CN1841696A - Apparatus for processing substrate - Google Patents
Apparatus for processing substrate Download PDFInfo
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- CN1841696A CN1841696A CNA2006100028229A CN200610002822A CN1841696A CN 1841696 A CN1841696 A CN 1841696A CN A2006100028229 A CNA2006100028229 A CN A2006100028229A CN 200610002822 A CN200610002822 A CN 200610002822A CN 1841696 A CN1841696 A CN 1841696A
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- treating apparatus
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- 239000000758 substrate Substances 0.000 title claims abstract description 313
- 238000012545 processing Methods 0.000 title abstract description 5
- 230000008021 deposition Effects 0.000 claims abstract description 67
- 238000000034 method Methods 0.000 claims description 110
- 230000008569 process Effects 0.000 claims description 108
- 239000000463 material Substances 0.000 claims description 86
- 230000005540 biological transmission Effects 0.000 claims description 47
- 238000005137 deposition process Methods 0.000 claims description 26
- 230000007246 mechanism Effects 0.000 claims description 12
- 238000012423 maintenance Methods 0.000 description 11
- 230000033001 locomotion Effects 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011900 installation process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
In a substrate processing apparatus for forming thin layers on a substrate used for an organic light emitting diode, the apparatus includes a mask attaching chamber, a deposition chamber and a mask detaching chamber. The mask attaching chamber, the deposition chamber and the mask detaching chamber are provided with a transferring guide installed thereinside, and a substrate supporter for supporting the substrate moves along the transferring guide in or between the chambers. Thus, a time for processing the substrate and an area for the apparatus may be reduced. Also, the chambers are grouped in one or more, and a gate valve is installed between the grouped chambers for opening and closing a path between the grouped chambers. Accordingly, the chambers may be continuously maintained in a vacuum state when any one of the chambers is repaired.
Description
Related application
The application requires on February 7th, 2005, on March 4th, 2005 and korean patent application No.2005-11334, the No.2005-18240 of submission on March 31st, 2005 and the priority of No.2005-27022, and their full content is incorporated the application as a reference into.
Technical field
The present invention relates to substrate treating apparatus.Specifically, the present invention relates to the device that a kind of like this implementing process is handled, it forms film in the substrate that is applied to Organic Light Emitting Diode.
Background technology
Recently, messaging device develops rapidly, and they have the function of different shape and fast processing data.This category information treatment facility has the display unit that is used to show processed information.Such display unit mainly is to adopt the cathode ray tube type display unit, still, compares with the cathode ray tube type display unit, and various characteristicses such as that panel display apparatus has is in light weight, compact dimensions also are used as the display unit of messaging device recently.Especially attractively be, compare with liquid crystal display that Organic Light Emitting Diode (OLED) has various advantages, for example, thin thickness, energy consumption is low, image quality is clear, response speed is fast, or the like.This is because OLED does not need independent backlight element (backlight unit).
In order to make above-mentioned OLED, need a lot of PROCESS FOR TREATMENT, and mainly adopt cluster type (cluster type) device to finish these PROCESS FOR TREATMENT.In the cluster type device, process chamber is arranged to circle, the manipulator that is used for transmission substrate between process chamber is positioned at the central authorities of this circle.
But because substrate is transmitted by manipulator, described PROCESS FOR TREATMENT needs repeatedly substrate to be written into process chamber from the process chamber unloading and with substrate.In addition, when the quantity of process chamber increase, when size of foundation base becomes big, the shared area of described cluster type device also will increase.
Summary of the invention
The invention provides a kind of substrate treating apparatus, it can carry out deposition process effectively for Organic Light Emitting Diode.
The present invention also provides a kind of substrate treating apparatus, and it can carry out a plurality of technical processs continuously.
According to one aspect of the present invention, substrate treating apparatus comprises a plurality of process chambers, transmits guide rail, at least one substrate frame and deposition materials supply part.Described process chamber comprises a plurality of settling chambers, and each settling chamber has an opening that penetrates its sidewall.Described transmission guide rail is installed in the top in the settling chamber.When substrate was moved between the settling chamber and substrate handled, described substrate frame was supporting substrate.Described substrate frame is connected in the transmission guide rail, thereby this substrate frame is moved along transmitting guide rail.The substrate that the basad support of described deposition materials supply part is supported provides deposition materials, and this deposition materials supply part is arranged on the below of the transmission guide rail in the settling chamber.Described substrate frame, is handled substrate when the substrate frame that is connected in the transmission guide rail is supporting substrate via described opening, mobile between process chamber along transmitting guide rail.
Can between described process chamber, gate valve be set, be used to open or close described opening, thereby make the inside of process chamber keep apart mutually.When substrate was handled, the inner sustain of described settling chamber was a vacuum state.
Each process chamber also can comprise mask attaching chamber and mask detaching chamber.Described mask attaching chamber provides a space, in this space, allows have the process of the mask adhesion of predetermined pattern in substrate.Described mask attaching chamber is arranged on first side of settling chamber and has an opening, moves substrate via this opening.Described mask detaching chamber provides a space, in this space, carries out from the process of substrate dismounting mask, and described mask detaching chamber is arranged on second side of settling chamber and has an opening, moves substrate via this opening.
When substrate was handled, the inner sustain of described settling chamber was a vacuum state.Described mask attaching chamber, described settling chamber and described mask detaching chamber are divided into one or more groups, and described gate valve can open or close the opening between the group that is arranged on described mask attaching chamber, described settling chamber and described mask detaching chamber.
Described substrate can be the substrate that is used for making Organic Light Emitting Diode.Described substrate frame comprises the adhesion layer that is formed at its lower surface, and, allow described substrate be attached to described substrate frame by this adhesion layer.
Described deposition materials supply part can comprise the heater block that is used to hold the service tank of deposition materials and is used to heat this service tank, when described substrate is handled, provides described deposition materials to described substrate.
Described substrate treating apparatus can also comprise baffle plate, penetrates this baffle plate and forms the opening facing to deposition materials supply part top.Described baffle plate is installed between the substrate and deposition materials supply part that is attached to substrate frame.Described baffle plate can prevent that the deposition materials that provided by the deposition materials supply part from flowing or being deposited on via the opening of settling chamber and transmit on the guide rail.
When substrate was handled, described substrate frame can move continuously along transmitting guide rail.Perhaps, when substrate was handled, described substrate frame can move after the precalculated position stops the scheduled time again.
Described substrate treating apparatus can also comprise the lid that is used to hide an opening, via this opening the deposition materials in the deposition materials supply part is offered the settling chamber.
Described substrate treating apparatus can also comprise and returns guide rail, is used to return the substrate frame that has unloaded substrate.This returns guide rail and is arranged on the transmission guide rail in the process chamber, and when when transmitting guide rail and return, described substrate frame moves to mask attaching chamber with mask from mask detaching chamber.
Described substrate treating apparatus can also comprise the mask Returning part, be used for mask being moved to mask attaching chamber from mask detaching chamber along transmitting guide rail, and the inside of described settling chamber has cushion space, and described mask Returning part stops in this cushion space temporarily.
Described cushion space is positioned at the top of the transmission guide rail of settling chamber.Described cushion space is positioned at mask attaching chamber, and mask detaching chamber has a cushion space, and described mask Returning part stops in this cushion space temporarily.
Described substrate frame comprises supporting bracket and the driving wheel that is used for support base, when supporting bracket when transmitting guide rail and transmit, this driving wheel rolls on the upper surface that transmits guide rail.Described driving wheel combines with the lower surface of described supporting bracket.
Described substrate frame can also comprise the guide wheel that rolls along the side of transmission guide rail, and when along transmission guide rail transmission supporting bracket, this guide wheel can prevent that supporting bracket from transmitting guide rail deviation in driction transmission longitudinally guide rail towards being substantially perpendicular to.
The lower surface of described supporting bracket comprises: the middle body that is used for support base; The end portion of driving wheel is installed; And be formed at first sweep between middle body and the end portion.The upper surface of described transmission guide rail comprises: the flat that contacts with driving wheel; And corresponding to second sweep of first sweep.
Described substrate treating apparatus can also comprise the driver that is used to drive substrate frame.This driver comprises: be formed at the rack gear on the supporting bracket sidewall; The pinion drive mechanism that combines with rack gear; First rotating shaft that is rotated by motor; The inside is inserted with first magnetisable material of first rotating shaft; Second rotating shaft that is used for the rotary pinion transmission mechanism, this second rotating shaft is substantially perpendicular to first rotating shaft; And second magnetisable material, be used for revolving force is transferred to second rotating shaft from first rotating shaft.Described second rotating shaft is inserted in second magnetisable material, and second magnetisable material is substantially perpendicular to first magnetisable material.
From the above mentioned, can shorten the time that is used to handle substrate, and reduce to install the area of described substrate treating apparatus, and when any chamber of maintenance, vacuum state can be continued to be maintained in other chamber.
Description of drawings
Be elaborated below in conjunction with accompanying drawing, more easily to understand above-mentioned and other advantage of the present invention.In the accompanying drawing:
Fig. 1 is a stereogram, has shown the substrate treating apparatus of an illustrative embodiment of the invention;
Fig. 2 and 3 is plane graphs, has shown the layout of the substrate treating apparatus of another exemplary embodiment of the present invention;
Fig. 4 is a plane graph, has shown the substrate conveyer of an illustrative embodiment of the invention;
Fig. 5 is a cutaway view, has shown substrate frame shown in Figure 4;
Fig. 6 is the cutaway view along I-I line among Fig. 4;
Fig. 7 is a cutaway view, has shown the mask attaching/detaching chamber of an illustrative embodiment of the invention;
Fig. 8 is a cutaway view, has shown the settling chamber of an illustrative embodiment of the invention;
Fig. 9 is a cutaway view, has shown the deposition process of carrying out in the settling chamber of Fig. 8;
Figure 10 is a cutaway view, has shown the unloading process of mask in the substrate treating apparatus of Fig. 1;
Figure 11 and 12 is cutaway views, has shown the gate valve of the substrate treating apparatus that is applied to Fig. 1;
Figure 13 has shown each indoor vacuum state in any chamber of maintenance;
Figure 14 has shown the substrate treating apparatus of another exemplary embodiment of the present invention;
Figure 15 has shown the substrate treating apparatus of Figure 14 according to another exemplary embodiment of the present invention; And
Figure 16 to 18 has shown the process that adopts substrate treating apparatus shown in Figure 14 to return mask.
Embodiment
Be understandable that, when a certain parts or layer " on another parts or layer ", " being connected in " or " being incorporated into " another parts or layer are described, can be directly described another parts or the layer on, directly be connected in or be incorporated into described another parts or the layer, also can be exist between the two intermediate member or the layer.By contrast, when a certain parts or layer " directly on another parts or layer ", " being directly connected in " or " directly being incorporated into " another parts or layer are described, there are not intermediate member or layer between the two.In full, identical Reference numeral is represented identical parts.Employed here vocabulary " and/or ", comprise making up arbitrarily or all in listed one or more relevant entrys.
Also be understandable that, although may use first, second and so on vocabulary each parts, assembly, zone, layer and/or part are described, be not limit them with this class vocabulary.This class vocabulary only is used for allowing parts, assembly, zone, layer or part and other differentiate.Therefore, first parts of discussing below, assembly, zone, layer or part also can be called as second parts, assembly, zone, layer or part, and can not deviate from instruction of the present invention.
Term used herein only is in order to describe specific embodiment, rather than in order to limit the present invention.Here used singulative " ", " being somebody's turn to do " and " described " also should comprise plural form, unless clearly provided other implication in the context.It should also be understood that, the vocabulary that uses in this specification " comprises " or " comprising ", listed the feature that is had, integral body (integer), step, operation, parts and/or assembly in detail, also do not existed or increase one or more further features, integral body, step, operation, parts, assembly and/or their set but do not get rid of.
Unless otherwise defined, the implication of all terms used herein (comprising technology and scientific terminology) is understood identical with those skilled in the art's routine.It should also be understood that, defined and other term by common dictionary, unless made qualification in the literary composition especially clearly, otherwise, explanation to its implication should meet their implications in correlation technique, and can not do the judgement on idealized or the extreme form.
Describe the present invention with reference to the accompanying drawings in detail.
Fig. 1 is a stereogram, has shown the substrate treating apparatus of an illustrative embodiment of the invention.Fig. 2 and 3 is plane graphs, has shown the layout of the substrate treating apparatus of another exemplary embodiment of the present invention.
With reference to Fig. 1, substrate treating apparatus 1 comprises a plurality of chambers.Described chamber comprises load chamber 10, clean room 30, process chamber 40 and relief chamber 20.Process chamber 40 comprises mask attaching chamber 42, settling chamber 44 and mask detaching chamber 46.Described substrate treating apparatus 1 can also comprise other chamber except load chamber 10, clean room 30, process chamber 40 and relief chamber 20.Perhaps, process chamber 40 can include only settling chamber 44, and mask installation process and mask detaching process of assembling can carry out in settling chamber 44.
In the present embodiment, described load chamber 10, clean room 30, process chamber 40 and relief chamber 20 are arranged in a row in order.Mask attaching chamber 42, settling chamber 44 and mask detaching chamber 46 all are installed in the process chamber 40, and are arranged on the same direction with load chamber 10, clean room 30, process chamber 40 and relief chamber 20.In addition, the quantity that is used for the chamber of process chamber 40 can change, and therefore, about 20 chambers can be used for substrate treating apparatus 1 as the process chamber 40 under Organic Light Emitting Diode (OLED) situation.Each chamber 10,20,30 and 40 can comprise that a door is to be used for maintenance and management.In addition, each chamber 10,20,30 and 40 is connected to the blast pipe 54 that the vacuum pump (not shown) is installed, and it is vacuum state that this blast pipe 54 is used for making the inner sustain of chamber 10,20,30 and 40 in the base treatment process.
As mentioned above, described chamber 10,20,30 and 40 can be arranged to various structures.For example, chamber 10,20,30 and 40 can be arranged to U-shaped substrate treating apparatus 1 shown in Figure 2 ' or in a zigzag, thereby makes the space of arranging chamber 10,20,30 and 40 so not long.Perhaps, substrate treating apparatus 1 as shown in Figure 3 ", settling chamber 44 to be arranged to a row and to make settling chamber 44 adjacent one another are, mask attaching chamber 42 and mask detaching chamber 46 can be arranged to such an extent that be substantially perpendicular to the direction that settling chamber 44 is arranged.
In the deposition process, substrate 3 is written into substrate treating apparatus 1, then, after deposition process finishes, substrate 3 is unloaded from substrate treating apparatus 1 via relief chamber 20 via load chamber 10.The substrate 3 that is written into load chamber 10 is transferred into clean room 30.In clean room 30, adopt plasma or ultraviolet ray to carry out the cleaning course of clean substrate 3.After the cleaning course of substrate 3 finished, substrate 3 is sent to mask attaching chamber 42, settling chamber 44 and mask detaching chamber 46 successively.In mask attaching chamber 42, the top mask that has formed predetermined pattern is installed on the substrate 3, in settling chamber 44, in substrate 3, deposit a thin layer, then, in mask detaching chamber 46, the mask in the substrate 3 is removed from this substrate 3.Subsequently, substrate 3 is sent to next process chamber, for example process chamber 40, and repeat to install processes such as mask, stringer and unloading mask.In process chamber 40, only carry out deposition process and do not carry out mask installation process and mask detaching process.In this case, described process chamber 40 does not comprise mask attaching chamber 42 and mask detaching chamber 46.
Although do not show among the figure that the bottom in load chamber 10, clean room 30 and relief chamber 20 is provided with the substrate connecting gear.In the present embodiment, the substrate connecting gear can be an assembly, and this assembly has: axostylus axostyle, and each axostylus axostyle is parallel to each other basically; Be connected to the roller of axostylus axostyle outer surface respectively; Motor; And the belt that applies revolving force to axostylus axostyle.
Fig. 4 is a plane graph, has shown the substrate conveyer of an illustrative embodiment of the invention.Substrate conveyer 100 allows substrate 3 transmit in process chamber 40 and between the process chamber.With reference to Fig. 4, substrate conveyer 100 comprises substrate frame 110, transmits guide rail 140 and driver 160.Described substrate frame 110 is supporting substrate 3 and transmitting substrate 3 between process chamber 40 in the base treatment process.In the substrate conveyer 100, allow the base treatment process in each process chamber 40 carry out simultaneously basically thereby be provided with a plurality of substrate frames.Described transmission guide rail 140 is arranged in mask attaching chamber 42, settling chamber 44 and the mask detaching chamber 46, and guiding substrate frame 110, thereby allows substrate frame 110 move along a straight line.Described driver 160 imposes on actuating force the substrate frame 110 that will move along a straight line.
Fig. 5 is a cutaway view, has shown substrate frame shown in Figure 4.
With reference to Fig. 5, substrate frame 110 comprises supporting bracket 120.Thereby substrate 3 by the lower surface of supporting bracket 120 support make substrate 3 deposition surface down.The lower surface of supporting bracket 120 comprises middle body 120a, sweep 120b and end portion 120c.On the middle body 120a of supporting bracket 120, form adhesion layer 122 so that easily that substrate 3 is adhered thereto.Supporting bracket 120 is provided with declutcher control lever 126, and it is inserted in the hole 128 that forms in the supporting bracket 120 and can moves up and down.Adhesion layer 122 has and is suitable for easily adhesion that substrate 3 is separated from supporting bracket 120.As mentioned above, substrate frame 110 can utilize instruments such as anchor clamps (not shown) or the combination of instrument and adhesion layer 122 is fixed thereon substrate 3.In addition, substrate frame 110 comprises the magnet 124 that is placed in it, and mask 4 comprises metal material, thereby prevents that the mask 4 that is connected in substrate frame 110 from coming off.In the present embodiment, magnet 124 is permanent magnets.
Fig. 6 is the cutaway view along I-I line among Fig. 4.
With reference to Fig. 6, rolling mechanism 130 is installed at the end portion 120c of supporting bracket 120.Rolling mechanism 130 contacts with transmitting guide rail 140, so that substrate frame 110 easily moves along this transmission guide rail 140.Rolling mechanism 130 comprises driving wheel 132 and guide wheel 134.Driving wheel 132 is installed in the end portion of supporting bracket 120 lower surfaces, and rolls along the upper surface that transmits guide rail 140.Guide wheel 134 is installed in the side of supporting bracket 120, and rolls along the side of transmitting guide rail 140.When transmitting substrate 3 and mask 4 or substrate 3 are connected in supporting bracket 120 or when supporting bracket 120 was separated, described guide wheel 134 can prevent that supporting bracket 120 from moving horizontally.
End portion at supporting bracket 120 lower surfaces forms the first slot 132a.This first slot 132a form with transmit guide rail 140 vertically become same direction.A plurality of fixed axis 136 are incorporated into the both sides, inside of the first slot 132a.Be inserted in driving wheel 132 among the first slot 132a and allow fixed axis 136 be incorporated into driving wheel 132 respectively.In another kind of structure, on the direction vertically identical, form slot with transmitting guide rail 140, these slots are separated from one another, so fixed axis 136 and driving wheel 132 can be installed in slot inside respectively.
Similarly, form the second slot 134a in the side of supporting bracket 120.This second slot 134a form with transmit guide rail 140 vertically become same direction.A plurality of fixed axis 138 are incorporated into upper and lower two surfaces of the second slot 134a.Be inserted in guide wheel 134 among the second slot 134a and allow fixed axis 138 be incorporated into guide wheel 134 respectively.
Between the middle body 120a of supporting bracket 120 and end portion 120c, form sweep 120b.In the present embodiment, the sweep 120b of supporting bracket 120 comprises sunk part 129a and bossing 129b.Sunk part 129a forms to such an extent that become same direction with the moving direction of supporting bracket 120 with bossing 129b.In addition, sunk part 129a and bossing 129b alternately are formed between middle body 120a and the end portion 120c.
In the present embodiment, be applied to substrate conveyer 100 as two transmission guide rails that transmit guide rail 140.These two transmission guide rails are positioned at sustained height, separated from one another and be parallel to each other.Described transmission guide rail 140 comprises the sweep 140b and the flat 140c on surface formed thereon.Hereinafter, the sweep 120b of supporting bracket 120 and the sweep 140b of transmission guide rail 140 are defined as first sweep and second sweep respectively.Flat 140c has flat upper surface, thereby provides a surface to allow driving wheel 132 roll in the above, and the second sweep 140b has the shape corresponding to the first sweep 120b.That is to say that the second sweep 140b comprises bossing 149b and sunk part 149a, they correspond respectively to sunk part 129a and the bossing 129b of the first sweep 120b.The described first sweep 120b and the second sweep 140b can prevent that particulate from entering the middle body 120a of supporting bracket 120, these particulates derive from the friction between driving wheel 132 or guide wheel 134 and the transmission guide rail 140, the perhaps friction between the assembly of driver 160.In addition, thus transmitting guide rail 140 has flat side and provides a surface to allow guide wheel 134 roll in the above.
Described transport sector 163 comprises a plurality of first magnetisable material 163a and a plurality of second magnetisable material 163b.By first rotating shaft 162 is inserted among the first magnetisable material 163a, allow the first magnetisable material 163a be connected in first rotating shaft 162.The first magnetisable material 163a is separated from one another along first rotating shaft 162.The second magnetisable material 163b is installed in respectively and the first magnetisable material 163a position adjacent place.Each second magnetisable material 163b is connected in second rotating shaft 165.Second rotating shaft 165 is provided with pinion drive mechanism 166, and is formed at the top of supporting bracket 120 sides corresponding to the rack gear 167 of pinion drive mechanism 166.This rack gear 167 is formed on the direction identical with transmitting guide rail 140 moving directions in succession.When pinion drive mechanism 166 was transferred to rack gear 167 by the rotation of second rotating shaft 165 and from the actuating force of pinion drive mechanism 166, this rack gear 167 was linearly moved along same direction.Compare with gear assembly, according to present embodiment, owing to adopted the first magnetisable material 163a and the second magnetisable material 163b between first rotating shaft 162 and second rotating shaft 165, to transmit actuating force, so can prevent particulate.Driver 160 is applied to each chamber 10,20,30 and 40, and in chamber 10,20,30 and 40 by drive.
Although do not show among the figure, the clamping chamber can be installed between clean room 30 and process chamber, and the unloading clip chamber can be installed between relief chamber 20 and process chamber 40.Described clamping chamber can comprise and load chamber 10 interior identical substrate connecting gears with the unloading clip chamber.In the clamping chamber, be used for substrate 3 is sent to from the substrate connecting gear clamping process of substrate frame 110.In addition, in the unloading clip chamber, be used for substrate 3 is sent to from substrate frame 110 clip process that unloads of substrate connecting gear.On the other hand, clamping process can carry out in load chamber 10 or clean room 30, unloads clip process and can carry out in relief chamber 20.Further, cleaning course can, be carried out in the clamping chamber therefore when substrate frame 110 is fixed in substrate 3 between load chamber 10 and clean room 30.
In clamping chamber and the unloading clip chamber, the lift (not shown) can be installed so that substrate 3 moves up and down.When substrate 3 is loaded on the lift in the clamping chamber,, this lift allow substrate 3 be attached to the lower surface of substrate frame 110 thereby rising to the precalculated position.For substrate 3 being attached to exactly the lower surface of substrate frame 110, also the technical process that need add is calibrated the position of substrate 3.In the unloading clip chamber, lift drops to the precalculated position of substrate frame 110 belows.In addition, therefore declutcher control lever 126 moves downward substrate 3 is pushed open from substrate frame 110, drops on the lift thereby allow substrate 3 separate then with substrate frame 110.On the other hand, thus can make substrate frame 110 move down clamping substrate 3 or substrate 3 is unloaded from the substrate connecting gear.
Fig. 7 is a cutaway view, has shown the mask attaching/detaching chamber of an illustrative embodiment of the invention.
With reference to Fig. 7, the inside of mask attaching chamber 42 and mask detaching chamber 46 comprises mask shifter 300.Mask shifter 300 can move up and down, and mask 4 is positioned on the mask shifter 300.Be formed with predetermined pattern on the mask 4 to limit the zone that will form thin layer.In mask attaching chamber 42, when mask shifter 300 moves to predetermined altitude, be connected to substrate frame 110 by mask 4 by the anchor clamps (not shown) that is applied to substrate frame 110.Before mask 4 is connected to substrate frame 110, between substrate 3 and mask 4, carry out calibration process.Mask 4 comprises metal material so that mask 4 combines with the magnet 124 of substrate frame 110, thereby prevents to be connected to mask 4 local shedding of substrate frame 110.In mask detaching chamber 46, when mask shifter 300 moved to predetermined altitude, the anchor clamps of substrate frame 110 unclamped mask 4, therefore allowed mask 4 separate with substrate frame 110 and dropped on then on the mask shifter 300.Be used for the connection of mask and isolating construction and method and be not limited to above-mentioned exemplary embodiment, on the contrary, those of ordinary skill in the art can make variations and modifications.
To be sent to settling chamber 44 with the substrate 3 of mask 4, to carry out deposition process.
Fig. 8 is a cutaway view, has shown the settling chamber of an illustrative embodiment of the invention.Fig. 9 is a cutaway view, has shown the deposition process of carrying out in the settling chamber of Fig. 8.Figure 10 is a cutaway view, has shown the unloading process of mask in the substrate treating apparatus of Fig. 1.Figure 11 and 12 is cutaway views, has shown the gate valve of the substrate treating apparatus that is applied to Fig. 1.
With reference to Fig. 8, deposition materials supply chamber 48 is positioned at the below of settling chamber 44.Deposition materials supply chamber 48 can form with settling chamber's 44 integral body, perhaps, can after independent manufacturing deposition materials supply chamber 48 this deposition materials supply chamber 48 be connected to settling chamber 44.The inside of deposition materials supply chamber 48 comprises deposition materials supply part 500.Deposition materials supply part 500 comprises service tank 520 and heater block 540.Service tank 520 provides the spatial accommodation that holds deposition materials, and the top of service tank 520 opening wide.Heater block 540 heats service tanks 520 thereby produces deposition material stream from deposition materials.The pipeline that vacuum pump is installed is connected to deposition materials supply chamber 48, and in the front of deposition materials supply chamber 48 door 56 (referring to Fig. 1) is installed.In the present embodiment, the example of heater block 540 can comprise heater coil.Heater block 540 can be installed on the inwall of service tank 520 or around the inwall of service tank 520.In order to produce deposition material stream from deposition materials, available generating laser (not shown) replaces heater block 540 and is applied to settling chamber 44.In the present embodiment, the deposition materials supply chamber 48 that is applied independently in settling chamber 44 has been described, still, deposition materials supply chamber 48 also can be installed in 44 inside, settling chamber.
Under the situation of small size substrate 3, carrying out deposition process in the face of after the deposition materials supply chamber 48 anchoring base supports 110.But, under the situation of large-sized substrates 3, then at substrate frame 110 when transmitting guide rail 140 and moving, in substrate 3, carry out deposition process partly and repeatedly.That is to say that deposition process can be carried out when substrate frame 110 continues to make uniform motion, perhaps when substrate frame 100 stops the scheduled time and then motion, carry out.During carrying out deposition process, substrate frame 110 can be in settling chamber 44 back and forth movement.In another exemplary embodiment, can in mobile service tank 520, carry out deposition process.But mobile service tank 520 is when carrying out deposition process, and the structure of settling chamber 44 is complexity like this, therefore, in the deposition process, preferably moves substrate frame 110 along transmitting guide rail 140.
In addition, for the settling chamber 44 of process chamber 40, the chamber that is used to transmit substrate 3 can be provided with transmits guide rail 140.But it is big that the size of process chamber 40 becomes, and substrate 3 need be sent to the technical process of another chamber.And the processing time that is used to deposit is elongated, also is difficult to construct the structure that is used to transmit large-sized substrates 3.
Further, process chamber 40 comprises that lid 620 is with the top that is used for opening/closing service tank 520 or the opening of deposition materials supply chamber 48.When not carrying out deposition process (substrate 3 is not on deposition materials supply chamber 48), lid 620 prevents to flow into the settling chamber 44 from the deposition material stream that deposition materials produces.When deposition material stream flowed into settling chamber 44, this deposition material stream was deposited on and transmits on the guide rail 140 or 44 inside, settling chamber, thereby produces particulate.
Carry out during the deposition process, when the deposition material stream that produces from deposition materials flows to the top of substrate 3, should another parts in deposition material stream is deposited on substrate frame 110 or settling chamber 44 on.In addition, in the time of in this deposition material stream is dispersed in settling chamber 44, the deposition material stream of dispersion may flow into another chamber via the opening 40a adjacent with settling chamber 44, thereby pollutes another chamber.In order to prevent to pollute another chamber adjacent, baffle plate 640 is set in settling chamber 44 with settling chamber 44.The installation site of baffle plate 640 is lower than the substrate 3 that is attached on the substrate frame 110.Baffle plate 640 has opening 642, this opening be connect and corresponding to the opening 502 of deposition materials supply chamber 48.Via the opening 642 of baffle plate 640 deposition material stream is supplied to the top of settling chamber 44, therefore, the deposition material stream that produces from deposition materials is limited in the zone, and this zone is the presumptive area in the substrate 3.
When carrying out deposition process, the inner space of process chamber 40 is maintained high vacuum state.But when maintenance process chamber 40, the inner space of process chamber 40 is maintained atmospheric pressure state.Therefore, because that the opening of each chamber by opening 40a and so on is connected with each other is logical, when any chamber of maintenance, institute has family and all is maintained atmospheric pressure state.As a result, when maintenance process finishes, need with have family and be maintained high vacuum state and could begin next technical process, this just needs long time.In order to shorten this time, substrate treating apparatus 1 comprises gate valve 700, is used to open and close the opening 40a of each chamber.As shown in figure 11, gate valve 700 can be installed between per two chambers.But, when gate valve 700 is arranged between per two chambers, just increased the manufacturing cost of substrate treating apparatus 1.Therefore, the chamber is divided into after a plurality of groups, just gate valve 700 can be installed between the chamber of grouping.
In the present embodiment, as shown in figure 12, mask attaching chamber 42, settling chamber 44 and mask detaching chamber 46 can be configured in the process chamber group.In this case, gate valve 700 is between the chamber except the process chamber group and process chamber group and being adjacent between the chamber of this process chamber group.When maintenance during any chamber, can allow chamber to be keeped in repair and adjacent chamber separate.
Figure 13 has shown indoor vacuum state in any chamber of maintenance.Among Figure 13, shown the situation of an illustrative embodiment of the invention, wherein, the process chamber 40 that comprises mask attaching chamber 42, settling chamber 44 and mask detaching chamber 46 Under Repair.
With reference to Figure 13, the gate valve 700 that is installed in the chamber place adjacent with process chamber 40 all is closed, and opens wide corresponding to the door 52 of process chamber 40.As a result, the air pressure of process chamber 40 is maintained atmospheric pressure state, and the air pressure of the chamber except process chamber 40 then is maintained high vacuum state.When maintenance process finishes, close the door 52 of process chamber 40, then, the air pressure of process chamber 40 becomes high vacuum state again.Therefore, can shorten the required time of maintenance process chamber 40, thereby improve the service speed of substrate treating apparatus 1 effectively.
Figure 14 has shown the substrate treating apparatus of another exemplary embodiment of the present invention.Figure 15 has shown the substrate treating apparatus of Figure 14 according to another exemplary embodiment of the present invention.Among Figure 14, same Reference numeral is represented the parts identical with Fig. 1, therefore omits the detailed description to these same parts.
With reference to Figure 14, substrate treating apparatus 2 also comprises mask Returning part 900, is used to make mask 4 to turn back to mask attaching chamber 42 from mask detaching chamber 46.What be provided for returning substrate frame 110 in process chamber 40 outsides returns guide rail 400.Mask Returning part 900 moves along transmitting guide rail 140.When mask Returning part 900 returned, this mask Returning part 900 may collide the substrate frame 110 that is inserted in the process chamber 40.In order to prevent the collision between mask Returning part 900 and the substrate frame 110, cushion space 800 is set in settling chamber 44, mask Returning part 900 can rest in this cushion space 800 temporarily.Cushion space 800 is positioned at the top of settling chamber 44, thereby can easily mobile mask Returning part 900.
When mobile mask Returning part 900, this mask Returning part 900 can be towards the settling chamber cushion spaces 800 in 44 rise, to avoid the collision between mask Returning part 900 and the substrate frame 110.After the veneer process in the substrate 3 of substrate frame 110 of being attached to finished, when from the settling chamber during 44 unloading substrate frames 110, mask Returning part 900 was connected to and transmits guide rail 140 and move to mask attaching chamber 42.
Mask Returning part 900 can have the structure similar to substrate frame 110.Mask Returning part 900 can utilize mechanical part of magnetic, anchor clamps and so on or magnetic to make mask 4 attached to it with combining of mechanical part.Although do not show among Figure 14, mask Returning part 900 can move up and down between transmission guide rail 140 and cushion space 800.For instance, mask Returning part 900 can have connection transfer member (not shown) thereon, for example is used to move up and down the cylinder of object.
In order to prevent the collision between substrate frame 110 and the mask Returning part 900, substrate treating apparatus 2 can also comprise transducer (not shown) and controller (not shown).The position of described sensor substrate frame 110 also offers controller with detection signal.Described controller responds to the detection signal that transducer provided and controls the motion of mask Returning part 900.In order to prevent the collision between substrate frame 110 and the mask Returning part 900, can in substrate frame 110 or mask Returning part 900, enroll a program, this program has been considered various factors, for example: the displacement of the displacement of substrate frame 110, mask Returning part 900, mask Returning part 900 moves to the time of cushion space 800, mask Returning part 900 rests on the time in the cushion space 800, or the like.
When mask 4 returned, mask Returning part 900 can rest in the cushion space 800.As shown in figure 15, cushion space 800 also can be applicable to mask attaching chamber 42 or mask detaching chamber 46 and settling chamber 44.
According to substrate treating apparatus shown in Figure 14 2, because mask Returning part 900 moves along transmitting guide rail 140, the guide member that does not need to add guides mask Returning part 900.And, move in process chamber 40 because be used for 4 of the masks of process chamber 40, be contained in the size decreases of the opening 40a of 40 of process chambers, thereby make the size of the gate valve that is used for opening 40a also diminish.
Figure 16 to 18 has shown the process that adopts substrate treating apparatus shown in Figure 14 to return mask.
With reference to Figure 16 to 18, when mask 4 was arranged on the mask Returning part 900 of mask detaching chamber 46, mask Returning part 900 moved to settling chamber 44 along transmitting guide rail 140 (referring to Figure 16).When mask 4 returns and mask Returning part 900 does not collide under the situation of substrate frame 110, mask Returning part 900 makes mask 4 return mask attaching chamber 42 and moves to mask detaching chamber 46 or cushion space 800.But under the situation that this mask Returning part 900 and substrate frame 110 bump before mask Returning part 900 arrives at mask attaching chamber 42, mask Returning part 900 moves to the cushion space 800 (referring to Figure 17) in the settling chamber 44.Then, in settling chamber 44, be attached to the deposition process of the substrate 3 of substrate frame 110.After deposition process finished, when substrate frame 110 was sent to mask detaching chamber 46, mask Returning part 900 was connected to and transmits guide rail 140 and move to mask attaching chamber 42 (referring to Figure 18).After this, mask Returning part 900 moves to cushion space 800 or mask detaching chamber 46 to repeat deposition process.
From the above mentioned, the transmission guide rail that is used for the substrate frame of guide support substrate is installed in the settling chamber that carries out deposition process, therefore, has reduced the shared area of substrate treating apparatus.In addition, when the substrate frame that is connected in the transmission guide rail moves to the settling chamber, carry out deposition process, can shorten the time of deposition process in substrate.
Further, gate valve is installed between the process chamber after process chamber or the grouping, and during any chamber, other chamber interior can be maintained high vacuum state in maintenance.Therefore, when the base treatment process continues to carry out, can reduce and operate again the required time of substrate treating apparatus.
In addition, the mask return course carries out in each process chamber independently.Like this, owing to do not need the mask Returning part between process chamber, to move, therefore can reduce the quantity of gate valve via opening.
In addition, since mask Returning part and substrate connecting gear along transmit that guide rail moves and the settling chamber in be provided with cushion space, described substrate treating apparatus can prevent the collision between mask Returning part and the substrate connecting gear, thereby has simplified the structure of this substrate treating apparatus.
And, being connected in substrate frame along the driving wheel and the guide wheel that transmit the guide rail rolling, this substrate frame can separate with described chamber, thereby can easily keep in repair and maintain substrate frame.
In addition, be provided with sweep between following two parts of substrate frame: one is the part that driving wheel and guide wheel are installed, another is the part of support base, therefore, has prevented adhering to owing to the particulate that friction produced between driving wheel or guide wheel and the transmission guide rail.
Further, the employing magnetisable material, therefore, is compared as the situation of transport sector with adopting gear assembly to be used for transmitting revolving force between axle as transport sector, has reduced particulate.
Although exemplary embodiment of the present invention has been described, be understandable that the present invention is not limited to these exemplary embodiments, on the contrary, in the spirit and scope of claim of the present invention, those of ordinary skill in the art can make variations and modifications.
Claims (24)
1. substrate treating apparatus comprises:
A plurality of process chambers, this process chamber comprises a plurality of settling chambers, and each settling chamber has the opening that penetrates sidewall;
Transmit guide rail, it is installed in the top in the described settling chamber;
At least one substrate frame, when substrate was moved between described settling chamber and substrate handled, this substrate frame was supporting substrate, and this substrate frame is connected in described transmission guide rail, and moves along described transmission guide rail; And
The deposition materials supply part, being used for the substrate that basad support supports provides deposition materials, and this deposition materials supply part is arranged on the below of the transmission guide rail in the settling chamber,
Wherein, described substrate frame, is handled this substrate when the substrate frame that is connected in the transmission guide rail is supporting substrate via described opening, mobile between process chamber along described transmission guide rail.
2. substrate treating apparatus as claimed in claim 1 also comprises the gate valve that is used to open or close described opening, and this gate valve is kept apart the inside of described process chamber mutually,
Wherein, when described substrate was handled, the inner sustain of described settling chamber was a vacuum state.
3. substrate treating apparatus as claimed in claim 1, wherein, each process chamber also comprises:
Mask attaching chamber in this mask attaching chamber, allows have the process of the mask adhesion of predetermined pattern in substrate, and this mask attaching chamber is arranged on first side of described settling chamber and has opening, moves described substrate via this opening; And
Mask detaching chamber in this mask detaching chamber, is carried out from the process of described substrate dismounting mask, and this mould detaching chamber is arranged on second side of described settling chamber and has opening, moves described substrate via this opening.
4. substrate treating apparatus as claimed in claim 3 also comprises the gate valve that is used to open and close described opening,
Wherein, when described substrate is handled, the inner sustain of described settling chamber is a vacuum state, described mask attaching chamber, described settling chamber and described mask detaching chamber are divided into one or more groups, and described gate valve opens or closes the opening between the group that is arranged on described mask attaching chamber, described settling chamber and described mask detaching chamber.
5. substrate treating apparatus as claimed in claim 1, wherein, described substrate is the substrate that is used for making Organic Light Emitting Diode.
6. substrate treating apparatus as claimed in claim 1, wherein, described substrate frame comprises the adhesion layer that is formed at its lower surface, and allows described substrate be attached to described substrate frame by this adhesion layer.
7. substrate treating apparatus as claimed in claim 1, wherein, described deposition materials supply part comprises:
Be used to hold the service tank of deposition materials; And
Be used to heat the heater block of described service tank, be used for when described substrate is handled, providing deposition materials to described substrate.
8. substrate treating apparatus as claimed in claim 1 also comprises baffle plate, penetrates this baffle plate and is formed with opening facing to deposition materials supply part top, and this baffle plate is installed between the substrate and described deposition materials supply part that is attached to substrate frame,
Wherein, described baffle plate prevents that deposition materials that described deposition materials supply part provides from flowing or being deposited on via the opening of settling chamber and transmits on the guide rail.
9. substrate treating apparatus as claimed in claim 8, wherein, when substrate was handled, described substrate frame moved continuously along described transmission guide rail.
10. substrate treating apparatus as claimed in claim 8, wherein, when substrate was handled, described substrate frame moved after the precalculated position stops the scheduled time again.
11. substrate treating apparatus as claimed in claim 1 also comprises the lid that is used to hide opening, via this opening the deposition materials in the described deposition materials supply part is offered described settling chamber.
12. substrate treating apparatus as claimed in claim 3 also comprises and returns guide rail, is used to return the substrate frame that has unloaded substrate, this returns guide rail and is arranged on the interior transmission guide rail of process chamber,
Wherein, when described substrate frame when described transmission guide rail returns, this substrate frame moves to described mask attaching chamber with mask from described mask detaching chamber.
13. substrate treating apparatus as claimed in claim 3 also comprises the mask Returning part, is used for mask being moved to described mask attaching chamber from described mask detaching chamber along transmitting guide rail,
Wherein, the inside of described settling chamber has cushion space, and described mask Returning part stops in this cushion space temporarily.
14. substrate treating apparatus as claimed in claim 13, wherein, described cushion space is positioned at the top of the transmission guide rail of described settling chamber.
15. substrate treating apparatus as claimed in claim 13 also comprises and returns guide rail, is used to return the substrate connecting gear that transmits substrate between described process chamber,
Wherein, describedly return the outside that guide rail is installed in described process chamber.
16. substrate treating apparatus as claimed in claim 13, wherein, described cushion space is positioned at described mask attaching chamber, and described mask detaching chamber has cushion space, and described mask Returning part stops in this cushion space temporarily.
17. substrate treating apparatus as claimed in claim 1, wherein, described substrate frame comprises:
Be used to support the supporting bracket of described substrate; And
Driving wheel, when when described transmission guide rail transmits described supporting bracket, this driving wheel rolls on the upper surface of described transmission guide rail, and this driving wheel combines with the lower surface of described supporting bracket.
18. substrate treating apparatus as claimed in claim 17, wherein, described substrate frame also comprises the guide wheel that rolls along the side of described transmission guide rail, when when described transmission guide rail transmits described supporting bracket, this guide wheel prevents that described supporting bracket is towards being substantially perpendicular to the described transmission guide rail described transmission guide rail of deviation in driction longitudinally.
19. substrate treating apparatus as claimed in claim 17, wherein, the lower surface of described supporting bracket comprises:
Be used to support the middle body of described substrate;
The end portion of described driving wheel is installed; And
Be formed at first sweep between described middle body and the described end portion,
And the upper surface of described transmission guide rail comprises:
The flat that contacts with described driving wheel; And
Facing to described first sweep and corresponding to second sweep of described first sweep.
20. substrate treating apparatus as claimed in claim 17 also comprises the driver that is used to drive described substrate frame,
Wherein, described driver comprises:
Be formed at the rack gear on the described supporting bracket sidewall;
The pinion drive mechanism that combines with described rack gear;
First rotating shaft that is rotated by motor;
The inside is inserted with first magnetisable material of first rotating shaft;
Be used to rotate second rotating shaft of described pinion drive mechanism, this second rotating shaft is substantially perpendicular to described first rotating shaft; And
Second magnetisable material is used for revolving force is transferred to described second rotating shaft from described first rotating shaft, and described second rotating shaft is inserted in described second magnetisable material, and described second magnetisable material is substantially perpendicular to described first magnetisable material.
21. a substrate treating apparatus comprises:
A plurality of process chambers, the mask adhesion that is used for having pattern are in substrate, deposition materials in described substrate, and, after described material is deposited in the described substrate, described mask is unloaded from described substrate;
Be installed in the transmission guide rail of process chamber internal upper part;
At least one is used for the substrate frame of support base, and this substrate frame is connected in described transmission guide rail, and this substrate frame moves in described process chamber and between the described process chamber; And
The deposition materials supply part, being used for the substrate that basad support supports provides deposition materials, and this deposition materials supply part is arranged on the substrate below that substrate frame supports,
Wherein, described substrate is supported by described substrate frame, in described substrate during deposition materials, described substrate will deposition materials that surface in the face of below, and, when substrate is handled, described substrate frame moves continuously along described transmission guide rail, perhaps, in deposition process, described substrate frame moves after the precalculated position stops the scheduled time again.
22. substrate treating apparatus as claimed in claim 21, wherein, described process chamber comprises:
Mask attaching chamber in this mask attaching chamber, allows described mask adhesion in the process of described substrate;
Mask detaching chamber in this mask detaching chamber, carries out dismantling from described substrate the process of described mask; And
The settling chamber in this settling chamber, carries out deposition process, and this settling chamber is arranged between described mask attaching chamber and the described mask detaching chamber, and combines with described deposition materials supply part,
Wherein, described mask attaching chamber, described mask detaching chamber and described settling chamber have the opening that penetrates its sidewall, move described substrate via this opening.
23. substrate treating apparatus as claimed in claim 22 also comprises the gate valve that is used to open and close described opening,
Wherein, when deposition process is carried out in described substrate, the inner sustain of described mask attaching chamber, described mask detaching chamber and described settling chamber is a vacuum state, described mask attaching chamber, described settling chamber and described mask detaching chamber are divided into one or more groups, and described gate valve opens or closes the opening between the group that is arranged on described mask attaching chamber, described settling chamber and described mask detaching chamber.
24. substrate treating apparatus as claimed in claim 22 also comprises and returns guide rail, is used to return the substrate frame that has unloaded substrate, this returns guide rail and is arranged on the interior transmission guide rail of process chamber,
Wherein, when described substrate frame when described transmission guide rail returns, this substrate frame moves to mask attaching chamber with described mask from described mask detaching chamber.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050011334 | 2005-02-07 | ||
| KR1020050011334A KR100661908B1 (en) | 2005-02-07 | 2005-02-07 | Apparatus for treating substrates |
| KR1020050018240 | 2005-03-04 | ||
| KR1020050027022 | 2005-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1841696A true CN1841696A (en) | 2006-10-04 |
| CN100470752C CN100470752C (en) | 2009-03-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100028229A Active CN100470752C (en) | 2005-02-07 | 2006-02-06 | Apparatus for processing substrate |
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| Country | Link |
|---|---|
| KR (1) | KR100661908B1 (en) |
| CN (1) | CN100470752C (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN100470752C (en) | 2009-03-18 |
| KR20060090111A (en) | 2006-08-10 |
| KR100661908B1 (en) | 2006-12-28 |
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