JPH01123499A - Electronic parts mounting method - Google Patents

Electronic parts mounting method

Info

Publication number
JPH01123499A
JPH01123499A JP62281421A JP28142187A JPH01123499A JP H01123499 A JPH01123499 A JP H01123499A JP 62281421 A JP62281421 A JP 62281421A JP 28142187 A JP28142187 A JP 28142187A JP H01123499 A JPH01123499 A JP H01123499A
Authority
JP
Japan
Prior art keywords
circuit board
electronic parts
static electricity
board
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62281421A
Other languages
Japanese (ja)
Inventor
Takao Ido
井戸　太加雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP62281421A priority Critical patent/JPH01123499A/en
Publication of JPH01123499A publication Critical patent/JPH01123499A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor

Landscapes

  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To mount electronic parts on a circuit board, without the possibility of electrostatic breakdown, by providing a process wherein static electricity of the circuit board is discharged, before a process wherein electronic parts are mounted on a circuit board by a chuck equipment. CONSTITUTION:A chuck equipment 10 chucks an electronic parts 1 by using vacuum attraction force, and presses it down on an adherent material on a circuit board 2. Before this parts mounting process, another process is provided, in which static electricity is discharged from the board 2. A static electricity discharging equipment 20 ionizes air, and spreads the ionized air onto the board 2 in the manner of a shower to neutralize electric charge generated on the board 2. Thereby enabling the mounting of electronic parts on the circuit board, without the possibility of electrostatic breakdown.

Description

【発明の詳細な説明】 （イ）産業上の利用分野 本発明は、回路基板表面に電子部品を付着させる方法に
関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a method for attaching electronic components to the surface of a circuit board.

（口］　従来の技術 回路基板への電子部品の実装は、最近では殆んど自動装
置で行なわれるようになった。装置例も特開昭６２−１
１４２９１号公報、同１４５８９９号公報に記載のもの
等、故多くのものを見ることができる。このような自動
装着装置はエアコンディジ、ニングされた工場内に置か
れており、これによって取り扱う回路基板は、コンベア
によると 搬送、ＸＹテーブルによる位置決めともに、生産式 性追求のため高速で動かされ、静電気の帯電しゃすい条
件がととのっている。チップコンデンサやチップ抵抗の
ような部品ばかりならば多少の帯電は問題にならないが
、ＩＣ−？ＬＳＩまでもこのような高速型部品装着装置
で装着することが求められるようになってくると、静電
気をただ発生するにまかせておくことはできない。(Explanation) Conventional technology Recently, most electronic components have been mounted on circuit boards using automated equipment.
Many examples can be found, such as those described in Japanese Patent Nos. 14291 and 145899. This type of automatic mounting equipment is located in an air-conditioned factory, and the circuit boards it handles are transported by a conveyor, positioned by an XY table, and moved at high speed in order to improve production efficiency. Conditions are in place to avoid static electricity. If the components are chip capacitors or chip resistors, a slight charge is not a problem, but IC-? As it becomes necessary for even LSIs to be mounted using such high-speed component mounting equipment, it is no longer possible to simply allow static electricity to occur.

（ハ）発明が解決しようとする問題点 本発明ｄ１静電破壊を懸念することなく回路基板にＩＣ
等を装着することのできる方法を提供しようとするもの
である。(c) Problems to be solved by the invention The present invention d1 IC can be mounted on a circuit board without worrying about electrostatic damage.
The purpose is to provide a method that allows the user to wear the following items.

に）問題点を解決するための手段 本発明では、電子部品をチャック装置で回路基板に装着
する工程の前に、回路基板の静電気を除去する工程を置
いた。B) Means for Solving the Problems In the present invention, a step of removing static electricity from the circuit board is provided before the step of mounting the electronic component on the circuit board using a chuck device.

（ホ）作　用 高速−運搬によシ静電気を発生してい九回路基板は、電
子部品の装着にとりかかる前に静電気を除去される。従
って、静電破壊を気にすることなくＩＣ等を装着できる
。(e) Operation at high speed - Circuit boards that generate static electricity during transportation are removed from static electricity before mounting electronic components on them. Therefore, ICs and the like can be mounted without worrying about electrostatic damage.

（へ）実施例 図において、（１）Ｉ／ｉ電子部品、（２）は回路基板
である。回路基板（２）の表面には接着剤、半田ペース
ト等の粘着性物質が所定個所に塗布されている。ａｏは
チャック装置で、真空吸引力により電子部品（１）をチ
ャッキングし、回路基板（２）上の粘着性物質に押しつ
けるものである。この部品装着工程の前に回路基板（２
）から静電気を除去する工程を置く。■が静電気除去装
置である。これは空気をイオン化し、そのイオン化した
空気をシャワーのように回路基板（２）に吹きかけて、
回路基板（２）に帯電した電荷を中和するものである。(f) In the embodiment diagram, (1) I/i electronic components, and (2) a circuit board. Adhesive substances such as adhesives and solder pastes are applied to predetermined locations on the surface of the circuit board (2). AO is a chuck device that chucks the electronic component (1) using vacuum suction force and presses it against the adhesive material on the circuit board (2). Before this component mounting process, the circuit board (2
) to remove static electricity. (2) is a static electricity eliminator. This ionizes the air and sprays the ionized air like a shower onto the circuit board (2).
This neutralizes the electric charge that has accumulated on the circuit board (2).

まんべんなくイオンシャワーを浴びせ為ため、回路基板
（２）または静電気除去装置■を他方に対し移動させる
ようにしても良い。In order to apply an ion shower evenly, the circuit board (2) or the static electricity eliminator (2) may be moved relative to the other.

（））　　発明の効果 回路基板は絶縁物質あるいは絶縁処理された素材からな
り、本質的に静電気を帯びやすいものであるが、本発明
によれば帯電を意に介さず高速でハンドリングし、部品
装着工程にかけることができる。()) Effects of the Invention Circuit boards are made of insulating materials or materials that have been insulated and are inherently susceptible to static electricity, but according to the present invention, they can be handled at high speed without worrying about static electricity, and parts can be mounted easily. It can be applied to the process.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明を説明する概略図である。 （１）・・・電子部品、（２）−・・回路基板、（１０
−・・チャック装置、■・・・静電気除去装置。The figure is a schematic diagram illustrating the present invention. (1)...Electronic component, (2)-...Circuit board, (10
-...Chuck device, ■...Static electricity removal device.

Claims (1)

【特許請求の範囲】[Claims] （１）電子部品をチャック装置で回路基板に装着する工
程の前に、回路基板の静電気を除去する工程を置いたこ
とを特徴とする電子部品装着方法。(1) An electronic component mounting method characterized by including a step of removing static electricity from the circuit board before the step of mounting the electronic component onto the circuit board using a chuck device.
JP62281421A 1987-11-06 1987-11-06 Electronic parts mounting method Pending JPH01123499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62281421A JPH01123499A (en) 1987-11-06 1987-11-06 Electronic parts mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62281421A JPH01123499A (en) 1987-11-06 1987-11-06 Electronic parts mounting method

Publications (1)

Publication Number Publication Date
JPH01123499A true JPH01123499A (en) 1989-05-16

Family

ID=17638925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62281421A Pending JPH01123499A (en) 1987-11-06 1987-11-06 Electronic parts mounting method

Country Status (1)

Country Link
JP (1) JPH01123499A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04144199A (en) * 1990-10-04 1992-05-18 Nec Corp Individual carrying method for semiconductor equipment
JPH04117498U (en) * 1991-03-30 1992-10-21 太陽誘電株式会社 Chip-shaped circuit component mounting device
JP2002232200A (en) * 2001-02-07 2002-08-16 Pioneer Electronic Corp Electronic component mounter
JP2006294981A (en) * 2005-04-13 2006-10-26 Yamaha Motor Co Ltd Substrate supporting device and substrate supporting method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04144199A (en) * 1990-10-04 1992-05-18 Nec Corp Individual carrying method for semiconductor equipment
JPH04117498U (en) * 1991-03-30 1992-10-21 太陽誘電株式会社 Chip-shaped circuit component mounting device
JP2002232200A (en) * 2001-02-07 2002-08-16 Pioneer Electronic Corp Electronic component mounter
JP2006294981A (en) * 2005-04-13 2006-10-26 Yamaha Motor Co Ltd Substrate supporting device and substrate supporting method

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