CN1884610A - Anode device with on-line cleaning function and its application method - Google Patents
Anode device with on-line cleaning function and its application method Download PDFInfo
- Publication number
- CN1884610A CN1884610A CN 200510077346 CN200510077346A CN1884610A CN 1884610 A CN1884610 A CN 1884610A CN 200510077346 CN200510077346 CN 200510077346 CN 200510077346 A CN200510077346 A CN 200510077346A CN 1884610 A CN1884610 A CN 1884610A
- Authority
- CN
- China
- Prior art keywords
- anode
- power supply
- cleaning
- sputter
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- ing And Chemical Polishing (AREA)
- Physical Vapour Deposition (AREA)
Abstract
This invention provides a kind of anodes device with the on-line cleaning function and its application. The on-line cleaning anodes can rotate around its axis, and set on-line cleaning device in local space. The continuous rotation of anodes and the relatively same location of cleaning device can on-line clean all the anode face continuously, so to keep good conductivity of anode face. It improves the stability, control and recurrence.
Description
Technical field
The invention belongs to the physical gas phase deposition technology field, specifically belong to sputter and arc ion plating apparatus and application method thereof.
Background technology
In sputter and arc ion plating coating equipment, use the metal inner surface (perhaps liner or heat shielding) of coating equipment cavity to absorb electronics usually as anode; In technological process, in the film forming while of workpiece surface, anode surface also gradually contaminated thing cover, its electroconductibility is always come and go, make anode lose function under the serious situation, so-called " anode disappearance " phenomenon appears, stability influence to film layer quality is very big, becoming in the coating process control process one is not much accounted of and insoluble problem, perplexing research, development and the commercial application thereof of sputter and ion plating plated film for a long time, do not obtaining one up to now as yet and be familiar with and find an effective solution clearly.
Summary of the invention
For addressing the above problem, the object of the present invention is to provide a kind of anode assembly and application method thereof with function of on-line cleaning.Another object of the present invention is to provide a kind of coating equipment, can realize on-line cleaning anode wherein.
For achieving the above object, main contents of the present invention provide a kind of anode assembly, comprising rotatable anode (but water-cooled) and anode washing unit.By the part surface of online periodically anode purge, make it return to original conduction good order and condition.Wherein anode can by metal or other electro-conductive material make and within it portion magnetic field is set.
The concrete scheme that anode cleans can be divided into simple mechanical system and ion etching mode two classes; Corresponding with it above-mentioned anode washing unit can be mechanical washing unit or ion etching washing unit.Wherein, the machinery washing unit is that the fricting strip parallel with the anodic working face is set, and has a horizontal power source, to apply transverse force fricting strip is crushed on the anode surface, makes fricting strip and anode surface to mill, the settling film that is generated on the anodic working-surface is disposed by the anode rotation, recover the satisfactory electrical conductivity of anode surface, online loop cycle like this, anode can keep conducting electricity good order and condition for a long time, thereby keep the permanent stability of coating process process.
Details are as follows with the ion etching mode:
Above-mentioned ion etching washing unit comprises: anode, shielding wall in the anode arranged outside, distribution device is set in the formed partial closure space between the part circumferential area of shielding wall and anode surface on the other side and cleans the utmost point, externally be equipped with clean power supply and make the current potential that cleans the utmost point with respect to anode for just; Anode surface is cleaned by the inert gas ion etching because of rotation can periodically enter in the local space, and the settling film that produces in the plated film space on the anodic working face is eliminated, and returns to original conduction good order and condition; Anode keeps conducting electricity good order and condition for a long time by this continuous on-line cleaning effect, thereby keeps plasma body, electric field and temperature field distributional stability in the plated film space, increases the stability and the controllability of technology in the coating process.
Above-mentioned rotatable anode is cylindrical or disc or annular, can be around its central axis rotation.When anode when being cylindrical, control by internal magnetic field in the cleaning process, on the outside surface in anode enters above-mentioned partial closure space, form launch azimuth fixed long strip shape sputter runway, the axial length of runway equals or slightly is longer than its working length, by cleaning the utmost point and cleaning power supply excitation build-up of luminance and carry out the cleaning of inert gas ion ise, its waste is closed in the local space; In this local space, charge into rare gas element via distribution device, and the air pressure that makes the rare gas element that charges into is a little more than (or equaling) plated film spatial air pressure.When anode was disc or annular, a part of sector of disk or annulus was as working face, towards intravital workpiece to be plated orientation, coating equipment chamber; In another part sector, (be in the enclosed space) simultaneously the sputter runway that forms the transmitting site basic fixed, on the anodic radial direction, make sputter runway radial dimension equal or be longer than the radial dimension of its working portion.Clean power supply excitation build-up of luminance by the auxiliary etch that is equipped with and carry out the cleaning of ion sputtering etching, the waste that is produced is closed in the local space.
The present invention provides a kind of coating equipment system of this anode assembly of application simultaneously, one or more sets above-mentioned anode assemblies wherein are set, the anodal of power supply of each emissive source in the system (sputtering source and arc source etc.) and grid bias power supply partly or entirely connects with this anode assembly, and unlike traditional way the positive pole of these power pack connected with chamber walls; Simultaneously, partly or entirely can insert an earthing power supply device between this anode assembly and the chamber walls, and make anode potential suitably be higher than the chamber walls current potential, to control electron motion better.
This application method with anode assembly of function of on-line cleaning is: rotatable anodic groundwork part and near subregion thereof, in the plated film working process, can periodically be cleaned, thereby the settling film that produces in the plated film space on the anode surface is eliminated; Said cleaning can be that machinery cleans or the inert gas ion etching is cleaned.In inert gas ion etching cleaning process, in local space, aura district at the sputter runway of anode surface is cleaned by the inert gas ion antianode, and anode rotates continuously and the relative orientation of sputter runway is constant, reaches the continuous on-line cleaning to whole anode surface; By rotation, the settling film that in the plated film space, is produced on the anode surface, in the time of in changing the inert atmosphere of local space over to, can be by the inert gas ion part in the aura orientation of sputter runway or all sputter removings, return to original conduction good order and condition, so circulation forms the continuous on-line cleaning of anode, even under the coating speed condition with higher in the plated film space, also can make the anode conducting performance long-time continuously good, avoid anode conducting to enter deterioration or failure state, to keep the continuous stability and the controllability of coating process.In the plated film cavity, many these anode assemblies of cover can be set as required, with the distribution of regulation and control plasma body (particularly electronics wherein), electric field and temperature field distribution etc.
In addition, by regulating the power that cleans power supply, perhaps periodically ON/OFF is cleaned power supply and is changed the time ratio of opening and closing, and its formation and removing ratio with required anode surface settling film is complementary, with the etching cleaning performance that reaches the best and don't consumable anode material too much.
In use, when sputter clean anode surface in advance, can not open primary source, only use auxiliary etch to clean power supply, clean the utmost point and feed rare gas element, only in local space, etching be carried out in advance on the rotating anode surface and clean.
Effect of the present invention is conspicuous: prove by experiment, according to on-line cleaning anode assembly of the present invention and correlation technique thereof, rotating anode has continuous function of on-line cleaning, promptly on anode surface, in a part of zone as in the anode absorption electronics, in another part zone, clean, make anode surface electroconductibility keep good, guaranteed continuous stability, controllability and the circulation ratio of coating process substantially.The present invention will exert far reaching influence for research, development and the industrial application of vapour deposition.
Description of drawings
Fig. 1. anode assembly works online and cleans synoptic diagram
Fig. 2. sputter runway etching is cleaned synoptic diagram in the local space of anodic part circumferential area and shielding wall formation
Fig. 3. a circulation synoptic diagram of the online ion cleaning process of anode surface
Fig. 4. online ion sputtering etching was cleaned synoptic diagram after cylindrical anode was removed magnetic field
Fig. 5. disc and annular anode on-line cleaning synoptic diagram
Fig. 6. the online ion washing unit of many covers is set in the coating equipment system uses synoptic diagram
Fig. 7. the online machinery of anode assembly cleans synoptic diagram
In accompanying drawing 1～7,1-cylindrical anode, 2-sputter runway, the 3-arc source, 4-partial closure space, 5-cleans the utmost point, the tracheae of 6-distribution device, the 7-auxiliary etch cleans power supply, 8-master's shielding power supply, 9-arc power, the settling film that 10-forms on anode surface, the 11-shielding wall, 12-disk anode, 13-annular anode, the pivoted frame of 14-workpiece, the 15-sputtering target, 16-earthing power supply, the designated area on the 17-anode surface, the aura of 18-sputter clean when anode does not have magnetic control, 19-workpiece bias power supply, 20-fricting strip, 21-elasticity source.
Embodiment
Now the present invention is described further in conjunction with the accompanying drawings, but the concrete scheme described in the embodiment does not constitute limiting the scope of the invention.
Referring to Fig. 1, anode assembly of the present invention, comprise the shielding wall 11 that rotatable cylindrical anode 1 reaches in the anode arranged outside, form partial closure space 4 between shielding wall 11 and anode surface part circumferential area on the other side, and the anode washing unit is set in this space.Above-mentioned anode washing unit can be mechanical washing unit or ion etching washing unit.
Referring to Fig. 7, the machinery washing unit is the fricting strip 20 that the long strip shape parallel with the anodic surface is set in anodic inoperative orientation, and has a horizontal power source 21, to apply transverse force fricting strip is crushed on the anode surface, make fricting strip and anode surface to mill by the anode rotation, the settling film that is generated on the anodic working-surface is disposed, recover the satisfactory electrical conductivity of anode surface metal, online loop cycle like this, anode can keep conducting electricity good order and condition for a long time, thereby keeps the permanent stability of coating process process.
Referring to Fig. 1 and Fig. 2, the ion etching washing unit comprises: anode, in the part circumferential area of anode surface and shielding wall 11 formed partial closure spaces 4, distribution device is set, 6 is the tracheae of distribution device, clean the utmost point 5 and externally supporting cleaning power supply 7 and the current potential that cleans the utmost point is corrected than anode; Anode surface is cleaned by the inert gas ion etching because of rotation can periodically enter in the local space 4, and the settling film that produces in the plated film space on the anodic working face is eliminated, and returns to original conduction good order and condition; Anode keeps conducting electricity good order and condition for a long time by this continuous on-line cleaning effect, thereby keeps plasma body, electric field and temperature field distributional stability in the plated film space, increases the stability and the controllability of technology in the coating process.
Above-mentioned rotatable anode can be cylindrical (referring to Fig. 1) or disc or annular (referring to Fig. 5), can be around its central axis rotation.
Referring to Fig. 1, in cleaning process, control by internal magnetic field, on the outside surface in anode enters above-mentioned partial closure space, form launch azimuth fixed long strip shape sputter runway 2, by cleaning the utmost point 5 and cleaning power supply 7 excitation build-ups of luminance and carry out the cleaning of inert gas ion ise, its waste is closed in the local space; In this local space, charge into rare gas element via distribution device, and the air pressure of the feasible rare gas element that charges into is a little more than (or equaling) plated film spatial air pressure.
The present invention provides a kind of coating equipment system simultaneously, one or more sets above-mentioned anode assemblies (referring to Fig. 1 and 6) wherein are set, the anodal of the positive pole of the power supply of each emissive source in the system (sputtering source and arc source etc.) and grid bias power supply all connects with this anode assembly, and unlike traditional way the positive pole of these power pack connected with chamber walls; Simultaneously, can insert an earthing power supply device between this anode assembly and the chamber walls, and make anode potential suitably be higher than the chamber walls current potential, to control electron motion better.
To specifically describe anode assembly of the present invention below and realize the detailed process of on-line cleaning:
1) the online machinery of anode cleans: anode can be cylindrical 1 or disc 12 or annular 13, can be around its central axis rotation, at the anodic back side or the side roughness suitable fricting strip 20 surperficial parallel with anodic is set, make fricting strip and anode surface to mill by applying horizontal elastic force, the settling film that is generated on the anodic working-surface is disposed, recover the satisfactory electrical conductivity of anode surface metal, online loop cycle like this, anode can keep conducting electricity good order and condition for a long time, thereby keeps the permanent stability (Fig. 7) in the coating process process.
2) the online ion etching of the anode agent structure of cleaning: anode can be cylindrical 1 or disc 12 or annular 13, can be around its central axis rotation, control by internal magnetic field, in the local space 4 of the sealing that forms by segment anode and shielding wall 11, on the anodic outside surface, form one group of launch azimuth fixed long strip shape sputter runway 2 and be positioned at the anode back side or side, clean power supply 7 excitation build-ups of luminance by the auxiliary etch that is equipped with and carry out the cleaning of ion sputtering etching, its waste is closed in the local space 4; Groundwork part on the anode and near subregion thereof can periodically enter in the local space and be cleaned by the inert gas ion etching, thereby avoid the anodic working face to enter failure state (Fig. 1) in the plated film working process.
2) local space structure of the present invention: anode rotation the part circumferential area and shielding wall 11 formation local spaces 4 of process, wherein be provided with and clean the utmost point 5 (general water flowing cooling) and distribution device, charge into rare gas element (as argon gas etc.) by tracheae 6, make the air pressure P of local space
1A little more than or equal plated film spatial air pressure P
2
3) connecting mode of power supply of the present invention: anode and various power supply, positive pole as shielding power supply (DC or pulse or RF power supply etc.), arc power, grid bias power supply (DC or the pulse power etc.) and earthing power supply etc. connects, the negative pole of these power pack is connected in the shell of sputtering target material, arc source target, workpiece and plated film cavity respectively, carries out plated film; Simultaneously, the auxiliary power supply 7 that cleans is connected between the cleaning utmost point 5 (general water flowing cooling) in anode 2 and the local space, and make clean the utmost point 5 for just with anode for bearing, encouraged the glow discharge sputtering in one group of sputter runway 2 orientation, the cleaning of antianode surface sputtering etching.
4) when anode 1 when being cylindrical, the axial length of the one group of runway 2 that forms on its cylindrical outer surface equals or slightly is longer than its working length, when the anode front works in coating film area, the aura antianode of the sputter runway at its back side carries out inert gas ion and cleans, continuously rotation and the relative orientation of sputter runway is constant of anode reaches the continuous on-line cleaning to its whole surface; By rotation, on the anode surface in the plated film space formed settling film, in the time of in changing the inert atmosphere of local space over to, can be converted to the favorable conductive state when making this part surface enter coating film area once more by the inert gas ion part in the aura orientation of sputter runway or all sputter removings:
In the process that anode rotates a circle; Its lip-deep each different azimuth is successively respectively gradually by plated film (sputter or electric arc) zone with clean etch areas: the deposit film 10 (A) that forms gradually in appointed area 17 → appointed area 17 is shifted out gradually workspace (B) → appointed area 17 and is entered and clean in etched area 4 (C) → appointed area 17 deposit film 10 and shifted out by sputter attenuate or removing (D) → appointed area 17 gradually and clean etched area 4 (E) → appointed area 17 and progress into plated film district (F) → appointed area 17 and get back to plated film workspace (A) fully, and so circulation forms continuously online cleaning. Even therefore under the film forming speed condition with higher in the plated film space, the working order of whole anode surface also can keep the favorable conductive state continuously for a long time, avoid anode surface to enter deterioration or failure state, keep continual and steady, the controlled and circulation ratio (Fig. 3) of technology.
5) a kind of mode of using as this technology in implementation process, in the plated film space, under the less situation of settling film that anode surface generates 10, can be closed auxiliary etch and clean power supply 7; Also can open and close auxiliary etch in the course of the work discontinuously and clean power supply 7, the principle of work that settling film 10 carries out continuously or online intermittently etching is cleaned according to antianode is looked unfamiliar guarantees that the anode surface conductivity is good for a long time in the coating process process.
6) as another simplification of this technology, in implementation process, can cancel above-mentioned magnetic-control anode sputter runway 2, employing charges into rare gas element in local space, only utilize and clean the utmost point 5, make the anode surface in the local space under 7 excitations of auxiliary etch cleaning power supply, produce aura 18 and obtain the ise cleaning, equally the settling film 10 of looking unfamiliar according to antianode continuously or carry out the principle of work of on-line cleaning etching intermittently guarantees the long-time continuous stable (Fig. 4) of coating process process.
7) the above-mentioned feature 1 of foundation)～6) method and principle, anode can also be designed to disc 12 or annular 13, makes sputter runway radial dimension equal or be longer than the radial dimension of its working portion on the anode radial direction; Disc or annular anodic part sector are carried out plated film as working face towards the workpiece to be plated position; Simultaneously in another part sector is in the local space district of sealing, correspondingly being provided with to clean the utmost point 5 and feed rare gas element 6 makes wherein pressure a little more than (or equaling) plated film space pressure, form the sputter runway of transmitting site basic fixed by internal magnetic field control, clean power supply excitation build-up of luminance by the auxiliary etch that is equipped with and carry out the cleaning of ion sputtering etching, the waste that is produced is closed in the local space.Its principle and working process and application mode and reduction procedure etc. are all with above-mentioned cylindrical anode (Fig. 5).
8) by suitably regulating the power that auxiliary etch cleans power supply 7, perhaps periodically the ON/OFF auxiliary etch cleans power supply 7 and changes the time ratio of opening and closing, the formation and the removing ratio of the settling film 10 on itself and the required anode surface are complementary, to reach best etching cleaning performance and don't consumable anode material too much.
9) adopt this programme, when sputter clean anode surface in advance, do not open primary source (shielding power supply 8, arc power 9 and grid bias power supply 19 etc.) and do not feed reactant gases, only use auxiliary etch to clean the power supply 7 and the utmost point cleaning utmost point 5 and pass through gas distribution pipe 6 and feed rare gas elementes, only in local space, etching cleaning is in advance carried out on the rotating anode surface, just can be reached the metastable purpose of holding anode electroconductibility.
10) in the coating equipment system, a cover can be set as required or overlap this anode assembly (Fig. 6) more, with electronics and ionic density distribution, electric field distribution and temperature field distribution etc. in the regulator control system ionic medium body.
11) when this anode assembly of cover more than in the coating equipment system, being provided with, can be between the inwall of each anode and vacuum chamber, independently earthing power supply is set separately, makes the positive pole of each power pack (sputter, electric arc and bias voltage etc.) and one of them simultaneously or part is several links; By adjusting the different earthing potentials of each anodic, reach the purpose (Fig. 6) of regulating electron distributions in the whole plated film space effectively.
Claims (12)
1. an anode assembly is characterized in that comprising rotatable anode and anode washing unit.
2. according to the described anode assembly of claim 1, portion is provided with magnetic field to it is characterized in that making also within it by metal or other electro-conductive material by above-mentioned anode; The anode washing unit is mechanical washing unit or ion etching washing unit.
3. according to the described anode assembly of claim 2, it is characterized in that described mechanical washing unit is that the fricting strip parallel with the anodic working face is set, and has a horizontal power source, to apply transverse force fricting strip is crushed on the anode surface, make fricting strip and anode surface to mill by the anode rotation, the settling film that is generated on the anodic working-surface is disposed, recovered the satisfactory electrical conductivity of anode surface.
4. according to the described anode assembly of claim 2, it is characterized in that described ion etching washing unit comprises: anode, shielding wall in the anode arranged outside, between shielding wall and anode surface part circumferential area on the other side in the formed partial closure space, distribution device is set, cleans the utmost point, externally supporting cleaning power supply also makes the current potential that cleans the utmost point correct than anode.
5. according to the described anode assembly of claim 1, it is characterized in that described rotatable anode is cylindrical or disc or annular, can be around its central axis rotation.
6. a coating equipment system is characterized in that wherein being provided with each described anode assembly among one or more sets aforesaid right requirements 1-5.
7. according to the described coating equipment of claim 6 system, contain emissive source power supply and workpiece bias power supply in the system, it is characterized in that the anodal of described emissive source power supply and grid bias power supply partly or entirely connects with described anode assembly; Simultaneously, described anode assembly partly or entirely and insert the earthing power supply device between the chamber walls and makes this part or all of anode potential be higher than the chamber walls current potential, to control electron motion better.
8. the application method of each described anode assembly in the claim 1～5 is characterized in that using this anode assembly to realize rotatable anodic function of on-line cleaning; On-line cleaning realizes by following steps: described rotating anode groundwork part and near subregion thereof in the plated film working process, periodically are cleaned, thereby the settling film that produces in the plated film space on the anode surface are eliminated.
9. according to the described application method of claim 8, it is characterized in that described cleaning is that machinery cleans or the inert gas ion etching is cleaned.
10. according to the described application method of claim 9, it is characterized in that in the working process that described inert gas ion etching is cleaned, in local space, aura district at the sputter runway of anode surface is cleaned by the inert gas ion antianode, continuously rotation and the relative orientation of sputter runway is constant of anode reaches the continuous on-line cleaning to whole anode surface; By rotation, the settling film that in the plated film space, is produced on the anode surface, in the time of in changing the inert atmosphere of local space over to, can be by the inert gas ion part in the aura orientation of sputter runway or all sputter removings, return to original conduction good order and condition, so circulation forms the continuous on-line cleaning of anode.
11. according to the described application method of claim 10, it is characterized in that by regulating the power of cleaning power supply, perhaps periodically ON/OFF is cleaned power supply and is changed the time ratio of opening and closing, the formation and the removing ratio of itself and required anode surface settling film are complementary, to reach best etching cleaning performance and don't consumable anode material too much.
12. the application method of each described anode assembly in the claim 1～5, it is characterized in that: when sputter clean anode surface in advance, do not open primary source, only use auxiliary etch to clean power supply, clean the utmost point and feed rare gas element, only in local space, etching cleaning is in advance carried out on the rotating anode surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510077346 CN1884610A (en) | 2005-06-22 | 2005-06-22 | Anode device with on-line cleaning function and its application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510077346 CN1884610A (en) | 2005-06-22 | 2005-06-22 | Anode device with on-line cleaning function and its application method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1884610A true CN1884610A (en) | 2006-12-27 |
Family
ID=37582916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510077346 Pending CN1884610A (en) | 2005-06-22 | 2005-06-22 | Anode device with on-line cleaning function and its application method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1884610A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102225477A (en) * | 2011-04-15 | 2011-10-26 | 云南铝业股份有限公司 | On-line automatic bottom cleaning machine for pre-baked anode |
| CN104259149A (en) * | 2014-07-23 | 2015-01-07 | 宁波钰烯阴极保护材料有限责任公司 | Surface coating treatment equipment for tubular ferrosilicon positive electrode |
| CN107937877A (en) * | 2017-11-15 | 2018-04-20 | 温州职业技术学院 | DLC coating apparatus based on anode technology |
-
2005
- 2005-06-22 CN CN 200510077346 patent/CN1884610A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102225477A (en) * | 2011-04-15 | 2011-10-26 | 云南铝业股份有限公司 | On-line automatic bottom cleaning machine for pre-baked anode |
| CN102225477B (en) * | 2011-04-15 | 2012-12-26 | 云南铝业股份有限公司 | On-line automatic bottom cleaning machine for pre-baked anode |
| CN104259149A (en) * | 2014-07-23 | 2015-01-07 | 宁波钰烯阴极保护材料有限责任公司 | Surface coating treatment equipment for tubular ferrosilicon positive electrode |
| CN107937877A (en) * | 2017-11-15 | 2018-04-20 | 温州职业技术学院 | DLC coating apparatus based on anode technology |
| CN107937877B (en) * | 2017-11-15 | 2019-11-08 | 温州职业技术学院 | DLC coating apparatus based on anode technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3281371B2 (en) | Cylindrical rotating magnetron for wide surface coating | |
| EP0045822B1 (en) | Cylindrical magnetron sputtering cathode | |
| US8387561B2 (en) | Method and apparatus for cathodic arc ion plasma deposition | |
| KR100559285B1 (en) | Apparatus for steering the arc in a cathodic arc coater | |
| CN100537833C (en) | A kind of magnetron sputtering target system and application method thereof with function of on-line cleaning | |
| WO2014133964A1 (en) | Configurable variable position closed track magnetron | |
| JP5793555B2 (en) | End block and sputtering equipment | |
| EP0905272A2 (en) | Cathodic arc vapor deposition apparatus (annular cathode) | |
| EP0081331B1 (en) | Vacuum sputtering apparatus | |
| CN1053712C (en) | Rotary target column type magnetic controlled sputtering device | |
| CN109338292B (en) | Vacuum coating device for inner wall of pipe fitting and production process | |
| CN1884610A (en) | Anode device with on-line cleaning function and its application method | |
| EP2709138B1 (en) | Chamber for physical vapor deposition | |
| KR101950857B1 (en) | Sputter deposition source, sputtering apparatus and method of operating thereof | |
| CN2835254Y (en) | Anode device with on-line cleaning function and coating machine having the same | |
| WO2019130471A1 (en) | Film-forming method and film-forming device | |
| JPH0539567A (en) | Sputtering unit | |
| KR19990024033A (en) | Cathode arc deposition equipment | |
| CN2873799Y (en) | Magnetic sputter target with online cleaning function | |
| JP4646066B2 (en) | Vacuum processing equipment | |
| CN100471987C (en) | Contacting of an electrode with a substance in vacuum | |
| KR100701267B1 (en) | Apparatus for pulse arc by low an electric current | |
| CN109487225A (en) | Magnetron sputtering film formation device and method | |
| RU2242821C2 (en) | Magnetron spraying system | |
| JPH0565634A (en) | Sputtering apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20061227 |