CN1855453A - Radiating fin and its packing structure - Google Patents
Radiating fin and its packing structure Download PDFInfo
- Publication number
- CN1855453A CN1855453A CN 200510067917 CN200510067917A CN1855453A CN 1855453 A CN1855453 A CN 1855453A CN 200510067917 CN200510067917 CN 200510067917 CN 200510067917 A CN200510067917 A CN 200510067917A CN 1855453 A CN1855453 A CN 1855453A
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- CN
- China
- Prior art keywords
- fin
- arc
- panel part
- annular projection
- level height
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Abstract
The heat sink is designed for an encapsulation process and has a round cambered surface panel. The height of central part of the round cambered surface is equal or higher than the one of ring- shaped bulge. When the horizontal top side of internal cavity of encapsulation mold is pressed down to the heat sink so as to produce a deformation, the cambered surface can not be pressed to oppress the subjacent metal line, and the ring-shaped bulge can also prevent mold-overflow.
Description
Technical field
The present invention relates to a kind of fin and its application, particularly relate to a kind of fin and its application that is applicable to encapsulation procedure.
Background technology
Along with IC chip internal circuit integration (integration) is constantly soaring, how heat effectively and is rapidly discharged the important topic that has been faced when having become the IC chip encapsulating manufacturing procedure, therefore the metal fin that has the high heat-conduction coefficient characteristic just often is used in the encapsulation procedure, and when sealing (molding) program, just directly fin is pasted at carrying one chip and be on the substrate under the preheat mode, insert in the dies with epoxy compound then together, afterwards again with the packing colloid of a fusion for example epoxy resin (epoxy molding compound) be pressed into mould, make it seal the interior element of (encapsulate) die cavity, and the program of after cooling, carrying out other shear formings again.
Existing known in a dies with epoxy compound 16, when fin 15 has pasted to substrate 11 and ccontaining one cross-sectional view when routing has engaged the chip of finishing 13 can be consulted shown in Figure 1A.Substrate 11 mats one adhesion layer 12 is with chip 13 glutinous being located on the surface 111, and chip 13 is done an electric connection with substrate 11 and by the program that a routing engages with metal wire 14.Fin 15 mainly is made up of a top 151, a support base 152 and connection and the annular sidewall 153 between top 151 and support base 152, slightly is the external form of a cover cap.The top 151 of fin 15 is by a circular board 1511 and be connected in circular board 1511 peripheries be used for preventing the overflowing annular projection 1512 of glue and formed; Annular sidewall 153 has an inclination external form, the top of its inclination is connected with the peripheral lower edge of annular projection 1512, the bottom of its inclination then is connected with the upper limb of support base 152, and is formed with a plurality of openings that run through 1531 to flow opening as mould on the part annular sidewall; Support base 152 is then by an adhesion material 17 for example elargol and the glutinous carrying contact (not shown) that is located on the surface 111.
Please continue to consult shown in Figure 1A, when the substrate 11 that pastes fin 15 is inserted in the dies with epoxy compound 16 preheating, dies with epoxy compound 16 is to shift to substrate 11 along the direction of arrow, the scope that can fill in the hope of packing colloid after defining by being formed on the die cavity 161 on the dies with epoxy compound 16.Then see also shown in Figure 1B, when dies with epoxy compound 16 is pressure bonded on the fin 15, the flat surface 1611 of die cavity 161 be with fin 15 structures in annular projection 1512 end faces of top fit, thus, follow-uply just can prevent that it from overflowing into above the circular board 1511 and the effect of heat radiation after hindering when in die cavity 161, pouring into packing colloid.
Please continue to consult shown in Figure 1B, must bestow annular projection 1512 end faces one enough downward pressures when the flat surface 1611 of die cavity 161 could do with it and fit tightly and when reaching preferable anti-overflow effect, inevitably, this downward pressure will cause fin 15 to produce distortion, especially center on by annular projection 1512 and the circular board 1511 that is a plane external form more can so and be bent downwardly and is a cambered surface external form.And in the time of the past more frivolous development of the thickness of encapsulation finished product, circular board 1511 lower surfaces distance is only being counted Mill (mile on metal wire 14 its camber that routing engages and the fin 15; Lmil=0.0254mm) about, therefore reclinate circular board 1511 is easy to just directly be urged to the trickle metal wire 14 in below and makes its distortion displacement even fracture, thereby has influence on the electric connection between chip 13 and the substrate 11 and allow to encapsulate that finished product forms be a waste product.
This shows that above-mentioned existing fin obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that fin exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that above-mentioned existing fin exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of fin and the encapsulating structure thereof of founding a kind of new structure, can improve general existing fin, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcoming the fin that adopted in the existing encapsulation procedure produces one inside crooked and then be urged to the problem that metal wire makes its distortion displacement even damages because of the compressing of dies with epoxy compound when the sealing program easily, and provide a kind of fin and encapsulating structure thereof of new structure, technical problem to be solved is to make it allow the encapsulation procedure of using this fin metal wire below can not being urged to when the sealing program, thereby improve the yield that encapsulates finished product, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.The fin of a kind of suitable encapsulation procedure that proposes according to the present invention, this fin comprises: a top, this top by an arc of circle panel part and one around and the annular projection that is linked to this arc of circle panel part periphery formed, wherein, the level height of these arc of circle panel part central authorities is not less than in the level height of this annular projection end face; One support base; And one annular sidewall link and between the peripheral lower edge of this annular projection and the upper limb of this support base.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The fin of aforesaid suitable encapsulation procedure, wherein said annular sidewall have an inclination external form.
The fin of aforesaid suitable encapsulation procedure, wherein said annular sidewall have the inclination external form of a staged.
The fin of aforesaid suitable encapsulation procedure has at least one opening on the wherein said annular sidewall.
The fin of aforesaid suitable encapsulation procedure more comprises forming a plurality of protrusion contacts on this support base.
The fin of aforesaid suitable encapsulation procedure, the level height of wherein said arc of circle panel part central authorities is greater than or equal to the level height of this annular projection end face.
The object of the invention to solve the technical problems also adopts following technical scheme to realize.According to a kind of encapsulating structure that the present invention proposes, it comprises: a substrate; One chip, this chip is glutinous to be located on this substrate; One metal wire, this metal wire electrically connect this chip and this substrate; One fin, this fin is made up of a top, a support base and an annular sidewall, wherein this top by an arc of circle panel part and one around and the annular projection that is linked to this arc of circle panel part periphery formed, and the level height of these arc of circle panel part central authorities is not higher than in the level height of this annular projection end face, and this annular sidewall then links and between the peripheral lower edge of this annular projection and the upper limb of this support base; And a packing colloid, this packing colloid coats this chip, this metal wire and this substrate of part, and this fin of cover part and only expose the outer surface of this arc of circle panel part.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid encapsulating structure, wherein said annular sidewall have an inclination external form.
Aforesaid encapsulating structure, wherein said annular sidewall have the inclination external form of a staged.
Aforesaid encapsulating structure has at least one opening on the wherein said annular sidewall.
Aforesaid encapsulating structure more is included in and forms a plurality of protrusion contacts that contact with this substrate surface on this support base.
Aforesaid encapsulating structure, the level height of wherein said arc of circle panel part central authorities is less than or equal to the level height of this annular projection end face.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, in order to achieve the above object, the invention provides a kind of fin of encapsulation procedure and encapsulating structure of using this fin of being applicable to, fin is made by the rigidity material, have the arc of circle panel part, and the central authorities of its arc of circle panel part are the height that is greater than or equal to the annular projection end face; Thus, when the flat surface of die cavity in the dies with epoxy compound presses on the fin and when making it produce distortion, the inboard metal wire that just can not be urged to the below of arc of circle panel part, and annular projection equally also can be brought into play the function of the glue that prevents to overflow.
In sum, the fin of special construction of the present invention and encapsulating structure thereof allow the encapsulation procedure of using this fin metal wire below can not being urged to when the sealing program, thereby improve the yield of encapsulation finished product.It has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and more existing fin has the multinomial effect of enhancement, thus be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Figure 1A places existing known fin in one dies with epoxy compound and pastes to substrate and cross-sectional view during a ccontaining chip;
Figure 1B is that dies with epoxy compound is pressure bonded to the cross-sectional view that existing known fin causes fin generation distortion;
Fig. 2 A will place in the dies with epoxy compound according to fin that a preferred embodiment of the present invention provided and paste to substrate and cross-sectional view during a ccontaining chip;
Fig. 2 B is that dies with epoxy compound is pressure bonded to the cross-sectional view that fin provided by the present invention causes fin generation distortion; And
Fig. 2 C uses the formed encapsulating structure generalized section of fin provided by the present invention.
11: substrate 111: surface
12: adhesion layer 13: chip
14: metal wire 15: fin
151: top 1511: circular board
1512: annular projection 152: support base
153: annular sidewall 1531: opening
16: dies with epoxy compound 161: die cavity
1611: flat surface 17: adhesion material
2: encapsulating structure 21: substrate
211: surface 22: adhesion layer
23: chip 24: metal wire
25: fin 251: top
2511: arc of circle panel part 2512: annular projection
252: support base 253: annular sidewall
2531: opening 26: dies with epoxy compound
261: die cavity 2611: flat surface
27: adhesion material 28: packing colloid
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to fin and its embodiment of encapsulating structure, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Embodiments of the invention are to be described in detail as follows with schematic diagram, and when embodiments of the invention were described in detail in detail, the ring-like projection that fin had and the cambered surface external form of circular board can be amplified demonstration and explanation, so should be with this as the cognition that qualification is arranged.Other necessary parts when in addition, composition such as the employed bearing substrate of above-mentioned encapsulation procedure, chip, metal wire and fin and operating mechanism also should be included in actual enforcement.
Fig. 2 A is the generalized section of assembling a potted element according to one embodiment of the invention.Substrate 21 mats one adhesion layer 22 is with chip 23 glutinous being located on the surface 211; Chip 23 is done an electric connection with substrate 21 and by the program that a routing engages with metal wire 24; One fin 25 has pasted to substrate 21 and ccontaining routing engages the chip of finishing 23; In a dies with epoxy compound 26, then prepare to assemble in the appropriate location.
Fin 25 mainly is made up of a top 251, a support base 252 and connection and the annular sidewall 253 between top 251 and support base 252, slightly is the external form of a cover cap.In one embodiment, top 251 is by an arc of circle panel part 2511 and be connected in circular board 2511 peripheries be used for preventing the overflowing annular projection 2512 of glue and formed.Arc of circle panel part 2511 its central level heights that present embodiment provided are the level height height than annular projection 2512 end faces in vertical direction, shown in height H among Fig. 2 A, but also can equal the height of (or claim trim) ring-like protruding 2512 end faces in other embodiments.The top of annular sidewall 253 is to be connected with the peripheral lower edge of annular projection 2512, its underpart then is connected with the upper limb of support base 252, annular sidewall 253 can have an inclination external form, even also can as shown in Fig. 2 A, be a stepped inclination external form, and on the part annular sidewall, form a plurality of openings that run through 2531 to flow opening as mould.Support base 252 then can be connected with annular sidewall 253, can be the plane of a ring-like or rectangle and on the corner, be formed with a plurality of protrusion contacts, but the also extension of part annular sidewall, but all can be by an adhesion material 27 for example elargol and the glutinous carrying contact (not shown) that is located on the surface 211.
See also shown in Fig. 2 A, when the substrate 21 that pastes fin 25 is inserted in the dies with epoxy compound 26 preheating, dies with epoxy compound 26 is to shift to substrate 21 along the direction of arrow, the scope that can fill in the hope of packing colloid after defining by being formed on the die cavity 261 on the dies with epoxy compound 26.And execute son one downward pressure same as the prior art when conforming on the fin 25 when dies with epoxy compound 26, the flat surface 2611 of die cavity 261 is to contact with arc of circle panel part 2511 end faces of top in fin 25 structures earlier, then as shown in Fig. 2 B, the central authorities of this arc of circle panel part 2511 are pressed to and annular projection 2512 end faces contour (or a little less than annular projection 2512 end faces).Thus, annular projection 2512 end faces still can fit tightly with the flat surface 2611 of die cavity 261 and prevent follow-up when pouring into packing colloid packing colloid overflow into arc of circle panel part 2511 tops and hinder heat radiation, on the other hand, arc of circle panel part 2511 inboards also can not be bent downwardly and be urged to the trickle metal wire 24 in below, so the situation that just can avoid metal wire 24 to deform displacement even rupture.
Can consult shown in Fig. 2 C and use its generalized section of the formed encapsulating structure of fin provided by the present invention, before this, packing colloid 28 is to have poured in the defined filling scope of die cavity (not shown), coating chip 23, metal wire 24 and part substrate 21 surfaces, and cover part fin 25 and only expose the outer surface of arc of circle panel part 2511; And external physical characteristic that fin 25 is had and composition are mostly identical with the fin 25 that previous embodiment is provided, unique difference is when finishing encapsulating structure 2, arc of circle panel part 2511 its central level heights in the fin 25 are the level height that is not higher than annular projection 2512 end faces in vertical direction, just can be equal to or less than the level height of annular projection 2512 end faces.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the structure that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (12)
1, a kind of fin of suitable encapsulation procedure is characterized in that this fin comprises:
One top, this top by an arc of circle panel part and one around and the annular projection that is linked to this arc of circle panel part periphery formed, wherein, the level height of these arc of circle panel part central authorities is not less than in the level height of this annular projection end face;
One support base; And
One annular sidewall links and between the peripheral lower edge of this annular projection and the upper limb of this support base.
2, the fin of suitable encapsulation procedure according to claim 1 is characterized in that wherein said annular sidewall has an inclination external form.
3, the fin of suitable encapsulation procedure according to claim 1 is characterized in that wherein said annular sidewall has the inclination external form of a staged.
4, the fin of suitable encapsulation procedure according to claim 1 is characterized in that having at least one opening on the wherein said annular sidewall.
5, the fin of suitable encapsulation procedure according to claim 1 is characterized in that more comprising forming a plurality of protrusion contacts on this support base.
6, the fin of suitable encapsulation procedure according to claim 1 is characterized in that the level height of wherein said arc of circle panel part central authorities is greater than or equal to the level height of this annular projection end face.
7, a kind of encapsulating structure is characterized in that it comprises:
One substrate;
One chip, this chip is glutinous to be located on this substrate;
One metal wire, this metal wire electrically connect this chip and this substrate;
One fin, this fin is made up of a top, a support base and an annular sidewall, wherein this top by an arc of circle panel part and one around and the annular projection that is linked to this arc of circle panel part periphery formed, and the level height of these arc of circle panel part central authorities is not higher than in the level height of this annular projection end face, and this annular sidewall then links and between the peripheral lower edge of this annular projection and the upper limb of this support base; And
One packing colloid, this packing colloid coat this chip, this metal wire and this substrate of part, and this fin of cover part and only expose the outer surface of this arc of circle panel part.
8, encapsulating structure according to claim 7 is characterized in that wherein said annular sidewall has an inclination external form.
9, encapsulating structure according to claim 7 is characterized in that wherein said annular sidewall has the inclination external form of a staged.
10, encapsulating structure according to claim 7 is characterized in that having at least one opening on the wherein said annular sidewall.
11, encapsulating structure according to claim 7 is characterized in that more being included in a plurality of protrusion contacts that contact with this substrate surface of formation on this support base.
12, encapsulating structure according to claim 7 is characterized in that the level height of wherein said arc of circle panel part central authorities is less than or equal to the level height of this annular projection end face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100679174A CN100433308C (en) | 2005-04-28 | 2005-04-28 | Radiating fin and its packing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100679174A CN100433308C (en) | 2005-04-28 | 2005-04-28 | Radiating fin and its packing structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1855453A true CN1855453A (en) | 2006-11-01 |
| CN100433308C CN100433308C (en) | 2008-11-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100679174A Active CN100433308C (en) | 2005-04-28 | 2005-04-28 | Radiating fin and its packing structure |
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| Country | Link |
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| CN (1) | CN100433308C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102274828A (en) * | 2010-04-30 | 2011-12-14 | 泰克元有限公司 | Opener for test handler |
| CN101800208B (en) * | 2009-02-11 | 2012-02-29 | 日月光半导体制造股份有限公司 | Semiconductor packaging structure and heat radiating fin thereof |
| US8198740B2 (en) | 2009-04-09 | 2012-06-12 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and encapsulating module for molding the same |
| CN101859690B (en) * | 2009-04-10 | 2012-09-05 | 日月光半导体制造股份有限公司 | Packaging structure, sealing compound module and sealing compound mold for packaging same |
| CN101796634B (en) * | 2007-07-12 | 2012-12-19 | 威世通用半导体公司 | Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof |
| CN103978871A (en) * | 2013-02-08 | 2014-08-13 | 法国圣戈班玻璃公司 | Method for forming corner window and injection molding component, guide rail, corner window, automobile door and automobile |
| WO2014121706A1 (en) * | 2013-02-08 | 2014-08-14 | Saint-Gobain Glass France | Methods for forming injection molding component and quarter window, guide rail, quarter window, vehicle door and vehicle |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1175479C (en) * | 1998-12-22 | 2004-11-10 | 胜开科技股份有限公司 | Ball-array package method for integrated circuits |
| US6191477B1 (en) * | 1999-02-17 | 2001-02-20 | Conexant Systems, Inc. | Leadless chip carrier design and structure |
| US20040159935A1 (en) * | 2003-02-14 | 2004-08-19 | Prosenjit Ghosh | Thermally optimized conductive block |
| CN1549337A (en) * | 2003-05-09 | 2004-11-24 | 华泰电子股份有限公司 | Radiating fin device for preventing radiating fin glue spilling in semi conductor packaging parts |
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2005
- 2005-04-28 CN CNB2005100679174A patent/CN100433308C/en active Active
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101796634B (en) * | 2007-07-12 | 2012-12-19 | 威世通用半导体公司 | Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof |
| CN101800208B (en) * | 2009-02-11 | 2012-02-29 | 日月光半导体制造股份有限公司 | Semiconductor packaging structure and heat radiating fin thereof |
| US8198740B2 (en) | 2009-04-09 | 2012-06-12 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and encapsulating module for molding the same |
| CN101859690B (en) * | 2009-04-10 | 2012-09-05 | 日月光半导体制造股份有限公司 | Packaging structure, sealing compound module and sealing compound mold for packaging same |
| CN102274828A (en) * | 2010-04-30 | 2011-12-14 | 泰克元有限公司 | Opener for test handler |
| US8558569B2 (en) | 2010-04-30 | 2013-10-15 | Techwing Co., Ltd. | Opener for test handler |
| CN102274828B (en) * | 2010-04-30 | 2014-09-17 | 泰克元有限公司 | Opener for test handler |
| CN103978871A (en) * | 2013-02-08 | 2014-08-13 | 法国圣戈班玻璃公司 | Method for forming corner window and injection molding component, guide rail, corner window, automobile door and automobile |
| WO2014121706A1 (en) * | 2013-02-08 | 2014-08-14 | Saint-Gobain Glass France | Methods for forming injection molding component and quarter window, guide rail, quarter window, vehicle door and vehicle |
| CN103978871B (en) * | 2013-02-08 | 2018-09-28 | 法国圣戈班玻璃公司 | Quarter window and injection molding assembly forming method, guide rail, quarter window, car door and automobile |
| US10195928B2 (en) | 2013-02-08 | 2019-02-05 | Saint-Gobain Glass France | Quarter window assembly for a vehicle door and method of making the assembly |
| EA032248B1 (en) * | 2013-02-08 | 2019-04-30 | Сэн-Гобэн Гласс Франс | Quarter window for a vehicle passenger compartment, method for forming the quarter window, vehicle door and vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100433308C (en) | 2008-11-12 |
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