CN1838861A - 电子电路单元及其密封结构 - Google Patents
电子电路单元及其密封结构 Download PDFInfo
- Publication number
- CN1838861A CN1838861A CN200510113240.3A CN200510113240A CN1838861A CN 1838861 A CN1838861 A CN 1838861A CN 200510113240 A CN200510113240 A CN 200510113240A CN 1838861 A CN1838861 A CN 1838861A
- Authority
- CN
- China
- Prior art keywords
- framework
- circuit
- pcb
- metal
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010276 construction Methods 0.000 claims description 12
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 description 75
- 238000012216 screening Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 230000014509 gene expression Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229910052752 metalloid Inorganic materials 0.000 description 2
- 150000002738 metalloids Chemical class 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S174/00—Electricity: conductors and insulators
- Y10S174/34—PCB in box or housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP082377/2005 | 2005-03-22 | ||
JP2005082377A JP3875709B2 (ja) | 2005-03-22 | 2005-03-22 | 電子回路ユニットとそのシールド構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1838861A true CN1838861A (zh) | 2006-09-27 |
CN100592843C CN100592843C (zh) | 2010-02-24 |
Family
ID=34939062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200510113240.3A Expired - Fee Related CN100592843C (zh) | 2005-03-22 | 2005-09-15 | 电子电路单元及其密封结构 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7009107B1 (zh) |
EP (1) | EP1705978B1 (zh) |
JP (1) | JP3875709B2 (zh) |
CN (1) | CN100592843C (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI277386B (en) * | 2006-03-31 | 2007-03-21 | Asustek Comp Inc | Electromagnetic shielding device |
JP4929897B2 (ja) * | 2006-07-25 | 2012-05-09 | 富士通東芝モバイルコミュニケーションズ株式会社 | シールド構造及びシールド構造を備えた携帯端末 |
US20100128453A1 (en) * | 2007-05-04 | 2010-05-27 | Nxp B.V. | tuner |
JP4999934B2 (ja) * | 2007-12-14 | 2012-08-15 | 富士通株式会社 | シールドケース、それを用いた電子装置、および携帯型情報機器 |
JP2010251375A (ja) * | 2009-04-10 | 2010-11-04 | Toshiba Corp | 電子回路 |
JP5428486B2 (ja) * | 2009-04-22 | 2014-02-26 | 日本電気株式会社 | シールド実装基板およびシールド基板実装方法 |
KR101052559B1 (ko) * | 2011-02-25 | 2011-07-29 | 김선기 | 전자파 차폐 및 보호용 실드케이스 |
JP5073859B1 (ja) * | 2012-01-10 | 2012-11-14 | パイオニア株式会社 | シールドケース、シールドケースの板取方法、電子機器 |
US10893636B2 (en) * | 2017-03-10 | 2021-01-12 | Laird Technologies Inc. | Method for forming a pickup area of a board level shield |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3954889A (en) | 1973-01-31 | 1976-05-04 | Bayer Aktiengesellschaft | Process for the production of 1,1,3,3-substituted hydroxyindanes |
US4370515A (en) * | 1979-12-26 | 1983-01-25 | Rockwell International Corporation | Electromagnetic interference |
JPH06164265A (ja) * | 1992-11-16 | 1994-06-10 | Toshiba Corp | マイクロ波増幅器 |
US5495399A (en) * | 1994-07-05 | 1996-02-27 | Motorola, Inc. | Shield with detachable grasp support member |
US5917708A (en) * | 1997-03-24 | 1999-06-29 | Qualcomm Incorporated | EMI shield apparatus for printed wiring board |
US6180876B1 (en) * | 1997-12-29 | 2001-01-30 | Research In Motion Limited | Apparatus and method for RF shielding of a printed circuit board |
GB2351183B (en) * | 1999-06-18 | 2003-10-15 | Nokia Mobile Phones Ltd | Shielding can for a printed circuit board |
JP3679285B2 (ja) | 1999-11-12 | 2005-08-03 | 株式会社ケンウッド | シールドケース |
-
2005
- 2005-03-22 JP JP2005082377A patent/JP3875709B2/ja not_active Expired - Fee Related
- 2005-03-24 EP EP05102386A patent/EP1705978B1/en not_active Expired - Fee Related
- 2005-03-24 US US11/089,910 patent/US7009107B1/en not_active Expired - Fee Related
- 2005-09-01 US US11/219,103 patent/US7102075B1/en not_active Expired - Fee Related
- 2005-09-15 CN CN200510113240.3A patent/CN100592843C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20060213688A1 (en) | 2006-09-28 |
EP1705978A3 (en) | 2008-08-06 |
JP3875709B2 (ja) | 2007-01-31 |
US7009107B1 (en) | 2006-03-07 |
EP1705978B1 (en) | 2011-09-21 |
JP2006269542A (ja) | 2006-10-05 |
US7102075B1 (en) | 2006-09-05 |
EP1705978A2 (en) | 2006-09-27 |
CN100592843C (zh) | 2010-02-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: FUJITSU TOSHIBA MOBILE COMMUNICATIONS CO., LTD. Free format text: FORMER OWNER: TOSHIBA K.K. Effective date: 20110301 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TOKYO-TO, JAPAN TO: KANAGAWA PREFECTURE, JAPAN |
|
TR01 | Transfer of patent right |
Effective date of registration: 20110301 Address after: Kanagawa Patentee after: Toshiba KK Address before: Tokyo, Japan, Japan Patentee before: Toshiba Corp |
|
C56 | Change in the name or address of the patentee |
Owner name: FUJITSU MOBILE COMMUNICATIONS LIMITED Free format text: FORMER NAME: FUJITSU TOSHIBA MOBILE COMMUNICATIONS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Patentee after: Fujitsu Toshiba Mobile Comm Address before: Kanagawa Patentee before: Toshiba KK |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100224 Termination date: 20170915 |
|
CF01 | Termination of patent right due to non-payment of annual fee |