CN1864867A - 涂布装置 - Google Patents

涂布装置 Download PDF

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CN1864867A
CN1864867A CNA2005100347588A CN200510034758A CN1864867A CN 1864867 A CN1864867 A CN 1864867A CN A2005100347588 A CNA2005100347588 A CN A2005100347588A CN 200510034758 A CN200510034758 A CN 200510034758A CN 1864867 A CN1864867 A CN 1864867A
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coating
masking liquid
opening
liquid pipe
liquid material
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CN100411750C (zh
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李志鹏
刘泰健
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Priority to CNB2005100347588A priority Critical patent/CN100411750C/zh
Priority to US11/307,544 priority patent/US7556689B2/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C7/00—Apparatus specially designed for applying liquid or other fluent material to the inside of hollow work
    • B05C7/06—Apparatus specially designed for applying liquid or other fluent material to the inside of hollow work by devices moving in contact with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种涂布装置，尤指一种适用于涂液管与各式散热鳍片之紧密接合的涂布装置。该涂液管前端设内具复数流通孔之一环状凹槽，经由此设计之涂液管具有液料涂布均匀之功能。

Description

涂布装置
【技术领域】
本案发明系于电子元件相互黏着密封有关，尤其使液料涂布均匀之涂布装置。
【背景技术】
在目前电脑散热冷却技术中，举凡风冷热管型散热器、水冷式散热系统的散热管排及压缩冷冻循环系统的冷凝器等散热元件系皆为利用热交换器之原理予以应用与设计，以提高散热元件的移热性能。合理的热交换器之设计固然可以满足散热系统的需求，符合体积小、重量轻巧、价格便宜等优点，但如何在量产制程阶段中开发关键技术以提高散热器的性能及可靠度也益形重要，否则即使热交换器之设计再极致，亦无法发挥其最佳的效能。
如第一、二、三图中所示、上述所列举的各式热交换器中管件9与散热之鳍片7间紧密接合的制作过程，是使用多排鳍片7在冲孔过程中精确地控制突领8之高度，将管件9套入孔圈中而固定在鳍片8突领里(如第三图所示)，然后再经过涨管程序加热后与管件9紧配合，或以锡膏焊黏使鳍片与管件紧密接触里(如第一图所示)。
(1)尽管鳍片7与管件9间之接合制程技术有着加工简单、工艺成熟且成本低等优点，不过目前在量产技术应用上仍有以下诸多问题及缺点尚待克服，使得以习知接合技术应用与推广于热交换器上仍有以下改善的空间：
管件与散热鳍片之间接合处锡膏涂布不均匀
(2)目前在自动化产联机以习知的锡膏焊接技术用于管件与鳍片接合，如第一图所示，最常见的是使用锡膏之涂布机1以挤锡棒5穿过鳍片7上孔圈之突领8内(图1、2中所示之鳍片与孔圈突领系剖面图)，挤锡棒5在固定进给速度下挤出适量之锡膏沿着鳍片7各突领8内缘表面涂布，再将管件穿入鳍片后送入一定温度的回焊炉加热，使管件与鳍片之间的锡膏熔融后填补于孔隙中。然而习知的挤锡棒5之前端设计乃为复数之开孔6，当锡膏由挤锡棒开孔6溢出后涂于突领8内缘表面，则锡膏移动之涂层轨迹呈线条分布而非完全面接触分布，此涂布不均之现象致使两接触接口之间锡膏接合不良，长时间容易因氧化或震动等因素，进而导致接触接口密合度降低，甚至两接触面会有剥离松落之虞，无法有效地将管内热量经由鳍片完全传递至空气侧，造成热传效率不佳。为使涂布均匀或可藉由转动该设备达成，但实务上仍十分不便，且无法保证其均匀性。
锡膏涂布层黏着性不稳定
(3)在产联机工程人员为解决锡膏涂布不均之问题，通常增加挤锡棒之锡膏溢出量，然而锡膏流体受到重力的影响，涂敷较厚之锡膏层牵引邻近锡膏沿重力方向流动造成涂层厚薄不均之现象，如第二图所示，而且若挤锡棒5移动速度较快时，锡膏附着壁面之黏着性降低，受到上述重力影响，导致涂布于突领8内壁的锡膏有崩塌脱落等现象，无法确保制程上锡膏附着力之稳定性。
涨管制程易使热交换器的热传效率不佳
在冷冻空调系统中最广泛应用于热交换器之管件9与鳍片7接合技术是采用机械或液压涨管方式，以一心轴或液体加压膨胀管件使管径增大，与鳍片7紧密接合，但由于接触面仅是机械接触且涨管压力若稍微偏低便会造成管件9与鳍片7之间密合度不佳而产生间隙，因而降低管件9的热传效率，且当热交换器运送过程中受到外力碰撞时，鳍片7发生异位松脱亦会增加管件9与鳍片7间之介面热阻，如第三图所示。
【发明内容】
本发明主要创作目的在于利用涂液管前端设一环状凹槽，凹槽内具复数之流通孔，使管件涂布时液料由孔溢出均匀地分布于凹槽内，以达到管件涂布均匀之功能。
本发明的另一创作目的在于利用该涂液管前端设顶部设一毛刷，让涂液管涂布时毛刷刷过涂布层，以达到涂布层厚度均匀之功能。
本发明的又一创作目的在于利用该涂液管前端设一垫环使设置垫环以提高涂布层的附着力及厚度的均匀性。
本发明的另一创作目的在于利用该管件前端设顶部设一毛刷，让管件涂布时毛刷刷过涂布层，以达到涂布层厚度均匀之功能。
本发明的又一创作目的在于利用该管件前端设一垫环使设置垫环以提
高涂布层的附着力及厚度的均匀性。
【附图说明】
图一为习知液料涂布技术中锡膏涂布不均匀之一立体示意图；
图二为习知液料涂布技术中锡膏黏着性不佳之另一立体示意图；
图三为习知涨管技术中管件与鳍片之间密合度不佳之一立体示意图；
图四为本发明涂布装置的第一实施例之立体示意图；
图五为依图四中涂液管的局部放大立体示意图；
图六为本发明涂布装置的第二实施例之立体示意图；
图七为图六中涂液管的局部放大立体示意图；
图八为本发明涂布装置的第三实施例之立体示意图；
图九为图八中涂液管的局部放大立体示意图；
图十为本发明涂布装置的第四实施例之立体示意图；及
图十一为图十中涂液管的局部放大立体示意图。
【具体实施方式】
为进一步了解本发明之构造、运用之技术手段即所预期达成之功效，兹举数个较佳实施例并配合图示详细说明如下，相信本发明之创作目的、特徵及其他特点，当可由此而得深入且具体之了解。
请参阅第四、五图所示，该液料之涂布装置10主要包括一涂液控制器12、一置液筒14及一涂液管16。该涂布装置10藉由涂液控制器12调整空气压力后，驱动置液筒14内的活塞142向前推进，使液料由涂液管16挤出。该涂液管16前端设一环状凹槽162，槽内具复数之流通孔164，该流通孔164之形状大小及结构可根据实际需求而变化，如为圆形、方形、三角形等。当液料由流通孔164挤出后，部份液料由流通孔164两侧流动填满环状凹槽162，可使环状凹槽162之环面均匀布满液料，确保涂液管16之在涂布呈均匀之面分布。
请参阅第六、七图所示，为本发明第二实施例，该涂布装置10主要在涂液管16前端设复数之流通孔164a及顶端设一毛刷166，当涂液管22移动中由流通孔23挤出液料涂布于壁面时，顶端的毛刷166沿液料经过的轨迹线刷过，抹平液料且将多余散开之液料涂抹于四周，以达到涂布层厚度均匀之效果。
请参阅第八、九图所示，为本发明第三实施例，该涂布装置10主要在涂液管16前端设一垫环168及一环状凹槽162b，槽内具复数之流通孔164b，当涂液管16移动由之流通孔164b挤出液料涂布于物件时，垫环168沿涂布面抹平液料且将多余之液料刮除，以提高涂布层的附着力及厚度的均匀性。
请参阅第十、十一图所示，为本发明第四实施例，该涂布装置10主要包括前端设复数之流通孔162c、一环状凹槽164c及一垫环168c。通常产品在市场上有急迫需求或制程进度落后的情况下，量产速度必须加快且品质要稳定，因此便将管件涂液速度加快且液料挤出量增加以便提高生产量。然而当管件垂直于地面的操作环境下朝上移动涂布时，一部份的液料受重力之影响向下流动，造成距离地面愈近，液料涂布量愈多。因此本实施例中涂液管16前端的之流通孔162c溢出的液料一部份随着管件移动的方向而流动，另一部份受重力影响的液料往下流入环状凹槽164c内，再利用垫环168c将过厚的液料层刮除，如此可改善涂液设备在操作速度快的情况下涂布层的均匀性。

Claims (5)

1.一种涂布装置，主要包括一涂液控制器、一置液筒及一涂液管，其改良在于：该涂液管前端系设一环状凹槽，槽内具复数之流通孔。
2.依据申请专利范围第1项所述之涂布装置，其中，该流通孔之形状大小及结构可根据实际需求而变化，如为圆形、方形、三角形等。
3.依据申请专利范围第1项所述之涂布装置，其中，该涂液管前端系设复数之流通孔及顶端设一毛刷。
4.依据申请专利范围第1项所述之涂布装置，其中，该在涂液管前端系设一垫环及一环状凹槽，槽内具复数之流通孔。
5.依据申请专利范围第1项所述之涂布装置，其中，该在涂液管前端系设复数之流通孔、一环状凹槽及一垫环。
CNB2005100347588A 2005-05-20 2005-05-20 涂布装置 Expired - Fee Related CN100411750C (zh)

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Application Number Priority Date Filing Date Title
CNB2005100347588A CN100411750C (zh) 2005-05-20 2005-05-20 涂布装置
US11/307,544 US7556689B2 (en) 2005-05-20 2006-02-13 Device for spreading viscous thermal medium on heat dissipation device for electronic component

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Application Number Priority Date Filing Date Title
CNB2005100347588A CN100411750C (zh) 2005-05-20 2005-05-20 涂布装置

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CN100411750C CN100411750C (zh) 2008-08-20

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Cited By (5)

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CN100430153C (zh) * 2005-06-10 2008-11-05 讯凯国际股份有限公司 散热鳍片穿孔涂布工具及涂布方法
CN105499013A (zh) * 2016-01-26 2016-04-20 河北硅谷化工有限公司 缝隙、槽格喷涂装置
CN105798415A (zh) * 2014-12-30 2016-07-27 中国科学院宁波材料技术与工程研究所 焊接装置及焊接方法
CN106363267A (zh) * 2016-10-18 2017-02-01 成都言行果科技有限公司 电子设备熔接装置的过滤型焊料送料装置
CN106425004A (zh) * 2016-10-18 2017-02-22 成都言行果科技有限公司 电子设备熔接装置的多点位焊料送料装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100430153C (zh) * 2005-06-10 2008-11-05 讯凯国际股份有限公司 散热鳍片穿孔涂布工具及涂布方法
CN105798415A (zh) * 2014-12-30 2016-07-27 中国科学院宁波材料技术与工程研究所 焊接装置及焊接方法
CN105499013A (zh) * 2016-01-26 2016-04-20 河北硅谷化工有限公司 缝隙、槽格喷涂装置
CN106363267A (zh) * 2016-10-18 2017-02-01 成都言行果科技有限公司 电子设备熔接装置的过滤型焊料送料装置
CN106425004A (zh) * 2016-10-18 2017-02-22 成都言行果科技有限公司 电子设备熔接装置的多点位焊料送料装置

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