CN1876584A - 电子温控装置 - Google Patents

电子温控装置 Download PDF

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Publication number
CN1876584A
CN1876584A CNA2005100352868A CN200510035286A CN1876584A CN 1876584 A CN1876584 A CN 1876584A CN A2005100352868 A CNA2005100352868 A CN A2005100352868A CN 200510035286 A CN200510035286 A CN 200510035286A CN 1876584 A CN1876584 A CN 1876584A
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die
temperature control
cooling module
control unit
thermoelectric cooling
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CNA2005100352868A
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English (en)
Inventor
林志泉
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNA2005100352868A priority Critical patent/CN1876584A/zh
Priority to US11/433,244 priority patent/US7462026B2/en
Publication of CN1876584A publication Critical patent/CN1876584A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/52Heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/58Measuring, controlling or regulating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38Cooling arrangements using the Peltier effect
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/58Measuring, controlling or regulating
    • B29C2043/5816Measuring, controlling or regulating temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/02Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/08Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means for dielectric heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00Optical elements, e.g. lenses, prisms
    • B29L2011/0016Lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

一种模仁的电子温控装置,其特征在于包括:一模仁、一温度感测元件、一控制电路以及一热电致冷器,其中该模仁具有一成型面以及至少一非成型面;该温度感测元件、该控制电路以及该热电致冷器依次电连接,其中该温度感测元件以及该热电致冷器分别与该模仁的非成型面相贴附。

Description

电子温控装置
【技术领域】
本发明是关于一种电子温控装置,尤其是一种应用于微透镜阵列的热压成型的电子温控装置。
【背景技术】
微透镜阵列广泛应用于导光板的制作,其可通过其网点分布式设计达到均匀导光的目的。微透镜阵列一般在聚碳酸酯(或聚甲基丙烯酸甲酯)材质的基板上通过热压成型法制备,其先利用深刻电铸模造成型制程(Lithogrophy Electroforming Micro Molding),制作具有复数个微细孔洞的平板模仁,然后利用热压成型技术,通过高温及高压在导光板基材上挤压出复数个成网点分布的微透镜。由于上述的微透镜是在高温高压下导光板材质本身的内聚力与表面张力共同作用而形成的,热挤压效果即成品形状受所述平板模仁的孔洞形状影响不大,因此,不需要形状精准的模具就可以获得近似半球形的微透镜。所述微透镜的制程如图1所示,在热挤压过程中,基板1在玻璃转换温度(Tg)时开始软化,并在模仁2所施的压力下产生流动变形填充模仁孔穴3而形成微透镜4。从所述微透镜的制程可知,在热挤压过程中,控制适当的温度、压力及时间对获得所需的微透镜形状十分重要。
现有的温度控制技术通常采用水循环冷却的方式进行温度控制,通过循环水带走适当的热能,以此达到控制模仁温度的目的。但是,水循环冷却方式的温控系统反应慢,当温度改变为另一预设温度时,需等待较长时间,因此水循环冷却的控温系统仅适合进行恒温控制,而无法进行温度的实时变化,因而不能有效控制微透镜热压成型的效果,且该控温过程复杂,设备庞大。
【发明内容】
鉴于以上内容,有必要提供一种在微透镜制程中有效、实时的控制模仁温度的电子温控装置。
一种模仁的电子温控装置,其特征在于包括:一模仁、一温度感测元件、一控制电路以及一热电致冷器,其中该模仁具有一成型面以及至少一非成型面;该温度感测元件、该控制电路以及该热电致冷器依次电连接,其中该温度感测元件以及该热电致冷器分别与该模仁的非成型面相贴附。
该温度感测元件获得一温度讯号,并将该温度讯号输入至该控制电路,该控制电路将该温度讯号转化为一电流讯号,并以该电流讯号驱动该热电致冷器。
相较现有的模仁温度控制方式,所述的电子温控装置采用热电致冷器及一控制电路以取代水循环冷却温控系统,结构简单,无须复杂的设备,其通过一温度感测元件获得模仁的温度讯号,并通过一控制电路将该模仁的温度讯号转换为电流讯号,并以该电流讯号驱动该热电致冷器,以该热电致冷器对该模仁加热或致冷,由此达到对该模仁实时控温的目的。
【附图说明】
图1是现有的微透镜热压成型的制程示意图;
图2是本发明较佳实施方式的电子温控装置示意图;
图3是本发明较佳实施方式的控制电路示意图。
【具体实施方式】
请参照图2所示,本发明的较佳实施例的电子温控装置适用于一平板模仁的温控系统,所述平板模仁8包括一成型面80及复数个非成型面81、82,所述非成型面81与该成型面80相对,而非成型面82位于该成型面80与非成型面81之间。
所述电子温控装置包括一温度感测元件5、一控制电路6及一热电致冷器7,该温度感测元件5、该控制电路6及该热电致冷器7依次电连接。其中该温度感测元件5优选为热敏电阻,其贴附于平板模仁8的非成型面82。
请参照图3所示,该控制电路6包括一比较电路(图未标)、一差动放大器62、一积分器63及一功率放大器64构成。
该比较电路由稳定电压源610、可变电阻611、第一电阻612及第二电阻613构成,其中稳定电压源610、可变电阻611、第一612、第二电阻613与热敏电阻5构成一温氏电桥,即热敏电阻5与第一电阻612串联相接,可变电阻611与第二电阻613串联相接,所述热敏电阻5与第一电阻612,以及可变电阻611与第二电阻613两条串联电路以并联的形式电连接于稳定电压源610。
该比较电路中,以热敏电阻5与第一电阻612之间的节点614,以及可变电阻611与第二电阻613之间的节点615为输出端口,皆连接于差动放大器62。然后,差动放大器62、积分器63及功率放大器64依次电连接。
同时请参照图2及图3所示,热电致冷器7与功率放大器64的输出端连接,以实现控制电路6与热电致冷器7的电连接。
热电致冷器7由于珀尔贴效应,当通过一直流电流时,会表现出一端致冷,一端放热。可将热电致冷器7的热端作为工作面与模仁8的非成型面相贴附,亦可将热电致冷器7的冷端作为工作面与模仁8的非成型面相贴附。在本实施例中,热电致冷器7的放热端与该成型面80相对的非成型面81相贴附。
本发明的较佳实施例的具体工作原理进一步说明如下:
由于热敏电阻5贴附于模仁8的非成型面82,该热敏电阻5将模仁的温度讯号转换为其阻值讯号,可变电阻611的阻值则对应于一预设温度。从而,模仁8的温度讯号与预设温度的温度讯号则可通过热敏电阻5与可变电阻611的阻值转化为节点614的电压讯号与节点615的电压讯号。此二个电压讯号通过差异放大器62,取出差值讯号,其即对应于模仁温度与预设温度的差值讯号。此差值讯号再经过积分器63的误差累积功能,获得一温度补偿控制讯号,该温度补偿控制讯号经由功率放大器64,获得一温度控制讯号,以该温度控制讯号为驱动电流驱动该热电致冷器7。
因此,当模仁8的温度小于预设温度时,热电致冷器7的驱动电流逐渐变大,直到模仁8的温度等于预设温度时,驱动电流才保持定值;当模仁8的温度大于预设温度时,热电致冷器7的驱动电流逐渐变小,直到模仁8的温度等于预设温度时,驱动电流才保持定值;当需要改变预设温度值时,调整可变电阻611的阻值即可。据此作用,模仁8的温度则可实时的被控制在任一预设的温度工作点上。

Claims (7)

1.一种模仁的电子温控装置,其特征在于包括:一模仁、一温度感测元件、一控制电路以及一热电致冷器,其中该模仁具有一成型面以及至少一非成型面;该温度感测元件、该控制电路以及该热电致冷器依次电连接,其中该温度感测元件以及该热电致冷器分别与该模仁的非成型面相贴附。
2.如权利要求1所述的模仁的电子温控装置,其特征在于:与该热电致冷器相贴附的非成型面与该模仁的成型面相对。
3.如权利要求2所述的模仁的电子温控装置,其特征在于:该热电致冷器包括一热端及一冷端,以该热电致冷器的热端与该模仁的非成型面相贴附。
4.如权利要求3所述的模仁的电子温控装置,其特征在于:该热电致冷器包括一热端及一冷端,以该热电致冷器的冷端与该模仁的非成型面相贴附。
5.如权利要求1所述的模仁的电子温控装置,其特征在于:该温度感测元件为一热敏电阻。
6.如权利要求5所述的模仁的电子温控装置,其特征在于:该控制电路由一比较电路、一差动放大器、一积分器及一功率放大器构成,该比较电路、该差动放大器、该积分器及该功率放大器依次电连接。
7.如权利要求6所述的模仁的电子温控装置,其特征在于:该比较电路包括一稳定电压源、一可变电阻、一第一电阻以及一第二电阻,其中该热敏电阻与该第一电阻串联相接,该可变电阻与该第二电阻串联相接,该热敏电阻与该第一电阻,以及该可变电阻与该第二电阻的串联电路以并联的形式电连接于该稳定电压源。
CNA2005100352868A 2005-06-10 2005-06-10 电子温控装置 Pending CN1876584A (zh)

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CNA2005100352868A CN1876584A (zh) 2005-06-10 2005-06-10 电子温控装置
US11/433,244 US7462026B2 (en) 2005-06-10 2006-05-12 Mold core having a temperature control apparatus

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Cited By (2)

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CN104281177A (zh) * 2013-07-03 2015-01-14 致茂电子股份有限公司 广域温度控制装置
US9494353B2 (en) 2013-07-03 2016-11-15 Chroma Ate Inc. Temperature control equipment

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Publication number Priority date Publication date Assignee Title
JP4885779B2 (ja) * 2007-03-29 2012-02-29 オリンパスメディカルシステムズ株式会社 静電容量型トランスデューサ装置及び体腔内超音波診断システム
US7914271B2 (en) * 2007-11-29 2011-03-29 Husky Injection Molding Systems Ltd. Gate insert heating and cooling
CN101937242B (zh) * 2010-08-04 2014-01-08 中国电力科学研究院 一种应用于智能电表设备的温度控制装置

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Publication number Priority date Publication date Assignee Title
CN104281177A (zh) * 2013-07-03 2015-01-14 致茂电子股份有限公司 广域温度控制装置
US9494353B2 (en) 2013-07-03 2016-11-15 Chroma Ate Inc. Temperature control equipment

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