CN1838381A - Method for electrically discharging substrate, substrate processing apparatus and program - Google Patents

Method for electrically discharging substrate, substrate processing apparatus and program Download PDF

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Publication number
CN1838381A
CN1838381A CN 200610067412 CN200610067412A CN1838381A CN 1838381 A CN1838381 A CN 1838381A CN 200610067412 CN200610067412 CN 200610067412 CN 200610067412 A CN200610067412 A CN 200610067412A CN 1838381 A CN1838381 A CN 1838381A
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electric
remove
condition
treatment
improper
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CN100382239C (en
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横内健
八木文子
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Abstract

The present invention provides a substrate processing apparatus that executes electrical discharge processing before detaching a substrate held onto an electrostatic chuck of a lower electrode constituting a stage and undergoing a specific type of processing from the electrostatic chuck. Before electrically discharging the substrate, a decision is made as to whether or not the specific type of processing on the substrate has ended normally, and electrical discharge conditions are set based upon regular electrical discharge condition information stored at a regular electrical discharge condition information storage means if the substrate processing is judged to have ended normally, whereas electrical discharge conditions are set based upon non-regular electrical discharge condition information stored at a non-regular electrical discharge condition information storage means if the substrate processing is judged not to have ended normally. Then, under the electrical discharge conditions having been set, electrical discharge processing is executed on the substrate.

Description

Processed substrate remove method for electrically, substrate board treatment, program
Technical field
What the present invention relates to the processed substrate that carries out under the situation that processed substrate is broken away from from mounting table removes method for electrically, substrate board treatment and program.
Background technology
In the substrate board treatment that processed substrate such as semiconductor wafer and glass substrate is carried out regulations processing such as etching, film forming, for example processed substrate is moved in the process chamber by carrying arm etc., carry out etch processes being positioned on the mounting table and being adsorbed under the state of maintenance, when processing finishes, but for example push the lifting pin of free lifting to, processed substrate is broken away from from mounting table, take out of by carrying arm etc.
At this moment, the anchor clamps as processed substrate absorption being remained on the mounting table for example adopt electrostatic chuck mostly, and this electrostatic chuck is that direct voltage is applied to the battery lead plate of imbedding in the dielectric member, keeps processed substrate by the absorption of electrostatic force such as Coulomb force.Yet, utilizing this electrostatic chuck to adsorb under the situation of processed substrate,, disconnect the voltage be applied to electrostatic chuck sometimes even after processing, also residual on processed substrate have an electric charge, and it is also remaining to adsorb confining force.Therefore, in this state,, be easy to generate cutting of processed substrate and decrease and skew when making processed substrate when mounting table breaks away from by promoting pin.Therefore, before processed substrate is broken away from, carry out the electric treatment that removes of processed substrate, weaken Electrostatic Absorption power (for example with reference to patent documentation 1,2).
Carry out this when removing electric treatment, for example with the treatment conditions (processing method) of processed substrate, read the parameter of removing electric condition (for example the gas flow in voltage that electrostatic chuck applies, chamber pressure, importing process chamber etc.) of pre-stored and set the electric condition of removing, remove electric treatment according to the electric condition of setting of removing.
[patent documentation 1] Japanese patent laid-open 9-64021 communique
[patent documentation 2] Japanese patent laid-open 11-274141 communique
Yet, because usually the electric condition of removing of pre-stored is to be the value that prerequisite determines parameter with the electricity that removes under the state of the processed substrate to the processing normal termination of processed substrate the time, so according to carry out processed substrate remove electricity the time the difference of state of processed substrate, can not carry out fully removing to processed substrate sometimes.
For example, handle in the way processed substrate being carried out etching etc., when substrate board treatment takes place unusually, in the time of can not normal termination, according to this unusual reason and standing time etc., processed substrate becomes adsorbed state.Therefore, to remove processed substrate in order getting in this state, even carry out the electricity that removes of processed substrate, can not to carry out the electricity that removes of processed substrate under the electric condition fully removing of pre-stored, processed substrate is easy to generate to cut and decreases and skew.
The present invention proposes in view of such problem, it is a kind of not only when the processing normal termination of processed substrate that its purpose is to provide, and under the situation of the improper end of processing of processed substrate, also can carry out the substrate board treatment that removes electricity of processed substrate, processed substrate fully remove method for electrically and program.
Summary of the invention
In order to address the above problem, according to viewpoint of the present invention, a kind of method for electrically that removes of processed substrate is provided, it carries out when above-mentioned mounting table breaks away from the processed substrate that carries out predetermined processing that absorption remains under the state that is disposed at the mounting table in the process chamber, it is characterized in that, have: carry out above-mentioned processed substrate remove electricity before, judgement is to the whether normal termination of the predetermined processing of above-mentioned processed substrate, when being judged as normal termination, set the electric condition of removing according to being stored in the electric conditional information that just often removes that just often removes in the electric conditional information memory unit, when being judged as improper end, removing electric conditional information when removing improper in the electric conditional information memory unit when improper and set the electric condition enactment operation of removing of removing electric condition according to being stored in; With according to carrying out the electric treatment that removes that removes electric treatment of above-mentioned processed substrate and carry out operation by the above-mentioned electric condition of removing of removing electric condition enactment component settings.
In order to address the above problem, according to another viewpoint of the present invention, a kind of substrate board treatment is provided, it carries out removing of above-mentioned processed substrate at the processed substrate that carries out predetermined processing that absorption remains under the state that is disposed at the mounting table in the process chamber when above-mentioned mounting table breaks away from, it is characterized in that having: what storage just often removed electric conditional information just often removes electric conditional information memory unit; Store and remove electric conditional information memory unit when removing electric conditional information improper when improper; Carry out above-mentioned processed substrate remove electricity before, judgement is to the whether normal termination of the predetermined processing of above-mentioned processed substrate, when being judged as normal termination, according to setting the electric condition of removing from the above-mentioned electric conditional information that just often removes that just often removes electric conditional information memory unit, when being judged as improper end, according to removing electric conditional information when removing electric conditional information memory unit improper when improper and set the electric condition enactment parts that remove that remove electric condition from above-mentioned; With according to carrying out the electric treatment that removes that removes electric treatment of above-mentioned processed substrate and carry out device by the above-mentioned electric condition of removing of removing electric condition enactment component settings.
In order to address the above problem, another viewpoint according to the present invention provides a kind of program, it is used to carry out the processed substrate that carries out predetermined processing that remains under the state that is disposed at the mounting table in the process chamber in absorption and carries out the electric treatment that removes of processed substrate when above-mentioned mounting table breaks away from, it is characterized in that, have: in computer, carry out above-mentioned processed substrate remove electricity before, judgement is to the whether normal termination of the predetermined processing of above-mentioned processed substrate, when being judged as normal termination, set the electric condition of removing according to being stored in the electric conditional information that just often removes that just often removes in the electric conditional information memory unit, when being judged as improper end, removing electric conditional information when removing improper in the electric conditional information memory unit when improper and set and remove the electric condition enactment order of removing of electric condition according to being stored in; With according to set remove electric condition carry out above-mentioned processed substrate remove electric treatment remove electric treatment implementation order.
In device of the present invention, method and program, when to the predetermined processing normal termination of processed substrate, remove electric treatment according to just often removing electric condition, when to the improper end of the predetermined processing of processed substrate, according to just often remove electric condition different remove electric condition improper the time remove electric condition and remove electric treatment, therefore not only when the predetermined processing normal termination of processed substrate, and during improper end, also can be fully to processed substrate except that.Thus, can prevent cutting of processed substrate reliably decreases and skew.
In said apparatus, method and program, the above-mentioned setting that removes electric condition also can be, under situation to the improper end of processing of above-mentioned processed substrate, judge whether to move to maintenance, when judgement moves to when safeguarding, same under situation about returning from maintenance, remove electric conditional information when being stored in improper in the said apparatus parameter memory unit and set the electric condition of removing.Thus, return, for example be under the adsorbed state, at this moment also can remove electric condition when improper and carry out and remove electric treatment, therefore can remove processed substrate fully at processed substrate from being maintained into.
In said apparatus, method and program, the above-mentioned implementation that removes electric treatment also can be, the above-mentioned electric treatment implementation parts that remove detect the above-mentioned electric treatment situation of removing, its detected value compares with allowing terminal conditions, when the above-mentioned detected value that removes the electric treatment situation satisfies the permission terminal conditions, judge and above-mentionedly remove electric treatment board abnormality and stop the above-mentioned electric treatment that removes, according to removing electric condition enactment when removing electric conditional information memory unit improper when improper and remove electric condition, the tentative more above-mentioned electric treatment that removes from above-mentioned.Thus, though for example because of remove electric treatment can not carry out fully unusually processed substrate remove electricity the time, remove that electric condition is tentative again removes electric treatment when improper, therefore can remove processed substrate fully.
In said apparatus, method and program, above-mentioned permission terminal conditions is divided into that above-mentioned to remove electric treatment be unusual exceptional condition and as two stages of warning condition of the condition that relaxes than this exceptional condition, carrying out above-mentioned removing in the electric treatment, when the above-mentioned detected value that removes the electric treatment situation satisfies above-mentioned exceptional condition, being judged as the above-mentioned electricity that removes locates abnormality and stops the above-mentioned electric treatment that removes, when the above-mentioned detected value that removes the electric treatment situation satisfies above-mentioned warning condition, judge and above-mentionedly remove electric treatment and be in alarm condition and carry out above-mentioned warning processing.When being in alarm condition, by warning processing etc. situation is informed the operator, so the operator can ex ante forecasting be the possibility of abnormality except that electric treatment except that electric treatment.
In said apparatus, method and program, carry out and above-mentionedly remove electric treatment and also can be, removing after electric treatment finishes of above-mentioned processed substrate, seek and whether select again the tentative above-mentioned electric treatment that removes, tentative above-mentioned when removing electric treatment when selecting again, according to removing electric conditional information when removing electric conditional information memory unit improper when improper and set the electric condition of removing from above-mentioned.Thus, owing to remove electric treatment according to the state of processed substrate is tentative again, so can remove processed substrate more reliably.
In said apparatus, method and program, can remove electric conditional information when improper by input block editor for example is above-mentioned.Thus because the operator can remove electric condition removing time that electric conditional information removes electric treatment setting state according to processed substrate when improper, therefore can be efficiently to processed substrate fully except that.
In said apparatus, method and program, above-mentioned to remove electric conditional information when improper also can be the editable number of removing electric conditional parameter that just often to remove electric conditional information many than above-mentioned.Comprise and produce certain processing when unusual owing to remove the electric treatment that removes of electric conditional information when improper, therefore can set carefullyyer than just often removing electric conditional information 284.Thus, the state of the processed substrate when removing electric treatment can be set the electric condition of removing meticulously, therefore can carry out removing of processed substrate fully.
In said apparatus, method and program, according to based on above-mentioned remove that electric conditional information sets when improper remove that electric condition carries out remove electric treatment and also can be included in the processing that vacuumizes between the back side of above-mentioned processed substrate and the above-mentioned mounting table.This is for preventing processed substrate takeofing when mounting table breaks away from.
In said apparatus, method and program, remove in the electric treatment above-mentioned, comprise and repeat and will be applied to the processing of the polarity inversion of the voltage that makes the Electrostatic Absorption parts on the mounting table of above-mentioned handled object Electrostatic Absorption in being disposed at above-mentioned process chamber.Thus, can remove processed substrate more reliably.
In said apparatus, method and program, above-mentionedly remove each parameter of gas flow that electric conditional information also can comprise pressure in the voltage that is applied to above-mentioned Electrostatic Absorption parts, the above-mentioned process chamber at least, supply to a plurality of gas pipings of the processing gas in the above-mentioned process chamber when improper.Thus, in removing the implementation of electric treatment, can not be when this gas piping be supplied with the processing gas of the regulation flow that removes electric treatment necessity even for example in gas piping, produce unusually, can make up from the supply of the processing gas of other a plurality of gas pipings, edit and remove electric conditional information when improper, each gas flow is added up to except that the necessary regulation flow of electric treatment.
Adopt the present invention, not only when the processing normal termination of processed substrate, and when the improper end of the processing of processed substrate, can remove processed substrate fully.Thus, can prevent the problem of decreasing and being offset of cutting of processed substrate reliably.
Description of drawings
Fig. 1 is the sectional view of the structure example of the substrate board treatment of expression embodiments of the present invention.
Fig. 2 is the block diagram of the structure example of expression control part shown in Figure 1.
Fig. 3 is the schematic diagram of concrete example of tables of data of the processing of wafers conditional information of presentation graphs 2.
Fig. 4 is the schematic diagram of concrete example of the tables of data of just often removing electric conditional information of presentation graphs 2.
Fig. 5 is the schematic diagram of concrete example of tables of data of the permission terminal conditions information of presentation graphs 2.
When being presentation graphs 2 improper, removes Fig. 6 the schematic diagram of concrete example of the tables of data of electric conditional information.
Fig. 7 is the flow chart of the concrete example that removes electric treatment of the same execution mode of expression.
Fig. 8 is the flow chart of the concrete example of the expression setting that removes electric condition shown in Figure 7.
Fig. 9 is the flow chart of the concrete example of the expression implementation that removes electric condition shown in Figure 7.
Symbol description
The 100-substrate board treatment
The 102-process chamber
The 103-container body
The 104-lid
The 105-bellows
The 106-family of power and influence
The 120-lower electrode
The 122-electrostatic chuck
124-electrostatic chuck electrode
The 125-DC power supply
The 126-variable resistor
The 127-switch
128,129-terminal
The 132-focusing ring
The 134-bezel ring,
136-refrigerant chamber
The 138-cooling unit
139-heat-conducting gas supply unit
The 140-upper electrode
142-handles gas supply part
The 144-battery lead plate
The 145-gas vent hole
The 146-electrode support
The 147-surge chamber
The 148-insulating component
The 150-shading ring
162-first high frequency electric source
The 164-adaptation
166-high pass filter (HPF)
172-second high frequency electric source
The 174-adaptation
176-low pass filter (LPF)
The 180-exhaust outlet
The 182-exhaust apparatus
The 200-control part
210-CPU
220-ROM
230-RAM
The 240-display unit
The 250-inputoutput unit
260-reports parts
The various controllers of 270-
280-method parameter memory unit
282-processing of wafers conditional information
284-just often removes electric conditional information
290-device parameter memory unit
The fair gauge limit of 292-conditional information
Remove electric conditional information when 294-is improper
The W-wafer
Embodiment
Below the preferred implementation that present invention will be described in detail with reference to the accompanying.In this specification and accompanying drawing, the inscape with identical function is in fact omitted repeat specification with identical symbolic representation.
(structure example of substrate board treatment)
At first, with reference to the structure example of description of drawings substrate board treatment of the present invention.Fig. 1 is the sectional view of the structure example of the substrate board treatment of expression present embodiment.Substrate board treatment 100 constitutes as the plasma processing apparatus that processing means is carried out etch processes etc.
As shown in Figure 1, substrate board treatment 100 has the process chamber (chamber) 102 that is made of conductive materials such as aluminium.Process chamber 102 for example has the container body 103 of opening by top and the container handling of the lid (cap) 104 of the peristome with inaccessible this container body 103 constitutes.Lid 104 can be installed on the container body 103 by clamp structures such as screws with freely loading and unloading airtightly.In addition, containment member (not shown) such as placement O shape circle between lid 104 and container body 103.Thus, can guarantee to cover 104 and container body 103 between higher air-tightness.Wherein, process chamber 102 protective earths.
In process chamber 102, have double as and place for example lower electrode (pedestal) 120 of the circular plate type of the mounting table of semiconductor wafer (being designated hereinafter simply as " wafer ") W of processed substrate, with with lower electrode 120 relative configurations, have the upper electrode 140 of spray head effects such as import handling gas or purge gas concurrently.
First high frequency electric source 162 is connected with lower electrode 120 across adaptation 164, and above-mentioned first high frequency electric source of the frequency ratio 162 second high high frequency electric sources 172 are connected with upper electrode 140 across adaptation 174.In addition, filtration is connected with lower electrode 120 from high pass filter (HPF) 166 that second high frequency electric source 172 flows into the high-frequency current of lower electrode 120, filters low pass filter (LPF) 176 that flows into the high-frequency current of upper electrode 140 from first high frequency electric source 162 and is connected with upper electrode 140.
Supplying with the processing gas supply part 142 of handling necessary gas in the process chamber 102 is connected with upper electrode 140 across gas introduction tube.Processing gas supply part 142 is for example handled the gas supply source of gas or flushing gas etc. and is had the many piece gas pipings formations of control from the valve and the mass flow controller of the gas importing of gas supply source by the processed of supplying with the wafer in process chamber 102 or the clean in the process chamber 102 etc. are necessary.
Wherein, handling gas supply part 142 has according to the control signal from control part 200, selectively a plurality of gas pipings of Gou Chenging.For example, different types of processing gas can be supplied with different gas pipings, and is also passable by the processing gas of many gas pipings supply identical type in addition.Thus, even any gas piping sends unusually, also can supply with same treatment gas by other gas pipings.In addition, because only the also available many gas pipings of the processing gas of the flow that can not supply with a gas piping are supplied with, so can supply with the gas of necessary flow.
Be provided with exhaust outlet 180 in the bottom surface of process chamber 102.The exhaust apparatus 182 of discharging the gas in the process chamber 102 is connected with this exhaust outlet 180 across blast pipe.Exhaust apparatus 182 has for example vacuum pump, can will be decompressed to the specified vacuum degree in the process chamber 102.
Lower electrode 120 is provided with and is used for the electrostatic chuck 122 of trying hard to keep and holding wafer W with Electrostatic Absorption.This electrostatic chuck 122 is clipped in the dielectric film by the electrostatic chuck electrode 124 that will for example be made of conducting film and constitutes.The DC power supply 125 that changeable positive voltage applies, negative voltage applies is electrically connected with electrostatic chuck electrode 124 across variable resistor 126 and switch 127.
Adopt the electrostatic chuck 122 that constitutes like this, switch 127 is connected with terminal 128, applies positive voltage by utilizing DC power supply 125, can utilize the Coulomb force that wafer W absorption is remained on the electrostatic chuck 122.In addition, switch 127 is connected with terminal 129, by applying negative voltage by DC power supply 125, because the voltage of opposite polarity is relevant during with Electrostatic Absorption, so can remove processed substrate.In addition, by adjusting the voltage that applies from DC power supply 125, can adjust the absorption confining force of wafer W by variable resistor 126.In addition, the polarity of the polarity during Electrostatic Absorption when removing electricity is not limited to above-mentioned situation, also can be opposite according to the structure of electrostatic chuck 122.
Lower electrode 120 has from the disengaging parts (not shown) of the upper surface removed wafer W of electrostatic chuck 122.Break away from parts by for example extending, can promoting pin (can be described as lifter pin or fulcrum post again) from the upper surface of electrostatic chuck 122 outstanding many (for example four) and be installed in lift component and constitute in the direction vertical with lower electrode 120.This lifting pin is the driving mechanism by being made of cylinder or ball screw framework etc. for example, constituting across lift component can lifting, according to the lifting that promotes pin, the front end that promotes pin is for example across the hole portion that forms on lower electrode 120, outstanding on the surface of electrostatic chuck 122, the wafer W on the electrostatic chuck 122 is broken away from.
Top surface edge portion at electrostatic chuck 122 disposes focusing ring 132, makes it surround the periphery of wafer W.And then, dispose bezel ring, 134 in the top surface edge portion of lower electrode 120, make it surround electrostatic chuck 122 and focusing ring 132.By these focusing rings 132, bezel ring, 134, plasma is concentrated on the wafer W.In addition, these focusing rings 132 and bezel ring, 134 are not necessarily essential separately to be constituted, and also can one constitute.
In addition, be provided with cooling body in the inside of lower electrode 120.This cooling body for example can be across pipe arrangement, and the refrigerant (for example cooling water) of set point of temperature is supplied to for example refrigerant chamber 136 of the extension of the circumferencial direction lower electrode 120 in from cooling device 138 circulations.Treatment temperature by the wafer W on the temperature control electrostatic chuck 122 of refrigerant.
And then, will be for example heat-conducting gas such as He gas (refrigerating gas, oppositely (back) gas) supply between the back side of the upper surface of electrostatic chuck 122 and wafer W through the gas supply pipe roads from heat-conducting gas supply unit 139.Thus, can promote heat conduction between lower electrode 120 and the wafer W.Heat-conducting gas supply unit 139 constitutes and can vacuumize between the back side with the upper surface of electrostatic chuck 122 and wafer W.Thus, can adjust the pressure at the back side of the upper surface of electrostatic chuck 122 and wafer W.
In addition, between the bottom surface of the lower surface of lower electrode 120 and process chamber 102, place for example bellows 105 of aluminum.Lower electrode 120 is provided with elevating mechanism (not shown), makes lower electrode 120 liftings by this elevating mechanism, can suitably set the gap with upper electrode 140 according to the processing to wafer W.In addition, on the sidewall of process chamber, be equipped with and open and close the family of power and influence 106 that moving into of wafer W taken out of mouth.
The upper electrode 140 of double as spray head possesses the battery lead plate 144 of the lower surface with a plurality of gas via-holes 145 and can freely support the electrode support 146 of this battery lead plate 144 with installing and removing.Battery lead plate 144 is made of for example silicon materials, and electrode support 146 is made of for example aluminium.Be formed with surge chamber 147 in electrode support 146, above-mentioned processing gas supply part 142 is connected across the gas introduction port of gas introduction tube with this surge chamber 147.
Insulating component 148 is installed on upper electrode 140, surrounds its periphery, become and process chamber 102 insulation.The lower surface of the lower surface of insulating component 148 and battery lead plate 144 is a face, in the lower surface edge portion of the lower surface of this insulating component 148 and battery lead plate 144 shading ring 150 is installed.Shading ring 150 is made of for example inorganic oxides such as quartz, aluminium oxide.Wherein, shading ring 150 not necessarily must separate formation with insulating part 148, also can one constitute the double as insulating component.
Aforesaid substrate processing unit 100 has the control part 200 of control various piece.Control part 200 and for example first and second high frequency electric sources 162,172, adaptation 164,174, the switch 127 of handling gas supply part 142, exhaust apparatus 182, electrostatic chuck 122 usefulness is connected with variable resistor 126 cooling devices 138, heat-conducting gas supply unit 139 etc.
In addition, substrate board treatment 100 is provided with various transducers (not shown).Can enumerate as various transducers and to measure the electric sensor be applied to the voltage on upper electrode 140 and the lower electrode 120 or be applied to voltage on the electrostatic chuck 122 etc.; The gas flow sensor of the processing gas flow of detection processing gas supply part 142 and the heat-conducting gas flow of heat-conducting gas supply unit 139; Detect the temperature sensor of the temperature of upper electrode 140 and lower electrode 120 etc.In addition, also comprise the luminescence of plasma optical splitter of installing across the transparency window of the sidewall that is arranged on process chamber 11 (not shown) in the various transducers.Luminescence of plasma optical splitter 31 detects the variation of plasmoid, according to the etched terminal point of the change-detection of this specific wavelength plasma intensity with the plasma beam split of specific wavelength.These various transducers are connected with control part 200.
Control part 200 is by processing (processing of wafers) situation and the electric treatment situation of removing described later to wafer such as various sensor etchings such as above-mentioned electric sensor, gas flow sensor, temperature sensor, luminescence of plasma optical splitter, according to these detected values, various piece such as control and treatment gas supply part 142, exhaust apparatus 182, heat-conducting gas supply unit 139 is also handled.And, detected value by various transducers judges whether normally carrying out processing of wafers or described later except that electric treatment, in the fault that detects substrate board treatment 100 with handle under the unusual situation such as unusual, drive alarm etc. and report parts 260 notifying operation persons (interlock process).
(structure example of control part)
Secondly, the structure example of above-mentioned control part is described with reference to Fig. 2.As shown in Figure 2, control part 200 has the CPU (central control unit) 210 that constitutes the control part main body; Storage CPU210 is used to control the ROM (read-only memory) 220 of the routine data (for example routine data that removes electric treatment etc. of the predetermined processing that wafer W is carried out, wafer W) of various piece etc.; Be provided with the RAM (random access memory) 230 that CPU210 is used to carry out the storage area etc. of various data processing.
In addition, control device 200 possesses: by display-operation picture or the display unit 240 of selecting the LCD etc. of picture etc. to constitute; Have that the operator utilizes the input block of the various data of operations such as keyboard or touch plate input and by the various data of operator's operation being outputed to the inputoutput unit 250 of the output block of printer or external memory etc.; For example report parts 260 by what the such siren of buzzer constituted; The various controllers 270 of the each several part of control basal plate processing unit 100 (for example handling the switch 127 of gas supply part 142, heat-conducting gas supply unit 139, electrostatic chuck 122 usefulness etc.); As the method parameter memory unit 280 that just often removes an example of electric conditional information memory unit; With a routine device parameter memory unit 290 that removes electric conditional information memory unit when improper.
Above-mentioned CPU210, ROM220, RAM230, display unit 240, inputoutput unit 250, report parts 260, various controller 270, method parameter memory unit 280, device parameter memory unit 290 and be electrically connected by bus lines such as control bus, system bus, data/address buss.
In various controllers 270, comprise control first and second high frequency electric sources 162,172, adaptation 164,174, the controller of the switch 127 of processing gas supply part 142, exhaust apparatus 182, electrostatic chuck 122 usefulness and variable resistor 126, cooling unit 138, heat-conducting gas supply unit 139 etc.
Said method parameter memory unit 280 is mainly stored the information of reference when carrying out automatically such as processing of 100 pairs of wafer W of substrate board treatment for example, and device parameter memory unit 290 for example stores mainly that the processing of substrate board treatment 100 stops, by the operator carry out the various settings of substrate board treatment 100 and safeguard under the situation such as processing with reference to information.
In the present embodiment, when the regulations such as etching of carrying out wafer W were continuously handled (hereinafter referred to as " processing of wafers "), the electric conditional information of implementing during with the processing of wafers normal termination 284 that just often removes was stored in the method parameter memory unit 280; With processing of wafers is improper implement when finishing improper the time remove electric conditional information 294 and be stored in the device parameter memory unit 290.Thus, when the processing of wafers normal termination, remove electric treatment after finishing, therefore can improve the productivity ratio of processing owing to can carry out processing of wafers automatically.Relative therewith, for example when certain unusual generation, in the time of can not the normal termination processing of wafers, for example must stop processing of wafers and remove under the situation of wafer W, owing to according to unusual reason and standing time etc. different wafer W the setting state optimum remove electric condition, therefore can fully remove wafer W.
Below explanation is stored in the information of this method parameter memory unit 280 and device parameter memory unit 290.In method parameter memory unit 280, store processing of wafers condition (processing method) information 282 and just often remove electric condition (removing method for electrically) information 284.Processing of wafers conditional information 282 is when carrying out processing of wafers in process chamber 102, the condition of the each several part of control basal plate processing unit 100.Processing of wafers conditional information 282 has voltage in the process chamber, handles gaseous species and flow, is applied to a plurality of parameters such as high frequency voltage of upper electrode and lower electrode for example as shown in Figure 3.
Just often remove electric conditional information 284 for removing in the electric treatment of according to processing of wafers conditional information 282 normal termination processing of wafers the time, carrying out, be used for the condition of the each several part of control basal plate processing unit 100.Therefore, align and often remove electric conditional information 284 as long as determine the value of each parameter, just can be so that can fully remove under the state of the wafer W when the processing of wafers normal termination.For example as shown in Figure 4, normally, electric conditional information 284 applies a plurality of parameters such as voltage, the gas flow of handling gas, chamber pressure except that having electrostatic chuck.It is the voltage that is applied to electrostatic chuck 122 that electrostatic chuck applies voltage, for example is the voltage of reversed polarity during with Electrostatic Absorption.The gas flow of handling gas is from handling the processing gas that gas supply part 142 is supplied with, for example N 2The gas flow of gas.Chamber pressure is the pressure in the process chamber 102, for example adjusts by importing and the process chamber 102 interior air displacemenies of controlling above-mentioned processing gas.
Wherein, just often removing each parameter of removing electric condition of electric conditional information 284 can be by operator for example by the operation editor of inputoutput unit 250.For example, corresponding therewith under the situations such as change processing of wafers condition before carrying out processing of wafers, must to change the electric condition of removing.
In device parameter memory unit 290, store permission terminal conditions information 292 and improper electric condition (the removing method for electrically) information 294 of removing except that electric treatment.As shown in Figure 5, the permission terminal conditions information 292 except that electric treatment is that the permission terminal conditions of whether normally carrying out except that electric treatment is checked in storage in removing electric treatment.
Allow terminal conditions in each of all or a part of parameter of removing electric condition, to divide the multistage to set.In permission terminal conditions information 292 shown in Figure 5, for example electrostatic chuck applies two stages that are set with this terminal conditions 1,2 in each parameters such as voltage, gas flow, chamber pressure.These allow terminal conditions to be set at arbitrary value by inputoutput unit 250.
Allow terminal conditions 2 for removing the parameter of electric condition, for example be discontinuous each transducer that removes the electric treatment degree detected value with the permission terminal conditions of comparing except that the set point of electric condition under the abnormality that departs from.Allowing terminal conditions 1 for removing electric conditional parameter, for example is to remove under the electric treatment degree discontinuous, but the permission terminal conditions of the alarm condition more than departing to a certain degree with the pre-set parameter that removes electric condition.Can set the permission terminal conditions of comparing mitigation with enabled condition 2 for.
Allow terminal conditions only removing the stage setting that electric treatment is the permission terminal conditions 2 of abnormality.By above-mentioned two stages, since reach be the permission terminal conditions 2 of abnormality except that electric treatment before, must reach the permission terminal conditions 1 that becomes except that the electric treatment alarm condition, therefore, can be when becoming alarm condition except that electric treatment, to be that the message of alarm condition is handled the untill further notice operator by warning described later except that electric treatment, thus, the operator can remove the possibility of electric treatment abnormality in ex ante forecasting.
In addition, according to state that removes the substrate board treatment 100 in the electric treatment and surrounding environment etc., for the parameter of removing electric condition, the detected value of each transducer has change.Therefore, even the temporary transient satisfied terminal conditions that allows also can be got back in the scope of regulation immediately, do not hinder removing electric treatment itself.Therefore, as shown in Figure 6,, not only be illustrated in each and fairly put degree (for example, the ratio of the default definite value of each parameter) scope that departs from each pre-set parameter that removes electric condition in the terminal conditions 1,2, and the time that surpasses this scope also can be set as allowing terminal conditions.Thus, the change of the value of each constant is few, even temporary transient surpassing allows the terminal conditions scope, this state can not continue more than the setting-up time yet, is not judged as unusual.By doing like this, can except that judging, the unusual situation of generation in the electric treatment be abnormality real.
Wherein, the permission terminal conditions information of using in the interlock process of electric treatment 292 of removing has been described in the present embodiment, but the permission terminal conditions information in the interlock process that the regulations such as etch processes of wafer W are handled is also put terminal conditions information 292 and is constituted equally with fair, for example is stored in the device parameter memory unit also passable.Thus, judge whether normally, can carry out equally with the situation of removing electric treatment to the processing of wafer W.
Removing electric conditional information 294 when improper is, according to processing of wafers conditional information 282, that carries out under the situation of improper end processing of wafers removes in the electric treatment condition of the various piece of control basal plate processing unit 100.During the improper end of processing of wafers, not only for example produce just like the back is described that certain is unusual, the situation of Halfway Stopping processing of wafers, no matter and comprise have or not take place unusual, by the situation of operator's Halfway Stopping processing of wafers.
Remove each parameter of removing electric condition of electric conditional information 294 when improper, for example can operate inputoutput unit 250 editors by the operator.Thus,, can remove electric condition according to the setting state of wafer W owing to remove in the time of electric treatment removing electric conditional information 294 when improper, therefore can be expeditiously to wafer W fully except that.
Remove when in addition, improper electric conditional information 294 remove the editable number of parameters of electric condition than just often remove electric conditional information 284 except that electric conditional parameter number many.For example, when improper, remove in the electric conditional information 294, can edit the time of the pressure adjustment carried out in the process chamber 102 etc. and voltage is applied to time on the electrostatic chuck 122.Comprise certain processing when unusual takes place owing to remove the electric treatment that removes of electric conditional information 294 when improper, therefore can be set at thinner than just often removing electric conditional information 284.Thus because the state of wafer W that can be when removing electric treatment is set the electric condition of removing meticulously, therefore can carry out more fully wafer W except that.
The default value that removes each parameter of removing electric condition of electric conditional information 294 when in addition, improper also can be identical with the value of just often removing electric conditional information 284.This is because under the situation of the improper end of processing of wafers, for example standing time short situation etc., the almost immovable situation of state of wafer W when handling normal termination, though with just often remove the identical condition of electric condition, also can carry out removing of wafer W fully.In addition, at first with just often remove the identical condition of electric condition under remove electric treatment, on one side also can see the state of wafer W, edit on one side remove electric conditional information 294 when improper and try again except that.
The default value that removes each parameter of removing electric condition of electric conditional information 294 when in addition, improper can all be 0 also.Thus, can save in each substrate board treatment 100 trouble that changes the default value when removing electric conditional information 294 when improper and dispatching from the factory.Promptly, because the structure by substrate board treatment 100 (for example, the maximum gas flow of handling the flue way of gas supply part 142 and can supplying with by gas piping etc.) remove electric conditional information 294 in the time of can changing to set improper, therefore the default value that removes each parameter of removing electric condition of electric conditional information 294 when improper is not under 0 the situation, must change improper default value when dispatching from the factory except that electric conditional information 294 in each substrate board treatment 100.In this case, do not need to change default value when removing electric conditional information 294 in each substrate board treatment 100 when improper and dispatching from the factory.
Wherein, as mentioned above, under the default value that makes each parameter of removing electric condition of removing electric conditional information 294 when improper all is 0 situation, when essential editor is improper before removing electric treatment except that electric conditional information 294.But,, remove electric treatment if forget the electric condition of removing of removing electric conditional information 294 when editor is improper, removing each parameter of electric condition all is under 0 the state, can not normally remove electric treatment, therefore in this state, for example can not wafer W be broken away from from electrostatic chuck 122 by promoting pin.
In addition, in the present embodiment, illustrated that removing electric conditional information 294 when improper is stored in situation in the device parameter memory unit 290, but be not necessarily limited to this, also can be stored in the method parameter memory unit 280, in aftermentioned is removed electric treatment, when when needs are improper, removing electric conditional information 294, from method parameter memory unit 280, read and set the electric condition of removing.
For example as shown in Figure 6, remove electric conditional information 294 when improper and have that electrostatic chuck applies voltage, is applied to voltage application time on the electrostatic chuck, adjustment time of chamber pressure, pressure etc., handle the parameters such as gas flow of processing gas etc. of each gas piping of gas supply part 142.
In addition, but each gas piping of handling gas supply part 142 can make the parameter of all gas pipeline that memory substrate processing unit 100 has, and also can store the parameter of the part in a plurality of parameters.In addition, also can only can set and supply with to remove electric treatment necessary processing gas (N for example 2Gas and inert gas) gas piping.Thus, can edit and remove electric conditional information 294 when improper, make in removing electric treatment, there for example have gas piping to produce to be unusual, can not be when this gas piping be supplied with the processing gas that removes the necessary regulation flow of electric treatment, combination makes each gas flow add up to the above-mentioned necessary regulation flow of electric treatment that removes from the supply of the processing gas of other a plurality of gas pipings.
The each several part of the control part 200 control basal plate processing unit 100 by such formation, as processing of wafers, for example carry out under the situation of etch processes, by carrying arm etc. wafer W is moved in the process chamber 102, be placed on the lower electrode 120 of double as mounting table, by electrostatic chuck 122 Electrostatic Absorption wafer W.Afterwards, by handling gas supply part 142 predetermined process gas is imported in the process chamber 102, the gas by exhaust apparatus 182 is discharged in the process chamber 102 reaches the specified vacuum degree thus.
Like this under the state of keeping the specified vacuum degree, by for example first High frequency power of 2MHz being applied on the lower electrode 120 from first high frequency electric source 162, from second high frequency electric source 172 for example second High frequency power of 60MHz is applied on the upper electrode 140 simultaneously, can be under the second High frequency power effect, make and produce the plasma of handling gas between lower electrode 120 and the upper electrode 140, simultaneously, under the effect of first High frequency power, on lower electrode 120, produce the automatic biasing current potential.Thus, can carry out for example reactive ion etching plasma treatment to the wafer W on the lower electrode 120.In carrying out this processing of wafers, control part 200 detects unusual according to the detected value from above-mentioned various transducers, check whether unusual (interlock process) takes place.
In addition, do not detecting unusually, under the situation of the processed of normal termination wafer W, carrying out the electric treatment that removes of wafer W, for example pushing to promote pin, wafer W is broken away from from electrostatic chuck 122, taking out of from process chamber 102 by carrying arm etc.As the electric condition of removing of this situation, the electric condition of removing that the state of wafer W that can be when preferring the processing of wafers normal termination is predetermined is removed electric treatment.
But in processing of wafers is under the situation of improper end, and owing to unusual reason and standing time etc., the state of wafer W might become adsorbed state.The situation of the improper end of so-called processing of wafers is in for example processing of wafers is carried out, produce that fault, power failure, electric leakage, the processing of substrate board treatment 100 is unusual etc. to be stopped the situation of processing of wafers and move to the situation that waits, restart substrate board treatment after getting except that reason such as unusual, return etc. of safeguarding.
In this case, for example need the time owing to returning from abnormality, most is the situations that wafer W keeps adsorbed state to place, and is in a ratio of adsorbed state when the state of the wafer W when therefore removing electric treatment and processing of wafers normal termination.Therefore, in this state, break away from from electrostatic chuck 122, even, can not remove wafer W fully in the electric treatment that removes except that implementation wafer W under the electric condition same as described above in order to make wafer W.Therefore, exist to depress to promote pin, make wafer W when electrostatic chuck 122 breaks away from, produce the damage of cutting of wafer W, make wafer W produce the problem of skew when taking out of wafer W by carrying arm.
Adopt the present invention, except being prerequisite to remove electricity under the state when the processing of wafers normal termination in wafer W, determine each parameter value just often except that electric condition, setting removes electric condition in the time of can editing each parameter of removing electric condition improper, under the situation of processing of wafers normal termination, carry out and remove electric treatment, under the situation of the improper end of processing of wafers, remove electric condition when improper and carry out and remove electric treatment according to just often removing electric condition.Thus and since with just often remove different the removing under the electric condition of electric condition and can remove electric treatment, so even also can be fully under the situation of the improper end of processing of wafers to wafer W except that.Therefore, can prevent to produce wafer W reliably and cut the problem of decreasing and being offset.
(concrete example that removes electric treatment of wafer)
Here, the concrete example that removes electric treatment from the wafer of above-mentioned present embodiment is described.Fig. 7 is the flow chart of the concrete example that removes electric treatment of expression wafer.As shown in Figure 7, in step S100, carry out the setting that removes electric condition (remove electric condition enactment parts, remove electric condition enactment operation, remove the electric condition enactment stage) according to the wafer W state, in step S200, removing of setting carry out under the electric condition wafer W remove electric treatment (remove electric treatment parts, remove electric treatment operation, remove stage of electric treatment).
At first, the concrete example of setting except that electric condition (step S100) is described.Removing the setting of electric condition can be undertaken by subroutine shown in Figure 8 (routine).In step S110, judge whether normal termination of processing of wafers.Particularly, by the interlock process of above-mentioned control part 200, check whether in processing of wafers is carried out, take place unusually.When not producing the abnormal ending processing of wafers, be judged as the processing of wafers normal termination.In addition, in processing of wafers was carried out, it was unusual etc. for example to produce fault, power failure, electric leakage, the processing of substrate board treatment 100, when stopping processing of wafers, judges that processing of wafers is improper end.Wherein, when the operator stops processing of wafers by inputoutput unit 250, judge that all processing of wafers is improper end unusually no matter whether take place.
When in step S110, being judged as the processing of wafers normal termination, in step S160, just often remove electric conditional information as removing electric condition, get back to main routine shown in Figure 7, move to the processing of step S200 to set.When the processing of wafers normal termination, by according to just often removing removing electric treatment and can carrying out removing fully of electric conditional information 284.Particularly, read just often from method parameter memory unit 280 and to remove electric conditional information 284, with each parameter as the later electric condition of removing of removing electric treatment.
In step S110, judge when processing of wafers is improper end, judge whether to move to maintenance.As mentioned above, carry out medium generation when unusual, report parts by alarm etc. and report in processing of wafers.In this case, the operator carries out the repairing of each several part in order to remove unusual reason, can be moved to safeguard processing.Whether move to and safeguard to handle, can be by the selection picture that for example on display unit 240, shows etc., judge by whether selecting to move to protect after the dimension.
In step S120, be judged as under the situation that moves to maintenance, in step S130, judge whether to return, wait by the time return from maintenance from maintenance.
In step S120, be judged as under the situation that does not move to maintenance, in step S140, judge whether again tentative processing of wafers.It is unusual to carry out medium generation in processing of wafers, and when reporting the parts report by alarm, except that moving to above-mentioned maintenance, for example by the selection picture of display unit 240 demonstrations, operator selectable is selected tentative processing of wafers again or stopped processing of wafers.Wherein, in this wafer W tentative again, not only comprise under the same treatment condition, carrying out the situation of processing of wafers at first, and comprise the situation of the processing of being left.
In step S140, be judged as when trying processing of wafers more tentative again processing of wafers under identical treatment conditions.In step S150, judge whether normal termination of processing of wafers.The processing of the processing of step S150 and step S110 is same.
When in step S150, judging that processing of wafers is improper end, get back to the processing of step S120.In addition, in step S150, when judging the processing of wafers normal termination, in step S160, will just often remove electric condition as removing electric condition enactment.This is because under the situation of the tentative again normal termination of processing of wafers, can carry out removing of wafer W under the electric condition with identical removing just often.
Relative therewith, when in step S130, judging when maintenance is returned, no longer try the processing of wafers while (for example being judged as when stopping processing of wafers) with judgement in step S140, move to the later processing of aftermentioned step S170, remove electric condition when improper as except that electric condition enactment, get back to main routine shown in Figure 7 and move to the processing of step S200.In situation about returning with stop the situation etc. of processing of wafers from maintenance and since wafer W cross adsorbed state, remove under the electric condition and can not remove wafer W fully just often.
In above-mentioned steps S170, judge whether to edit and remove electric condition when improper.Before removing electric treatment, can edit and remove electric condition when improper.Thus, on one side the operator can confirm the state of wafer W, Yi Bian or freely edit according to the experience in past and to remove electric condition when improper.
In above-mentioned steps S170, be judged as editor when removing electric condition when improper, wait among the step S180 that the editor who removes electric condition when improper finishes.When in step S180, being judged as when removing electric condition editor when improper and finishing, remove electric conditional information 294 during updating device parameter memory unit 290 improper, remove electric condition during improper behind the storage editor, remove electric condition during improper after in step S190, will edit as except that electric condition enactment.Particularly, when reading upgraded improper, removes device parameter memory unit 290 electric conditional information 294, with the remove electric condition enactment that remove electric treatment of each parameter as the later front of a garment.
In step S170, be judged as and do not edit when removing electric condition when improper, with keep intact among the step S190 improper the time remove electric condition as except that electric condition enactment.In this case, remove the default value of each parameter of electric condition when for example improper as except that electric condition enactment.In addition, if by constituent apparatus parameter memory units 290 such as hard disk or non-volatility memorizers, then remove under the situation of electric condition during editor improper in the past, owing to remove electric condition when having stored improper behind the editor, thus also can such past editor improper the time except that electric condition as except that electric condition enactment.
Secondly, the concrete example that removes electric treatment (step S200) is described.Removing electric treatment is undertaken by subroutine shown in Figure 9.That is removing under the electric condition of, setting in step S210 removes electric treatment.Particularly, when the parameter conduct that will just often remove electric condition by the setting (step S100) that removes electric condition removes electric condition enactment, remove electric treatment according to the parameter of just often removing electric condition, remove electric condition when improper as removing under the situation of electric condition enactment, removing electric treatment except that the parameter of electric condition when improper.
Carry out except that electric treatment is following.At first, will handle gas, for example N from the gas piping of the regulation of handling gas supply part 142 2Gas imports in the process chamber 102 to remove the gas flow of setting in the electric condition, and vacuumizes by exhaust apparatus, adjusts and makes the pressure that removes electric condition enactment in the process chamber 102.
At this moment, when improper, remove electric condition remove electric treatment the time, control thermal transfer gas supply part 139 vacuumizes between the back side with the upper surface of electrostatic chuck 122 and wafer W.This is for prevent that wafer W from takeofing when electrostatic chuck breaks away from.Promptly, when the backside pressure of wafer W is in than the high state of chamber pressure, remain in the back side of wafer W and the heat-conducting gas between the electrostatic chuck 122 since with process chamber in the pressure differential ejection of pressure, wafer W flyer on electrostatic chuck 122, cause the wafer W skew, the deposit of the edge part of wafer W etc. dances in the air in process chamber 102, produces attached to the problem on the wafer W.
Particularly, improper remove electric condition remove electric treatment the time since take place unusual etc., can not the normal termination processing of wafers, again since abnormal cause etc. can not the prediction of wafer W back side etc. state, so probability height of the wafer W backside pressure state higher than chamber pressure.Therefore, remove the removing under the situation of electric treatment of electric condition when improper, in order reliably to prevent takeofing of wafer W, preferably the back side with wafer W vacuumizes.This point, can vacuumize the wafer W back side because the backside pressure of wafer W or the pressure in the process chamber are as can be known as required just often removing the removing under the situation of electric treatment of electric condition.
When removing the pressure of electric condition enactment when serving as reasons in the process chamber 102, keep this pressure, diverter switch 127 simultaneously, opposite polarity voltage (the anti-voltage that applies) is applied to electrostatic chuck 122 in the time of will be with Electrostatic Absorption.At this moment, be applied to the magnitude of voltage of electrostatic chuck 122 for removing the magnitude of voltage of electric condition enactment.Under this state when when the stipulated time, disconnect the anti-voltage that applies that is applied to electrostatic chuck 122, the importing of disconnection process gas simultaneously stops the pressure control in the process chamber 102.
In addition, as the control and treatment of the electrostatic chuck 122 that removes electric treatment, as mentioned above, the voltage that is not limited to be applied to electrostatic chuck 122 is set at the processing of the magnitude of voltage that removes electric condition.For example, the switch 127 by handover operation electrostatic chuck 122 repeats to make polarity inversion, and the processing that will be applied to electrostatic chuck 122 except that the magnitude of voltage of electric condition enactment is also passable.
In step S220, judge and above-mentionedly remove electric treatment and whether normally carry out.Judgement is being carried out interlock process in removing electric treatment, whether take place substrate board treatment 100 fault, power failure, electric leakage, to remove electric treatment unusual etc.Wherein, in removing electric treatment unusually, for example applying voltage, gas flow, chamber pressure etc. at electrostatic chuck removes in the parameter of electric condition, monitor the detected value of various transducers such as electric sensor, gas flow sensor, pressure sensor, check whether take place unusually according to permission terminal conditions information shown in Figure 5 292.
The interlock process of removing electric treatment is so for example carried out as follows.The detected value of each transducer satisfies and allows terminal conditions 1 and do not satisfy under the situation that allows terminal conditions 2 in removing the parameter of electric condition, reports parts 260 reports by alarm etc., carries out showing on display unit 240 that the warning of warning handles (report to the police and handle).In this case, for example for example allow in the terminal conditions information 292 as being stored in except that the electric treatment situation with the number of times that satisfy to allow terminal conditions 1 etc.
In addition, the detected value of each transducer in removing the parameter of electric condition satisfies under the situation that allows terminal conditions 2, by reporting units such as alarm 260, shows that on display unit 240 generation is unusual, stops to remove electric treatment.
Remove electric treatment just often when in step S220, judging, for example in the processing of above-mentioned interlocking, detected value from each transducer does not satisfy under the situation that allows terminal conditions 2, in step S230, judge whether to finish to remove electric treatment, when being judged as when not finishing to remove electric treatment, return the processing of step S210.
In addition, when in step S220, judge removing electric treatment when improper, for example in above-mentioned interlock process, the detected value of each transducer satisfies under the situation that allows terminal conditions 2, in step S222, stop to remove electric treatment, in step S270～step S290, set the processing that removes electric condition when improper.The processing of step S270～step S290 is identical with the processing of step S170 shown in Figure 8～step S190.
Under the situation of removing electric treatment like this, when removing take place in the electric treatment way unusual, when stopping to remove electric treatment, and though set how remove electric condition, all can not carry out removing of wafer W fully.Therefore, in this case, can set and remove electric condition when improper and carry out removing once more electric treatment.Thus, can carry out removing of wafer W fully.
When judging that in step S230 removing electric treatment finishes, in step S240, in display unit 240, show the electric treatment situation of removing.At this moment, can in display unit 240, show the tentative again picture of selecting that removes electric treatment with removing the electric treatment situation.As removing the tentative again picture of selecting of electric treatment, for example available " YES ", " NO " expression.
In addition, as removing the electric treatment situation, show the satisfied number of times that removes the permission terminal conditions 1 in the electric treatment situation that is stored in permission terminal conditions information 292 shown in Figure 5 etc.For example, the number of times that satisfies permission terminal conditions 1 is 0 o'clock, because the warning of electric treatment no longer takes place to remove, means and normally finishes can show this meaning except that electric treatment.In addition, under the number of times that satisfy to allow terminal conditions 1 is situation 1 or more, more than the warning that removes electric treatment takes place once at least, does not also reach to satisfy and allow boundary 2, then mean and remove the electric treatment end.Therefore, in this case, can be tentative again by select picture and selecting except that electric separation.
Secondly, in step S250, judge whether again the tentative electric treatment that removes.Particularly, selecting picture and selecting by the above-mentioned electric separation that removes " YES " situation under, be judged as again the tentative electric treatment that removes, selecting " NO " situation, be judged as the no longer tentative electric treatment that removes.
Tentative when removing electric treatment when in step S250, judging again, in step S270～S290, carry out removing when improper the setting of electric condition and handle, get back to step S210, tentatively again remove electric treatment.That is, trying again except that under the situation of electric treatment, can be improper except that electric condition by editor, change removes electric treatment except that electric condition is tentative again.Thus, can prevent from reliably can not carry out fully under the state that removes electricity of wafer W, wafer W breaks away from from electrostatic chuck 122.
In addition, in flow chart shown in Figure 9, be judged as in step S250 no longer tentatively when removing electric treatment, repeating step S210～step S250 and step S270～step S290, thus can be arbitrarily time change the electric condition of removing, tentative again except that electric treatment.Thus, change an electric treatment situation of removing of removing electric condition and removing electric treatment owing to for example can confirm every minimizing, so can carry out removing of wafer W more reliably.
When judgement in step S250 is no longer tried except that electric treatment, get back to step S260, wafer W is broken away from from electrostatic chuck 122, return the processing of Fig. 7, finish a series of electric treatment that removes.Particularly,, wafer W is broken away from from the electrostatic chuck 122 of the lower electrode 120 of double as mounting table, finish to remove electric treatment for example by pushing to promote pin to.Thus, not only when the processing of wafers normal termination, when the improper end of processing of wafers, also can remove electricity to wafer W fully,, not have skew, can take out of, get by carrying arm etc. except that wafer W so can not cut the damage wafer W.
In addition, to store and realize above-mentioned execution mode function (processing of wafers function for example, remove the electric treatment function) the media such as storage medium of program of software supply to system or device, computer (or CPU and MPU) by this system or device reads and moves the program in the media such as being stored in storage medium, can reach the present invention.
In this case, utilize the function of the above-mentioned execution mode of program realization that reads from storage medium etc. itself, the media such as storage medium that store this program can constitute the present invention.Can use for example soft (registered trade mark) dish, hard disk, CD photomagneto disk, CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW, tape, non-volatile storage card, ROM or by network download etc. as the media such as storage medium of supplying with program.
In addition, not only can realize the function of above-mentioned execution mode by moving the program that computer reads, and can be according to the indication of this program, make the OS that works on the computer etc. carry out one one of actual treatment or all, the function by the above-mentioned execution mode of this processings realization is also contained among the present invention.
In addition, after the program that reads from media such as storage mediums is written to the memory that the functional expansion unit that inserts the expansion board the computer or be connected with computer has, indication according to this program, the CPU that this expansion board or functional expansion unit have etc. carries out part or all of actual treatment, handle the function that realizes above-mentioned execution mode by this, this is also contained among the present invention.
More than, with reference to description of drawings preferred implementation of the present invention, but this brightly is not limited only to above-mentioned example.Those skilled in the art can have various modifications or revise example as can be known in the scope that the claim scope is put down in writing.These also belong to this technical scope certainly.
The possibility of utilizing on the industry
That carries out in the situation that the present invention can be used for making processed substrate to break away from from mounting table is processed Substrate except method for electrically, substrate board treatment and program.

Claims (30)

  1. A processed substrate remove method for electrically, it carries out when described mounting table breaks away from the processed substrate that carries out predetermined processing that absorption remains under the state that is disposed at the mounting table in the process chamber, it is characterized in that having:
    Carry out described processed substrate remove electricity before, judgement is to the whether normal termination of the predetermined processing of described processed substrate, when being judged as normal termination, set the electric condition of removing according to being stored in the electric conditional information that just often removes that just often removes in the electric conditional information memory unit, when being judged as improper end, removing electric conditional information when removing improper in the electric conditional information memory unit when improper and set the electric condition enactment operation of removing of removing electric condition according to being stored in; With
    According to carrying out the electric treatment that removes that removes electric treatment of described processed substrate and carry out operation by the described electric condition of removing of removing electric condition enactment component settings.
  2. Processed substrate as claimed in claim 1 remove method for electrically, it is characterized in that:
    Described when removing electric condition enactment operation and being included in to the improper end of being treated to of described processed substrate, judge whether to move to maintenance, move to when safeguarding when being judged as, equally when this maintenance is returned, remove electric conditional information when being stored in improper in the described device parameter memory unit and set the operation of removing electric condition.
  3. Processed substrate as claimed in claim 1 or 2 remove method for electrically, it is characterized in that:
    The described electric treatment implementation operation of removing comprises the described electric treatment situation of removing that detects, compare its detected value and allow terminal conditions, when the described detected value that removes the electric treatment situation satisfies the permission terminal conditions, judge that described to remove electric treatment be abnormality and stop the described electric treatment that removes, according to removing electric condition enactment when removing electric conditional information memory unit improper when improper and remove electric condition, the tentative more described operation of removing electric treatment from described.
  4. Processed substrate as claimed in claim 3 remove method for electrically, it is characterized in that:
    Described permission terminal conditions is divided into and describedly removes the unusual exceptional condition of electric treatment and as two stages of warning condition of the condition that relaxes than this exceptional condition,
    Describedly remove electric treatment and carry out operation and be included in the described detected value that removes the electric treatment situation when satisfying described exceptional condition, judge and describedly remove electric treatment and be in abnormality and stop the described electric treatment that removes, when the described detected value that removes the electric treatment situation satisfies described warning condition, judge the described operation that electric treatment is in alarm condition and carries out described warning processing of removing.
  5. 5. as the method for electrically that removes of each described processed substrate in the claim 1～4, it is characterized in that:
    Describedly remove electric treatment and carry out operation and be included in removing after electric treatment finishes of described processed substrate, seek and whether select again the tentative described electric treatment that removes, tentative described when removing electric treatment when selecting again, according to removing electric conditional information when removing electric conditional information memory unit improper when improper and set the operation of removing electric condition from described.
  6. 6. as the method for electrically that removes of each described processed substrate in the claim 1～5, it is characterized in that:
    Described remove electric conditional information when improper can be by the input block editor.
  7. Processed substrate as claimed in claim 6 remove method for electrically, it is characterized in that:
    Describedly remove in the electric conditional information the editable number of removing electric conditional parameter when improper just often to remove electric conditional information many than described.
  8. 8. as the method for electrically that removes of each described processed substrate in the claim 1～7, it is characterized in that:
    According to described remove that electric conditional information sets when improper remove removing in the electric treatment that electric condition carries out, be included in the operation that vacuumizes between the back side of described processed substrate and the described mounting table.
  9. 9. as the method for electrically that removes of each described processed substrate in the claim 1～8, it is characterized in that:
    Remove in the electric treatment described, comprise and repeat and to be applied to the operation of the polarity inversion of the voltage that makes the Electrostatic Absorption parts on the mounting table of described handled object Electrostatic Absorption in being disposed at described process chamber.
  10. Processed substrate as claimed in claim 9 remove method for electrically, it is characterized in that:
    Described remove when improper electric conditional information comprise the voltage that applies to described Electrostatic Absorption parts, the pressure in the described process chamber at least, from each parameter of in described process chamber, supplying with the gas flow of a plurality of gas pipings of handling gas.
  11. 11. a substrate board treatment, it remains on the processed substrate that carries out predetermined processing under the state that is disposed at the mounting table in the process chamber carries out described processed substrate when described mounting table breaks away from the electricity that removes in absorption, it is characterized in that having:
    What storage just often removed electric conditional information just often removes electric conditional information memory unit;
    Store and remove electric conditional information memory unit when removing electric conditional information improper when improper;
    Carry out described processed substrate remove electricity before, judgement is to the whether normal termination of the predetermined processing of described processed substrate, when being judged as normal termination, according to setting the electric condition of removing from the described electric conditional information that just often removes that just often removes electric conditional information memory unit, when being judged as improper end, according to removing electric conditional information when removing electric conditional information memory unit improper when improper and set the electric condition enactment parts that remove that remove electric condition from described; With
    According to carrying out the electric treatment that removes that removes electric treatment of described processed substrate and carry out device by the described electric condition of removing of removing electric condition enactment component settings.
  12. 12. substrate board treatment as claimed in claim 11 is characterized in that:
    Describedly remove electric condition enactment parts the time to the improper end of being treated to of described processed substrate, judge whether to move to maintenance, move to when safeguarding when being judged as,, remove electric conditional information during according to described device parameter storage component stores improper and set the electric condition of removing equally when maintenance is returned.
  13. 13., it is characterized in that as claim 11 or 12 described substrate board treatments:
    The described electric treatment implementation parts that remove detect the described electric treatment situation of removing, compare its detected value and allow terminal conditions, when the described detected value that removes the electric treatment situation satisfies the permission terminal conditions, judge that described to remove electric treatment be abnormality and stop the described electric treatment that removes, according to removing electric condition enactment when removing electric conditional information memory unit improper when improper and remove electric condition, the tentative more described electric treatment that removes from described.
  14. 14. substrate board treatment as claimed in claim 13 is characterized in that:
    Described permission terminal conditions is divided into and describedly removes the unusual exceptional condition of electric treatment and as two stages of warning condition of the condition that relaxes than this exceptional condition,
    The described electric treatment implementation parts that remove are when the described detected value that removes the electric treatment situation satisfies described exceptional condition, judge and describedly remove electric treatment and be in abnormality and stop the described electric treatment that removes, when the described detected value that removes the electric treatment situation satisfies described warning condition, judge and describedly remove electric treatment and be in alarm condition and carry out described warning processing.
  15. 15., it is characterized in that as each described substrate board treatment in the claim 11～14:
    Describedly remove electric treatment and carry out parts removing after electric treatment finishes at described processed substrate, seek and whether select again the tentative described electric treatment that removes, tentative described when removing electric treatment when selecting again, according to removing electric conditional information when removing electric conditional information memory unit improper when improper and set the electric condition of removing from described.
  16. 16., it is characterized in that as each described substrate board treatment in the claim 11～15:
    Described remove electric conditional information when improper can be by the input block editor.
  17. 17. substrate board treatment as claimed in claim 16 is characterized in that:
    Describedly remove in the electric conditional information the editable number of removing electric conditional parameter when improper just often to remove electric conditional information many than described.
  18. 18., it is characterized in that as each described substrate board treatment in the claim 11～17:
    According to described remove that electric conditional information sets when improper remove removing in the electric treatment that electric condition carries out, be included in the processing that vacuumizes between the back side of described processed substrate and the described mounting table.
  19. 19., it is characterized in that as each described substrate board treatment in the claim 11～18:
    Remove in the electric treatment described, comprise and repeat and to be applied to the polarity inversion of the voltage that makes the Electrostatic Absorption parts on the mounting table of described handled object Electrostatic Absorption in being disposed at described process chamber.
  20. 20. substrate board treatment as claimed in claim 19 is characterized in that:
    Described remove when improper electric conditional information comprise the voltage that applies to described Electrostatic Absorption parts, the pressure in the described process chamber at least, from each parameter of the gas flow of a plurality of gas pipings of the processing gas of in described process chamber, supplying with.
  21. 21. a program, it is used to carry out the processed substrate that carries out predetermined processing that remains under the state that is disposed at the mounting table in the process chamber in absorption and carries out the electric treatment that removes of processed substrate when described mounting table breaks away from, and it is characterized in that having:
    In computer,
    Carry out described processed substrate remove electricity before, judgement is to the whether normal termination of the predetermined processing of described processed substrate, when being judged as normal termination, set the electric condition of removing according to being stored in the electric conditional information that just often removes that just often removes in the electric conditional information memory unit, when being judged as improper end, removing electric conditional information when removing improper in the electric conditional information memory unit when improper and set and remove the electric condition enactment order of removing of electric condition according to being stored in; With
    According to set remove electric condition carry out described processed substrate remove electric treatment remove electric treatment implementation order.
  22. 22. program as claimed in claim 21 is characterized in that:
    Described when removing electric condition enactment and being included in proper order to the improper end of being treated to of described processed substrate, judge whether to move to maintenance, move to when safeguarding when being judged as, equally when this maintenance is returned, remove electric conditional information when being stored in improper in the described device parameter memory unit and set the order of removing electric condition.
  23. 23., it is characterized in that as claim 21 or 22 described programs:
    Describedly remove the electric treatment implementation and comprise the described electric treatment situation of removing that detects in proper order, compare its detected value and allow terminal conditions, when the described detected value that removes the electric treatment situation satisfies the permission terminal conditions, judge that described to remove electric treatment be abnormality and stop the described electric treatment that removes, according to removing electric condition enactment when removing electric conditional information memory unit improper when improper and remove electric condition, the tentative more described order of removing electric treatment from described.
  24. 24. program as claimed in claim 23 is characterized in that:
    Described permission terminal conditions is divided into that described to remove electric treatment be unusual exceptional condition and as two stages of warning condition of the condition that relaxes than this exceptional condition,
    Describedly remove the electric treatment implementation and be included in the described detected value that removes the electric treatment situation in proper order when satisfying described exceptional condition, judge and describedly remove electric treatment and be in abnormality and stop the described electric treatment that removes, when the described detected value that removes the electric treatment situation satisfies described warning condition, judge the described order that electric treatment is in alarm condition and carries out described warning processing of removing.
  25. 25., it is characterized in that as each described program in the claim 21～24:
    Describedly remove the electric treatment implementation and be included in removing after electric treatment finishes of described processed substrate in proper order, seek and whether select again the tentative described electric treatment that removes, tentative described when removing electric treatment when selecting again, according to removing electric conditional information when removing electric conditional information memory unit improper when improper and set the order of removing electric condition from described.
  26. 26., it is characterized in that as each described program in the claim 21～25:
    Described remove electric conditional information when improper can be by the input block editor.
  27. 27. program as claimed in claim 26 is characterized in that:
    Describedly remove in the electric conditional information the editable number of removing electric conditional parameter when improper just often to remove electric conditional information many than described.
  28. 28., it is characterized in that as each described program in the claim 21～27:
    According to described remove that electric conditional information sets when improper remove removing in the electric treatment that electric condition carries out, be included in the order that vacuumizes between the back side of described processed substrate and the described mounting table.
  29. 29., it is characterized in that as each described program in the claim 21～28:
    Remove in the electric treatment described, comprise and repeat and to be applied to the order of the polarity inversion of the voltage that makes the Electrostatic Absorption parts on the mounting table of described handled object Electrostatic Absorption in being disposed at described process chamber.
  30. 30. program as claimed in claim 29 is characterized in that:
    Described remove when improper electric conditional information comprise the voltage that applies to described Electrostatic Absorption parts, the pressure in the described process chamber at least, from each parameter of in described process chamber, supplying with the gas flow of a plurality of gas pipings of handling gas.
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