CN1853272B - 具有折叠柔性衬底的电子封装及其生产方法 - Google Patents

具有折叠柔性衬底的电子封装及其生产方法 Download PDF

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CN1853272B
CN1853272B CN2004800270058A CN200480027005A CN1853272B CN 1853272 B CN1853272 B CN 1853272B CN 2004800270058 A CN2004800270058 A CN 2004800270058A CN 200480027005 A CN200480027005 A CN 200480027005A CN 1853272 B CN1853272 B CN 1853272B
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mould cover
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CN1853272A (zh
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J·萨尔塔三世
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Abstract

提供了一种电子封装以及构造方法。将一个微电子管芯安装在柔性衬底上。在该管芯上注入成型模罩。该模罩具有所述柔性衬底包绕的弯曲凸表面。所述柔性衬底的折叠由所述边缘表面所控制，从而减少了缺陷，确保了各封装间形状因数的一致性并且允许包括相对具有弹性的接地层。

Description

具有折叠柔性衬底的电子封装及其生产方法
技术领域
本发明涉及一种具有微电子管芯类型的电子封装以及一种构造电子封装的方法。
背景技术
集成电路通常是在随后被“单一化”或“切割成”单独微电子管芯且每个管芯都各种载有集成电路的半导体晶片上生产的。这种管芯非常薄，通常小于100微米，并在随后出于结构整体性的目的就把该管芯安装在封装衬底上。封装衬底也具有以其表面上的轨迹、其中的金属线和/或其中的过孔为形式的导体，用于提供对其他器件的电互连，通常在相同的封装衬底上安装有其他的集成电路或其他的管芯。
为了节省x和y轴上的空间，通常需要在z方向上把多于一个的管芯堆叠在另一个管芯上，其中集成电路中的管芯是相互连接的。例如，可以把两个管芯安装在柔性衬底上，并且该柔性衬底可以折叠至一个管芯位于另一个管芯之上的位置。
前述类型的封装衬底通常在其宽度上具有均匀的柔性。当该封装衬底的一部分折叠在该封装衬底的另一部分之上时，可能会在封装衬底上的一个非期望的，甚至是任意的区域创建一个折叠区域，在非期望区域折叠衬底会导致衬底上某些组件的损坏。在任意位置上的弯曲会引起不同组件的弯曲度上的不一致，而这会导致错误的下游封装。未受控制的折叠还会导致最终的电子封装的非期望性质因数。
图4A-D示出了一种形成现有电子封装的方式。图4A中，两个微电子管芯310经由其他两个微电子管芯312安装在柔性封装衬底314上。覆料316位于微电子管芯310、微电子管芯312和柔性衬底314上。覆料316具有与柔性衬底314的折叠部分320相接触的突出318。
如图4B所示，随后将模罩324注入成型在由覆料316、微电子管芯310、微电子管芯312和柔性衬底314结构所定义的剩余空间。当如图4C所示移除覆料316时，可见模罩324形成了相互面对的直角边缘326，而所述折叠部分320则位于边缘326之间。
如图4D所示，随后就折叠所述折叠部分420，使得载有一个微电子管芯310的柔性衬底314部分位于载有另一个微电子管芯310的该柔性衬底的另一部分上。折叠部分420的折叠是不受控制的，并且各封装之间是不一致的。
附图说明
以参考附图的实例的方式描述本发明，其中所述附图包括：
图1A是柔性衬底的一部分和电子封装的微电子管芯，以及用于构造所述电子封装的形状定义件和覆料的截面图；
图1B是在柔性衬底上放置覆料并且将电子封装的模罩注入成型由电子封装的其他组件、所述形状定义件和所述覆料所定义的剩余空间之后的类似于图1A的视图；
图1C是移除所述覆料之后的类似于图1B的视图；
图1D是移除了形状定义件并在模罩凹进部分内涂覆粘合剂之后的类似于图1C的视图；
图1E是柔性衬底围绕模罩折叠，且柔性衬底的折叠部分包绕了模罩的弯曲凸表面之后的类似于图1D的视图；
图1F是示出了完整电子组件的类似于图1E的视图；
图2是以分解形式示出并处于被折叠之前的带有柔性衬底的电子装配的透视图；
图3A是根据本发明另一个实施例的电子封装组件以及用于构造所述电子封装的两块形状定义件和一块覆料的截面图；
图3B是在柔性衬底上放置覆料并且将两个模罩注入成型，其中各自分别覆盖所述电子封装的一个微电子管芯之后的类似于图3A的视图；
图3C是移除所述覆料和形状定义件之后的类似于图3B的视图；
图3D是在折叠了所述柔性衬底并且其折叠部分包绕了两个模罩的弯曲凸表面之后示出了完整电子组件的类似于图3C的视图；
图4A是根据现有技术具有模罩的电子封装组件的截面图；
图4B是在两个模罩注入成型以覆盖所述电子封装的微电子管芯之后的类似于图4A的视图；
图4C是移除所述覆料之后的类似于图4B的视图；
图4D是在折叠了所述柔性衬底之后的类似于图4C的视图。
具体实施方式
提供了一种电子封装及其构造方法。将微电子管芯安装在柔性衬底上。模罩可注入成型以覆盖所述管芯。所述模罩具有由所述柔性衬底所包绕的弯曲凸边缘表面。所述柔性衬底的折叠由所述边缘表面所控制，从而减少了缺陷，确保了各封装间形状因数的一致性并且允许包括相对具有弹性的接地层。
附图的图1A示出了所制造的电子封装的部分组件，包括柔性衬底10和微电子管芯12，以及含有覆料14和形状定义件16的模制组件。
柔性衬底10具有第一和第二部分18和20以及在所述第一和第二部分18和20之间的折叠部分22。柔性衬底10包括一个柔性电介质材料的核以及以金属面、金属线和过孔的形式在所述柔性核内部或表面形成的导体。
微电子管芯12安装在柔性衬底10的第一部分18。微电子管芯12具有其中形成的集成电路，并且与柔性衬底10上的端点电气连接。在该实施例中，微电子管芯12通过引线键合引线24与柔性衬底10的端点相连，其中每条引线键合引线24的一端连接至所述微电子管芯12上表面的一个触件而另一端则连接至柔性衬底10上的一个端点。
形状定义件16位于折叠部分22之上，并朝向折叠部分22的左边。形状定义件16具有高度25和宽度26。形状定义件16还具有向左正对微电子管芯12的弯曲凸表面28。该弯曲凸表面28略低于形状定义件16的上表面30，使得形状定义件16具有高度34的左上边缘32。弯曲凸表面28一直延伸至形状定义件16的下表面，使得弯曲凸表面28和下表面在柔性衬底10上的相关陡沿38处相遇。
覆料14具有从其上表面44到其下表面46测量的总计高度42。在覆料14内加工第一表面48。示出的覆料14带有位于柔性衬底10的第一部分18之上的第一表面48。第一表面48高于下表面46上的高度50。
在覆料14内加工第二表面52并示出其直接位于形状定义件16之上。第二表面52具有与形状定义件16的宽度26大致相当的宽度54。加工第二表面52使其具有与形状定义件16的高度25大致相当的高度56。
因为将第二表面52加工的比第一表面48更深，所以高度56和高度50之间存在高度差60。高度差60大于形状定义件16的左上边缘32的高度34。
在覆料14内形成注入口62。在此实例中，注入口62是形成在从覆料14的上表面44到第一表面48之间的。
图1B示出了在柔性衬底10和形状定义件16上放置覆料14并且定义件模罩64注入和形成在柔性衬底10、微电子管芯12、覆料14和形状定义件16之间形成的剩余空间之后的图1A的组件。当比较图1A和1B时，可见带有第二表面52的覆料14部分套在形状定义件16上，这是因为第二表面52的宽度54与形状定义件16的宽度26大致相同。覆料14的上表面48略低于形状定义件16的左上边缘32是因为高度差60大于高度34。第一表面48与微电子管芯12的上表面之间留有间隔。
通过注入口62注入液体树脂。树脂接触到并填充由微电子管芯12、未被微电子管芯12覆盖的第一部分18区域、形状定义件16的弯曲凸表面28以及第一表面48所定义的空间。随后就固化该树脂以使其凝固。
如图1C所示，随后就移除覆料14。在模罩64内形成了具有上表面68和侧表面70的凹进部分66，这是因为第一表面(图1A中的48)要低于左上边缘(图1A中的32)。
如图1D所示，随后就移除了形状定义件(图1C中的16)并将粘合层72附在模罩64之上。模罩64在其边缘处具有弯曲凸表面74。该弯曲凸表面74具有与形状定义件的弯曲凸表面(图1A中的28和16)相同的形状。在凹进部分(图1C中的66)内形成粘合层72，使得其上表面76与弯曲凸表面74的终止沿具有大致相同的高度。
参见图1E，柔性衬底10随后以方向80围绕着模罩64进行折叠。折叠部分22的内表面包绕了模罩64的弯曲凸表面74。第二部分20位于并附于粘合层72之上。这样就弯曲了柔性衬底10的期望部分，并由此保持了其他部分的大致平坦。通过避免折叠非期望区域，就能够避免毁坏柔性衬底10上的某些组件。此外，在预定义位置上的弯曲保证了不同电子封装之间弯曲度的一致性，这就导致了期望的和正确的下游封装。受控的折叠还保证各个电子封装之间的形状因数的一致性。
图1F示出了完整的电子封装82。引线键合引线24位于微电子管芯12的不同侧。最初相对的柔性衬底10边缘现在一个在另一个上面的呈直线排列并且与模罩64的边缘也呈直线排列。
图2示出了折叠之前的所述电子封装82的又一些组件。除了柔性衬底10和微电子管芯12之外，电子封装82还包括多个导电互连构件84并且还包括第二微电子管芯86。柔性衬底10的核是由聚酰亚胺组成的绝缘体的柔性层88。分别在柔性层88的上表面和下表面形成第一和第二金属薄层90和92。最初形成的金属薄层90和92覆盖了柔性层88的长度和宽度。随后就图形化金属薄层90从而移除某些区域并留下包括触件94和轨迹96的其他区域。
第一焊接掩模98在第一金属薄层90的剩余部分上形成。在蚀刻过程中选择性地移除第一焊接掩模98的区域100，使之能够暴露出第一金属薄层90的触件94。
随后就将一个相对有弹性的接地金属层102镀于第二金属薄层92的表面。并在所述接地金属层102的暴露表面上形成第二焊接掩模104，并图形化以形成开口106。第二微电子管芯86可由引线键合引线108通过第二焊接掩模104内的开口106以及接地金属层102、第二金属层92和柔性层88的开口连接至某些触件94。导电互连构件84则能够以类似的方式经由过孔110连接至某些触件94。以此方式，微电子管芯12和86能够互连并可连接至导电互连构件84。于是，就可通过导电互连构件84为任一或全部微电子管芯12的和86提供信号，并且微电子管芯12和86能够相互通信。
接地金属层102的内含物还为柔性衬底10提供了能够承受柔性衬底10的弯曲的弹性程度。这一弯曲的抗性在做出柔性衬底10的弯曲尝试时倾向于产生一个较大的弯曲，而不是创建一个较小的折叠区。既使在包括了接地金属层102的情况下，模罩的成形弯曲凸表面(图1E中的64和74)仍控制柔性衬底10的折叠。
图3A到图3D示出了具有分别安装在未折叠柔性衬底210同一侧上的第一和第二微电子管芯212和286的电子封装的生产。在该实例中，所述电子封装包括其上分别要安装微电子管芯212和286的微电子管芯220和222。引线键合引线224将微电子管芯212和286以及微电子管芯220和222连接至柔性衬底210。
具体参见图3A，两个形状定义件216A和216B位于柔性衬底210的折叠部分260上。第一和第二微电子管芯212和286则分别位于折叠部分260相对侧上的第一和第二部分。覆料214具有与形状定义件216A和216B高度大致相同的突起250，并且该突起的宽度与形状定义件216A和216B之间的间隔大致相等。
具体参见图3B，移除覆料214使得突起250可插入形状定义件216A和216B之间并且在微电子管芯212和286上的剩余区域内注入成型模罩240。如图3C所示，随后就分别移除覆料214和形状定义件216A和216B。模罩240具有弯曲凸表面274。每个弯曲凸表面274就在其横截面上大致形成四分之一个圆周，而图1D中示出的弯曲凸表面74则在其横截面上大致形成一个半圆。
参见图3D，对模罩240中的一个施加粘合层230，并且折叠柔性衬底210的折叠部分260以使得第二微电子管芯286位于第一微电子管芯212之上。因为折叠部分260包绕了两个模罩240的弯曲凸表面274，所以对柔性衬底210的折叠是受控。
虽然在此描述并在附图中示出了某些典型实施例，但应该理解这些实施例仅是示例性的而不限制本发明，并且本发明不限于示出和描述的具体结构和排列，因为修改对本领域普通技术人员来说是显而易见的。

Claims (25)

1.一种电子封装，包括：
衬底，该衬底具有第一和第二部分以及在所述第一和第二部分之间的折叠部分；
安装在所述第一部分上的第一微电子管芯；以及
一个第一折叠控制构件，所述折叠部分部分地包绕所述第一折叠控制构件以将所述第二部分置于所述第一部分之上。
2.如权利要求1所述的电子封装，其特征在于，所述第一折叠控制构件是所述第一微电子管芯上的第一模罩的一部分。
3.如权利要求2所述的电子封装，其特征在于，还包括在所述模罩之上的粘合层，所述第二部分附于所述粘合层。
4.如权利要求1所述的电子封装，其特征在于，由所述折叠部分包绕的所述第一折叠控制构件的表面是弯曲的。
5.如权利要求4所述的电子封装，其特征在于，所述表面从第一部分一直到第二部分是弯曲的。
6.如权利要求1所述的电子封装，其特征在于，所述第一折叠控制构件是所述第一微电子管芯上的第一模罩上的一部分，由所述折叠部分包绕的所述第一折叠控制构件的所述表面从第一部分一直到第二部分都是弯曲的，还包括在所述模罩之上的粘合层，所述第二部分附于所述粘合层。
7.如权利要求1所述的电子封装，其特征在于，还包括安装在所述第二部分上的第二微电子管芯。
8.如权利要求7所述的电子封装，其特征在于，还包括一个第二折叠控制构件，所述折叠部分部分地包绕所述第二折叠控制构件以将所述第二部分置于所述第一部分之上。
9.如权利要求8所述的电子封装，其特征在于，在所述折叠部分包绕所述折叠控制部分之前，所述第一和第二折叠控制构件是分别附于所述第一和第二部分的。
10.如权利要求9所述的电子封装，其特征在于，所述第二折叠控制构件是所述第二微电子管芯上的第二模罩的一部分。
11.如权利要求10所述的电子封装，其特征在于，还包括在所述第一模罩之上的粘合层，所述第二模罩附于所述粘合层。
12.如权利要求7所述的电子封装，其特征在于，还包括安装在所述第二部分上的第二微电子管芯，其中所述第一折叠控制构件是所述第一微电子管芯之上第一模罩上的一部分，其中所述第二折叠控制构件是所述第二微电子管芯上的第二模罩的一部分，还包括在所述第一模罩之上的粘合层，所述第二模罩附于所述粘合层。
13.一种电子封装，包括：
衬底，该衬底具有第一和第二部分以及在所述第一和第二部分之间的折叠部分；
安装在所述第一部分上的微电子管芯；
在所述微电子管芯之上并附于所述第一部分的模罩，所述模罩在其边缘具有弯曲的表面，所述折叠部分部分地包绕所述模罩并与所述弯曲表面的形状一致，以将所述第二部分置于所述第一部分之上。
14.如权利要求13所述的电子封装，其特征在于，还包括在所述模罩之上的粘合层，所述第二部分附于所述粘合层。
15.如权利要求14所述的电子封装，其特征在于，所述第二部分是直接附于所述粘合层的。
16.一种电子封装，包括：
衬底，该衬底具有第一和第二部分以及在所述第一和第二部分之间的折叠部分；
安装在所述第一部分上的第一微电子管芯；
安装在所述第二部分上的第二微电子管芯；
在所述第一微电子管芯之上并附于所述第一部分的第一模罩，所述第一模罩在其边缘处具有第一弯曲表面；
在所述第二微电子管芯之上并附于所述第二部分的第二模罩，所述第二模罩在其边缘处具有第二弯曲表面，所述折叠部分部分包绕所述第一弯曲表面并部分地围绕所述第二弯曲表面，以将所述第二部分置于所述第一部分之上。
17.如权利要求16所述的电子封装，其特征在于，还包括在所述第一模罩之上的粘合层，所述第二模罩附于所述粘合层。
18.如权利要求16所述的电子封装，其特征在于，所述第一和第二弯曲表面共同形成从第一部分到第二部分的连续弯曲。
19.一种构造电子封装的方法，包括：
在衬底的第一部分上安装第一微电子管芯，该衬底具有紧接着所述第一部分的折叠部分和紧接着所述折叠部分的第二部分；
在所述衬底上放置所述折叠控制构件；
使得所述衬底的折叠部分部分包绕所述折叠控制构件的表面从而将所述第二部分置于所述第一部分之上。
20.如权利要求19所述的方法，其特征在于，所述第一折叠控制构件是所述第一微电子管芯上的第一模罩上的一部分。
21.如权利要求20所述的方法，其特征在于，还包括将所述第二部分粘合到所述模罩。
22.如权利要求19所述的方法，其特征在于，所述折叠部分所包绕的所述第一折叠控制构件的所述表面是弯曲的。
23.如权利要求19所述的方法，其特征在于，所述折叠控制构件是被注模的。
24.如权利要求23所述的方法，其特征在于，还包括：
在所述衬底上放置形状定义件，所述折叠控制构件可相对于所述形状定义件的表面模制成型；以及
移除所述形状定义件。
25.如权利要求24所述的方法，其特征在于，所述形状定义件和所述折叠控制构件的接触表面分别是凹入的和凸出的。
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TW200512922A (en) 2005-04-01
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CN1853272A (zh) 2006-10-25
EP1665379A1 (en) 2006-06-07
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US6972482B2 (en) 2005-12-06
US20060008949A1 (en) 2006-01-12
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