is at least 1.5 times of average grain spacing between described conductive particle but is less than or equal to 40 μ m.
(4) according to (3) described method, wherein said film that can be biaxial stretch-formed is that long film and described adhesive sheet are long adhesive sheet.
(5) a kind of electronic circuit component that uses anisotropic conductive adhesive sheet will have meticulous splicing ear is electrically connected to the method on the circuit card with corresponding with it circuit, this method comprises uses 1 or 2 described anisotropic conductive adhesive sheets described electronic circuit component to be electrically connected on the circuit card with corresponding with it circuit, the height of the described meticulous splicing ear of wherein said electronic circuit component is 3 times～15 times of the average grain spacing between conductive particle and is less than or equal to 40 μ m, spacing between described meticulous splicing ear is 1 times～10 times of described average grain spacing and is less than or equal to 40 μ m, and the pitch between described meticulous splicing ear is 3 times～30 times of described average grain spacing and is less than or equal to 80 μ m.
(6) the meticulous syndeton body that obtains by (5) described method.
Anisotropic electroconductive binder of the present invention and syndeton body have the good insulation performance characteristic between adjacent circuit, and have good electrical connection properties between junction circuit.The present invention has also brought into play above-mentioned effect especially in the connection of microcircuit.
Embodiment
To specifically describe the present invention below.
At first, the conductive particle among description the present invention.In the present invention, although can use hitherto known conductive particle, the preferred at least a conductive particle that is selected from by in the alloying pellet of the metallic particles of the resin particle of precious metal lining, precious metal lining, metallic particles, precious metal lining and the group that alloying pellet is formed that uses.More preferably, these particles have and are less than or equal to 500 ℃ fusing point.As the resin particle of described precious metal lining, the preferred use with nickel and golden spherical particle with this polystyrene that is covered in proper order, benzo guanamine, polymethylmethacrylate etc.As the metallic particles of described precious metal lining, the preferred use at outermost layer uses precious metal as gold, palladium and the metal of rhodium lining such as the metallic particles of nickel and copper; As the alloying pellet of described precious metal lining, the preferred use at the outermost layer following alloying pellet of precious metal as gold, palladium and rhodium lining.As coating method, can use film forming method such as vapour deposition method and sputtering method, pass through dry type blended lining method or damp process such as non-electrolytic plating method and metalliding.From the angle of producing in batches, preferred non-electrolytic plating method.As metallic particles and alloying pellet, preferably use one or both or the two or more metal that is selected from as particle silver-colored, copper and mickel.As alloying pellet, the preferred fusing point that uses is less than or equal to 500 ℃ low melting point alloy particles, and, owing to can between splicing ear, form metallic bond, so, more preferably use fusing point to be less than or equal to 350 ℃ low melting point alloy particles from the angle of connection reliability.When using low melting point alloy particles, preferably with described particulate surfaces that is covered in advance such as fusing assistants.Preferably be covered with so-called fusing assistant, this is because can remove lip-deep oxide compound etc.As solubility promoter, can use lipid acid etc., as sylvic acid.
The median size of described conductive particle and the ratio of maximum particle diameter are preferably and are less than or equal to 2, more preferably are less than or equal to 1.5.The size distribution of preferred described conductive particle is very narrow, and the geometric standard deviation of the size distribution of described conductive particle is preferably 1.2～2.5, and more preferably 1.2～1.4.If geometric standard deviation is in the above-mentioned value, then can reduce the variation of particle diameter.Usually, when having constant clearance between two terminals that connected, think that then particle diameter is average, the conductive particle function is just more effective.
The described geometric standard deviation of size distribution is meant the value that the σ value (particle size values when 84.13% accumulation) with size distribution obtains divided by the particle size values when 50% accumulates.When the X-coordinate that particle diameter (logarithm) is set at grain size distribution curve, and with accumulated value (per-cent, accumulation number ratio, logarithm) when being set at ordinate zou, described size distribution is essentially straight line, and described size distribution is followed lognormal distribution.Described accumulated value be meant with per-cent represent have specified particle diameter and less than the number of this size particles and the ratio of all numbers of particles.By the steepness of recently representing size distribution of σ (particle size values when 84.13% accumulates) with median size (particle size values when 50% accumulates).The σ value is the value of being read by plotted value in measured value or the above-mentioned curve.Can use hitherto known method and apparatus to measure median size and size distribution,, can use wet type size distribution meter, laser size distribution meter etc. in order to measure.Perhaps, can use the described particles of observation such as electron microscope, and can calculate described median size and size distribution.Can use laser size distribution meter to obtain median size and size distribution among the present invention.
The median size of conductive particle is 1 μ m～8 μ m, is preferably 2 μ m～6 μ m.From the viewpoint of insulating property, be preferably and be less than or equal to 8 μ m, and be not vulnerable to the influence of the height change etc. of splicing ear etc.; From the viewpoint that is electrically connected, be preferably more than or equal 1 μ m.
With adjacent conductive particulate average grain spacing is to be less than or equal to 20 μ m and to be 1 times～5 times of median size, is preferably 1.5 times～3 times.Particle flow when preventing to connect and the particle that causes condense and guarantee the viewpoint of insulating property, and preferred described average grain spacing is not less than median size; And from the viewpoint of meticulous connection, preferred described average grain spacing is less than or equal to 5 times of median size.
In the present invention, the adjacent conductive particle is meant and immediate 6 particles of optional conductive particle.It is as follows to be used to the method measured with adjacent conductive particulate average grain spacing.
The photo that opticmicroscope for shooting amplifies is selected any 20 particles, measures immediate each other 6 particulate spacings, calculates all mean value and as described average grain spacing.
The thickness of described anisotropic conductive adhesive sheet is at least 1.5 times of described average grain spacing and is less than or equal to 40 μ m, and is preferably the twice at least of described average grain spacing but is less than or equal to 40 μ m.From the viewpoint of mechanical strength of joint, be preferably greater than or equal 1.5 times; Viewpoint from the connection granule number that prevents to cause owing to the particle flow the connection reduces preferably is less than or equal to 40 μ m.Comprise the component of solidifying agent and solidified nature insulating resin with respect to 100 mass parts, the combined amount of conductive particle is preferably 0.5 mass parts～20 mass parts, more preferably 1 mass parts～10 mass parts.From the viewpoint of insulating property, preferably be less than or equal to 20 mass parts; With viewpoint, be preferably greater than or equal 0.5 mass parts from electrical connection properties.
Then, anisotropic conductive adhesive sheet of the present invention will be described.In anisotropic conductive adhesive sheet of the present invention, number is present in 2.0 times the zone of median size that the thickness that extends along thickness direction from a side surface of described anisotropic conductive adhesive sheet is less than or equal to described conductive particle more than or equal to 90% conductive particle; Yet, preferred number is present in more than or equal to 90% conductive particle in 1.5 times the zone, more preferably greater than or equal in the zone that 95% conductive particle is present in 2.0 times, further be preferably greater than or equal in the zone that 95% conductive particle is present in 1.5 times.Particularly, when median size is 3.0 μ m, " in 2.0 times zone " is meant that the thickness in anisotropic conductive composition is in the zone of 6.0 μ m, and " conductive particle more than or equal to 90% is present in the described zone " is meant being present in the layer that thickness is 6.0 μ m more than or equal to 90% of described conductive particle sum.In anisotropic conductive adhesive sheet of the present invention, thickness direction with respect to anisotropic conductive adhesive sheet, as the position that has conductive particle, use the positional value of 100 conductive particles of selection at random with the measurements such as laser microscope of energy measurement focus direction displacement.Simultaneously, also can measure the quantity of the conductive particle that does not contact and exist with other conductive particles.When using described laser microscope to measure the displacement of focus direction, the resolving power of its displacement measurement is preferably and is less than or equal to 0.1 μ m, more preferably is less than or equal to 0.01 μ m.As the median size of conductive particle, use in independent values of measuring in advance such as laser size distribution.The thickness of anisotropic conductive adhesive sheet of the present invention is preferably 3 times～20 times of median size of described conductive particle, more preferably 5 times～10 times.From the bond strength aspect of syndeton body, thickness is preferably greater than or equals 3 times; From the switching performance aspect, preferably less than 20 times.From the switching performance aspect, have 2.0 times the zone that is less than or equal to described conductive particle median size more than or equal to 90% conductive particle among the present invention and preferably be in the outside of centre portions on the thickness direction of described conductive adhesive sheet, more preferably the partially conductive particle is exposed on the surface of described anisotropic conductive adhesive sheet.2.0 times the zone that is less than or equal to described conductive particle median size is located on the thickness direction in the scope of surperficial preferred 1/2, the more preferably 1/3 described sheet thickness of described conductive sheet.Also preferred partially conductive particle is exposed on the surface of described anisotropic conductive adhesive sheet.
Then, will describe the method for the anisotropic conductive adhesive sheet of preparation, described sheet material is characterised in that conductive particle of the present invention is not to contact with other conductive particles and to exist.In the present invention, " conductive particle does not exist not contact with other conductive particles " be meant each conductive particle Individual existence and not aggegation.Below, can use the phraseology of " Individual existence " or " particle separately " in order to represent this meaning.Although can use the method for currently known methods as preparation anisotropic conductive adhesive sheet of the present invention, but the method that is preferably as follows: the individual layer conductive particle is arranged on stretchable film or the sheet material, by its stretching being disperseed and arranging described conductive particle, and they are transferred at least on the adhesive sheet that is made of solidifying agent and solidified nature insulating resin, keep described stretched state simultaneously.As stretchable film, although can use known resin molding etc., but preferably use homopolymer or multipolymers such as polyvinyl resin, acrylic resin, vibrin, polyvinyl alcohol resin, polyvinyl butyral resin, polyvinylidene dichloride resin, or such as soft and stretchable resin moldings such as rubber sheets such as paracril, polybutadiene rubber, silicon rubber.Special optimization polypropylene resin and vibrin.Expansion and contraction after the stretching is preferably and is less than or equal to 10%, more preferably is less than or equal to 5%.
As dispersion on stretchable film, arrangement and the fixing method of conductive particle, can use currently known methods.For example, can adopt following method: on stretchable film, form the bonding coat comprise thermoplastic resin at least, contact and adhere to conductive particle, and use rubber rollers it to be arranged with individual layer thereon by applied load.In this case, in order seamlessly to fill described conductive particle, preferably repeat repeatedly to adhere to and the roll-in step.Because under the situation of spherical conductive particle, the closeest filling is stable structure, so can relatively easily fill described conductive particle.Perhaps, can make with the following method: with adhesive coated to the described stretchable film to form bonding coat, adhere to conductive particle thereon, can repeat if desired to adhere to for several times so that the method that distributes and arrange described conductive particle with individual layer; But make stretched film charged, conductive particle is disperseed with individual layer and the method for adhering to etc.
But,, preferably use biaxial stretch-formed device from the angle of homodisperse and arrangement although can use the method for currently known methods as the stretched film that is arranged with the individual layer conductive particle thereon of being used for stretching.From the angle of intergranular spacing, extensibility is preferably 80%～400%, and more preferably 100%～300%.100% stretches is meant that along the length partly that is stretched of draw direction be 100% of the preceding film length that stretches.Although draw direction is arbitrarily, the angle that preferably stretches is 90 ° biaxial stretch-formed, and preferably stretches simultaneously.Although draw direction is arbitrarily, the angle that preferably stretches is 90 ° biaxial stretch-formed, and preferably stretches simultaneously.Under biaxial stretch-formed situation, the extensibility on each direction can be identical or different.As biaxial stretch-formed device, preferred twin shaft is continuously elongated device simultaneously.
Although can use known devices, preferably wherein will grow by chuck fixing means that the limit is fixed and stretch simultaneously to carry out continuously elongated tentering type drawing machine in the distance between with them on length and the width as twin shaft continuously elongated device simultaneously.As the regulative mode of extensibility, although can use approach screw or pantograph mode, from the viewpoint of sharpness of regulation, more preferably pantograph mode.In Jia Re the pulled out condition, preferably the preheating zone is set at the same time, and the heat setting district is set in the back of stretched portion in the front of stretched portion.
But as the state of described conductive particle dispersion and arrangement being prepared the method for anisotropic conductive adhesive sheet by wherein stretching by arrangement individual layer conductive particle on stretched film and with it; preferably make with the following method: the previously prepared adhesive sheet that is made of the solidified nature insulating resin is at least carried out lamination, and transferring conductive particle or comprise the binding property film of conductive particle.Can use the solution and the drying that wherein comprise insulating resin at least with dispersion and ordered state coating, but the method that then anisotropic conductive adhesive sheet is stripped down from described stretched film etc.
Anisotropic conductive adhesive sheet of the present invention can be single sheet or lamination sheet material, in this lamination sheet material, will not comprise conductive particle but the adhesive sheet that comprises insulating resin at least carries out lamination.The film thickness of the adhesive sheet of institute's lamination preferably is thinner than the film thickness of the adhesive sheet that comprises conductive particle.
As employed solidified nature insulating resin among the present invention, can use thermosetting resin, light-cured resin, thermoset and light-cured resin and electron(beam)curing resin.In order to be easy to processing, preferably use thermoset insulating resin.Although can use Resins, epoxy, acrylic resin etc. as thermosetting resin, Resins, epoxy is particularly preferred.Described Resins, epoxy is to have the compound of at least 2 epoxy group(ing) in 1 molecule, and have the compound of glycidyl ether, glycidyl ester group or alicyclic epoxy base and wherein the two keys in the molecule be preferred by epoxidised compound.Particularly, can use bisphenol A type epoxy resin, bisphenol f type epoxy resin, naphthalene type Resins, epoxy, phenolic varnish phenol type Resins, epoxy or its modified epoxy.
Employed solidifying agent can be for solidifying any solidifying agent of above-mentioned thermoset insulating resin among the present invention.When using thermosetting resin as the solidified nature insulating resin, preferably can be the time more than or equal to 100 ℃ and described thermosetting resin react with its solidified reagent.Under the situation of Resins, epoxy, viewpoint from storge quality, preferred latent curing agent, for example, can use imidazole curing agent, capsule type imidazole curing agent, cation curing agent, free radical curing agent, Lewis acid solidifying agent, amine imide solidifying agent, polyamine salt solidifying agent or hydrazides solidifying agent etc.From the viewpoint of storge quality and low-temp reaction, preferred described capsule type imidazole curing agent.
For anisotropic conductive adhesive sheet of the present invention, except that solidifying agent and solidified nature insulating resin, but mixed thermoplastic resin etc. also.By the mixed thermoplastic resin, be easy to form sheet material.The combined amount of this moment is preferably 200 quality % of the component that is combined into smaller or equal to solidifying agent and solidified nature insulating resin, more preferably smaller or equal to 100 quality %.The thermoplastic resin that may be combined among the present invention is phenoxy resin, polyvinyl acetal resin, polyvinyl butyral resin, alkylating celluosic resin, vibrin, acrylic resin, styrene resin, urethane resin, pet resin etc.This resin can optionally use separately or two kinds or be used in combination.In these resins,, preferably has the resin of polar group such as hydroxyl and carboxyl from the viewpoint of adhesion strength.And preferred described thermoplastic resin comprises one or more glass transition points more than or equal to 80 ℃ thermoplastic resin.
In anisotropic conductive adhesive sheet of the present invention, can in said components, be mixed into additive.In order to improve the binding property between anisotropic conductive adhesive sheet and dirt settling, can be mixed into coupling agent as additive.As described coupling agent, although can use silane coupling agent, titanium coupling agent or aluminum coupling agent, the preferred silane coupling agent.As silane coupling agent, can use γ-glycidoxypropyltrimewasxysilane, γ-glycidoxypropyl triethoxyl silane, γ-sulfydryl Trimethoxy silane, gamma-amino propyl trimethoxy silicane, beta-aminoethyl-gamma-amino propyl trimethoxy silicane, γ-urea groups propyl trimethoxy silicane etc.Based on the solidifying agent of 100 mass parts and the mixture of solidified nature insulating resin, the combined amount of described coupling agent is preferably 0.01 mass parts～1 mass parts.From improving fusible angle, be preferably greater than or equal 0.01 mass parts, from the angle of reliability, preferably be less than or equal to 1 mass parts.
In addition, in order to prevent when absorbing moisture because the ionic component in the anisotropic conductive adhesive sheet causes the insulativity reduction, can the hybrid ionic trapping agent as additive.As described ion capturing agent,, preferably has the inorganic ion exchanger of excellent heat resistance although can use organic ion exchanger, inorganic ion exchanger or mineral ion absorption agent etc.As inorganic ion exchanger, can use zirconium compounds, zirconium-bismuth compound, antimony-bismuth compound, magnesium-aluminum compound etc.Although that the ionic type that is exchanged comprises is cationic, anionic and amphoteric ion type, but amphoteric ion type is preferred, because it can exchange the metal ion (positively charged ion) and the negatively charged ion that can directly cause ion migration simultaneously, described negatively charged ion can cause the rising of electroconductibility and the formation of metal ion.The median size of institute's blended ion capturing agent is preferably 0.01 μ m～5 μ m, more preferably 0.01 μ m～1 μ m.
Then, will the method for preparation anisotropic conductive adhesive sheet of the present invention be described.
At first, with bonding coat be arranged on can be biaxial stretch-formed film on to form laminate, with median size is that the conductive particle of 1 μ m～8 μ m closely is filled on the described laminate with preparation conductive particle coherent film, described conductive particle coherent film can be biaxial stretch-formed and be kept, so that the average grain spacing between conductive particle and the adjacent particle is at least 1～5 times of median size of described conductive particle and is equal to or less than 20 μ m, and described conductive particle transferred on the adhesive sheet, it is 1.5 times of the average grain spacing of described conductive particle or bigger and be less than or equal to 40 μ m that described adhesive sheet comprises solidifying agent and solidified nature insulating resin and thickness at least, to prepare anisotropic conductive adhesive sheet of the present invention.Preferably, but described biaxially-stretched film is long film, and described adhesive sheet also is long adhesive sheet.
Although in bonding coat, can use known tackiness agent, when the time carry out preferably using non-heat cross-linking tackiness agent when biaxial stretch-formed in heating.Particularly, can be used singly or in combination natural rubber latex tackiness agent, synthetic latex tackiness agent, synthetic resin emulsion tackiness agent, silicone adhesive agent, vinyl-vinyl acetate copolymer tackiness agent etc.As the binding property of tackiness agent, the stripping strength on the surface of the surface metal of employed conductive particle is preferably 0.5gf/cm～40gf/cm, more preferably 1gf/cm～20gf/cm.As measuring method, can make with the following method: preparation is coated with the sheet glass of metal, and described metal has the composition identical with the surface metal of described conductive particle, and bonding width is 2cm and the film that is coated with tackiness agent, measures 90 ° of stripping strengths.When bonding conductive particle with when stretching described film, from keeping the viewpoint of described conductive particle, stripping strength is preferably more than or equals 0.5gf/cm; From after stretching with the viewpoint of transfer of granules to described adhesive sheet, stripping strength is preferably and is less than or equal to 40gf/cm.The thickness of bonding coat is preferably 1/50 times～2 times of median size of employed conductive particle, more preferably 1/10 times～1 times.When bonding described conductive particle with when stretching described film, from keeping the viewpoint of described conductive particle, described thickness be preferably more than or equal described conductive particle median size 1/50; And from after stretching with the viewpoint of transfer of granules to described adhesive sheet, described thickness is preferably and is less than or equal to 2 times.As the method that forms described bonding coat, can make with the following method: use hitherto known method, be coated with coatings such as machine as intaglio plate formula coating machine, die coater, scraper type coating machine, rod and be dispersed or dissolved in tackiness agent in solvent or the water, and carry out drying.When the coated heat molten type adhesive, can carry out solvent-free roller coat.
As tight filled conductive particulate method, can use aforesaid method, in the method, but conductive particle disperseed and be arranged on the stretched film and fix.
The film thickness of the described film in back of stretching is preferably 1/10 times～1 times of film thickness summation of the support membrane of the adhesive sheet that is used to shift and described adhesive sheet, more preferably 1/5 times～1/2 times.From the viewpoint of the described film of stretching aftertreatment, described film thickness is preferably more than or equals 1/10 of described film thickness summation; And from after stretching with the viewpoint of transfer of granules to adhesive sheet, described film thickness is preferably be less than or equal to 1 times of described film thickness summation.
The invention still further relates to the electronic circuit component that uses anisotropic conductive adhesive sheet will have meticulous splicing ear and be electrically connected to method on the circuit card with circuit corresponding with described electronic circuit component.In described meticulous method of attachment, the height of the meticulous splicing ear of described electronic circuit component is 3～15 times of the average grain spacing of described conductive particle but is less than or equal to 40 μ m, spacing between described meticulous splicing ear is 1～10 times of average grain spacing but is less than or equal to 40 μ m, and the pitch of described meticulous splicing ear is 3～30 times of the average grain spacing of described conductive particle but is less than or equal to 80 μ m.Use anisotropic conductive adhesive sheet of the present invention that electronic circuit component is electrically connected on the circuit card with circuit corresponding with described electronic circuit component.
The height of described splicing ear is 3～15 times of the average grain spacing of described conductive particle but is less than or equal to 40 μ m, is preferably 4～10 times.From the physical strength of described syndeton body, be preferably greater than or equal 3 times; With from following viewpoint: the moving of the conductive particle that causes owing to the resin flows of the adhesive sheet that takes place during being connected, owing to the reduction of the switching performance that causes in the reduction of the conductive particle number of splicing ear bottom, be present in the reduction of the insulating property that move and cause owing to condensing of the conductive particle in the zone except that connecting zone preferably is less than or equal to 15 times and be less than or equal to 40 μ m.Spacing between splicing ear is 1～10 times of average grain spacing and is less than or equal to 40 μ m, is preferably 1～10 times and be less than or equal to 20 μ m, more preferably 2～5 times but be less than or equal to 15 μ m.From the viewpoint of insulating property, be preferably more than or equal 1 times, from the viewpoint of meticulous connection, preferably be less than or equal to 10 times and be less than or equal to 40 μ m.Described pitch is 3～30 times of described average grain spacing and is less than or equal to 80 μ m, is preferably 5～20 times and be less than or equal to 40 μ m.From the viewpoint of switching performance, be preferably more than or equal 3 times; From the viewpoint of meticulous connection, preferably be less than or equal to 30 times and be less than or equal to 80 μ m.
The invention still further relates to the meticulous syndeton body that connects by above-mentioned meticulous method of attachment.
Use the material of the circuit card of anisotropic conductive adhesive sheet connection of the present invention can be organic radical plate or inorganic substrate.As organic substrate, can use polyimide film substrate, polyamide membrane substrate, poly (ether sulfone) film substrate, by Resins, epoxy being injected into the rigid substrates that makes in the woven fiber glass or by bismaleimides-cyanate resin being injected into rigid substrates that makes in the woven fiber glass etc.As inorganic substrate, can use silicon substrate, glass substrate, aluminium base or aluminium nitride substrate etc.As the wiring material that is used for wiring substrate, can use inorganic wiring material, as tin indium oxide or indium zinc oxide etc.; The metal wiring material is as gold-plated copper, chromium-copper, aluminium and golden projection; Compound wiring material wherein covers inorganic wiring material such as tin indium oxide with metallic substance such as aluminium and chromium, etc.
From the viewpoint of electrical insulation capability, the spacing among the present invention between the employed junction circuit is preferably 3 times～500 times of median size of conductive particle.Be used between the junction circuit of the present invention, with the connection area of connected circuit part be preferably above-mentioned median size value square 1 times～10000 times.From the angle of switching performance, be preferably 2 times～100 times especially.
Anisotropic conductive adhesive sheet of the present invention or syndeton body of the present invention can be used for display equipment is connected on the wiring board as liquid-crystal display, plasma display and electroluminescent display; The electronic unit such as the LSI of these devices are installed; Other devices are connected on the wiring board; With installation electronic unit such as LSI.In the aforementioned display device device, described anisotropic conductive adhesive sheet or described syndeton body suitably can be used for the plasma display system and the el display device of requirement reliability.
Below, reference example and comparative example are described in further detail the present invention.
Embodiment 1
In the mixed solvent (ratio of mixture is 1: 1) of ethyl acetate-toluene, dissolving 37g phenoxy resin (glass transition point: 98 ℃, number-average molecular weight: 14000), 26g bisphenol-A type Resins, epoxy (epoxy equivalent (weight): the viscosity in the time of 190,25 ℃: 14000mPaS) and γ-glycidoxypropyltrimewasxysilane of 0.3g to have solids content be 50% solution to make.
In solids content is 50% described solution, mixes and also disperse 37g to comprise the dive liquid epoxies of imidazole curing agent (median size of microcapsule: 5 μ m, activation temperature: 125 ℃) of microcapsule-type.Then, dispersion liquid is applied on the polyethylene terephthalate film that thickness is 50 μ m, dries dry 15 minutes to obtain the membranaceous adhesive sheet that film thickness is 20 μ m at 60 ℃.
Be 45 μ m and be coated with on the non-stretching polypropylene screen of the nitrile rubber that thickness is 5 μ m-methyl methacrylate graft copolymer tackiness agent that the coating median size is that the gold-plated plastic grain of individual layer of 3.0 μ m makes very close to each other basically at thickness.Particularly, prepare the container of width greater than described film width, thereby and in container, be paved with gold-plated plastic grain and have multi-layered thickness, the surface that is coated with tackiness agent is pressed onto film on the gold-plated particle down to adhere, then, use the scraper of making by non-woven fabrics to scrape off the particle of surplus.By this process is repeated twice, obtained gapless single coating film.Use laser size distribution instrument (HELOS SYSTEM is made by JEOL) to measure the size distribution of described gold-plated plastic grain in advance, and the value when getting 50% accumulated value is as median size.Use respectively has biaxial stretch-formed device (the tension type biaxial stretch-formed device in the bight of pantograph mode of 10 chucks on vertical and horizontal, X6H-S by the manufacturing of Japan smart machine society) fixing described film, 150 ℃ of preheatings 120 seconds, then, the speed with 20%/second respectively stretches 100% and fixing on vertical and horizontal.With after the adhesive sheet lamination is on the stretched film, described adhesive sheet is stripped down to obtain anisotropic conductive adhesive sheet.Select 100 particles the conductive particle from the anisotropic conductive adhesive sheet of gained at random, and use can be at the laser microscope (VK9500 of focus direction Displacement Measurement, make shape measure resolving power by Keyence Corporation: 0.01 μ m) measure apart from the distance on described anisotropic conductive adhesive sheet surface.As a result of, 95% conductive particle is present on the film thickness direction of described anisotropic conductive adhesive sheet in the layer in 5.5 mu m ranges as can be known.In 100 measured conductive particles, the 92%th, independent particle.Intergranular described average headway is 4.17 μ m, and this spacing is 1.39 times of median size.
Embodiment 2
In the mixed solvent (ratio of mixture is 1: 1) of ethyl acetate-toluene, dissolving 42g phenoxy resin (second-order transition temperature: 45 ℃, 12000), γ-urea groups propyl trimethoxy silicane of 32g naphthalene type Resins, epoxy (epoxy equivalent (weight): 136, semisolid) and 0.06g is 50% solution to make solids content number-average molecular weight:.In solids content is 50% described solution, mixes and also disperse 26g to comprise the dive liquid epoxies of imidazole curing agent (median size of microcapsule: 5 μ m, activation temperature: 125 ℃) of microcapsule-type.Then, dispersion liquid is applied on the polyethylene terephthalate film that thickness is 50 μ m, dries dry 15 minutes to obtain the membranaceous adhesive sheet that film thickness is 15 μ m at 60 ℃.
Be 45 μ m and be coated with on the non-stretching polypropylene screen of the nitrile rubber that thickness is 5 μ m-methyl methacrylate graft copolymer tackiness agent at thickness, with embodiment 1 in same way as coating median size be that the gold-plated plastic grain of individual layer of 2.5 μ m makes very close to each other basically.With with embodiment 1 in identical mode, use biaxial stretch-formed device that described film is respectively stretched 120% and fixing on vertical and horizontal.With after the adhesive sheet lamination is on the stretched film, described adhesive sheet is stripped down to obtain anisotropic conductive adhesive sheet.Select 100 particles the conductive particle from the anisotropic conductive adhesive sheet of gained at random, and use laser displacement gauge to measure apart from the distance on the surface of described anisotropic conductive adhesive sheet.As a result of, 95% described conductive particle is present on the film thickness direction of described anisotropic conductive adhesive sheet in the layer in 4.8 mu m ranges as can be known.In 100 measured conductive particles, the 91%th, independent particle.Intergranular average headway is 4.24 μ m, and this spacing is 1.70 times of median size.
Embodiment 3
In the mixed solvent (ratio of mixture is 1: 1) of ethyl acetate-toluene, dissolving 15g phenoxy resin (second-order transition temperature: 45 ℃, 12000), 24g phenoxy resin (second-order transition temperature: 98 ℃ number-average molecular weight:, 14000), γ-glycidoxypropyl triethoxyl silane of 26g naphthalene type Resins, epoxy (epoxy equivalent (weight) is 136, semisolid) and 0.1g is 50% solution to make solids content number-average molecular weight:.In solids content is 50% described solution, mixes and also disperse 35g to comprise the dive liquid epoxies of imidazole curing agent (median size of microcapsule: 5 μ m, activation temperature: 125 ℃) of microcapsule-type.Then, described dispersion liquid is applied on the polyethylene terephthalate film that thickness is 50 μ m, dries dry 15 minutes to obtain the membranaceous adhesive sheet A that film thickness is 15 μ m at 60 ℃.
Then, except the polyethylene terephthalate film of easy lift-off processing had been carried out in use, having obtained film thickness in the same manner as described above was the membranaceous adhesive sheet B of 5 μ m.
Be 45 μ m and be coated with on the non-stretching polypropylene screen of the nitrile rubber that thickness is 5 μ m-methyl methacrylate graft copolymer tackiness agent at thickness, with embodiment 1 in identical mode to be coated with median size be that the gold-plated nickel particle of individual layer of 2.6 μ m makes very close to each other basically.With with embodiment 1 in identical mode, use biaxial stretch-formed device that described film is respectively stretched 200% and fixing on vertical and horizontal.With after adhesive sheet A lamination is on the stretched film, release adhesive, with adhesive sheet B lamination to the stripper surface to obtain anisotropic conductive adhesive sheet.Select 100 particles the conductive particle from the anisotropic conductive adhesive sheet of gained at random, and use laser displacement gauge to measure apart from the distance on the surface of described anisotropic conductive adhesive sheet.As a result of, 95% conductive particle is present on the film thickness direction of described anisotropic conductive adhesive sheet in the layer in 4.9 mu m ranges as can be known.In 100 measured conductive particles, the 91%th, independent particle.Intergranular average headway is 7.22 μ m, and this spacing is 2.77 times of median size.
Comparative example 1
In the mixed solvent (ratio of mixture is 1: 1) of ethyl acetate-toluene, dissolving 37g phenoxy resin (second-order transition temperature: 98 ℃, number-average molecular weight: 14000), the 26g bisphenol A type epoxy resin (epoxy equivalent (weight): the viscosity in the time of 190,25 ℃: 14000mPaS) and γ-glycidoxypropyltrimewasxysilane of 0.3g be 50% solution to make solids content.
In solids content was 50% described solution, mixing and disperseing 37g to comprise the dive liquid epoxies and the 2.0g median size of imidazole curing agent (median size of microcapsule: 5 μ m, activation temperature: 125 ℃) of microcapsule-type was the gold-plated plastic grain of 3.0 μ m.Then, dispersion liquid is applied on the polyethylene terephthalate film that thickness is 50 μ m, dries dry 15 minutes to obtain the membranaceous anisotropic adhesive sheet that film thickness is 20 μ m at 60 ℃.
Select 100 particles the conductive particle from the anisotropic conductive adhesive sheet of gained at random, and use laser displacement gauge to measure apart from the distance on the surface of described anisotropic conductive adhesive sheet.As a result of, conductive particle is present on the film thickness direction of described anisotropic conductive adhesive sheet at random as can be known.In 100 measured conductive particles, the 75%th, independent particle.
Comparative example 2
In the mixed solvent (ratio of mixture is 1: 1) of ethyl acetate-toluene, dissolving 42g phenoxy resin (second-order transition temperature: 45 ℃, 12000), γ-urea groups propyl trimethoxy silicane of 32g naphthalene type Resins, epoxy (epoxy equivalent (weight) is 136, semisolid) and 0.06g is 50% solution to make solids content number-average molecular weight:.In solids content is 50% described solution, mixes and also disperse 26g to comprise microcapsule-type the dive liquid epoxies of imidazole curing agent (median size of microcapsule: 5 μ m, activation temperature: 125 ℃) and the gold-plated nickel particle that the 6.0g median size is 2.6 μ m.Then, dispersion liquid is applied on the polyethylene terephthalate film that thickness is 50 μ m, dries dry 15 minutes to obtain the membranaceous anisotropic adhesive sheet that film thickness is 20 μ m at 60 ℃.
Select 100 particles the conductive particle from the anisotropic conductive adhesive sheet of gained at random, and use laser displacement gauge to measure apart from the distance on the surface of described anisotropic conductive adhesive sheet.As a result of, conductive particle is present on the film thickness direction of described anisotropic conductive adhesive sheet at random as can be known.In 100 measured conductive particles, the 70%th, independent particle.
Comparative example 3
Except using median size is the gold-plated plastic grain of 10 μ m, and sheet material is stretched beyond 60%, with embodiment 1 in identical mode obtain anisotropic conductive adhesive sheet.Select 100 particles the conductive particle from the anisotropic conductive adhesive sheet of gained at random, and use laser displacement gauge to measure apart from the distance on the surface of described anisotropic conductive adhesive sheet.As a result of, 96% described conductive particle is present on the film thickness direction of described anisotropic conductive adhesive sheet in the layer in 19.2 mu m ranges as can be known.
In 100 measured conductive particles, the 93%th, independent particle.Intergranular average headway is 8.52 μ m, and this spacing is 0.85 times of median size.
(measuring method that connects resistance value)
At width is that 1.6mm and length are the silicon chip (thickness: after forming oxide film on whole surface 0.5mm) of 15.1mm, in peripheral part meter 40 μ m, on long limit and minor face, form separately that width is that 74.5 μ m and length are 175 and 16 the aluminium films (1000 dust) of 120 μ m respectively, make that each intermembranous spacing is 0.1 μ m.Width is that 25 μ m and length are two golden projections (thickness: 15 μ m) so that spacing is 15 μ m of 100 μ m in order respectively to form separately on these aluminium films; at golden projection allocation position is that 10 μ m and length are on the part the opening of 85 μ m except that width with interior part from peripheral part meter 7.5 μ m; use usual method, on the whole surface except that above-mentioned opening, form the polyimide protective membrane.Then, form above-mentioned golden projection as the test substrate.
At thickness is on the non-alkali glass of 0.7mm, form tin indium oxide (the thickness: (width: 66 μ m of connection liner 1400 dusts), length: 120 μ m) thus with described aluminium film on golden projection become a pair of position relation and be connected, described aluminium film is adjacent with golden projection on above-mentioned aluminium film.20 golden projections of each connection, and on above-mentioned connection liner, form the wiring lead that approaches tin indium oxide, and (titanium: 1%, 3000 dust) conduct connects the evaluation substrate to form thin aluminium-titanium film on described wiring lead.Estimate on the substrate in above-mentioned connection, interim bonding width is that 2mm and length are the anisotropic electroconductive adhesive sheet material of 17mm, thereby cover whole connection liner, and use width as the sticking head of the pressure of 2.5mm under the 0.3MPa in 80 ℃ of compactings after 3 seconds, the basement membrane of polyethylene terephthalate is stripped down.Place the test substrate thereon, thus the position of arrange above-mentioned connection liner and golden projection and under 5.2MPa 220 ℃ of 5 seconds of crimping.After crimping, use the ohmer of 4-terminal method to measure resistance value between above-mentioned wiring lead (daisy chains of 20 golden projections) as connecting resistance value.
(measuring method of insulation resistance)
At thickness is on the non-alkali glass of 0.7mm, can position connected to one another relation form indium tin oxides film (the thickness: (width: 65 μ m, length: 120 μ m) of connection liner 1400 dusts) with 2 golden projections on the above-mentioned aluminium film.Form the connection distribution of thin tin indium oxide, make 5 to connect liners and can alternately connect, and form thin indium tin oxides film other connect distributions, make 5 connect that liners can alternately connect so that they in pairs and form comb pattern.Connect on the distribution at each, form the wiring lead of thin indium tin oxides film, and on described wiring lead, form the aluminium-titanium film (titanium: 1%, 3000 dust) estimate substrate that approaches as insulating property.Estimate on the substrate in above-mentioned insulating property, interim bonding width is that 2mm and length are the anisotropic electroconductive adhesive sheet material of 17mm, thereby cover whole connection liner, and use width as the bonding head of 2.5mm under the 0.3MPa in 80 ℃ of compactings after 3 seconds, the basement membrane of polyethylene terephthalate is stripped down.Place the test substrate thereon, thus the position of arrange above-mentioned connection liner and golden projection and under 2.6MPa in 220 ℃ of 5 seconds of crimping with as the insulation resistance test substrate.
When under 60 ℃ and 90% relative humidity, keeping described insulation resistance test substrate, use the power supply of constant voltage constant current between paired wiring lead, to apply the volts DS of 100V.Measured the once insulation resistance between these distributions in per 5 minutes, and to measure up to described insulating resistance value be that time when being less than or equal to 10M Ω is as the insulation reduction time.To work as the described insulation time of reducing is assessed as * (poor) less than 240 hours situation, is to be assessed as zero (good) more than or equal to 240 hours situation with the described time;
Top the results are shown in the table 1.
[table 1]
| Connect resistance value (Ω) | Insulation resistance test | |
| Embodiment 1 | 12.4 | Zero (good) |
| Embodiment 2 | 11.9 | Zero (good) |
| Embodiment 3 | 13.5 | Zero (good) |
| Comparative example 1 | 26.2 | * (poor) (short circuit) |
| Comparative example 2 | 14.0 | * (poor) (short circuit, initial stage) |
| Comparative example 3 | 13.1 | * (poor) (short circuit, initial stage) |
By table 1 obviously as can be known, anisotropic electroconductive binder according to the present invention has demonstrated very excellent insulating reliability.
Industrial applicibility
Anisotropic conductive adhesive sheet according to the present invention demonstrates low resistance and the high insulating reliability of connecting, and is suitable for connecting material and as the connection material that is used for high meticulous display equipment etc. as the nude film that requires microcircuit to connect.
Claims (6)
1. anisotropic conductive adhesive sheet, this sheet material comprises solidifying agent, solidified nature insulating resin and conductive particle at least, wherein, number is present in 2.0 times the zone of median size that the thickness that extends along thickness direction from a surface of described anisotropic conductive adhesive sheet is less than or equal to described conductive particle more than or equal to 90% described conductive particle, and number does not contact with other conductive particle more than or equal to 90% described conductive particle and exists; The median size of described conductive particle is 1 μ m～8 μ m, and the average grain spacing between the adjacent conductive particle is at least 1 times～5 times of described median size and is less than or equal to 20 μ m; The thickness of described anisotropic conductive adhesive sheet is at least 1.5 times of described average grain spacing but is less than or equal to 40 μ m.
2. anisotropic conductive adhesive sheet as claimed in claim 1, wherein said conductive particle are at least a particle that is selected from by in the alloying pellet of the metallic particles of the resin particle of precious metal lining, precious metal lining, metallic particles, precious metal lining and the group that alloying pellet is formed.
3. method for preparing anisotropic conductive adhesive sheet, this method be included in can be biaxial stretch-formed film on bonding coat is set to form laminate, the conductive particle of filling median size thick and fast and be 1 μ m～8 μ m on described laminate is to form the conductive particle coherent film, biaxial stretch-formed and keep described conductive particle coherent film, so that the average grain spacing between the adjacent conductive particle is at least 1 times～5 times of median size of described conductive particle and is less than or equal to 20 μ m, and described conductive particle transferred on the adhesive sheet, described adhesive sheet comprises solidifying agent and solidified nature insulating resin and thickness at least and is at least 1.5 times of average grain spacing between described conductive particle but is less than or equal to 40 μ m.
4. method as claimed in claim 3, wherein said film that can be biaxial stretch-formed is that long film and described adhesive sheet are long adhesive sheet.
5. an electronic circuit component that uses anisotropic conductive adhesive sheet will have meticulous splicing ear is electrically connected to the method on the circuit card with corresponding with it circuit, this method comprises uses claim 1 or 2 described anisotropic conductive adhesive sheets described electronic circuit component to be electrically connected on the circuit card with corresponding with it circuit, the height of the described meticulous splicing ear of wherein said electronic circuit component is 3 times～15 times of the average grain spacing between conductive particle and is less than or equal to 40 μ m, spacing between described meticulous splicing ear is 1 times～10 times of described average grain spacing and is less than or equal to 40 μ m, and the pitch between described meticulous splicing ear is 3 times～30 times of described average grain spacing and is less than or equal to 80 μ m.
6. the meticulous syndeton body that obtains by the described method of claim 5.
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- 2004-12-02 US US10/595,914 patent/US20070175579A1/en not_active Abandoned
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Also Published As
| Publication number | Publication date |
|---|---|
| CN101483080A (en) | 2009-07-15 |
| KR20060097737A (en) | 2006-09-14 |
| JP4822322B2 (en) | 2011-11-24 |
| US20110114256A1 (en) | 2011-05-19 |
| WO2005054388A1 (en) | 2005-06-16 |
| CN100537689C (en) | 2009-09-09 |
| JP5057594B2 (en) | 2012-10-24 |
| JP2011236427A (en) | 2011-11-24 |
| US8084083B2 (en) | 2011-12-27 |
| JP2011091049A (en) | 2011-05-06 |
| US20070175579A1 (en) | 2007-08-02 |
| KR100709640B1 (en) | 2007-04-24 |
| JPWO2005054388A1 (en) | 2010-02-04 |
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