CN1865531A - Process for preparing vapor doping zone-melted silicon single crystal - Google Patents
Process for preparing vapor doping zone-melted silicon single crystal Download PDFInfo
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- CN1865531A CN1865531A CN 200610013497 CN200610013497A CN1865531A CN 1865531 A CN1865531 A CN 1865531A CN 200610013497 CN200610013497 CN 200610013497 CN 200610013497 A CN200610013497 A CN 200610013497A CN 1865531 A CN1865531 A CN 1865531A
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- silicon single
- single crystal
- gas
- zone
- melted silicon
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 62
- 239000010703 silicon Substances 0.000 title claims abstract description 62
- 239000013078 crystal Substances 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000007789 gas Substances 0.000 claims abstract description 101
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 58
- 230000033001 locomotion Effects 0.000 claims abstract description 46
- 229910052786 argon Inorganic materials 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 26
- 230000008569 process Effects 0.000 claims abstract description 16
- 239000012535 impurity Substances 0.000 claims description 18
- 238000012423 maintenance Methods 0.000 claims description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 238000005516 engineering process Methods 0.000 claims description 12
- 230000008859 change Effects 0.000 claims description 11
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 9
- 229910000085 borane Inorganic materials 0.000 claims description 8
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 abstract description 6
- 238000004857 zone melting Methods 0.000 abstract description 5
- 238000002156 mixing Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2006100134976A CN1333114C (en) | 2006-04-21 | 2006-04-21 | Process for preparing vapor doping zone-melted silicon single crystal |
Applications Claiming Priority (1)
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CNB2006100134976A CN1333114C (en) | 2006-04-21 | 2006-04-21 | Process for preparing vapor doping zone-melted silicon single crystal |
Publications (2)
Publication Number | Publication Date |
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CN1865531A true CN1865531A (en) | 2006-11-22 |
CN1333114C CN1333114C (en) | 2007-08-22 |
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Family Applications (1)
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CNB2006100134976A Active CN1333114C (en) | 2006-04-21 | 2006-04-21 | Process for preparing vapor doping zone-melted silicon single crystal |
Country Status (1)
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CN (1) | CN1333114C (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2058420A1 (en) * | 2006-09-29 | 2009-05-13 | Sumco Techxiv Corporation | Silicon single crystal manufacturing method, silicon single crystal, silicon wafer, apparatus for controlling manufacture of silicon single crystal, and program |
CN101979719A (en) * | 2010-11-03 | 2011-02-23 | 天津市环欧半导体材料技术有限公司 | Method for producing gas phase heavy phosphorus-doped float zone silicon single crystal |
CN102808216A (en) * | 2012-08-22 | 2012-12-05 | 北京京运通科技股份有限公司 | Float-zone monocrystalline silicon production process and float-zone thermal field |
CN103076766A (en) * | 2013-01-30 | 2013-05-01 | 佛山市定中机械有限公司 | Can printing machine numerical-control system based on digital motion controller |
CN103114326A (en) * | 2013-02-25 | 2013-05-22 | 天津市环欧半导体材料技术有限公司 | Production method of zone-melted vapor doping silicon single crystal |
CN103147118A (en) * | 2013-02-25 | 2013-06-12 | 天津市环欧半导体材料技术有限公司 | Method for preparing solar grade silicon single crystal through Czochralski zone melting method |
CN103160912A (en) * | 2011-12-08 | 2013-06-19 | 有研半导体材料股份有限公司 | Doped region melting single crystal preparation process |
CN103866377A (en) * | 2012-12-14 | 2014-06-18 | 有研半导体材料股份有限公司 | Gas phase mixing system device and method used for obtaining zone-melting silicon single crystal with wide specific resistance range |
CN104313697A (en) * | 2014-11-17 | 2015-01-28 | 天津市环欧半导体材料技术有限公司 | Improved doping gas circuit for zone-melting gas-doped monocrystalline |
CN104328484A (en) * | 2014-11-17 | 2015-02-04 | 天津市环欧半导体材料技术有限公司 | Novel doping gas path for zone-melting gas-doped single crystal |
TWI613333B (en) * | 2016-04-12 | 2018-02-01 | 上海新昇半導體科技有限公司 | Method for forming monocrystalline silicon and wafer |
CN108411357A (en) * | 2018-04-13 | 2018-08-17 | 天津市环欧半导体材料技术有限公司 | A kind of doper and method improving zone-melted vapor doping stability |
CN113943973A (en) * | 2021-10-26 | 2022-01-18 | 中国电子科技集团公司第四十六研究所 | Process method for drawing high-resistivity zone-melting monocrystalline silicon |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0365583A (en) * | 1989-07-29 | 1991-03-20 | Minoda Buroiraa Fuaamu:Kk | Production of compost with specific fermentation microorganism |
JPH09286688A (en) * | 1996-04-22 | 1997-11-04 | Komatsu Electron Metals Co Ltd | Method for doping gas to silicon single crystal |
JP2002134518A (en) * | 2000-10-27 | 2002-05-10 | Mitsubishi Materials Silicon Corp | Resistibility-adjusted silicon wafer and its manufacturing method |
CN1254565C (en) * | 2002-12-30 | 2006-05-03 | 天津市环欧半导体材料技术有限公司 | Gas-phase doping-area fused silicon monocrystal production method |
CN1260402C (en) * | 2003-04-03 | 2006-06-21 | 天津市环欧半导体材料技术有限公司 | Combined gas-phase pre-doping and neutron irradiation doping area fused silicon monocrystal production method |
JP2005035816A (en) * | 2003-07-17 | 2005-02-10 | Shin Etsu Handotai Co Ltd | Method for manufacturing silicon single crystal and silicon single crystal |
WO2006003782A1 (en) * | 2004-06-30 | 2006-01-12 | Shin-Etsu Handotai Co., Ltd. | Silicon single crystal manufacturing method and apparatus |
-
2006
- 2006-04-21 CN CNB2006100134976A patent/CN1333114C/en active Active
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2058420A4 (en) * | 2006-09-29 | 2010-12-22 | Sumco Techxiv Corp | Silicon single crystal manufacturing method, silicon single crystal, silicon wafer, apparatus for controlling manufacture of silicon single crystal, and program |
US8382895B2 (en) | 2006-09-29 | 2013-02-26 | Sumco Techxiv Corporation | Silicon single crystal manufacturing method, silicon single crystal, silicon wafer, apparatus for controlling manufacture of silicon single crystal, and program |
EP2058420A1 (en) * | 2006-09-29 | 2009-05-13 | Sumco Techxiv Corporation | Silicon single crystal manufacturing method, silicon single crystal, silicon wafer, apparatus for controlling manufacture of silicon single crystal, and program |
CN101979719A (en) * | 2010-11-03 | 2011-02-23 | 天津市环欧半导体材料技术有限公司 | Method for producing gas phase heavy phosphorus-doped float zone silicon single crystal |
CN101979719B (en) * | 2010-11-03 | 2011-07-13 | 天津市环欧半导体材料技术有限公司 | Method for producing gas phase heavy phosphorus-doped float zone silicon single crystal |
CN103160912A (en) * | 2011-12-08 | 2013-06-19 | 有研半导体材料股份有限公司 | Doped region melting single crystal preparation process |
CN103160912B (en) * | 2011-12-08 | 2015-11-11 | 有研半导体材料有限公司 | A kind of preparation technology of the zone melting single-crystal that adulterates |
CN102808216A (en) * | 2012-08-22 | 2012-12-05 | 北京京运通科技股份有限公司 | Float-zone monocrystalline silicon production process and float-zone thermal field |
CN103866377A (en) * | 2012-12-14 | 2014-06-18 | 有研半导体材料股份有限公司 | Gas phase mixing system device and method used for obtaining zone-melting silicon single crystal with wide specific resistance range |
CN103076766A (en) * | 2013-01-30 | 2013-05-01 | 佛山市定中机械有限公司 | Can printing machine numerical-control system based on digital motion controller |
CN103076766B (en) * | 2013-01-30 | 2018-07-06 | 佛山市定中机械有限公司 | A kind of print tank machine digital control system based on digital motion controller |
CN103147118A (en) * | 2013-02-25 | 2013-06-12 | 天津市环欧半导体材料技术有限公司 | Method for preparing solar grade silicon single crystal through Czochralski zone melting method |
CN103114326A (en) * | 2013-02-25 | 2013-05-22 | 天津市环欧半导体材料技术有限公司 | Production method of zone-melted vapor doping silicon single crystal |
WO2014127646A1 (en) * | 2013-02-25 | 2014-08-28 | 天津市环欧半导体材料技术有限公司 | Method for preparing solar grade silicon single crystal using czochralski zone melting method |
EP2955252A4 (en) * | 2013-02-25 | 2015-12-16 | Tianjin Huanou Semiconductor Material & Technology | Method for preparing solar grade silicon single crystal using czochralski zone melting method |
CN103147118B (en) * | 2013-02-25 | 2016-03-30 | 天津市环欧半导体材料技术有限公司 | A kind of method utilizing vertical pulling and zone melting process to prepare solar energy level silicon single crystal |
CN104313697A (en) * | 2014-11-17 | 2015-01-28 | 天津市环欧半导体材料技术有限公司 | Improved doping gas circuit for zone-melting gas-doped monocrystalline |
CN104328484A (en) * | 2014-11-17 | 2015-02-04 | 天津市环欧半导体材料技术有限公司 | Novel doping gas path for zone-melting gas-doped single crystal |
TWI613333B (en) * | 2016-04-12 | 2018-02-01 | 上海新昇半導體科技有限公司 | Method for forming monocrystalline silicon and wafer |
CN108411357A (en) * | 2018-04-13 | 2018-08-17 | 天津市环欧半导体材料技术有限公司 | A kind of doper and method improving zone-melted vapor doping stability |
CN113943973A (en) * | 2021-10-26 | 2022-01-18 | 中国电子科技集团公司第四十六研究所 | Process method for drawing high-resistivity zone-melting monocrystalline silicon |
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Publication number | Publication date |
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CN1333114C (en) | 2007-08-22 |
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Effective date of registration: 20181101 Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 300384 Tianjin Huayuan Industrial Park (outside the ring) 12 East Hai Tai Road Patentee before: TIANJIN HUANOU SEMICONDUCTOR MATERIAL TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20191217 Address after: 214200 Dongfen Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Co-patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 300384 in Tianjin Binhai high tech Zone Huayuan Industrial Zone (outer ring) Haitai Road No. 12 Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
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Address after: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |