CN1886307A

CN1886307A - Flexible tube comprising an electronic component

Info

Publication number: CN1886307A
Application number: CNA2004800350781A
Authority: CN
Inventors: A·凯梅纳尔
Original assignee: Cebal SAS
Current assignee: Albea Tubes France SAS
Priority date: 2003-11-28
Filing date: 2004-11-24
Publication date: 2006-12-27
Also published as: FR2862946A1

Abstract

The invention relates to a flexible tube head (40, 40') comprising a dispensing port which is defined by an edge (41, 41') and a shoulder (42, 42'), said shoulder connecting the edge to the flexible skirt (30) of the tube. The invention is characterised in that it comprises an electronic module (20) which can be used for the electrically contactless exchange of information with a read or read/write device, normally a Radio Frequency Identification (RFID) type component.

Description

The flexible tube of being furnished with electronic building brick

Technical field

[01] the present invention relates to flexible plastic pipe, relate more particularly to the pipe that himself and/or product that it held will stand logistics (logistique) monitoring.

[02] advantageously, the present invention not only can be applied to before sending to packing merchant the logistics monitoring to this pipe, also can be applicable to the monitoring of product that it is comprised,, thereby be easy to suffer counterfeit behavior because the value of the product that this pipe comprised is usually greater than pipe.

Background technology

[03] flexible plastic pipe can comprise information, and this information is imported by flexible tube maker in the manufacturing process of described pipe.Therefore, patent application document JP2003-165552 (LION company) discloses a kind of flexible tube, and this pipe is equipped with, and bar code or expression are used for the ornament of registered trade mark (RTM) of the detection of name of product---near final weld seam---.If necessary, information can be inconspicuous, for example, if use thermochromism or " maintaining secrecy " printing ink to print, and can only be at certain heat, effects such as ultraviolet irradiation just can be realized down.

[04] such Technology Need is understood product information in advance when pipe is manufactured.Therefore, can not a kind of product that will be wrapped in the standard pipe of characterization, and this standard pipe can be used for other products.For example, if use UV printing ink to make a kind of ornament, this can perhaps on the fabric of laminated tube, perhaps on the cylinder that squeezes out (plastic pipe), use conventional printing equipment to finish in the process of making pipe.But in case pipe is sent to the packing merchant, information just can not be modified again, unless the client is equipped with expensive printing equipment.Therefore, in practice,, go out and be sent to the packing merchant, just be difficult in the additional information that coding is provided on the pipe or does not encode in case pipe is manufactured if not impossible words.

[05] the known technology that overcomes this problem is for printing the label encoding or not having to encode that comprises information needed, and it (for example is placed on the packing that comprises the flexible tube that is sent to packing merchant, be used for detector tube), or directly be placed on the skirt section of flexible tube (for example, being used for monitoring the product that is contained in pipe).But, use label to propose an important problem: be easy to remove it, thereby the product that will follow the information that it comprised from it to separate.

[06] patent application document KR2003-025624 (ID TECK Co., Ltd) discloses a kind of cover panel, the assembling of this cover panel has or not and electrically contacts electronic circuit, makes it to prevent to forge by the product that is held in the described cover panel institute osed top container by long-range read and write-in apparatus.Because it is oversize, it seems that such cover panel be not suitable for sealing standard-sized flexible tube (the skirt section diameter typically is 15-60mm, and recess diameter typically is 5-15mm).And in case container is opened, cover panel can be dropped or change at an easy rate.In this case, the risk that still has the contact of the associated product of the information that loses and information.

[07] patent document EP0697342 discloses a kind of flexible tube, this flexible tube is provided with anti-joyride device, this anti-joyride device is made of a passive interference element in field, this interference element is inserted between each layer of a multilayer structure making, this multilayer structure making is inserted in (the multilayer plug-in unit of transition between skirt section and shoulder, multilayer lid or the like on the described flexible tube ...).

[08] German patent application file DE 10 218 417 (TUBEX) discloses a kind of distributing box, this distributing box is made of flexible tube, molded removable top cover on this flexible tube, this removable top cover is assembled into and makes it can not be cancelled at the head of pipe substantially, this distributing box is provided with the electronic module radio responder type or magnetic stripe type, this module typically by the carrier as label be set at from the head can not be approaching the position in.

[09] applicant is intended to propose a kind of technique device, the feasible manufacturing that may guarantee to monitor pipe, and provide such possibility for packing merchant, promptly after the manufacturing of pipe, coding or noncoding authentic communication are provided on the product in being contained in pipe, and need not consider whether pipe is equipped with removable top cover, and in the whole cycle in service life of pipe, all do not lose the risk of described information.

Summary of the invention

[10] first purpose of the present invention provides a kind of head of flexible plastic pipe, it comprises an aperture, this aperture is by one side (41,41 ') and a shoulder (42,42 ') limit, this shoulder is connected to described limit the flexible skirt of described pipe, it is characterized in that, be fixed in the plastic material entity of the head that forms described pipe, the head of described flexible tube comprises an electronic module (20,20 '), this electronic module is used for the mode that electrically contacts with nothing and the information that exchanges at the exterior reading device of described pipe and/or read/write device on described pipe and/or its content.

[11] described electronic building brick make with for example with smart card, especially the information exchange of the external device (ED) of the type that mode provided of RFID (radio-frequency discriminating) becomes possibility, described external device (ED) will describe in detail hereinafter.This information can relate to pipe itself or relate to the product that is contained in the pipe.Because this assembly is arranged in the plastic material entity of the head that forms described pipe, it can be used in the commitment of manufacturing process, and can be when the manufacturing of the head of pipe, by showing, existence of special additive or the like is used for the monitoring of the manufacturing of pipe in the material in for example employed plastic material, employed skirt section structure, head or skirt section.

[12], and be sent to the packing merchant in case pipe is manufactured goes out, electronic building brick also can be used for making packaged product can be tracked (create conditions in the source of its assembly, storage before opening for the first time or the like ...).

[13] consider that independently electronic building brick also is possible, for example, be equipped with their energy and for example can carry out the function that the information by the data of handling from this same assembly starts.For example, this assembly can, based on method remote programmable or that control with product or the relevant parameter of packing, for example, by painted reagent, or diode or LCDs, demonstration information on the described packing on described product or the outer wall at packaging product.

[14] head of pipe has dispensing aperture and skirt section, and described dispensing aperture is fixed by the margin that is connected to described skirt section by shoulder.Described limit can be used to receive the cylindrical wall supporting of the neck of lid, and described neck is connected to the skirt section by shoulder, and described shoulder has the shape of overall basic circular cone.But as disclosed among the patent application document WO 02/28079, the head of pipe can not have cylindrical neck portion, and dispensing aperture can for example be arranged on the base portion place of the closure member that is superimposed upon on the described pipe, and is attached via a hinge to lid.Under such situation, described base portion is connected to flexible skirt to the limit that limits dispensing aperture, and also as shoulder.

[15] head of described pipe comprises described electronic building brick, and advantageously, described electronic building brick is arranged in the thickness of the thickness of shoulder and lid, if shoulder and lid exist.

[16] preferably, on the part of their thickness, by the molded integral piece that is implemented as of same plastic material, and described electronic building brick is fixed in the described plastic material entity at least for the limit in described aperture and described shoulder.On the one hand, this can make a shoulder---and this shoulder has in described skirt section and is in the part of described shoulder or the intact continuity of the material between the dispensing aperture in the whole thickness, and on the other hand, can simplify manufacturing: avoided making an intermediate member that comprises assembly, transmit this intermediate member, assemble this intermediate member, then it be soldered on the remainder of pipe.

[17] rfid system comprises a transceiver on the one hand, this transceiver---its control data is gathered and communication system---, and be connected to antenna, and comprise a RFID assembly on the other hand, described RFID assembly is made up of the radio responder that is connected to antenna.This radio responder is a radio-frequency (RF) identification label, and this radio-frequency (RF) identification label is programmed by electronics, to respond the next automatic transmission signals of interrogation signal that it is received.The antenna of RFID assembly is the lead that is connected to label.It receives radio signals, to start radio responder, to write or to read data.Antenna can have a lot of forms.Generally speaking, antenna is to use the form of the coil of electrically conductive ink screen printing (s é rigraphi é es) on plastic carrier (typically be epoxy resin or saturated polyester, for example, polybutyleneterephthalate), and radio responder also is connected to antenna.Coil can have circular or polygonal shape, typically is square or rectangle.In the latter's situation, when length during significantly greater than width, antenna has total elongated shape: hereinafter we will be referred to as " linear antenna " or " elongate antenna ".Connection between the branch of radio responder and antenna is protected by one deck plastic material usually, and described plastic material is generally epoxy resin, forms an additional thickness.

[18] preferably, described electronic building brick is arranged on the height place of the shoulder of pipe, in the plastic material entity of the head that forms pipe, contacts with the product that pipe will hold with label to prevent antenna.It is set in the plastic material entity, preferably, for example in the injection-molded of described head, need not to use bonding material.The condition in the injection mold cavities of being arranged on handle component depends on the shape of selected antenna.Wherein some will be described hereinafter.

[19] another object of the present invention is, a kind of method that is used to make the head of flexible tube is provided, it is characterized in that, use an electronic module, described electronic module can need not to electrically contact and with reading device and/or read/write device exchange message, described reading device and/or read/write device typically are RFID type electronic building brick, wherein, described electronic building brick (hereinafter referred to as " chip ") is set in the die cavity of the head that will be used to form described pipe, then, the head of described pipe is molded in described die cavity, thereby along with flowing of plastic material sealed described chip, makes the head and the chipset component of inseparable pipe thus.

[20] preferably, plastic material is injection-molded in described die cavity.Also can pass through the compression molded moulding, if employed electronic building brick is enough firm so that can bear the mechanical strees that is caused by such molding mode.No matter molded employing is injection-molded or pressure forming, and assembly is placed in the die cavity of the head that will be used to form described pipe.The head of described pipe comprises at least two parts, and described two parts can relative to each other move: the die cavity of die defines the outside face of shoulder and neck, and the head of punch defines the inside face of shoulder and neck.Usually, neck must have the screw thread on its outer wall, this just feasible necessary die that uses, and described die itself is grouped into by a plurality of movable parts, and described moveable part is moved away from each other, for example, by radial motion, to impel peeling off of the part that is spirally connected.

[21] in order to prevent and will to be preferably in and not use adhesive agent when connecting this assembly by the chemically inconsistent risk of the product of tube packaging.In this case, preferably determine the configuration of how much chips and the position in die cavity, thereby chip will be less than the possibility that moves and be out of shape when molded.The example that hereinafter provides illustrates two embodiment, wherein, and the molded operation of electronic building brick supporting time of its injection, and do not move substantially or distortion.

[22] preferably, described electronic building brick is placed on the trochoidal surface of projection of nose of punch, and device for molding is configured such that punch is positioned at the below of die.Thereby electronic building brick can be brought to the top of nose of punch, and is positioned by simple action of gravity.

[23] plastic material that is used for the head of molded tube is common employed plastic material, typically is the polyethylene of high density, lower density or intermediate density.Preferably, injection-molded is carried out under 240 ℃ to 250 ℃ temperature.

[24] select to have gross thickness (carrier+by the formed additional thickness of welding protective layer) less than 400 microns assemblies, thereby, described assembly not with the outside or the interior side contacts of pipe.Like this, just needn't change the common thickness of the shoulder of standard flexible tube.

[25] the common electronic building brick that provides is to make with the thermosetting resin carrier of epoxy type on the market.They can have all possible size.If the restriction relevant with the scope of message pick-up not too limited to, just can directly adopt the compact package on the market, this compact package is " embedded " in the injection of plastic material entities.Yet because must avoid using bonding material, the accurate location of this miniature electric assembly may go wrong, thereby makes this assembly for example can be set at the ad-hoc location of mould.

[26] why Here it is it seems is selected bigger assembly to have advantage, because bigger assembly has bigger range of receiving.These electronic building bricks must have can resist the machinery that caused by the plastic material that melts and the carrier of thermal stress in molding process.It can be pure mechanical that handle component is arranged in the plastic material of head of pipe: target just embeds the periphery of carrier and centers in the molded plastic material of described assembly.The setting of electronic building brick also can be undertaken by welding, in this case, adopt at least in part by the carrier that constitutes with the plastic material of described head compatible material under molten state, the material of described formation carrier typically is high density polyethylene (HDPE) or polypropylene.Such material [38] Fig. 4 illustrates the tape that is used for dish type chip high speed with holes is placed to the device chamber that makes that the head of pipe can be molded.

[39] Fig. 5 illustrates the axial cross section of this device for molding: before the head of molded tube, plug is assembled upper skirt, and dish type chip with holes has been placed on the trochoidal surface of projection of described plug head.

[40] Fig. 6 illustrates the axial cross section of the head that is molded into the pipe on the skirt section, and comprises the dish type chip with holes in the shoulder thickness.

The specific embodiment

[41] example 1---and superposable die is on the skirt section and be equipped with the head (Fig. 1-3) of the pipe of elongated electronic building brick

[42] in this embodiment, adopted the particular geometric configuration that on the skirt section, produces by the head superposable die of pipe, and the end in its skirt section must be stretched in the cavity of (d é border) mould.The end, skirt section that this stretches into is used as stop part, as the area supported of chip.

[43] Fig. 1 illustrates the tape that is used to device for molding that elongated chips is provided.Described tape is made by high density polyethylene (HDPE).Its edge portion 2 and 3 is perforated, to promote the moving forward of rule.Its central part is equipped with the rectangle perforation 4 of a large amount of separately frenulums (ligament) 5, on described frenulum, has been printed with elongate antenna by screen printing mode, and has laid radio responder in the centre of described frenulum.Radio responder is by being connected to antenna by the welding of protuberance 22 protections.In case come at its two ends 6 and 7 shearings, frenulum just becomes elongated electronic building brick 20, this elongated electronic building brick has carrier 21 and is made the radio responder of protection by a projection 22 slightly.Cause elongated electronic building brick 20 spontaneously to obtain certain curvature from the removing of remaining constrained force of shearing, this curvature impels it to be placed in the die cavity.For elongated chips, typically select 1/4 to 3/4 length of skirt section girth, be preferably 40 to 60%.

[44] Fig. 2 illustrates the axial cross section of plug 10, has laid elongated chips 20 on plug.This plug has cylindrical body 13, around this body skirt section 30 is installed, and comprises that the head of protuberance 14 is used to limit the inside face of neck, and protruding cone-shaped wall 11 is used to limit the inside face of the shoulder of pipe.Elongated chips 20 is laid near peripheral shoulder 12, and this periphery shoulder is with the outstanding end 31 stop collar connected in stars 15 in skirt section.The additional thickness that this periphery shoulder 12 is highly located corresponding to the head and the connection between the skirt section of pipe.Elongated chips 20 contacts with the skirt section inwall.In injection process, install at the outshot in skirt section, and make it deeply, thereby a distal process in skirt section goes out, and be closed in by the head of punch and the die cavity of die and limited in the die cavity that forms.Plastic material---under injection effect or under the extrusion effect---contacts with the end in skirt section.Under a temperature that is higher than their dimension card (Vicat) softening points separately, the plastic material in described head and skirt section is closely welding mutually, and need not to drop in addition heat or material.After exerting pressure a little (about several seconds) and cooling off, described head is molded into the size of wanting and is welded on the skirt section securely.

[33] another object of the present invention is, a kind of method of making flexible tube is provided, described flexible tube has assembled the head of pipe, wherein, the head of described pipe is molded on the end in skirt section, it is characterized in that, electronic module is set on the head of punch, contact with the end in skirt section in overflowing into die cavity, described electronic module can with reading device or read/write device exchange message, described reading device or read/write device typically are the RFID electronic building brick.

[34] in this embodiment of the present invention, the outstanding end in skirt section is used to " location (caler) " described electronic building brick, and described electronic building brick comprises radio responder and antenna: electronic building brick is set on the head of punch, contacts with the end in skirt section.Electronic building brick can be the chip on enough heavy and epoxy type carrier rigidity, thereby, providing of chip can provide by simply piling up: this piles up setting to a mould relatively, chip at this base portion that piles up is removed, and drop in the die cavity by gravity, contact with the end in skirt section then.Also can select linear antenna, preferably, described linear antenna is on the thermoplastic material carrier.Chip is placed by automatic holding device.The flexibility of chip is enough to follow the curvature that the end, skirt section is applied when placing.And, preferably, select the longest possible linear antenna (having half the length that equals diameter at least), to reduce when the plastic material of fusing arrives caused stress and to move.If necessary, the detection range of antenna can be adjusted by the quantity that increases coil.

Description of drawings

[35] Fig. 1 illustrates the tape that is used for elongated chips is placed at a high speed the chamber of the device that the head that makes pipe can be molded.

[36] Fig. 2 illustrates the axial cross section of the part of this device for molding: before the head of molded tube, plug is assembled upper skirt, and an elongated chips has been placed on the described plug head.

[37] Fig. 3 illustrates an axonometric drawing of the head of described pipe, and this axonometric drawing has a local radial section-drawing, and described head superposable die and is included in elongated chips in the shoulder thickness on the skirt section.

[38] Fig. 4 illustrates the tape that is used for dish type chip high speed with holes is placed to the device chamber that makes that the head of pipe can be molded.

The specific embodiment

[44] Fig. 2 illustrates the axial cross section of plug 10, has laid elongated chips 20 on plug.This plug has cylindrical body 13, around this body skirt section 30 is installed, and comprises that the head of protuberance 14 is used to limit the inside face of neck, and protruding cone-shaped wall 11 is used to limit the inside face of the shoulder of pipe.Elongated chips 20 is laid near peripheral shoulder 12, and this periphery shoulder is with the outstanding end 31 stop collar connected in stars 15 in skirt section.The additional thickness that this periphery shoulder 12 is highly located corresponding to the head and the connection between the skirt section of pipe.Elongated chips 20 contacts with the skirt section inwall.In injection process, before softened owing to heat the outstanding end in skirt section, elongated chips contacted with the outstanding end in skirt section on its whole length.

[45] Fig. 3 illustrates shaft side figure, comprises the part radial cross-section of the head 40 of pipe.It has neck 41 and described neck is connected to the shoulder 42 in skirt section 30.Can find that the elongated chips 20 in the thickness of shoulder is in the height place corresponding to the head of pipe and the bonded assembly additional thickness between the skirt section.

[46] example 2---be furnished with the head of the pipe of a dish type electronic building brick of boring a hole.

[47] in this example, but the head indistinction ground of pipe by independent molded or superposable die on the skirt section.

[48] Fig. 4 illustrates tape 1 ', and this tape is used to device for molding to provide to have the dish type chip in hole.This tape is made by high density polyethylene (HDPE).Its edge portion 2 ' and 3 ' is perforated, so that the moving forward of rule.Its central part is equipped with a large amount of antennas 23 ', and described antenna has the cardinal principle circle by the serigraphy printing, and is connected to radio responder.Tape 1 ' is sheared according to two circumference 6 ' and 7 ' around circular antenna.Thereby the dish type electronic building brick 20 ' that has the hole that is obtained has carrier 21 ', and on this carrier, antenna 23 ' is printed, and it comprises the radio responder itself to antenna of being welded to connect by pressurized protruding 22 ' protection.

[49] for chip can be used, and need not to consider size and dimension (cylindrical, oval, polygon skirt section or the like of pipe ...), in shear circumference diameter be selected to normal diameter greater than the maximum of dispensing aperture, the diameter of shearing circumference outward then is selected to the standard flexible skirt diameter less than minimum.And preferably, if projection by directed up, sheared circumference 6 ' and is provided with in radio responder and its protectiveness projection 22 ' more are close to, on the contrary, if projection is by directed down, the then more close outer circumference 7 ' of shearing is provided with.Like this, the projection 22 ' of protection welding, in molding process not with the wall uninterrupted contact of instrument, thereby be protected, avoid being subjected to the influence of caused mechanical strees when two parts of instrument are closed mutually.

[50] Fig. 5 illustrates the axial cross section of mould, comprises plug 10 and matrix 16.The dish type chip 20 ' that has a hole has been placed in around protuberance 14 on the protruding frustum of a cone side 11 of head of plug 10.It may be noted that at die and punch and close that assembly must adopt frusto-conical, to adhere in the described chamber with after forming die cavity 17.This distortion can cause the expansion near the contraction of the part of internal diameter and close outer radius portion.By means of a kind of carrier of special rigidity, epoxy resin thick-layer or even as the enough thick carrier of making by high density polyethylene (HDPE) in this example, advantageously, at least be installed on radially sealing near in the zone of internal diameter, so that the part of isolating mutually can move freely thus, thereby avoids uneven partly in the reducing process (se chevaucher).As in the described flexible program 1 hereinafter,, can under harmless situation, form frustum: be certain to produce ripple, but keep being embedded in the plastic material entity of head of pipe if carrier is thin and be flexible.

[51] Fig. 6 illustrates the axial cross section of the head 40 ' that is molded in the pipe on the skirt section.It has neck 41 ' and described neck is connected to the shoulder 42 ' in skirt section 30.Chip can have the dish type 20 ' that has the hole, and described dish type embeds in the thickness of shoulder.

[52] flexible program 1 of example 2:

[53] this flexible program relates to one has the embodiment of slight difference with the foregoing description.

[54] replace to use the tape of Fig. 4, can use a distribution tape, on this distribution tape, this assembly---its manufactured and be sheared into suitable dimensions---by a tack coat by bonding, thereby be beneficial to by simply peeling off separately them.In this case, carrier can be thinner, made by more flexible material (for example, low density polyethylene (LDPE)).The surface of supporting antenna is covered by described bonding material in its periphery.Thereby, before molded, assembly is brought to the mould place by advancing of described distribution tape, then, by simply peeling off described assembly is separated from the tape that faces die cavity, and for example drop in the cutting of mould by action of gravity and the effect by sucker, the surface of being made by thermoplastic material abuts on the scored surface of mould.In molded operation, the plastic material of fusing covers the side comprise antenna and tack coat: because the periphery of described assembly is not covered by described bonding material, it is embedded into the head of pipe, with the plastic material closed contact of the head of pipe.

[55] flexible program 2 of example 2:

[56] this flexible program also relates to another embodiment different with the foregoing description.

[57] replace among use Fig. 4 or the assembly described in first flexible program, used because other reason must be inserted into the assembly or the plug-in unit of the head of pipe: thereby, for example, the integral piece plug-in unit of being made by the multilayer material of PBT (polybutyleneterephthalate) or thermo forming is placed in the height place of shoulder, with the oxygen of the head that reduces pipe or the transmissibility of water vapour.For example, a carrier that can be used as electronic building brick as the multilayered barrier described in the EP-B-0524 897: antenna is printed on a side with respect to the inboard that will be exposed to pipe by serigraphy, preferably, die cavity carries out in the zone that will remain on shoulder, radio responder is placed and welds, thereby radio responder is connected to antenna.Then, make plug-in unit by hot forming.

[58] in a single day make, chip card is collected and is stacked up.Like this, just can provide the same mode of barrier plug that chip card is transferred in the head device for molding of pipe: mould piles up placement with respect to plug-in unit, is positioned at the plug-in unit that piles up base portion and is separated, and drop in the die cavity by gravity.This technology is known and is applied to inserting the barrier plug of the head of dentifrice tube.

[59] advantage

[60] this manufacture method comprises at high speed step insertion electronic building brick: there is no need repeatedly to add chip.Carry out with the speed that adapts with industrial speed and to insert, and the plug-in unit placing device exists, for example be used for barrier plug is inserted the plug-in unit placing device of dentifrice tube.

[61] in the plastic material entity of the head of chip buried formation pipe: electronic building brick can be maintained secrecy in good condition, does not exist and will pack the inconsistent problem of local specialties.

Claims

1. the head of flexible tube (40,40 '), it comprises an aperture, and this aperture is by (41,41) and a shoulder (42,42 ') qualification on one side, and this shoulder is connected to the flexible skirt of described pipe to described limit,

It is characterized in that, be fixed in the plastic material entity of the head that forms described pipe, the head of described flexible tube comprises an electronic module (20,20 '), this electronic module is used for the mode that electrically contacts with nothing and the information that exchanges at the exterior reading device of described pipe and/or read/write device on described pipe and/or its content.

2. the head of pipe according to claim 1, the head of described pipe comprises that one can stop up the pivot caps in described aperture, and described electronic building brick is fixed in the plastic material entity that constitutes described lid.

3. the head of pipe according to claim 1 is characterized in that, described electronic building brick is set at the locating of described shoulder of described pipe, is arranged in the plastic material entity of the head that constitutes described pipe.

4. according to the head of each described pipe in the claim 1 to 3, it is characterized in that described electronic building brick has the gross thickness less than 400 microns.

5. according to the head of each described pipe in the claim 1 to 4, it is characterized in that the periphery of the carrier of described electronic building brick (21,21 ') is sealed by the plastic material of the head of described pipe.

6. according to the head of each described pipe in the claim 1 to 5, it is characterized in that the carrier of described electronic building brick (21,21 ') is at least in part by constituting with the plastic material of the head of described pipe compatible material under molten state.

7. the head of pipe according to claim 6 is characterized in that, the carrier of described electronic building brick is made by polyethylene or polypropylene.

8. according to the head of claim 6 or 7 described pipes, it is characterized in that, with the plastic material of the head of described pipe compatible material under molten state be an outer field form, this skin belongs to the inwall of the shoulder of described pipe.

9. make the method for the head of flexible tube, it is characterized in that, described method is used an electronic module (20,20 '), mode and a reading device or read/write device exchange message that described electronic module can electrically contact with nothing, described reading device or read/write device typically are RFID type electronic building brick; And described electronic building brick is set in the die cavity (17) of the head that will be used to realize described pipe; Then, the head of molded described pipe, described plastic material flows, thus the described electronic building brick of embedding, and then make inseparable assembly set.

10. the method for the head of manufacturing flexible tube according to claim 9 is characterized in that, by the head of the described pipe of injection-molded.

11. the method according to the head of claim 9 or 10 described manufacturing flexible tubies is characterized in that described electronic building brick is placed in the die cavity of the head that will implement described pipe, and need not to be kept by any bonding material.

12. method according to the head of each described manufacturing flexible tube in the claim 9 to 11, it is characterized in that, described electronic building brick is placed on the protruding trochoidal surface (11) of head of punch (10), and device for molding is configured such that described punch (10) is positioned at the below of die (16).

13. method according to the head of each described manufacturing flexible tube in the claim 9 to 12, it is characterized in that, described electronic building brick (20,20 ') has a carrier (21,21 '), described carrier comprises one by the skin made from the plastic material of the head of described pipe compatible plastic material under molten state; And described electronic building brick is placed on the protruding trochoidal surface (11) of head of described punch (10), makes the described protruding trochoidal surface of described outer layer surface facing to described punch simultaneously.

14. the method according to the head of each described manufacturing flexible tube in the claim 9 to 13 is characterized in that described electronic building brick (20 ') has a carrier, this carrier has the dish type of heart perforate therein; And described electronic building brick is provided with around the protuberance (14) of described punch, and described punch is used to form the inboard of described neck.

15. flexible tube, it comprises the head and the flexible skirt of pipe, it is characterized in that, the head of described pipe is fixed in the plastic material entity of the head that constitutes described pipe, be preferably located in the height place of described shoulder, the head of described pipe comprises an electronic module, a mode that described electronic module can electrically contact with nothing and a reading device or the information of read/write device exchange on described pipe and/or its content, described reading device or read/write device typically are RFID (radio-frequency discriminating) electronic building brick.

16. make the method for the flexible tube that is provided with a head (40) and a skirt section (30), wherein, described head superposable die is on the end (31) in described skirt section, partly install around the so-called punch of mould in described skirt section, described punch is inserted into the depths, thereby an end (31) in described skirt section is outstanding, and be closed in the die cavity that die cavity limited (17) by the head of described punch (10) and described die (16)

It is characterized in that, one electronic module (20)---its mode that can electrically contact with nothing and the reading device or the read/write device exchange message that typically are RFID type electronic building brick---is set on the head (11) of described punch (10), the described skirt section (30) that reclining, in described die cavity (17) outstanding end (31).