JP2021066508A - Method for manufacturing synthetic resin member, and synthetic resin member - Google Patents

Abstract

To provide a method for manufacturing a synthetic resin member which can simplify a manufacturing process without exposing an embedded member such as RFID to an outer surface or an inner surface, and a synthetic resin member.SOLUTION: A method for manufacturing a synthetic resin member (synthetic resin container 1) having a cylindrical side part 4 and a blocking part (bottom 7) for blocking a lower end of the side part 4 includes a step of covering an embedded member (RFID 8) with a synthetic resin and forming a covering member 30, a step of arranging the covering member 30 in a cavity 11 of a molding die 10 of the synthetic resin member, and a step of filling the inside of the cavity 11 with a synthetic resin forming the synthetic resin member. The embedded member is arranged so as to be off-set in a thickness direction of the covering member 30, and the covering member 30 is arranged so that a surface opposite to the side where the embedded member is off-set is brought into closer contact with the inner surface of the cavity 11 than the surface where the embedded member is off-set.SELECTED DRAWING: Figure 5B

Description

The present disclosure relates to a method for manufacturing a synthetic resin member and a synthetic resin member.

In recent years, counterfeit products such as high-class cosmetics have been distributed, and development of a method for discriminating genuine products is required. To solve such problems, for example, a non-contact IC tag called RFID (Radio Frequency Identification) is mounted on a container, and various data are written / read to the RFID using a dedicated communication device. As a result, it has been proposed to manage products and physical distribution (for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2006-232292

In the container described in Patent Document 1, an electronic tag 8 is arranged on the inner surface of the bottom 7 of the container main body 2 in order to improve the design of the container. However, since the electronic tag 8 is sealed and fixed to the container main body 2 by the protective member 9, a special process such as a sealing step of sealing with the protective member 9 is added, so that there is room for improvement. there were.

The present disclosure has been made in view of such problems, and an object thereof is a synthetic resin capable of simplifying a manufacturing process without exposing an embedded member such as RFID to the outer surface or the inner surface. It is an object of the present invention to provide a manufacturing method of a manufacturing member and a synthetic resin member.

The method for manufacturing the synthetic resin member of the present disclosure is as follows.
Cylindrical side and
A method for manufacturing a synthetic resin member including a closing portion that closes the upper end portion or the lower end portion of the side portion.
The step of coating the buried member with synthetic resin to form the covering member,
The step of arranging the covering member in the cavity of the molding die of the synthetic resin member, and
Including a step of filling the cavity with a synthetic resin forming the synthetic resin member.
The buried member is arranged so as to be offset in the thickness direction of the covering member.
The covering member is characterized in that a surface opposite to the side on which the embedded member is offset is arranged so as to be closer to the inner surface of the cavity than a surface on the side on which the embedded member is offset. ..

Further, in the method for manufacturing a synthetic resin member of the present disclosure, in the above configuration, it is preferable that the embedded member is exposed on the surface of the covering member on the side where the embedded member is offset.

Further, in the method for manufacturing a synthetic resin member of the present disclosure, in the above configuration, the covering member is preferably a plate-shaped member embedded in either the side portion or the closed portion.

Further, in the method for manufacturing a synthetic resin member of the present disclosure, in the above configuration, the wall thickness of the portion of the synthetic resin member on which the covering member is arranged is preferably thicker than the thickness of the covering member.

Further, in the method for manufacturing a synthetic resin member of the present disclosure, in the above configuration, the synthetic resin covering the embedded member has the same main material as the synthetic resin filled in the molding die of the synthetic resin member. Is preferable.

Further, in the method for manufacturing a synthetic resin member of the present disclosure, in the above configuration, the surface of the covering member opposite to the side on which the embedded member is offset is a movable mold in the molding die of the synthetic resin member. It is preferably arranged so as to face the mold.

Further, in the method for manufacturing a synthetic resin member of the present disclosure, in the above configuration, in the step of forming the covering member, the buried member is adsorbed on the inner surface of the molding die of the covering member. It is preferable to include a step of filling the synthetic resin to be coated.

Further, in the method for manufacturing a synthetic resin member of the present disclosure, it is preferable that the embedded member is RFID in the above configuration.

In addition, the synthetic resin member of the present disclosure is
Cylindrical side and
A closed portion that closes the upper end or lower end of the side portion, and a closed portion.
A synthetic resin member including a covering member embedded in the side portion or the closing portion.
The covering member has a buried member coated with a synthetic resin, and the buried member is arranged so as to be offset in the thickness direction of the covering member.
The covering member is arranged so that the surface opposite to the side on which the embedded member is offset is closer to the surface of the synthetic resin member than the surface on the side on which the embedded member is offset. It is characterized by.

According to the present disclosure, a method for manufacturing a synthetic resin member and a synthetic resin member capable of simplifying the manufacturing process without exposing the embedded member such as RFID to the outer surface or the inner surface are provided. Can be done.

It is a front sectional view of the synthetic resin container formed by carrying out the manufacturing method of the synthetic resin member which is one Embodiment of this disclosure. It is a flowchart which shows the procedure which carries out the manufacturing method of the synthetic resin member which is one Embodiment of this disclosure. It is a perspective view of the covering member formed by carrying out the manufacturing method of the synthetic resin member which is one Embodiment of this disclosure. It is a figure which shows the molding die (state which RFID is adsorbed) of the covering member used for carrying out the manufacturing method of the synthetic resin member which is one Embodiment of this disclosure. It is a figure which shows the molding die (state which the synthetic resin which covers RFID is filled) of the covering member used for carrying out the manufacturing method of the synthetic resin member which is one Embodiment of this disclosure. It is a figure which shows the molding die (the state which the covering member is adsorbed) of the synthetic resin container used for carrying out the manufacturing method of the synthetic resin member which is one Embodiment of this disclosure. It is a figure which shows the molding die (state which the synthetic resin which forms a synthetic resin container is filled) of the synthetic resin container used for carrying out the manufacturing method of the synthetic resin member which is one Embodiment of this disclosure. It is a front sectional view of the synthetic resin container (an example at the time of mass production) formed by carrying out the manufacturing method of the synthetic resin member which is one Embodiment of this disclosure.

Hereinafter, the present disclosure will be described in more detail with reference to the drawings.

As shown in FIG. 1, the synthetic resin member (synthetic resin container 1) manufactured by the method for manufacturing a synthetic resin member according to the embodiment of the present disclosure has a tubular side whose diameter is reduced downward. A portion 4, a closing portion (bottom portion 7) that closes the lower end portion of the side portion 4, and a covering member 30 embedded in the bottom portion 7 are provided. In the present embodiment, the side portion 4 and the bottom portion 7 form a storage space S for the contents having a bottomed tubular shape. In the present embodiment, the covering member 30 has an RFID 8 as an embedded member. Note that FIG. 1 is a diagram in which only the characteristic portion is extracted for the sake of facilitating the description of the synthetic resin container 1 according to the present embodiment.

In the present specification, claims, and drawings, the vertical direction means upward and downward in a state where the synthetic resin container 1 is in an upright posture as shown in FIG. Therefore, in the molding die 10 of the synthetic resin container 1 shown in FIGS. 5A and 5B, the bottom portion 7 is molded so as to be located at the upper part of the drawing, so that the upper part of FIGS. 5A and 5B is the lower part. Further, the radial outer side is a direction toward the outside along a straight line perpendicular to the central axis O1 through the central axis O1 of the synthetic resin container 1 in FIG. 1, and the radial inner side is along the straight line. It shall mean the direction toward the central axis O1.

As shown in FIG. 1, the side portion 4 has a truncated cone side surface shape whose diameter is reduced downward. Further, a bottom portion 7 is integrally formed at the lower end portion of the side portion 4, and a storage space S for the contents is formed by the side portion 4 and the bottom portion 7. In the present embodiment, the upper end portion of the side portion 4 forms an opening for putting the contents in and out of the synthetic resin container 1. A male screw portion, an annular protrusion, or the like may be provided at the upper end portion of the side portion 4, and a lid, a pump, or the like may be attached to the upper end portion of the side portion 4 by screw engagement, plug engagement, or the like.

In the present embodiment, a covering member 30 in which RFID 8 (Radio Frequency Identification) as a buried member is coated with a synthetic resin is embedded in the bottom portion 7. As shown in FIG. 1, the covering member 30 and the RFID 8 are arranged at substantially the center position in the radial direction of the bottom portion 7. The RFID 8 is embedded in the bottom 7 without being exposed on the surface of the synthetic resin container 1.

The RFID 8 is arranged offset to the lower side in the thickness direction of the covering member 30 (lower side in FIG. 1), and the lower surface of the covering member 30 and the lower surface of the RFID 8 in FIG. 1 are substantially flush with each other. The surface of the covering member 30 opposite to the offset side (lower side of FIG. 1) of the RFID 8 (upper surface of the covering member 30 in FIG. 1) is the surface of the synthetic resin container 1 rather than the lower surface of the covering member 30. It is arranged so as to be close to. In the example of FIG. 1, the upper surface of the covering member 30 and the upper surface of the bottom portion 7 of the synthetic resin container 1 are substantially flush with each other.

The RFID 8 is a non-contact type IC tag. By mounting the RFID 8 on a container, a cap, or the like and writing / reading various data to the RFID 8 using a dedicated communication device, product management and distribution management It can be performed. In the present embodiment, the RFID 8 includes an IC chip having a function of a transmission / reception unit and a memory, an antenna for transmitting / receiving radio waves between a dedicated communication device and an information stored in the memory, and an IC chip and an antenna. It includes a fixed base sheet and a protective sheet that covers the IC chip and the antenna. In particular, the protective sheet is composed of a biaxially stretched sheet such as polyethylene terephthalate (PET) or polyethylene naphthalate, and the thickness is 50 microns or more, so that the IC chip and the antenna are heated by the injected molten resin material. And can be easily protected from pressure. However, the protective sheet is not limited to these aspects, and various other synthetic resins and the like capable of ensuring resistance to injection molding and weather resistance can be used, and the thickness can be arbitrarily determined. It can also be protected by coating the IC chip and antenna with ceramic.

In the present embodiment, the synthetic resin container 1 includes, for example, polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), PET copolymer (PETG, PCTA, PCTG, etc.), acrylonitrile, butadiene, styrene (ABS). ), Polyethylene (PC), polystyrene (PS) and other synthetic resin materials can be used as the main material. When polyethylene is used as the main material of the synthetic resin container 1, high-density polyethylene resin (HDPE), low-density polyethylene (LDPE), or the like can be used, and in particular, when high-density polyethylene resin is used, A synthetic resin container 1 having high rigidity and excellent impact resistance can be manufactured. Further, when low density polyethylene (LDPE) is used, the side portion 4 can be made flexible.

Further, for the covering portion 32 of the covering member 30, the synthetic resin used for forming the above-mentioned synthetic resin container 1 can be used as the main material. The synthetic resin main material used for the covering portion 32 may be different from the synthetic resin main material used for forming the synthetic resin container 1.

Next, a method of manufacturing the synthetic resin member according to the present embodiment will be described with reference to FIGS. 2 to 5B and the like.

In the present embodiment, when the synthetic resin container 1 is manufactured, first, the covering member 30 as an intermediate product in which the RFID 8 is coated with the synthetic resin is formed. As shown in FIG. 3, the covering member 30 includes an RFID 8 and a substantially disk-shaped covering portion 32 that covers the RFID 8. In the present embodiment, the thickness direction of the RFID 8 and the thickness direction of the covering member 30 are both the vertical direction of FIG. In the present embodiment, the thickness direction of the RFID 8 coincides with the thickness direction of the built-in IC chip and the base sheet. Further, the thickness direction of the covering member 30 is configured to coincide with the thickness direction of the RFID 8. The RFID 8 is formed so that the upper surface of the RFID 8 is exposed on the upper surface of the covering member 30 in FIG. The shape of the covering member 30 is not limited to the above example, and may be formed in a square plate shape according to, for example, the RFID 8. Further, it is not always necessary to expose the RFID 8 on one surface of the covering member 30, and the RFID 8 may be arranged so as to be offset in the thickness direction of the covering member 30.

The covering member 30 is formed by using the molding die 20 of the covering member 30. As shown in FIG. 4A, the molding die 20 of the covering member 30 includes a fixing mold 28 provided with a gate 28a for supplying the synthetic resin forming the covering portion 32 of the covering member 30 into the cavity 21, and the covering member. A cavity 21 in which the 30 is formed is provided, and a movable mold 27 capable of sucking and fixing the RFID 8 to the inner surface of the cavity 21 is provided.

When forming the covering member 30, first, the RFID 8 is fixed to the inner surface of the cavity 21 of the movable mold 27 in the molding mold 20 of the covering member 30 by suction (step S101). As shown in FIG. 4A, the RFID 8 is fixed by suction by sucking air in the direction of the arrow through a suction hole 27a provided in the movable mold 27 and communicating the inside of the cavity 21 with the outside of the molding mold 20. .. A recess or the like for positioning the RFID 8 may be provided on the movable mold 27 on the inner surface of the cavity 21.

Next, as shown in FIG. 4B, the movable mold 27 is moved in the direction of the arrow to align the fixed mold 28 with the parting lines, and then the synthetic resin constituting the covering portion 32 covering the RFID 8 from the gate 28a. Is supplied and filled in the cavity 21 (step S103). Then, after holding the pressure in the cavity 21 and cooling the molding die 20, the movable mold 27 is separated from the fixed mold 28, and the formed covering member 30 is released from the molding die 20. This completes the formation of the covering member 30 shown in FIG.

It is preferable that the synthetic resin covering the RFID 8 has the same main material as the synthetic resin constituting the synthetic resin container 1. By adopting such a configuration, the compatibility between the synthetic resin container 1 and the covering member 30 is enhanced, so that it is possible to prevent the covering member 30 from peeling off from the synthetic resin container 1. In particular, by making the synthetic resin that coats the RFID 8 the same resin as the synthetic resin that constitutes the synthetic resin container 1, the boundary between the covering member 30 and its surroundings is made inconspicuous, and the design of the synthetic resin container 1 is improved. Can be improved.

Since the RFID 8 is fixed to the inner surface of the cavity 21 of the movable mold 27, the RFID 8 is offset in the thickness direction of the covering member 30 (the left-right direction in FIG. 4B) in the space of the cavity 21 in FIG. 4B. Is placed. Further, since the RFID 8 is contact-fixed to the inner surface of the cavity 21, the covering member 30 formed by injecting synthetic resin into the cavity 21 exposes the RFID 8 on the surface of the covering member 30 on the side where the RFID 8 is offset. (See FIG. 3).

Next, the synthetic resin container 1 in which the covering member 30 formed in steps S101 to S103 is embedded in the bottom portion 7 is formed. To form the synthetic resin container 1, first, the covering member 30 is arranged in the cavity 11 of the molding die 10 of the synthetic resin container 1 (step S105). As shown in FIG. 5A, the covering member 30 is arranged in the molding die 10 on the surface of the molding die 10 of the synthetic resin container 1 facing the cavity 11. .. At this time, the covering member 30 is arranged so that the surface opposite to the side exposed to the surface by offsetting the RFID 8 in the thickness direction faces the inner surface of the cavity 11. As a result, the RFID 8 is separated from the inner surface of the cavity 11 by the amount of offset of the RFID 8 in the thickness direction of the covering member 30. Therefore, when the molding die 10 of the synthetic resin container 1 is filled with the synthetic resin, the RFID 8 can be more reliably embedded in the resin of the synthetic resin container 1.

The covering member 30 is arranged by suction fixing by sucking air through a suction hole 17a provided in the movable mold 17 and communicating the inside of the cavity 11 and the outside of the molding mold 10. A recess or the like for positioning the covering member 30 may be provided on the movable mold 17 on the inner surface of the cavity 11.

Next, as shown in FIG. 5B, the movable mold 17 is moved in the direction of the arrow to form a predetermined cavity 11, and then the synthetic resin forming the synthetic resin container 1 is supplied from the gate 18a to enter the cavity 11. (Step S107). Then, after holding the pressure in the cavity 11 and cooling the molding die 10, the movable die 17 is separated from the fixed die 18, and the formed synthetic resin container 1 is released from the molding die 10. Let me. This completes the formation of the synthetic resin container 1 shown in FIG.

As described above, the RFID 8 is separated from the inner surface of the cavity 11 by the amount of offset of the RFID 8 in the thickness direction of the covering member 30. Therefore, the RFID 8 can be more reliably separated from the surface of the synthetic resin container 1 and embedded in the resin.

In this embodiment, as shown in FIG. 5B, the lower surface of the bottom portion 7 is configured to be substantially flat, but the present embodiment is not limited to this embodiment. For example, a recess may be formed at a position facing the gate 18a in the center of the lower surface of the bottom portion 7. With such a configuration, even if a protruding portion (gate portion) protruding downward from the bottom portion 7 is formed by the gate 18a, the protruding portion is arranged in the recess so that the synthetic resin container 1 stands upright. It is possible to prevent the protrusion from coming into contact with the installation surface when the product is installed in a posture.

FIG. 6 is a diagram showing an example of the shape of the synthetic resin container 1 according to the present embodiment at the time of mass production. As shown in FIG. 6, the synthetic resin container 1 has a tubular mouth portion 3 for communicating with the storage space S of the contents and for taking in and out the contents, and a substantially cylindrical shape connected below the mouth portion 3. It includes a body portion 5 having a body portion 5, a bottom portion 7 that closes a lower end portion of the body portion 5, and a covering member 30 embedded in the bottom portion 7. A storage space S for the contents is partitioned by the body portion 5 and the bottom portion 7. The mouth portion 3 and the body portion 5 are both portions forming the side portion 4 of the synthetic resin container 1. In the present embodiment, the covering member 30 has an RFID 8 as an embedded member.

As shown in FIG. 6, the mouth portion 3 is provided with a substantially cylindrical outer peripheral wall 3b, and a male screw portion 3a for detachably mounting a lid, a pump, or the like is formed on the outer surface of the outer peripheral wall 3b. ing. In addition, instead of the male screw portion 3a, an engaging protrusion portion protruding radially outward from the outer peripheral wall 3b may be provided so that a lid body, a pump, or the like can be attached by tapping.

Below the mouth portion 3, a bottomed tubular body portion 5 and a bottom portion 7 are provided. The body portion 5 is integrally formed with the mouth portion 3, and the outer peripheral surface is slightly reduced in diameter toward the lower side. In the bottom portion 7, the radial outer end on the lower surface protrudes slightly downward, and the radial inner side of the lower surface has a slightly raised bottom shape. In particular, a recess 7a is formed in the center of the lower surface of the bottom portion 7. In the present embodiment, the recess 7a is provided at a position facing the gate 18a (see FIGS. 5A and 5B) when the synthetic resin container 1 is formed by injection molding. Even if a projecting portion (gate portion) projecting downward at the bottom portion 7 is formed by arranging the gate 18a, the projecting portion is arranged in the recess 7a, so that the synthetic resin container 1 is installed in an upright posture. Occasionally, the protrusion can be prevented from contacting the installation surface.

In the present embodiment, a covering member 30 in which RFID 8 as a buried member is coated with a synthetic resin is embedded in the bottom portion 7. As shown in FIG. 6, the covering member 30 and the RFID 8 are arranged at substantially the center position in the radial direction of the bottom portion 7. The RFID 8 is embedded in the bottom 7 without being exposed on the surface of the synthetic resin container 1.

The RFID 8 is arranged offset to the lower side in the thickness direction (lower side in FIG. 6) in the covering member 30, and the lower surface of the covering member 30 and the lower surface of the RFID 8 in FIG. 6 are substantially flush with each other. The surface of the covering member 30 opposite to the offset side (lower side of FIG. 6) of the RFID 8 (upper surface of the covering member 30 in FIG. 6) is the surface of the synthetic resin container 1 rather than the lower surface of the covering member 30. It is arranged so as to be close to (inner surface in the example of FIG. 6). In the example of FIG. 6, the upper surface of the covering member 30 and the upper surface of the bottom portion 7 of the synthetic resin container 1 are substantially flush with each other.

As described above, the present embodiment manufactures a synthetic resin member (synthetic resin container 1) including a tubular side portion 4 and a closing portion (bottom portion 7) that closes the lower end portion of the side portion 4. The method is a step of coating the buried member with a synthetic resin to form a covering member 30, a step of arranging the covering member 30 in the cavity 11 of the molding die 10 of the synthetic resin member, and the inside of the cavity 11. The buried member is arranged so as to be offset in the thickness direction of the covering member 30, and the covering member 30 is located on the side where the buried member is offset. Is configured so that the opposite surface is arranged closer to the inner surface of the cavity 11 than the surface on the side on which the buried member is offset. By adopting such a configuration, the buried member is separated from the surface of the synthetic resin member by the amount that the buried member is offset in the thickness direction of the covering member 30. Therefore, the embedded member such as the RFID 8 can be reliably embedded in the bottom 7 or the like without being exposed on the surface of the synthetic resin container 1 or the like. Further, since the covering member 30 and the synthetic resin member can be formed by injection molding or the like generally used for forming the synthetic resin member, the manufacturing process can be simplified.

Further, in the present embodiment, the buried member is configured to be exposed on the surface of the covering member 30 on the offset side of the buried member. By adopting such a configuration, the covering member 30 can be formed by adsorbing and fixing the embedded member such as the RFID 8 to the inner surface of the cavity 21 of the molding die 20, so that the manufacturing process of the synthetic resin member can be simplified. Can be transformed into. Further, since the buried member is offset to the maximum in the thickness direction until it is exposed on the surface of the covering member 30, the buried member can be separated from the inner surface of the cavity 11 to the maximum. Therefore, the buried member such as the RFID 8 can be more reliably separated from the surface of the synthetic resin container 1 and buried inside the resin.

Further, in the present embodiment, the covering member 30 is configured to be a plate-shaped member embedded in the closed portion (bottom portion 7). By adopting such a configuration, in a synthetic resin member whose weight is reduced due to thinning, the covering member 30 can be easily embedded in the bottom 7 or the like so as not to be exposed.

Further, in the present embodiment, the wall thickness of the portion of the synthetic resin member on which the covering member 30 is arranged is configured to be thicker than the thickness of the covering member 30. By adopting such a configuration, the buried member can be reliably embedded in the synthetic resin member by fixing the side of the covering member 30 opposite to the offset side to the inner surface of the cavity 11.

Further, in the present embodiment, the synthetic resin covering the embedded member is configured so that the main material is the same as the synthetic resin filled in the molding die 10 of the synthetic resin member (using PCTA). By adopting such a configuration, it is possible to prevent the outer surface of the covering member 30 from peeling off from the synthetic resin container 1. In particular, by making the synthetic resin that coats the buried member the same resin as the synthetic resin that is filled in the molding die 10 of the synthetic resin container 1, the boundary between the covering member 30 and its surroundings is made inconspicuous and the synthetic resin is made. The design of the manufacturing container 1 can be improved.

Further, in the present embodiment, the covering member 30 is arranged so that the surface opposite to the side on which the buried member is offset faces the movable mold 17 in the molding mold 10 of the synthetic resin member. did. By adopting such a configuration, the covering member 30 is fixed to the movable mold 17 side facing the fixed mold 18 provided with the gate 18a, so that the covering member 30 is not affected by the arrangement of the gate 18a. The position can be determined relatively freely.

Further, in the present embodiment, the step of forming the covering member 30 includes a step of filling the synthetic resin that coats the buried member with the buried member adsorbed on the inner surface of the molding die 20 of the covering member 30. Configured. By adopting such a configuration, it is possible to facilitate the positioning of the buried member in the covering member 30. Further, the buried member can be exposed flush with the surface of the covering member 30.

Further, in the present embodiment, the RFID 8 is configured to be used as the buried member. By adopting such a configuration, it is possible to easily manage the product and the distribution of the synthetic resin container 1.

Further, in the present embodiment, a synthetic resin member (synthesis) including a tubular side portion 4, a closing portion (bottom portion 7) that closes the lower end portion of the side portion 4, and a covering member 30 embedded in the closing portion. In the resin container 1), the covering member 30 has a buried member coated with a synthetic resin, and the buried member is arranged so as to be offset in the thickness direction of the covering member 30. The surface opposite to the side on which the buried member was offset was arranged so as to be closer to the surface of the synthetic resin member than the surface on the side where the embedded member was offset. By adopting such a configuration, the buried member is separated from the surface of the synthetic resin member by the amount that the buried member is offset in the thickness direction of the covering member 30. Therefore, the embedded member such as the RFID 8 can be reliably embedded in the bottom 7 or the like without being exposed on the surface of the synthetic resin container 1 or the like. Further, since the covering member 30 and the synthetic resin member can be formed by injection molding or the like generally used for forming the synthetic resin member, the manufacturing process can be simplified.

Although the present disclosure has been described based on the drawings and examples, it should be noted that those skilled in the art can easily make various modifications and modifications based on the present disclosure. Therefore, it should be noted that these modifications and modifications are included in the scope of the present invention. For example, the functions included in each component can be rearranged so as not to be logically inconsistent, and a plurality of components can be combined or divided into one. It should be understood that these are also included in the scope of the present invention.

For example, in the present embodiment, the case where the synthetic resin member is the synthetic resin container 1 has been described, but the present invention is not limited to this embodiment. The synthetic resin member may be, for example, a synthetic resin cap that can be attached to the mouth 3 of the synthetic resin container 1. When the synthetic resin member is a synthetic resin cap, the covering member 30 can be arranged, for example, on the side portion of the synthetic resin cap or the top portion that closes the upper end portion of the side portion.

Further, in the present embodiment, the covering member 30 is configured to be arranged (embedded) at one place on the bottom portion 7, but the present invention is not limited to this embodiment, and the covering member 30 may be arranged at two or more places. Further, the arrangement location of the covering member 30 is not limited to the bottom portion 7, and may be embedded in the side portion 4 or may be arranged in both the bottom portion 7 and the side portion 4.

Further, in the present embodiment, the surface of the covering member 30 opposite to the offset side of the RFID 8 is configured to face the movable mold 17 in the molding mold 10 of the synthetic resin container 1 and be adsorbed. , Not limited to this aspect. The covering member 30 may be configured so that the surface opposite to the offset side of the RFID 8 is fixed so as to face the fixing mold 18 in the molding mold 10.

Further, in the present embodiment, the RFID 8 is configured to be used as the buried member, but the present embodiment is not limited to this embodiment. As the buried member, for example, another member such as a magnetic recording medium or a magnet whose identification code can be read at least may be used.

Further, in the present embodiment, the covering member 30 is configured to be adsorbed by air in the molding die 10 of the synthetic resin container 1, but the present embodiment is not limited to this embodiment. A recess may be provided on the inner surface of the movable mold 17 and the covering member 30 may be fitted into the recess to be fixed to the movable mold 17. Further, the covering member 30 may be fitted into the recess of the movable mold 17 and may be adsorbed by air.

Further, in the present embodiment, the RFID 8 is configured to be adsorbed by air in the molding die 20 of the covering member 30, but the present embodiment is not limited to this embodiment. A recess may be provided on the inner surface of the movable mold 27, and the RFID 8 may be fitted into the recess to be fixed to the movable mold 27. Further, the RFID 8 may be fitted into the recess of the movable mold 27 and may be adsorbed by air.

Further, in the present embodiment, the RFID 8 is configured to include an IC chip, an antenna, a base sheet, and a protective sheet, but the present embodiment is not limited to this embodiment. For example, the RFID 8 may include an IC chip and an antenna, the IC chip and the antenna may be directly covered by the covering portion 32, and the IC chip and the antenna may be arranged offset in the thickness direction of the covering member 30.

According to the present disclosure, it is possible to provide a method for manufacturing a synthetic resin member and a synthetic resin member that can simplify the manufacturing process without exposing the buried member such as RFID 8 to the surface. ..

1 Synthetic resin container (synthetic resin member)
3 Mouth 3a Male thread 3b Outer wall 4 Side 5 Body 7 Bottom (closed part)
7a recess 8 RFID
10 Molding mold 11 Cavity 17 Movable mold 17a Suction hole 18 Fixed mold 18a Gate 20 Molding mold 21 Cavity 27 Movable mold 27a Suction hole 28 Fixed mold 28a Gate 30 Covering member 32 Covering part O1 Center axis S Storage space

Claims (9)

Cylindrical side and
A method for manufacturing a synthetic resin member including a closing portion that closes the upper end portion or the lower end portion of the side portion.
The step of coating the buried member with synthetic resin to form the covering member,
The step of arranging the covering member in the cavity of the molding die of the synthetic resin member, and
Including a step of filling the cavity with a synthetic resin forming the synthetic resin member.
The buried member is arranged so as to be offset in the thickness direction of the covering member.
The covering member is characterized in that the surface opposite to the side on which the embedded member is offset is arranged so as to be closer to the inner surface of the cavity than the surface on the side on which the embedded member is offset. A method for manufacturing a synthetic resin member. The method for manufacturing a synthetic resin member according to claim 1, wherein the buried member is exposed on the surface of the covering member on the offset side of the buried member. The method for manufacturing a synthetic resin member according to claim 1 or 2, wherein the covering member is a plate-shaped member embedded in either the side portion or the closed portion. The method for manufacturing a synthetic resin member according to any one of claims 1 to 3, wherein the wall thickness of the portion of the synthetic resin member on which the covering member is arranged is thicker than the thickness of the covering member. The synthetic resin member according to any one of claims 1 to 4, wherein the synthetic resin covering the buried member has the same main material as the synthetic resin filled in the molding die of the synthetic resin member. Manufacturing method. Any one of claims 1 to 5, wherein the covering member is arranged so that the surface opposite to the side on which the buried member is offset faces the movable mold in the molding die of the synthetic resin member. The method for manufacturing a synthetic resin member according to the item. Any of claims 1 to 6, wherein the step of forming the covering member includes a step of filling the buried member with a synthetic resin in a state of being adsorbed on the inner surface of the molding die of the covering member. The method for manufacturing a synthetic resin member according to item 1. The method for manufacturing a synthetic resin member according to any one of claims 1 to 7, wherein the buried member is an RFID. Cylindrical side and
A closed portion that closes the upper end or lower end of the side portion, and a closed portion.
A synthetic resin member including a covering member embedded in the side portion or the closing portion.
The covering member has a buried member coated with a synthetic resin, and the buried member is arranged so as to be offset in the thickness direction of the covering member.
The covering member is arranged so that the surface opposite to the side on which the embedded member is offset is closer to the surface of the synthetic resin member than the surface on the side on which the embedded member is offset. A synthetic resin member characterized by.

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