CN1828223A - Horizontal axis micromechanical gyroscope and its preparation method - Google Patents
Horizontal axis micromechanical gyroscope and its preparation method Download PDFInfo
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Abstract
The product comprises: an outer/inner frame, a drive electrode and a drive feedback electrode both with two group of lateral comb-tooth capacitors and movable electrodes connected to the outer frame, a drive-modal elastic beam, a detection electrode with two group of unequal vertical comb-tooth capacitors for difference detection with movable electrode connected to the inner frame, a detect-modal elastic beam as four group of combined torsion beams everyone with ends connected to former inner/outer frame respectively, and an anchor point fixed on substrate bottom and connected to the outer frame through the drive-modal beam. This invention is simple and fit to large-scale production, compatible to Z-axis gyro and accelerometer, and can be used for MIMU.
Description
Technical field
The present invention relates to a kind of capacitive micro mechinery gyroscope and preparation method thereof, particularly about a kind of horizontal axis micromechanical gyroscope that adopts the vertical comb teeth capacitance detecting and preparation method thereof.
Background technology
Micromechanical gyro is to utilize Coriolis force to come a class inertial sensor of Measuring Object angle of rotation speed.Volume is little, in light weight, low cost and other advantages because the manufacturing of employing MEMS (micro electro mechanical system) (MEMS) technology, micromechanical gyro have, and in fields such as inertial navigation, weapon guidance, automobile, consumer electronics products very application prospects is arranged.In order to obtain the complete information that object rotates, need detect three axial angular velocity signals simultaneously, this just needs three gyro.Three gyro can realize by three single shaft device quadratures are assembled, but the error during assembling makes three to detect axle and be difficult to accomplish complete quadrature, has limited the performance of three gyros, also can increase processing cost simultaneously.Adopt the MEMS technology can process the gyro of three single shafts simultaneously on single chip, the normal alignment between each realizes automatically by structural design, has avoided assembly problem, and can reduce the volume and weight of total system.Adopt the gyro structure of each one-way shaft in three gyros that this technology realizes independently to do optimal design, thereby can obtain higher performance.
Three single shaft gyros are integrated on the chip, when selecting design proposal, must consider the compatibility of technology between Z axle gyro and X, Y-axis gyro on the one hand, also should consider to realize the process program of high aspect ratio structure, to increase the inertial mass and the sensitization capacitance of gyro; On the other hand, for the quality factor (Q value) that improve that gyro drives and detect mode improving the performance of gyro, gyro drive and the detection side to motion should reduce the air press-filming damping as far as possible, as employing changed area comb electrodes.Being operated in the gyro that can obtain higher Q value under the atmospheric environment can encapsulate by needing no vacuum, reduces the processing cost of gyro.Z axle gyro is easy to utilize high-aspect-ratio MEMS technology to realize the gyro structural design of higher Q value, as people's such as Korea S Seong-HyokKim Gyroscope Design scheme (Proc.Transducers2001) owing to drive and detect all planar motions of mode.Detect X, the Y-axis gyro of Z direction off-plane movement for needs, limited by the MEMS process characteristic, be difficult to realize the changed area sensitization capacitance, existing scheme adopts the clearance-changed type parallel plate capacitor more, as the gyro structure (Sensors﹠amp of people such as the W.Geiger design of Germany; Actuators A, 95).Because the sensitivity and the gap of clearance-changed type capacity plate antenna are inversely proportional to, in order to guarantee higher sensitivity, the plate electrode gap can not be too big, will cause bigger air damping like this, must operate under low pressure or the vacuum environment, and this class electric capacity is difficult to realize Differential Detection.People such as the Huikai Xie of the U.S. have designed a kind of gyro structure that adopts vertical comb teeth electric capacity to detect (Sensors and Actuatorsa-Physical), this gyro adopts CMOS MEMS technology to realize, but the size of its sensitization capacitance depends on the number of plies and the thickness of interconnection line in the CMOS technology, the sensitization capacitance that very difficult acquisition is bigger, and have bigger stress in the technology, limited the performance of device.
Summary of the invention
The purpose of this invention is to provide a kind of highly sensitively, can realize horizontal axis micromechanical gyroscope of Differential Detection Z direction vertical movement and preparation method thereof.
For achieving the above object, the present invention takes following technical scheme: a kind of horizontal axis micromechanical gyroscope, it is characterized in that: it comprises housing, inside casing, drive electrode, the drive feedback electrode, drive the mode elastic beam, detecting electrode, detect mode elastic beam and anchor point, described drive electrode and drive feedback electrode all adopt two groups of horizontal broach electric capacity, and described housing is connected with the described anchor point that is fixed on the substrate by the elastic beam that drives mode, the movable electrode of described drive electrode and drive feedback electrode is connected with described housing, the movable electrode of described detecting electrode is connected with described inside casing, and described detecting electrode is for realizing two groups of not contour vertical comb teeth electric capacity of Differential Detection, and described detection mode elastic beam is four groups of combination torsion beam, one end of every group of described combination torsion beam connects described inside casing, and the other end connects described housing.
Two groups of not contour vertical comb teeth electric capacity of described detecting electrode are made up of adjacent single-ended movable electrode and the fixed electorde with difference in height that plugs, and wherein the movable electrode of one group of described electric capacity is shorter than fixed electorde, and another movable electrode of organizing described electric capacity is longer than fixed electorde.
Two groups of not contour vertical comb teeth electric capacity of described detecting electrode are made up of movable electrode and fixed electorde that the adjacent both-end that plugs has difference in height, and wherein the movable electrode position of one group of described electric capacity is than fixed electorde position height, and another movable electrode position of organizing described electric capacity is lower than fixed electorde position.
Four groups of combination torsion beam of described detection mode elastic beam comprise a rigidity part and four strutbeams respectively, and an end of described four strutbeams is connected to the end of described rigidity part.
A kind of preparation method of horizontal axis micromechanical gyroscope, it may further comprise the steps: (1) adopts the two N of throwing type silicon chips; (2) forming the composite mask that photoresist mask and monox are formed on silicon chip, is the mask etching deep trouth with the photoresist, and the deep trouth degree of depth is made the lower end difference in height of fixed electorde and movable electrode; (3) removing the photoresist mask, is the mask etching shallow slot with the monox, and the shallow slot degree of depth is made the gap between movable electrode and the substrate; (4) remove monox, silicon chip surface adopts ion to inject or diffusion technique is mixed, to form Ohmic contact; (5) on glass substrate, make metal electrode, as the lead-in wire electrode of micromechanical gyro; (6) anode linkage is realized glass substrate and silicon pad alignment and bonding, and wafer thinning is arrived suitable thickness; (7) mask etching releasing structure is finished the capacitive micromachined gyro preparation of broach.
Described mask etching releasing structure is finished single-ended not contour broach micromechanical gyro preparation for being the mask etching releasing structure with the aluminium mask.
Described mask etching releasing structure may further comprise the steps: (1) is the mask etching deep trouth at the composite mask of silicon chip surface formation photoresist mask and aluminium mask formation with the photoresist; (2) removing the photoresist mask, is the mask etching silicon chip with the aluminium mask, finishes the capacitive micromachined gyro preparation of the not contour broach of both-end.
The present invention is owing to take above technical scheme, it has the following advantages: 1, the present invention is owing to all adopt the changed area comb electrodes to realize drive electrode, drive feedback electrode and detecting electrode, the damping that reduces to drive mode effectively and detect mode, the sensitivity that has improved gyro.2, detecting electrode of the present invention is owing to adopt vertical comb teeth electric capacity, and its sensitivity and movable electrode and substrate gaps are irrelevant, so can be by increasing the air damping that movable electrode and substrate gaps further reduce to drive and detect mode.3, owing to effectively reduce air damping, gyro can obtain higher Q value under atmospheric environment, and the needing no vacuum encapsulation gets final product work, can reduce the processing cost of device.4, gyro structure of the present invention has realized the vertical movement of high aspect ratio structure, makes whole gyro structure realize that gyro can obtain bigger inertial mass and sensitization capacitance, helps improving the performance of device by high-aspect-ratio technology.5, the present invention adopts conventional MEMS process equipment to make product of the present invention, and technological process is simple, with Z axle gyro and accelerometer process compatible, can be used for realizing three gyros or the mini inertia measurement unit (MIMU) of single-chip, and can realize manufacturing in enormous quantities.
Description of drawings
Fig. 1 a, Fig. 1 b are the single-ended not contour vertical comb teeth electric capacity schematic cross-section of the present invention
Fig. 2 a, Fig. 2 b are the not contour vertical comb teeth electric capacity of both-end of the present invention schematic cross-section
Fig. 3 makes up the torsion beam structural representation for the present invention
Fig. 4 is a structural representation of the present invention
Fig. 5 a～Fig. 5 g is a preparation process synoptic diagram of the present invention
Fig. 6 a, Fig. 6 b are another embodiment synoptic diagram of preparation process of the present invention
Embodiment
Convenient for describing the present invention, at first not contour vertical comb teeth electric capacity of single-ended not contour vertical comb teeth electric capacity, both-end that relates among the present invention and the structure that makes up torsion beam are illustrated.
Shown in Fig. 1 a, 1b, single-ended not contour vertical comb teeth electric capacity comprises the movable electrode 1 and the fixed electorde 2 that are provided with at interval, and movable electrode 1 and fixed electorde 2 adopt single-ended (upper end or lower end) not contour structure, constitute two sensitization capacitances 3,4.Wherein the movable electrode 1 of sensitization capacitance 3 is than fixed electorde 2 short (as shown in Figure 1a), the movable electrode 1 of sensitization capacitance 4 is than fixed electorde 2 long (shown in Fig. 1 b), when movable electrode 1 makes progress (or downwards) vertical movement, height setting according to fixed electorde 2 and movable electrode 1, the electrode overlapping area of sensitization capacitance 3 reduces (or remaining unchanged), and promptly sensitization capacitance 3 reduces (or remaining unchanged); The electrode overlapping area of sensitization capacitance 4 remains unchanged (or reducing), i.e. sensitization capacitance 4 constant (or reducing).The difference result of two sensitization capacitances 3,4 is directly proportional with the perpendicular displacement of movable electrode 1, so can be used for the detection of perpendicular displacement.More than analyze not the CONSIDERING EDGE electric field to the influence of electric capacity.If count fringe field, single changes in capacitance amount changes and departs from linear to some extent, but the still retention wire sexual intercourse of the difference result of electric capacity, so can be used for actual detected.
Shown in Fig. 2 a, 2b, the not contour vertical comb teeth electric capacity of both-end, it is the improvement of on the basis of aforementioned single-ended not contour broach capacitance structure, doing, comprise the movable electrode 1 and the fixed electorde 2 that are provided with at interval, movable electrode 1 and fixed electorde 2 adopt the not contour structure of both-end, constitute two sensitization capacitances 5,6.Wherein fixed electorde 2 positions of sensitization capacitance 5 are lower than movable electrode 1 (shown in Fig. 2 a), and fixed electorde 2 positions of sensitization capacitance 6 are higher than movable electrode 1 (shown in Fig. 2 b).Shown in Fig. 2 a, 2b, when movable electrode 1 made progress (or downwards) vertical movement, the electrode overlapping area of sensitization capacitance 5 reduced (or increase), and promptly sensitization capacitance 5 reduces (or increase); The electrode overlapping area of sensitization capacitance 6 increases (or reducing), and promptly sensitization capacitance 6 increases (or reducing).The difference result of two sensitization capacitances 5,6 is directly proportional with the perpendicular displacement of movable electrode 1, admittedly can be used for the detection of perpendicular displacement.Compare with aforementioned single-ended not contour vertical comb teeth electric capacity, the detection sensitivity and the linearity of the not contour vertical comb teeth electric capacity of both-end are improved.
As shown in Figure 3, combination torsion beam 7 connects a rigid member 8 by four strutbeams 71,72,73,74 and forms, wherein two strutbeams 71,72 link to each other with point of fixity, in addition two strutbeams 73,74 link to each other with inertial mass (inertial mass be in the gyro with the continuous structure of beam, also to describe in detail below).When the inertial mass vertical movement, combination torsion beam 7 serves as that axle reverses with strutbeam 71,72, thereby realizes the vertical movement of high aspect ratio structure.Combination torsion beam 7 can reduce the Equivalent Elasticity rigidity of inertial mass in the Z direction, improves Z direction displacement sensitivity, in actual use, must adopt plural combination torsion beam 7 could guarantee the vertical movement of inertial mass.
As shown in Figure 4, the present invention adopts the horizontal axis micromechanical gyroscope of vertical comb teeth capacitance detecting, and it comprises drive electrode 9, drive feedback electrode 10, and detecting electrode 11,12 drives mode elastic beam 13, detects mode elastic beam 14 and anchor point 15.The drive electrode 9 of gyro comprises two arrays of electrodes, adopts the push-pull type type of drive, and drive feedback electrode 10 also comprises two arrays of electrodes, is respectively two groups of drive electrodes 9 feedback signal is provided.Drive electrode 9 and drive feedback electrode 10 can adopt horizontal comb electrodes to realize, with the amplitude that improves mode of oscillation and reduce air damping.The present invention adopts two framework 16,17 structures, and housing 16 links to each other with anchor point 15 by driving mode elastic beam 13, is fixed on the substrate of device.The movable electrode and the interelectrode one that connects and composes of inside casing 17 of the present invention and detecting electrode 11,12 link to each other with housing 16 by detecting mode elastic beam 14.Detect mode elastic beam 14 and have four groups, the structure of every group of detection mode elastic beam 14 is the structure and the mode of motion of aforementioned combination torsion beam 7, wherein the movable electrode and the interelectrode coupling part of the inside casing 17 of gyro and detecting electrode 11,12 are equivalent to make up the inertial mass that strutbeam 73,74 connects in the torsion beam 7; Wherein the housing 16 of gyro is equivalent to make up the point of fixity that strutbeam 71,72 connects in the torsion beam 7.Two groups of detecting electrodes of the present invention 11,12 adopt the version of the aforementioned single-ended or not contour vertical comb teeth electric capacity of both-end, to realize Differential Detection.Detecting electrode 11 is positioned at the middle part, detecting electrode 12 symmetries are arranged in both sides (the grey color part of figure is a fixed electorde), the broach of the movable electrode of close center fixed electrode both sides is longer, movable electrode broach near the both sides fixed electorde is shorter, the summation of the overlapping area in the both sides detecting electrode 12 between movable electrode and the fixed electorde equates with the summation of overlapping area between movable electrode in the intermediate detection electrode 11 and the fixed electorde.Wherein, detecting electrode 11 adopts the version (shown in Fig. 1 a or Fig. 2 a) of electric capacity 3 or 5, and detecting electrode 12 adopts the version (shown in Fig. 1 b or 2b) of electric capacity 4 or 6.The driving shaft of micromechanical gyro of the present invention is parallel to substrate direction (Y-axis), detects axle perpendicular to substrate (Z axle), and the angular velocity input shaft is parallel to the substrate direction, with a driving shaft and a detection axle quadrature (X-axis).
Micromechanical gyro of the present invention utilizes Coriolis force to come Measuring Object angular velocity, as shown in Figure 4, Y-axis drives during work, make total along Y axis vibration, when there is directions X angular velocity (is that axle rotates with the directions X) in system, (along the Z axle) vibration about under the constraint of torsion beam 7 of the movable electrode of inside casing 17 and detecting electrode 11,12 and interelectrode connecting portion branch, thus capacitance variations caused, obtain in Z axle detection of motion result.
Horizontal axis micromechanical gyroscope of the present invention can be taked following preparation method:
Embodiment 1: adopt following steps when making single-ended not contour broach electric capacity horizontal axis micromechanical gyroscope:
1, parent material adopts two N type (100) silicon chip 18 (shown in Fig. 5 a) that throw, and thickness is 400 ± 10 microns;
2, at first on silicon chip 18, form monox 19 masks, on silicon chip 18, form the composite mask (shown in Fig. 5 b) that photoresist 20 and monox 19 are formed then, be mask etching deep trouth 21 with photoresist 20 then, the degree of depth of deep trouth 21 is made the lower end difference in height of fixed electorde 2 and movable electrode 1;
3, shown in Fig. 5 c, remove photoresist mask 20, be mask etching shallow slot 22 with monox 19, shallow slot 22 degree of depth are made the gap between movable electrode 1 and the glass substrate;
4, shown in Fig. 5 d, remove monox 19, silicon chip 18 surfaces adopt ion to inject or diffusion technique mixes 23, to form Ohmic contact;
5, shown in Fig. 5 e, on glass substrate 24, make metal electrode 25, as the lead-in wire electrode of gyro;
6, shown in Fig. 5 f,, realize anode linkage, and silicon chip 18 is thinned to suitable thickness glass substrate 24 and silicon chip 18 alignings and bonding;
7, shown in Fig. 5 g, be the mask etching releasing structure with aluminium mask 26, form the movable electrode 1 and the fixed electorde 2 of electric capacity, finish the preparation (shown in Fig. 1 b) of single-ended not contour broach electric capacity horizontal axis micromechanical gyroscope.
Embodiment 2: adopt following steps when making the not contour broach electric capacity of both-end horizontal axis micromechanical gyroscope:
1, initial process is consistent with above-mentioned single-ended not contour broach micromechanical gyro technology, promptly adopts step 1～6 in the example 1, carries out according to the following steps then;
2, shown in Fig. 6 a, form the composite mask that photoresist mask 27 and aluminium mask 28 constitute on silicon chip 18 surfaces, be mask etching deep trouth 29 with the photoresist;
3, shown in Fig. 6 b, remove photoresist mask 27, be mask etching silicon chip 18 with aluminium mask 28, form the movable electrode 1 and the fixed electorde 2 of electric capacity, finish the preparation of the not contour broach electric capacity of both-end horizontal axis micromechanical gyroscope.
Claims (7)
1, a kind of horizontal axis micromechanical gyroscope, it is characterized in that: it comprises housing, inside casing, drive electrode, the drive feedback electrode, drive the mode elastic beam, detecting electrode, detect mode elastic beam and anchor point, described drive electrode and drive feedback electrode all adopt two groups of horizontal broach electric capacity, described housing is connected with the described anchor point that is fixed on the substrate by the elastic beam that drives mode, and the movable electrode of described drive electrode and drive feedback electrode is connected with described housing, and the movable electrode of described detecting electrode is connected with described inside casing, described detecting electrode is for realizing two groups of not contour vertical comb teeth electric capacity of Differential Detection, described detection mode elastic beam is four groups of combination torsion beam, and an end of every group of described combination torsion beam connects described inside casing, and the other end connects described housing.
2, a kind of according to claim 1 horizontal axis micromechanical gyroscope, it is characterized in that: two groups of not contour vertical comb teeth electric capacity of described detecting electrode are made up of adjacent single-ended movable electrode and the fixed electorde with difference in height that plugs, and wherein the movable electrode of one group of described electric capacity is shorter than fixed electorde, and another movable electrode of organizing described electric capacity is longer than fixed electorde.
3, a kind of horizontal axis micromechanical gyroscope as claimed in claim 1, it is characterized in that: two groups of not contour vertical comb teeth electric capacity of described detecting electrode are made up of movable electrode and fixed electorde that the adjacent both-end that plugs has difference in height, and wherein the movable electrode position of one group of described electric capacity is than fixed electorde position height, and another movable electrode position of organizing described electric capacity is lower than fixed electorde position.
4, as claim 1 or 2 or 3 described a kind of horizontal axis micromechanical gyroscopes, it is characterized in that: four groups of combination torsion beam of described detection mode elastic beam comprise a rigidity part and four strutbeams respectively, and an end of described four strutbeams is connected to the end of described rigidity part.
5, a kind of preparation method of horizontal axis micromechanical gyroscope, it may further comprise the steps:
(1) adopts the two N of throwing type silicon chips;
(2) forming the composite mask that photoresist mask and monox are formed on silicon chip, is the mask etching deep trouth with the photoresist, and the deep trouth degree of depth is made the lower end difference in height of fixed electorde and movable electrode;
(3) removing the photoresist mask, is the mask etching shallow slot with the monox, and the shallow slot degree of depth is made the gap between movable electrode and the substrate;
(4) remove monox, silicon chip surface adopts ion to inject or diffusion technique is mixed, to form Ohmic contact;
(5) on glass substrate, make metal electrode, as the lead-in wire electrode of micromechanical gyro;
(6) anode linkage is realized glass substrate and silicon pad alignment and bonding, and wafer thinning is arrived suitable thickness;
(7) mask etching releasing structure is finished the capacitive micromachined gyro preparation of broach.
6, the preparation method of a kind of horizontal axis micromechanical gyroscope as claimed in claim 5 is characterized in that: described mask etching releasing structure is finished single-ended not contour broach micromechanical gyro preparation for being the mask etching releasing structure with the aluminium mask.
7, the preparation method of a kind of horizontal axis micromechanical gyroscope as claimed in claim 5, described mask etching releasing structure may further comprise the steps:
(1) at the composite mask of silicon chip surface formation photoresist mask and aluminium mask formation, be the mask etching deep trouth with the photoresist;
(2) removing the photoresist mask, is the mask etching silicon chip with the aluminium mask, finishes the capacitive micromachined gyro preparation of the not contour broach of both-end.
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| WO2016119418A1 (en) * | 2015-01-30 | 2016-08-04 | 歌尔声学股份有限公司 | Z-axis structure in accelerometer |
| CN106546232A (en) * | 2015-11-05 | 2017-03-29 | 中国科学院地质与地球物理研究所 | A kind of MEMS gyroscope and its manufacturing process |
| CN106500732A (en) * | 2016-12-22 | 2017-03-15 | 四川纳杰微电子技术有限公司 | A kind of micro-mechanical gyroscope quadrature error collocation structure |
| CN108946655A (en) * | 2017-05-23 | 2018-12-07 | 北京大学 | A kind of single-chip integration inertia device process compatible method |
| CN108955663A (en) * | 2017-05-23 | 2018-12-07 | 北京大学 | A kind of wheeled gyro of resonant mode twin shaft micromechanics |
| CN108946655B (en) * | 2017-05-23 | 2021-04-30 | 北京大学 | Process compatibility method for single-chip integrated inertial device |
| CN108955663B (en) * | 2017-05-23 | 2022-03-25 | 北京大学 | Resonant double-shaft micro-mechanical wheel type gyroscope |
| CN112284368A (en) * | 2020-09-21 | 2021-01-29 | 北京航天控制仪器研究所 | Fully-differential high-precision X-axis silicon micro-gyroscope |
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