CN1846996A

CN1846996A - Substrate support device and substrate support method

Info

Publication number: CN1846996A
Application number: CN 200610073588
Authority: CN
Inventors: 楠木寿幸
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2005-04-13
Filing date: 2006-04-13
Publication date: 2006-10-18
Also published as: JP2006294981A; JP4573692B2

Abstract

The invention relates to a base plate support which can support base plate W without affecting the shape of lower surface of base plate W, and relative support method, wherein said support comprises: several base plate supports (27); each base plate support (27) comprises a contact pin (271) contacting the lower surface (W2) of base plate (W) to change the position relative to the lower surface (W2) of base plate (W), and a fixer for fixing the contact pin (271). With said invention, even the lower surface (W2) is arranged with mounted elements (C1, C2), since the contact pin (271) can change the position relative to the height of each element, the base plate support (27) can be avoided to change.

Description

Baseplate support device and base plate supports method

Technical field

The present invention relates to the employed baseplate support device that is used for supporting substrate in surface mounting apparatus or solder paste printing equipment etc., and the base plate supports method.

Background technology

In the past, by the printing equipment of masterplate (stencil) to the coating of substrates paste, or substrate is installed the surface mounting apparatus etc. of electronic component, as method that support to handle object (substrate), comprise the method for substrate-placing on the tabular mounting table, the method etc. of many places by a plurality of upright supporting pin (backup pin) supporting substrate lower surfaces of establishing.

For example, patent documentation 1 (the open communique spy of Japan Patent opens Fig. 1, Fig. 2 2004-230782 number) discloses a kind of printing equipment by a plurality of supporting pin supporting substrate lower surfaces.

Recently, for the substrate that makes installation elements is tending towards miniaturization, on the two sides of substrate electronic component is installed sometimes.In the case,, the one side that electronic component is installed is supported, realize the support of substrate with this when the another side (surface of electronic component is not installed) that the substrate of electronic component is installed with one side during as the processing object.

Yet, the one side that electronic component is installed of substrate, uneven because of the existence of electronic component, so substrate can't obtain stable support on the tabular mounting table.

In addition, pass through the method that supporting pin supports shown in the patent documentation 1, supporting pin must be arranged on the position corresponding to the position that does not have electronic component of substrate, so the position that is provided with that must change supporting pin according to the kind of the substrate of producing, so need long man-hour, therefore aspect operating efficiency, room for improvement arranged.

Summary of the invention

The present invention does in view of above-mentioned problem, and its purpose is to provide a kind of restriction that is not subjected to the base lower surface the shape easily baseplate support device of supporting substrate and base plate supports method etc.

Baseplate support device provided by the present invention comprises a plurality of base plate supports portion, and this base plate supports portion comprises the fixture by the position that contacts the contact that can carry out displacement corresponding to the underside shape of substrate and fixing above-mentioned contact with the lower surface of substrate.

Adopt foregoing invention, because the contact that contacts with base lower surface, underside shape corresponding to substrate carries out displacement, and the position after the displacement can be fixed, even therefore lower surface also can easily be supported because of the rough substrate of electronic component is installed.

In addition, in the aforesaid substrate bracing or strutting arrangement, also can comprise above-mentioned contact is pressed upward pressure device.

Adopt the aforesaid substrate bracing or strutting arrangement,, therefore can make contact come supporting substrate corresponding to the underside shape of substrate infalliblely because contact is pressed against upward.

In the aforesaid substrate bracing or strutting arrangement, pressure device can be made of magnetic spring (magnetic spring).

Adopt the aforesaid substrate bracing or strutting arrangement, pass through magnetic spring, can not be subjected to the influence of addendum modification and obtain roughly certain throw-on pressure, therefore when contact carries out displacement corresponding to the underside shape of substrate, can be to the generation overburdens such as element that are installed in base lower surface.

In the aforesaid substrate bracing or strutting arrangement, fixture can fix the position of contact by fluid pressure.

Adopt the aforesaid substrate bracing or strutting arrangement, can the fixture of each base plate supports portion be linked by simple structure.

In the aforesaid substrate bracing or strutting arrangement, each contact can comprise the adsorbent equipment that adsorbs base lower surface.

Adopt the aforesaid substrate bracing or strutting arrangement, owing to the lower surface of each contact to substrate adsorbs, therefore can more infallible ground supporting substrate.

In addition, substrate printing equipment involved in the present invention can comprise above-mentioned any one baseplate support device.

Lower surface adopts the aforesaid substrate printing equipment, even also can easily be supported and carry out printing treatment because of the rough substrate of electronic component is installed.

Base plate supports method involved in the present invention makes a plurality of contacts contact with the lower surface of substrate, makes each contact carry out displacement corresponding to the underside shape of substrate thus, and the fixing position of the contact after the displacement, with the lower surface of supporting substrate.

Adopt the aforesaid substrate method for supporting, can obtain the action effect identical with foregoing invention.

Description of drawings

Fig. 1 is the side view of the related printing equipment of one embodiment of the present invention.

Fig. 2 is the front view of above-mentioned printing equipment.

Fig. 3 is a stereogram of roughly representing above-mentioned printing equipment.

Fig. 4 is the stereogram of the major part of the above-mentioned printing equipment of expression.

Fig. 5 is the fixture unit of the above-mentioned printing equipment of expression and the side view of peripheral part thereof.

Fig. 6 is the stereogram of the pressing plate (location-plate) of the above-mentioned printing equipment of expression with respect to the position of holding piece relation, is the stereogram of pressing plate when being positioned at retreating position with figure (a), is the stereogram of pressing plate when being positioned at the position location with figure (b).

Fig. 7 is the longitudinal sectional view of base plate supports portion, is the longitudinal sectional view of contact when being positioned at common position with figure (a), is longitudinal sectional view after the contact displacement with figure (b).

Fig. 8 is the amplification key diagram of the fixture of base plate supports portion.

Fig. 9 is the stereogram of sealing gasket.

Figure 10 is the key diagram that base plate supports portion is in the base plate supports state.

Figure 11 is the side view that is used to illustrate the running of above-mentioned printing equipment, with figure (a) is the side view of substrate when moving into, with figure (b) is the side view of pressing plate when pushing the inboard to, is the side view of substrate when rising with figure (c), the side view when being the substrate clamping with figure (d).

Figure 12 is the side view that is used to illustrate the running of above-mentioned printing equipment, is the side view of pressing plate when keeping out of the way with figure (a), is the side view of lifting platform when rising with figure (b), the side view when being the expansion scolder with figure (c).

Figure 13 is the longitudinal sectional view of the base plate supports portion of the present invention the 2nd embodiment.

The specific embodiment

Fig. 1 is the side view of the related wire mark device of one embodiment of the present invention, and Fig. 2 is the front view of this device, and Fig. 3 is the vertical view of this device, and Fig. 4 is the stereogram of major part in this device (print station 10).Shown in above-mentioned figure, on the pedestal 2 of above-mentioned wire mark device, be provided with print station 10, the both sides of this print station 10 are provided with the downstream conveyance band 12 of printed base plate W being moved into the upstream side conveyance band 11 of print station 10 and printed base plate W being taken out of print station 10 along X-direction (conveyance path).

In addition, above-mentioned printing equipment engages with the positioning unit 4 that positions, the masterplate holding unit 5 that is arranged on print station 10 tops and squeegee unit 6 with upper surface of base plate when also comprising the fixture unit 3 that is used for clamping printed base plate W, clamping substrate W; As described later, the masterplate 51 of masterplate holding unit 5 overlaps on the substrate W of grip unit 3 clampings, under this state, carries out wire mark by the scraper plate 61 of squeegee unit 6.

As depicted in figs. 1 and 2, on pedestal 2, in horizontal plane, be provided with slide rail 211, and be equipped with on this slide rail 211 can be along slide freely Y-axis platform 21 of Y direction along Y direction with the X-direction quadrature.In addition, be provided with ball screw framework (diagram omit) between Y-axis platform 21 and pedestal 2, under the driving of this ball screw framework, Y-axis platform 21 can move along Y direction with respect to pedestal 2.

On the Y-axis platform 21, be provided with slide rail 221, and the X-axis platform 22 that can be free to slide along X-direction is installed on this slide rail 221 along X-direction.In addition, be provided with ball screw framework (diagram omit) between X-axis platform 22 and Y-axis platform 21, under the driving of this ball screw framework, X-axis platform 22 can move along X-direction with respect to Y-axis platform 21.

X-axis platform 22 is provided with the R pillow block 23 that freely rotates around the axis of vertical (Z-direction) through rotating unit 231.Above-mentioned R pillow block 23 can rotate around the Z axle by the driving of not shown device of rotation driving.

Four jiaos of R pillow block 23, the slipping column 241 that (Z-direction) along the vertical direction is free to slide is installed,, lifting platform 24 is installed simultaneously on the top of this slipping column 241, by the slip of slipping column 241, lifting platform 24 can be with respect to R pillow block 23 along the Z-direction free lifting.In addition, be provided with ball screw framework 243 between lifting platform 24 and R pillow block 23, under the driving of this ball screw framework 243, lifting platform 24 can move along Z-direction (above-below direction) with respect to R pillow block 23.

On the lifting platform 24, be provided with a pair of main conveyance band (main conveyer) 20 along X-direction.Above-mentioned main conveyance band 20, when lifting platform 24 was in the state of falling, its upstream-side-end and end of downstream side were relative with the end of the end of above-mentioned upstream side conveyance band 11 and downstream conveyance band 12 respectively.In addition, under above-mentioned relative state, main conveyance band 20 and the gap between the conveyance band 11,12 of its both sides are set at substrate W gap of transfer smoothly between the conveyance band, particularly are set at the reduced size about 5mm.Therefore, in the present embodiment, main conveyance band 20, for avoiding interfering with both sides conveyance band 11,12, when lifting platform 24 is in the state of falling, the X-direction and axial the moving of R that produce because of moving of X-axis platform 22 and R pillow block 23 are restricted, and produce position deviation in order to prevent with respect to both sides conveyance band 11,12 simultaneously, and the Y direction and axial the moving of R that produce because of moving of Y-axis platform 21 and R pillow block 23 are restricted.That is, main conveyance band 20 is when lifting platform 24 is in the state of falling, because of mobile being restricted on mobile (X-direction, Y direction and the R direction of principal axis) in the horizontal direction that produces of X-axis platform 21, Y-axis platform 22 and R pillow block 23.

Shown in Fig. 1～5, be arranged on the fixture unit 3 of lifting platform 24, have a pair of band plate-like holding piece 31a, the 31b that above a pair of main conveyance band 20, are provided with along X-direction.Wherein, one side's holding piece 31a is fixed on the structural member 25 (with reference to Fig. 5) of lifting platform 24 the opposing party's holding piece 31b, structural member 25 with respect to lifting platform 24 can be installed along Y direction with being free to slide, and can free clutch with respect to above-mentioned holding piece 31a.

In addition, above-mentioned holding piece 31b is provided with support 26b, is provided with cylinder (air cylinder) 33 between this support 26b and structural member 25.By the forward drive (uphold and drive) of above-mentioned cylinder 33, above-mentioned holding piece 31b moves to the direction of leaving above-mentioned holding piece 31a along Y direction, and holding

piece

31a, 31b separate thus.In addition, by cylinder 33 retreat driving (shrink drive), above-mentioned holding piece 31b can move to the direction near holding piece 31a along Y direction, thus holding

piece

31a, 31b closure.Like this, the clutch operation by a pair of

holding piece

31a, 31b can keep and removes maintenance substrate W.

Shown in Fig. 3,4, the upper surface of two

holding piece

31a, 31b is provided with a plurality of attractions hole 35.The above-mentioned hole 35 that respectively attracts can produce negative pressure by not shown suction device.Under masterplate 51 is overlapped in state on holding piece 31a, the 31b,, make masterplate 51 absorption remain on the upper surface of

holding piece

31a, 31b by being each negative pressure that attracts hole 35 to be produced.

As shown in Figure 5, be arranged on the lifting platform 24, have a pair of band plate-like location-plate 41a, the 41b that corresponds respectively to two

holding piece

31a, 31b and be provided with as the positioning unit 4 of press device.One side's location-plate 41a is arranged on the structural member 25 through parallel linkage 42, and the opposing party's location-plate 41b is arranged on the above-mentioned carriage 26b through parallel linkage 42.Rotation along with

parallel linkage

42,42, above-mentioned two location-

plate

41a, 41b, can remain level, and at the retreating position that is positioned at a pair of

holding piece

31a, 31b both sides shown in Fig. 6 (a), and shown in Fig. 6 (b) and a pair of

holding piece

31a, 31b push between the position location of butt, freely carry out displacement.In addition, above-mentioned two location-

plate

41a, 41b, when being positioned at retreating position, the upper surface of its upper surface and above-mentioned a pair of

holding piece

31a, 31b is in the same horizontal plane, when being positioned at the position location, the part of its lower surface is compared in Y direction side-prominent with a pair of

holding piece

31a, 31b.

In addition, lifting platform 24 and support 26b, be provided with the cylinder 43 that is used to drive two parallel linkage mechanisms 42, forward drive (uphold and drive) by cylinder 43, a pair of location-

plate

41a, 41b enter the position location to the inside along Y direction, in addition, by cylinder 43 retreat driving (shrink drive), a pair of location-

plate

41a, 41b is opened and move to retreating position.

As shown in Figure 4, four jiaos of lifting platform 24, upright being provided with as location-plate supported pillar 44 with support component.Be positioned at retreating position at location-plate 41a and keep out of the way state) time, location-

plate

41a, 41b are supported by pillar 44, thereby can overcome aftermentioned scraper plate 61 coining that produces (printing pressure) when the expansion scolder.

As shown in Figure 4, location-

plate

41a, 41b are provided with a plurality of attractions hole 45.The above-mentioned hole 45 that respectively attracts produces negative pressure through suction tube 46 by not shown suction device.As described later, under the state of location-

plate

41a, 41b, by each negative pressure that attracts hole 45 to be produced, masterplate 51 is adsorbed the upper surface that remains on location-

plate

41a, 41b at masterplate 51 closed assemblies.

Shown in Fig. 1～5, lifting platform 24 is provided with corresponding to the position between a pair of main conveyance band 20, through slipping column 291 lifting mounting table 29 freely along the vertical direction.In addition, be provided with ball screw framework (diagram is omitted) between above-mentioned mounting table 29 and lifting platform 24, by the driving of this ball screw framework, mounting table 29 can move along the vertical direction with respect to lifting platform 24.

Above-mentioned mounting table 29 has a plurality of base plate supports portion 27 that is rectangular setting, and the support of the lower surface W 2 by 27 couples of substrate W of this base plate supports portion realizes the mounting of substrate W.On lifting platform 24, when above-mentioned mounting table 29 rose, substrate W transferred load to mounting table 29 and is moved upward from main conveyance band 20, and when mounting table 29 descended, the substrate W on the mounting table 29 transferred load to main conveyance band 20.

As shown in Figure 4, be the base plate supports portion 27 of rectangular setting, be arranged side by side along X-direction a plurality of be a unit and being installed in respectively on the installing plate 289, and be that the unit dismounting is installed on the mounting table 29 possibly with the unit.Thus, when setting the interval of conveyance band 11,12,20, can be easily the base plate supports portion 27 of required unit number be arranged on the mounting table 29 as the Y direction size of the substrate W that handles object.

Fig. 7 is the longitudinal sectional view of base plate supports portion 27.Each base plate supports portion 27 shown in Fig. 7 (a), comprises the axial region 272 that contact plug 271 is installed, the cylindrical shell 273 that keeps axial region 272.Contact plug 271 is made of thin metal bar, and its upper end contacts with the lower surface W 2 of substrate W.In the present embodiment, contact plug 271 plays the effect of contact.The axial region 272 of above-mentioned contact plug 271 is installed,, and can slides along the vertical direction with respect to cylindrical shell 273 through cylindrical shell 273.Cylindrical shell 273, its underpart is fixed on the mounting table 29 by installing plate 289.

Above-mentioned axial region 272 and cylindrical shell 273 shown in Fig. 7 (b), are provided with when axial region 272 during with respect to cylindrical shell 273 displacement downwards, above-mentioned axial region 272 are pushed back the pressure device (magnetic spring mechanism) of top.Above-mentioned magnetic spring mechanism comprises the 1st permanent magnet 274 that is arranged on axial region 272 peripheries, is arranged on the cylindrical shell 273 and 2nd permanent magnet 275 relative with the 1st permanent magnet.The relative face of above-mentioned the 1st permanent magnet 274 and the 2nd permanent magnet 275 polarizes with different magnetic pole, so attract each other.The outer peripheral face of axial region 272 is provided with the tubing of stainless steel material, can slide swimmingly with respect to tube portion 273.

By above-mentioned magnetic spring mechanism, when axial region 272 during with respect to cylindrical shell 273 displacement downwards, in the scope of the relative each other part of two magnet 274,275 (lap axially), can not be subjected to the influence of above-mentioned addendum modification and obtain roughly certain throw-on pressure (elastic force).This be because, the effect attraction that makes the magnet reposition (thrust) in the axial direction, the oblique magnetic line of force that the end produced by two magnet is generated, and at the lap of two magnet 274,275, only produce the magnetic line of force of the vertical direction that does not influence axial throw-on pressure, be not subjected to the influence of the area size of lap.

In addition, above-mentioned magnetic spring mechanism is in when with respect to cylindrical shell 273 neutral condition of displacement not taking place at axial region 272, supports and keep in touch as holding device the height and position of pin 271 at the deadweight of contact plug 271 and axial region 272.

The bottom of tube portion 273 is provided with the fixture 276 that fixes the height and position of contact plug (contact) 271 by the slip of restriction axial region 272.Fig. 8 is the amplification key diagram of the fixture of base plate supports portion.Said fixing device 276 comprises the bottom that is formed on a portion 273 and around the closed chamber 277 of the outer peripheral face of axial region 272, and the above and below of sealing chamber 277 is provided with the cyclic sealing gasket of shown in Figure 9 being " V " shape section.In the time will limiting the slip of axial region 272,, supply with the air of supplying with by not shown air feeder by the port 278 that is communicated with closed chamber 277.Like this, as shown in Figure 8, with the outer peripheral face driving fit of axial region 272, so axial region 272 can't slide with regard to the height and position that is fixed on this moment because sealing gasket 279 deforms under the pressure effect of above-mentioned air.On the other hand, if remove air pressure from above-mentioned port 278, said fixing promptly is disengaged.

In addition, the port 278 of the fixture 276 of each base plate supports portion 27 is that unit is converged with each column unit that is installed on the same installing plate 289, and and above-mentioned air feeder between be provided with solenoid electric valve.Thus, belong to the fixture 276 of the base plate supports portion 27 of each unit, can switch stationary state and releasing state by the operation of a solenoid electric valve.

Figure 10 is the key diagram that base plate supports portion is in the base plate supports state.At this, suppose electronic component installed on the two sides of substrate W, the another side W1 that the substrate W of electronic component is installed with one side W2 handles object, electronic component C1, C2 wherein have been installed and rough be lower surface W 2.

As shown in figure 10, when rising the upright mounting table 29 that is provided with base plate supports portion 27, make this base plate supports portion 27 to aforesaid substrate W near the time, the contact plug of each base plate supports portion 27 (contact) 271 can correspond respectively to the shape of lower surface W 2 of the substrate W that comprises electronic component C1, C2 and displacement downwards.

At this moment, because the contact plug 271 of each base plate supports portion 27, mechanism presses upward by magnetic spring, so each contact plug 271 can be infalliblely carries out displacement corresponding to the shape of the lower surface W 2 of the substrate W that comprises electronic component C1, C2.

In addition, because the contact plug 271 of each base plate supports portion 27, press upward by magnetic spring mechanism, even therefore size (highly) difference because of electronic component C1, C2 makes the addendum modification of each contact plug 271 different, also can not produce bigger throw-on pressure, thereby electronic component C1, C2 can not take place be subjected to extra-heavy effect and give breakage electronic component C1, C2.Above-mentioned throw-on pressure can be decomposed into power that the deadweight with contact plug 271 and axial region 272 balances each other, and additional in addition additional force, and on electronic component C1, the C2 only effect additional force is arranged, so can avoid extra-heavy generation by reducing this additional force.

Like this, if carry out under the state of displacement corresponding to the shape of the lower surface W 2 of substrate W at each contact plug 271, fixture 276 by each base plate supports portion 27, height and position to contact plug 271 is fixed, and substrate W can be supported by the contact plug 271 corresponding to its lower surface W 2 shapes.Therefore, the power that acts on the contact of each element and contact plug 271 gives balance, and can not produce overburden to substrate W and the element C1, the C2 that are installed in the lower surface W 2 of substrate W, thus the roughly whole zone of supporting substrate W stably.

Particularly be arranged on contact plug 271 corresponding to the position of the electronic component that installs, can carry out displacement corresponding to the height of element, therefore need not to take off corresponding to the base plate supports portion 27 at element position etc., wait the position that is provided with of changing base plate supports portion 27 according to the element setting on the lower surface W 2 of substrate W.

Therefore, even at the kind time-like that is necessary to change the substrate of being produced, also can shorten man-hour and improve whole operating efficiency.

In addition, above-mentioned contact plug 271 can not cause breakage etc. because of align-err and the element that is installed in substrate produce butt as supporting pin in the past.

In addition,, only undertaken, therefore can be supported corresponding to lower surface W 2 shapes of substrate W by simple control by stationary state and the releasing state that switches fixture 276 to the control of each base plate supports portion 27.

In addition, because the switching controls of the stationary state of each fixture 276 and the state of releasing can carry out on same opportunity at the whole base plate support portion, so can carry out above-mentioned control by very simple controlling organization.

Particularly because the port 278 of each fixture 276, restraint by each unit and to be closed, and operated by a solenoid electric valve, therefore the solenoid electric valve by control and unit number same number can carry out integral body and controls.

In addition, be arranged on the masterplate holding unit 5 of print station 10 tops, the masterplate 51 that has peristome (pattern hole) at the solder coating position can be remained on the horizontally disposed state of putting up.

In addition, be arranged on the squeegee unit 6 of the upside of masterplate holding unit 5, have and can scrape board binding 62 along what Y direction moved freely, this is scraped board binding 62 and is provided with a pair of

scraper plate

61,61 of distinguishing free lifting.Scraper plate 61 by a side moves to a side of Y direction with the state of falling, can be on masterplate 51 paste scolder S mixed and expand to a side of Y direction, and the scraper plate 61 by the opposing party moves to the opposing party of Y direction with the state of falling, and can be on masterplate 51 paste scolder S mixed and expands to the opposing party of Y direction.

Have the wire mark device of said structure, carry out following operation.During original state, lifting platform 24 and mounting table 29 are in the state of falling respectively, and the fixture 276 of base plate supports portion 27 is in fixedly disarm state.In addition, main conveyance band 20 is positioned at the position corresponding to upstream side conveyance band 11 and downstream conveyance band 12.In addition, holding piece 31a, the 31b of grip unit 3 are in open state, and location-plate 41a, the 41b of positioning unit 4 are in and keep out of the way state.

From above-mentioned state, printed base plate W moves into main conveyance band 20 from upstream side conveyance band 11, shown in Figure 11 (a), this substrate W through main conveyance band 20 by conveyance to assigned address.

Afterwards, shown in Figure 11 (b), mounting table 29 rises to the height and position that the contact plug 271 of base plate supports portion 27 contacts with the lower surface W 2 of substrate W, each contact plug 271 is by contacting with the lower surface W 2 of substrate W, carries out displacement corresponding to the shape of the lower surface W 2 of the substrate W that comprises mounted element C.Under above-mentioned state, by the fixture 276 of base plate supports portion 27, the upper-lower position of axial region 272 and contact plug 271 is fixed, thereby substrate W is in the state that is supported by a plurality of contact plugs 271 corresponding to its lower surface W 2 shapes.

On the other hand, at the upside of holding

piece

31a, 31b, location-plate 41a, the 41b of positioning unit 4 move to the position location to the inside, and afterwards, shown in Figure 11 (c), mounting table 29 rises once again.Then, lower surface (datum level) butt and the stop of the upper surface W1 of substrate W and location-

plate

41a, 41b, the upper surface W1 of substrate W and holding

piece

31a, 31b upper surface are in the same plane thus, under this state shown in Figure 11 (d), by

closed holding piece

31a, 31b, make substrate W be held

sheet

31a, 31b clamping.

Then, shown in Figure 12 (a), location-

plate

41a, 41b move to retreating position laterally.At this moment, the upper surface of the upper surface of location-

plate

41a, 41b and holding

piece

31a, 31b is positioned at same plane, and the upper surface of the upper surface of holding

piece

31a, 31b and substrate W is positioned at same plane.

In addition, in the present embodiment, be between the print station 10 and masterplate holding unit 5 of the state of falling, but the cleaner (cleaner) 8 that is provided with video camera 7 (with reference to Fig. 1) that along continuous straight runs moves freely and can moves freely along Y direction.By above-mentioned video camera 7, can discern the position of the position of substrate W or kind (production code member) and masterplate 51 or kind etc., then according to above-mentioned identifying information, implement the fine position (revisal) that need carry out because of individual difference etc. etc.In addition, cleaner 8 behind the substrate W of every processing defined amount, will clean masterplate 51.

Then, shown in Figure 12 (b), lifting platform 24 rises slightly, when main conveyance band 20 rises to when exceeding both sides conveyance band 11,12, as required, Y-axis platform 21, X-axis platform 22 and R pillow block 23 suitably move on Y direction, X-direction and R direction of principal axis, with the horizontal direction position of fine setting (revisal) substrate W with respect to masterplate 51.

Like this, after the position revisal finished, shown in Figure 12 (c), lifting platform 24 rose, and the lower surface that makes the masterplate 51 of the upper surface of location-

plate

41a, 41b, holding

piece

31a, 31b, substrate W and holding unit 5 coincides and state in an overlapping.Then, make the attraction hole 35 of holding

piece

31a, 31b, the attraction hole 45 of location-

plate

41a, 41b produce negative pressure, thereby masterplate 51 is absorbed and fixed on holding

piece

31a, 31b and location-plate 41a, the 41b.

Afterwards, fall a side's of squeegee unit 6 scraper plate 61, make it to move along Y direction at the upper surface of masterplate 51, expanding the paste that is supplied on masterplate 51 with this is pasty state scolder S, and pasty state scolder S is printed (coating) assigned position at substrate W through the nib of masterplate 51.

At this moment, substrate W, its circumference is kept by holding

piece

31a, 31b, and its lower surface W 2 support by a plurality of base plate supports portion 27, so the flexural deformation that the coining because of scraper plate 61 applied of substrate W can be produced etc. prevent trouble before it happens.

In addition, at present embodiment, when carrying out solder coating, scraper plate 61 earlier in the upper surface of masterplate 51 zone (a wherein side preparation zone) corresponding to the holding piece 31a of a location-plate 41a of a side and a side move, enter then in the upper surface of masterplate 51 and slide corresponding to the zone (printing zone) of substrate W top.Like this, before to substrate W coating pasty state scolder S, can prepare zone mixing pasty state scolder S and its viscosity be reduced.Make pasty state scolder S can be filled into the pattern hole of masterplate 51 thus infalliblely, thereby can be coated in accurately on the substrate W.

Pasty state scolder S is coated in after coating operation on the substrate W finishes, and lifting platform 24 descends slightly, so substrate W breaks away from masterplate 51 (masterplate disengaging).At this moment, as required, Y-axis platform 21, X-axis platform 22 and R pillow block 23 suitably move to Y-axis, X-axis and R direction of principal axis, make the horizontal level of substrate W be back to common position.

Then, lifting platform 24 descends, and holding

piece

31a, 31b are opened simultaneously, thereby removes the maintenance to substrate W.Then, lifting platform 24 turns back to the initial position of falling, and simultaneously mounting table 29 descends, substrate W from mounting table 29 transfers to main conveyance band 20.

Then, substrate W is arrived downstream conveyance band 12 through main conveyance band 20 by conveyance, and then is sent to subsequent processing through downstream conveyance band 12.

Like this, on the one hand, substrate W by conveyance to downstream conveyance band 12, on the other hand, next substrate W by upstream side conveyance band 11 by conveyance to main conveyance band 20, to carry out and above-mentioned same printing treatment.Like this, substrate W is sent into successively and is carried out printing treatment successively.

Adopt above-mentioned printing equipment, owing to the contact plug (contact) 271 that contacts with the lower surface W 2 of substrate W carries out displacement corresponding to the shape of the lower surface W 2 of substrate W, and the position after its displacement is fixed, even, also can easily be supported so the lower surface W 2 of substrate W is uneven because of electronic component C etc. is installed.

In addition, need not situation to be set and change being provided with of base plate supports portion 27 etc. according to the element on the lower surface W 2 of substrate W, and, even when the kind of the substrate of being produced need change, also can shorten man-hour, thereby improve whole operating efficiency.

In addition because contact plug (contact) 271 presses upward by magnetic spring mechanism, so each contact plug 271 can be infalliblely corresponding to the shape of the lower surface W 2 of substrate W, support whole base plate W.

In addition, because pressing the pressure device of contact plug (contact) 271 is made of magnetic spring mechanism, therefore can not be subjected to the influence of addendum modification can obtain roughly certain throw-on pressure, therefore when contact plug 271 carries out displacement corresponding to the shape of the lower surface W 2 of substrate W, can be to the generation overburdens such as element C of the lower surface W 2 that is installed in substrate W.

In addition, because the fixture 276 of each base plate supports portion 27 adopts the brake structural that fixes the slip of axial region 272 by air pressure, therefore can the fixture 276 of each base plate supports portion 27 be linked by simple structure and control.

Below, the 2nd embodiment of the present invention is described.The 2nd embodiment except that the structure with embodiment recited above, comprises that also the contact plug (contact) of each base plate supports portion is provided with the adsorbent equipment of the lower surface of absorption substrate.The key element identical with above-mentioned embodiment paid prosign, and omits its explanation.

Figure 13 is the longitudinal sectional view of the related base plate supports portion of the 2nd embodiment of the present invention.As shown in figure 13, in the 2nd embodiment, be provided with the attraction hole 281 that gives opening in the upper end of contact plug (contact) 271, contact plug 271 and axial region 272 are run through in this attraction hole 281.Above-mentioned attraction hole 281 can be through being installed in the attraction mouth 282 of axial region 272 bottoms, and produce negative pressure by not shown suction device.Thus, in the present embodiment, identical with above-mentioned embodiment, contact plug (contact) 271 can carry out displacement corresponding to the shape of the lower surface W 2 of substrate W, and under lower surface W 2 state of contact of the upper end of each contact plug (contact) 271 and substrate W, negative pressure by attracting hole 281 to produce makes substrate W be adsorbed the upper end that remains on each contact plug 271.

Like this, as if the adsorbent equipment of the lower surface W 2 that absorption substrate W is set at each contact plug (contact) 271, can more infallible ground supporting substrate W.

In addition, when each contact plug (contact) 271 has above-mentioned adsorbent equipment, can omit the grip unit 3 of the substrate W that is used for the above-mentioned embodiment of clamping.

More than, describe the present invention according to concrete embodiment, but the present invention is not limited to above-mentioned embodiment, can in the scope that does not depart from its purport, do suitably change.

For example, in the above-described embodiment, be set at less by the additional force that a part constituted with the throw-on pressure of magnetic spring, the resistance that is produced when reducing displacement downwards, but if in the permission loading range of electronic component, set additional force significantly, when mounting table 29 is descended, can make each contact plug 271 turn back to top quickly, to prepare to support substrate W that next is moved into respect to the movable area of mounting table 29.

In addition, above-mentioned additional force can be set at setting, but also can adopt coil to constitute at least one side of the magnet 274,275 of magnetic spring, by the magnitude of current of this coil of control inflow, the size of additional force can be arranged on institute's time value like this.By above-mentioned setting, the distortion downwards of rectifiable substrate W, or change the displacement speed of contact plug 271, or, allow load change additional force according to this when each is installed in the electronic component permission load separately of lower surface of substrate W when different in conjunction with the lifting of mounting table 29.

In addition, in the above-described embodiment, the contact of whole base plate supports portions is set to the influence that is not subjected to its addendum modification and is fixed, but also can only have wherein a part of contact to be fixed.In addition, also optionally set the contact that to fix.

Whether in addition, also can carry out the addendum modification of displacement according to contact corresponding to the underside shape of substrate, setting contact needs to fix.Like this, can will be set at not fixed its position, thereby can avoid the suffered support force of substrate to be conveyed to electronic component through contact with the contact that big addendum modification is arranged after the electronic component of base lower surface contacts.For example, former thereby can play a role effectively when increasing at the pressing force of 61 pairs of masterplates 5 of scraper plate because of certain.

In addition, in the above-described embodiment, contact is pressed upward pressure device, adopted magnetic spring mechanism, but also can adopt various pressure devices such as helical spring or air spring.But,, comparatively it is desirable to for the base lower surface that contact is contacted does not suffer excessive load, adopt throw-on pressure a little less than, and throw-on pressure can be because of the pressure device of the excessive generation of addendum modification.

In addition, in the above-described embodiment, fixture adopts the vapour-pressure type fixture, but the fluid pressure beyond the also available air pressure is fixed.In addition, fixture also can not adopt above-mentioned fluid pressure mode, and adopts the brake gear that is driven by servomotor or solenoid etc.

In addition, in the above-described embodiment, be provided with contact is pressed upward pressure device, promptly contact is for pressing upward, but the structure of contact also can be to be pressed downwards when contacting with the lower surface of substrate, with the displacement downwards of certain resistance.At this moment, comparatively it is desirable to, return initial height and position, be provided for promoting the resetting means of contact in order to make contact.

In addition, in the above-described embodiment, the another side of substrate that electronic component is installed with one side is described as the example of handling object, but the present invention also is suitable for being shaped as the rough structure of lower surface because of substrate itself.

In addition, in the above-described embodiment,, make substrate and masterplate overlapping, but the present invention is also applicable to by the lifting masterplate, masterplate overlapped be positioned at the masterplate lifting type printing equipment on the substrate of print station by the print station of lifting supporting substrate.

In addition, in the above-described embodiment, illustrated the example of paste coatings such as scolder in the printing equipment of substrate, but the present invention is not limited to printing equipment, employed baseplate support device in the inspection machine that it is also checked applicable to the fitting machine of substrate being installed electronic component or to substrate etc.

Claims

1. baseplate support device is characterized in that:

Comprise a plurality of base plate supports portion;

The aforesaid substrate support portion comprises by contact contact that can carry out displacement corresponding to the underside shape of substrate and the fixture of fixing the position of above-mentioned contact with the lower surface of substrate.

2. baseplate support device according to claim 1 is characterized in that:

Comprise above-mentioned contact is pressed upward pressure device.

3. baseplate support device according to claim 2 is characterized in that:

Above-mentioned pressure device is made of magnetic spring.

4. according to each described baseplate support device in the claim 1～3, it is characterized in that:

The said fixing device fixes the position of contact by fluid pressure.

5. according to each described baseplate support device in the claim 1～3, it is characterized in that:

Above-mentioned each contact comprises the adsorbent equipment that adsorbs base lower surface.

6. baseplate support device according to claim 4 is characterized in that:

7. printing equipment is characterized in that:

Comprise each described baseplate support device in the claim 1～6.

8. base plate supports method is characterized in that:

A plurality of contacts are contacted with the lower surface of substrate, make each contact carry out displacement thus corresponding to the underside shape of substrate, and the fixing position of the contact after the displacement, with the lower surface of supporting substrate.