CN1159208C - Manufacture of integrated minuature movable silicon mechanical-structure on glass substrate - Google Patents
Manufacture of integrated minuature movable silicon mechanical-structure on glass substrate Download PDFInfo
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- CN1159208C CN1159208C CNB001194984A CN00119498A CN1159208C CN 1159208 C CN1159208 C CN 1159208C CN B001194984 A CNB001194984 A CN B001194984A CN 00119498 A CN00119498 A CN 00119498A CN 1159208 C CN1159208 C CN 1159208C
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Abstract
The present invention relates to a manufacturing method for integrating a micro mechanical structure of movable silicon on a monocrystal glass substrate. In the method, a silicon-glass electrostatic bonding technique is used for manufacturing a sensitive monocrystal silicon structure on a glass substrate, a movable structure corresponding to a pre-etching shallow pit at the bottom of the movable structure at one side of a bonding surface of a silicon chip is suspended, a deep reactive ion etching technique of monocrystal silicon is introduced for etching and molding a micro structure, and the monocrystal silicon can be used as a structural material to manufacture a plane-movable micro structure having a high depth ratio from surface micro mechanical dimensional thickness to body micro mechanical dimensional thickness; the present invention is suitable for manufacturing various plane-movable micro structures, such as accelerated sensors, gyroes, resonators, etc.
Description
Technical field
The present invention relates to microelectron-mechanical processing, the integrated manufacture method of movable silicon micro mechanical structure on particularly a kind of glass substrate.
Background technology
Since the 1980s, micromachining technology occurs and has obtained considerable progress, the mechanical component on many macroscopic scales, and as motor, gear, crank, springs etc. are achieved on tens microns miniature scale.Based on this, people organically combine micromechanics and microelectronic element, constitute to have the system of specific function, thereby have started this brand-new subject of microelectromechanical systems (MicroElectro Mechanical System is called for short MEMS).Than conventional system, it is little, in light weight that integrated micro-electron machinery system has a volume, and cost is low, compatible mutually with the large scale integrated circuit manufacture craft, be easy to remarkable advantages such as production in enormous quantities, in military affairs, communication, automotive electronics, fields such as biomedical engineering all have a wide range of applications.Micromachining technology can be divided into surface micromachined and body micromachined two big classes substantially.Surface micromachined is by deposit or growing film material on monocrystalline substrate, and as polysilicon, silicon nitride etc. carry out plane processing to these thin-film materials, pile up required micro-structural.The method that the unsettled general employing sacrifice layer corrosion of its movable structure discharges realizes.The body micromachined is directly carried out processing and fabricating to body material (normally monocrystalline silicon substrate) and is gone out accurate three-dimensional microstructures, more employing be the various corrosion technologies of body material.Deep reaction ion etching technology (Deep Reactive Ion Etching in recent years, abbreviation DRIE) obtained very big breakthrough, can realize in the short period of time that the degree of depth reaches the silicon etching of hundreds of microns grooves, obtain very high depth-to-width ratio and sidewall steepness, for the monocrystalline silicon body micromachined provides powerful technological means.Utilize micromachining technology, people have realized miniature acceleration sensor, little gyro, micro-resonator, the making of varied movable microstructure such as micro motor.
It is substrate that the making of plane movable microstructure can be adopted with monocrystalline silicon, the method of polysilicon surface micromachined is made, the unsettled employing sacrificial layer technology of movable microstructure is as the micro accelerometer ADXL50 of U.S. AD company (Analog Devices) development.But the polysilicon structure layer thickness of this kind manufacture method deposit is subjected to process technology limit generally to be no more than several microns, thereby sensor sensing electric capacity is very little, also there is certain parasitic capacitance between device and the monocrystalline substrate simultaneously, bring difficulty for the input of accelerometer, the stress of introducing in the device architecture material polysilicon deposition process also has influence on the device behavior to a certain extent.Thus people to begin to attempt with glass be substrate, the monocrystalline silicon body micromachined is made the compound movable microstructure of silicon-glass.The monocrystalline silicon body micromachined can increase considerably thickness of detector, is that substrate can be avoided the parasitic capacitance between device and substrate with glass simultaneously.With monocrystalline silicon is that the device architecture material does not exist polysilicon internal stress problem, and the unsettled of movable structure realized by pre-etching shallow hole before silicon-glass bonding, can avoid surface micromachined sacrifice layer release tech problem, the problem includes: " adhesion " problem of movable structure and substrate, movable silicon micro mechanism structure begins to be subjected to people's generally attention on the glass substrate thus.It is substrate that utilization (110) index crystal face silicon chip anisotropic wet corrosion such as international microelectromechanical systems proceeding of nineteen ninety-five (Proceedings of Micro Electro Mechanical Systems) report Japanese K.Ohwads obtain with glass in conjunction with silicon-glass electrostatic bonding technology, thickness is the monocrystalline silicon combed capacitance type acceleration sensor structure of 58 μ m, yet this pectination acceleration sensor structure realizes the unsettled of movable structure at corrosion shallow hole on glass, because glass is isotropic etch, corrosion area is difficult to accurate control, can only corrode the square shallow hole of large tracts of land, the fixing interdigital bottom of device is also unsettled, deflection also takes place in fixation fork under the acceleration effect, can bring error to acceleration analysis.Owing to adopt wet etching, device moulding post-etching liquid can creep into interdigital gap excessive erosion is caused in the hanging structure bottom in addition, and the corrosive liquid that infiltrates interdigital gap is cleaned certain degree of difficulty is also arranged.
Summary of the invention
The objective of the invention is to propose the integrated manufacture method of movable silicon micro mechanical structure on a kind of glass substrate in order thoroughly to solve the shortcoming in the above-mentioned technology.
Technical solution of the present invention is: the integrated manufacture method of movable silicon micro mechanical structure on a kind of glass substrate, it is characterized in that adopting in this method silicon-glass electrostatic bonding technology and monocrystalline silicon deep reaction ion etching technology, and will be produced on the silicon chip for realizing the unsettled shallow hole that movably needs.
The integrated manufacture method of movable silicon micro mechanical structure on the glass substrate particularly, is characterized in that it comprises the following steps:
1. silicon chip twin polishing;
2. under 1050 ℃, wet oxygen forms certain thickness silicon dioxide to the two-sided thermal oxidation of above-mentioned silicon chip;
3. silicon dioxide is carried out photoetching, the shallow hole figure of photoetching suspending movable structure correspondence;
4. be mask with silicon dioxide, erode away several microns to tens microns shallow hole with the moist corrosive agent of monocrystalline silicon anisotropy;
5. remove two-sided silicon dioxide, clean up;
6. with silicon chip shallow hole face and glass electrostatic bonding, little about 2-3 millimeter of the diameter of glass or side ratio silicon chip is with epoxy sealing silicon-glass bonded interface periphery;
7. use anisotropic etchant wet etching silicon chip, make the full wafer silicon chip be thinned to the device desired thickness equably, and guarantee the good evenness in silicon slice corrosion surface;
8. add heat abstraction epoxy resin with the concentrated sulfuric acid, clean up, at the thick aluminium of the about 0.2 μ m of the silicon face deposit of silicon-glass composite material;
9. aluminium lamination is made by lithography plane movable microstructure figure;
10. be mask with aluminium, deep reaction ion etching monocrystalline silicon is removed fully to place silicon, and movable structure is unsettled, the device moulding;
removes the aluminium mask, and the movable silicon micro mechanical structure completes on the glass substrate.
Above-mentioned the 2. 1050 ℃ of the wet oxygens in the step, the thick silicon dioxide of the about 0.1 μ m of two-sided thermal oxide growth, thermal oxidation condition herein can change, the temperature of oxidation can improve or reduce, the silicon dioxide thickness of growth also can increase or reduce, silicon dioxide is the mask that goes out the dark shallow hole of monocrystalline silicon 10 μ m as the KOH wet etching, though KOH is far smaller than corrosion rate to monocrystalline silicon to the corrosion rate of silicon dioxide, but still there is slight corrosion in KOH to silicon dioxide, as long as the thickness of growthing silica guarantees that making the silicon dioxide that finishes at shallow hole has not been corroded.
Above-mentioned the 4. with the 7. in the step, said corrosive agent can adopt potassium hydroxide (KOH), also can adopt other monocrystalline silicon anisotropic wet corrosive agent, as Tetramethylammonium hydroxide (TMAH), adjacent benzene diethylstilbestrol of ethylenediamine and water system (EPW system), the about 10 μ m of the shallow hole degree of depth get final product.
Preferably adopting 50% KOH, is to corrode under 60 ℃ the condition in temperature, can obtain smooth smooth corrosion surface like this, has corrosion rate faster simultaneously.
Said glass is preferably selected pyrex (Pyrex) #7740 glass for use, because the thermal coefficient of expansion of Pyrex#7740 glass is the most close with silicon, the size that glass radius ratio silicon chip is little is also not necessarily non-to be 2～3 millimeters, as long as guarantee to lose less the effective area of silicon chip under periphery is coated the prerequisite of epoxy resin as far as possible.
The integrated manufacture method of movable silicon micro mechanical structure on the glass substrate of the present invention, adopt silicon-glass electrostatic bonding technology, in conjunction with monocrystalline silicon deep reaction ion etching technology, can monocrystalline silicon be that structural material is produced the high-aspect-ratio plane movable microstructure from surface micro to body micromechanics yardstick any thickness, be applicable to acceleration transducer, gyro, the making of various planes such as resonator movable microstructure.The introducing of deep reaction ion etching technology can increase thickness of detector to hundreds of microns, obtain very smooth steep sidewall, corrode than anisotropic wet, the deep reaction ion etching technology is a dry etching, can not cause that corrosive liquid stains, need not after the device moulding to clean, the etching shape is not limited by or not the crystal orientation, can process the micro-structural of arbitrary shape.The present invention is by realizing the unsettled of movable structure at the corresponding movable structure zone pre-etching of wafer bonding face shallow hole, be used for promptly that the unsettled shallow hole of movable structure is opened at silicon chip but not on glass, can optionally accurately distinguish movable structure and fixed structure zone, when the realization movable structure is unsettled, guarantee the grappling of fixed structure.The present invention adopt the potassium hydroxide wet etching with wafer thinning to desired thickness, for preventing of the undercutting of potassium hydroxide wet etching to the wafer bonding face, select the sheet glass littler 2～3 millimeters during electrostatic bonding for use, with epoxy sealing silex glass bonded interface periphery than silicon chip radius.Preparation of Silicon Coating finishes, and epoxy resin can heat carbonization with the concentrated sulfuric acid and remove advantage of the present invention that Here it is.
The invention will be further described below in conjunction with most preferred embodiment and accompanying drawing thereof.
Description of drawings
Fig. 1 is the process chart of the integrated manufacture method most preferred embodiment of movable silicon micro mechanical structure on the glass substrate of the present invention.
Among the figure:
1-silicon chip 2-silicon dioxide
3-glass 4-epoxy resin
5-aluminium
Embodiment
Most preferred embodiment of the present invention comprises the following steps: as shown in the figure
(1) twin polishing silicon chip (as Fig. 1-1);
(2) two-sided wet oxygen thermal oxidation under 1050 ℃, is carried out wet oxidation, and two-sided oxidation generates the silicon dioxide (as Fig. 1-2) of about 0.1 μ m;
(3) the shallow hole figure of photoetching suspending movable structure (as Fig. 1-3);
(4) with silicon dioxide be mask, the dark about 10 μ m (as Fig. 1-4) of KOH wet etching shallow hole;
(5) remove two-sided silicon dioxide, clean up (as Fig. 1-5);
(6) with silicon chip shallow hole face and Pyrex#7740 glass electrostatic bonding, glass radius ratio silicon chip is little 2～3 millimeters, uses epoxy sealing at silicon-glass bonding face periphery (as Fig. 1-6)
(7) evenly be thinned to the device desired thickness with 60 ℃ of wet etching silicon chips of 50%KOH full wafer, guarantee the good evenness (as Fig. 1-7) in silicon slice corrosion surface;
(8) add heat abstraction epoxy resin with the concentrated sulfuric acid, clean up, at the aluminium (as Fig. 1-8) of the about 0.2 μ m thickness of silicon slice corrosion attenuate face deposit;
(9) aluminium lamination makes plane movable microstructure figure (as Fig. 1-9) by lithography;
(10) be mask with aluminium, deep reaction ion etching monocrystalline silicon is removed fully to place silicon, and movable structure is unsettled, device moulding (as Fig. 1-10);
(11) remove aluminium mask (as Fig. 1-11), the movable silicon micro mechanical structure completes on the glass substrate.
Claims (5)
1, the integrated manufacture method of movable silicon micro mechanical structure on a kind of glass substrate comprises the following steps:
1. silicon chip twin polishing;
2. under 1050 ℃, wet oxygen forms certain thickness silicon dioxide to the two-sided thermal oxidation of above-mentioned silicon chip;
3. silicon dioxide is carried out photoetching, the shallow hole figure of photoetching suspending movable structure;
4. be mask with silicon dioxide, erode away several microns to tens microns shallow hole with the moist corrosive agent of monocrystalline silicon anisotropy;
5. remove two-sided silicon dioxide, clean up;
6. with silicon chip shallow hole face and glass electrostatic bonding, the size of glass is than the little about 2-3 millimeter of size of silicon chip, with epoxy sealing silicon-glass bonded interface periphery;
7. use anisotropic etchant wet etching silicon chip, make the full wafer silicon chip be thinned to the device desired thickness equably, and guarantee the good evenness in silicon slice corrosion surface;
8. add heat abstraction epoxy resin with the concentrated sulfuric acid, clean up, at the thick aluminium of the about 0.2 μ m of silicon slice corrosion attenuate face coating by vaporization;
9. aluminium lamination makes plane movable structure figure by lithography;
10. be mask with aluminium, deep reaction ion etching monocrystalline silicon is removed fully to place silicon, and movable structure is unsettled, the device moulding;
(11) remove the aluminium mould that salts down, complete.
2, the integrated manufacture method of movable silicon micro mechanical structure on the glass substrate according to claim 1 is characterized in that the said the 2. about 0.1 μ m of thickness of silicon dioxide in the step.
3, the integrated manufacture method of movable silicon micro mechanical structure on the glass substrate according to claim 1, it is characterized in that said, 4. to go on foot employed anisotropic etchant be potassium hydroxide, erodes away the shallow hole of 10 μ m.
4, the integrated manufacture method of movable silicon micro mechanical structure on the glass substrate according to claim 1 is characterized in that 7. said the go on foot employed anisotropic etchant and adopt 50% KOH, carries out corrosion thinning when 60 ℃ of temperature.
5, the integrated manufacture method of movable silicon micro mechanical structure on the glass substrate according to claim 1 is characterized in that said glass is pyrex 7740 glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001194984A CN1159208C (en) | 2000-07-21 | 2000-07-21 | Manufacture of integrated minuature movable silicon mechanical-structure on glass substrate |
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| CNB001194984A CN1159208C (en) | 2000-07-21 | 2000-07-21 | Manufacture of integrated minuature movable silicon mechanical-structure on glass substrate |
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| CN1277142A CN1277142A (en) | 2000-12-20 |
| CN1159208C true CN1159208C (en) | 2004-07-28 |
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Families Citing this family (15)
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| JP2004219843A (en) | 2003-01-16 | 2004-08-05 | Seiko Epson Corp | Optical modulator, and display device and their manufacturing methods |
| CN1297470C (en) * | 2003-07-28 | 2007-01-31 | 华新丽华股份有限公司 | Structure formed utilizing micro-structure gap-controlling technology and forming method thereof |
| EP1661245A2 (en) * | 2003-08-20 | 2006-05-31 | Cornell Research Foundation, Inc. | Shell type actuator |
| CN100358094C (en) * | 2004-09-10 | 2007-12-26 | 北京工业大学 | Static bonding process with suspending movable sensitive structure |
| CN100449265C (en) * | 2005-02-28 | 2009-01-07 | 北京大学 | Horizontal axis micromechanical gyroscope and its preparation method |
| CN1325367C (en) * | 2005-09-16 | 2007-07-11 | 中国电子科技集团公司第二十四研究所 | Method for producing MEMS sensor suspension beam structure |
| CN102259825B (en) * | 2011-06-17 | 2015-04-08 | 清华大学 | Preparation method for micro-electro-mechanical system (MEMS) atomic vapor chamber and atomic vapor chamber |
| CN102285633B (en) * | 2011-07-04 | 2014-03-26 | 上海先进半导体制造股份有限公司 | Composite integrated sensor structure and manufacturing method thereof |
| CN102303845B (en) * | 2011-08-16 | 2014-02-19 | 上海交通大学 | Preparation method of drug-delivery type three-dimensional carbon microelectrode with microfluid channel |
| CN102879556A (en) * | 2012-09-25 | 2013-01-16 | 中国电子科技集团公司第四十九研究所 | Biochip with constant volume and preparation method thereof |
| CN103592061B (en) * | 2013-07-12 | 2015-04-22 | 西北工业大学 | High precision silicon micro resonant pressure transducer interface circuit |
| CN104197921B (en) * | 2014-08-08 | 2017-05-10 | 上海交通大学 | Pattern-transferred embossed miniature hemispherical resonant gyroscope and manufacturing method thereof |
| CN105329848A (en) * | 2015-09-29 | 2016-02-17 | 北京航天控制仪器研究所 | MEMS sandwich accelerometer sensitive chip wet etching processing method |
| CN109595156B (en) * | 2018-11-08 | 2020-06-26 | 北京化工大学 | Scroll micro-compressor with transparent glass substrate and related processing method thereof |
| CN111913245A (en) * | 2020-08-26 | 2020-11-10 | 上海华虹宏力半导体制造有限公司 | Method for forming grating device |
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