CN1825642A - 发光二极管及其制造方法 - Google Patents
发光二极管及其制造方法 Download PDFInfo
- Publication number
- CN1825642A CN1825642A CNA2006100011069A CN200610001106A CN1825642A CN 1825642 A CN1825642 A CN 1825642A CN A2006100011069 A CNA2006100011069 A CN A2006100011069A CN 200610001106 A CN200610001106 A CN 200610001106A CN 1825642 A CN1825642 A CN 1825642A
- Authority
- CN
- China
- Prior art keywords
- layer
- light
- conductivity type
- refractive index
- bragg reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 12
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims abstract description 41
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 22
- 239000006185 dispersion Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 6
- 238000001228 spectrum Methods 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005051657 | 2005-02-25 | ||
JP2005051657 | 2005-02-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1825642A true CN1825642A (zh) | 2006-08-30 |
CN100466310C CN100466310C (zh) | 2009-03-04 |
Family
ID=36848272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100011069A Expired - Fee Related CN100466310C (zh) | 2005-02-25 | 2006-01-11 | 发光二极管及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7683378B2 (zh) |
CN (1) | CN100466310C (zh) |
DE (1) | DE102006000094A1 (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102117771A (zh) * | 2009-12-31 | 2011-07-06 | 比亚迪股份有限公司 | 一种发光二极管外延片和管芯及其制作方法 |
CN102024896B (zh) * | 2009-12-31 | 2012-03-21 | 比亚迪股份有限公司 | 一种发光二极管外延片和其制造方法 |
CN103210507A (zh) * | 2010-11-15 | 2013-07-17 | 日本电气株式会社 | 光学器件 |
CN110854249A (zh) * | 2014-03-14 | 2020-02-28 | 晶元光电股份有限公司 | 发光元件 |
CN112447888A (zh) * | 2019-08-27 | 2021-03-05 | 株式会社东芝 | 光半导体元件 |
WO2023273374A1 (zh) * | 2021-06-30 | 2023-01-05 | 厦门士兰明镓化合物半导体有限公司 | Led外延结构和led芯片 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4850453B2 (ja) * | 2005-08-11 | 2012-01-11 | ローム株式会社 | 半導体発光装置の製造方法及び半導体発光装置 |
US8283683B2 (en) * | 2006-11-07 | 2012-10-09 | Opto Tech Corporation | Chip-bonding light emitting diode chip |
DE102006059612A1 (de) * | 2006-12-12 | 2008-06-19 | Forschungsverbund Berlin E.V. | Halbleiterbauelement und Verfahren zu dessen Herstellung |
US8680586B2 (en) * | 2007-01-05 | 2014-03-25 | Rohm Co., Ltd. | Semiconductor light emitting device including GaAs substrate and method for manufacturing the same |
KR101449005B1 (ko) * | 2007-11-26 | 2014-10-08 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
JP2010245312A (ja) * | 2009-04-07 | 2010-10-28 | Hitachi Cable Ltd | 発光素子 |
CN101872821A (zh) * | 2010-05-24 | 2010-10-27 | 厦门市三安光电科技有限公司 | 具有高光萃取效率的圆台状发光二极管及其制作方法 |
RU2553828C1 (ru) * | 2014-03-05 | 2015-06-20 | Федеральное государственное бюджетное учреждение науки Институт физики полупроводников им. А.В. Ржанова Сибирского отделения Российской академии наук (ИФП СО РАН) | Светодиод и способ его изготовления |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2344458B (en) | 1998-12-02 | 2000-12-27 | Arima Optoelectronics Corp | Light-emitting diodes |
JP2000173332A (ja) * | 1998-12-04 | 2000-06-23 | Stanley Electric Co Ltd | 車両用前照灯 |
JP2002083999A (ja) | 2000-06-21 | 2002-03-22 | Sharp Corp | 半導体発光素子 |
US7180100B2 (en) * | 2001-03-27 | 2007-02-20 | Ricoh Company, Ltd. | Semiconductor light-emitting device, surface-emission laser diode, and production apparatus thereof, production method, optical module and optical telecommunication system |
TW480752B (en) * | 2001-04-09 | 2002-03-21 | United Epitaxy Co Ltd | Structure and manufacturing method for light emitting diode |
JP2003218386A (ja) * | 2002-01-22 | 2003-07-31 | Hitachi Cable Ltd | 発光ダイオード |
-
2006
- 2006-01-11 CN CNB2006100011069A patent/CN100466310C/zh not_active Expired - Fee Related
- 2006-02-23 US US11/359,528 patent/US7683378B2/en not_active Expired - Fee Related
- 2006-02-24 DE DE102006000094A patent/DE102006000094A1/de not_active Withdrawn
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102117771A (zh) * | 2009-12-31 | 2011-07-06 | 比亚迪股份有限公司 | 一种发光二极管外延片和管芯及其制作方法 |
CN102024896B (zh) * | 2009-12-31 | 2012-03-21 | 比亚迪股份有限公司 | 一种发光二极管外延片和其制造方法 |
CN102117771B (zh) * | 2009-12-31 | 2013-05-08 | 比亚迪股份有限公司 | 一种发光二极管外延片和管芯及其制作方法 |
US9093596B2 (en) | 2009-12-31 | 2015-07-28 | Byd Company Limited | Epitaxial wafer for light emitting diode, light emitting diode chip and methods for manufacturing the same |
CN103210507A (zh) * | 2010-11-15 | 2013-07-17 | 日本电气株式会社 | 光学器件 |
CN103210507B (zh) * | 2010-11-15 | 2015-11-25 | 日本电气株式会社 | 光学器件 |
CN110854249A (zh) * | 2014-03-14 | 2020-02-28 | 晶元光电股份有限公司 | 发光元件 |
CN112447888A (zh) * | 2019-08-27 | 2021-03-05 | 株式会社东芝 | 光半导体元件 |
WO2023273374A1 (zh) * | 2021-06-30 | 2023-01-05 | 厦门士兰明镓化合物半导体有限公司 | Led外延结构和led芯片 |
Also Published As
Publication number | Publication date |
---|---|
US20060192211A1 (en) | 2006-08-31 |
US7683378B2 (en) | 2010-03-23 |
DE102006000094A1 (de) | 2006-09-07 |
CN100466310C (zh) | 2009-03-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI METALS, LTD. Free format text: FORMER OWNER: HITACHI CABLE CO., LTD. Effective date: 20141219 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20141219 Address after: Tokyo, Japan, Japan Patentee after: Hitachi Metals Co., Ltd. Address before: Tokyo, Japan, Japan Patentee before: Hitachi Cable Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: SCIOCS COMPANY LIMITED Free format text: FORMER OWNER: HITACHI METALS, LTD. Effective date: 20150812 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150812 Address after: Ibaraki Patentee after: Hitachi Cable Address before: Tokyo, Japan, Japan Patentee before: Hitachi Metals Co., Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160311 Address after: Tokyo, Japan, Japan Patentee after: Sumitomo Chemical Co., Ltd. Address before: Ibaraki Patentee before: Hitachi Cable |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090304 Termination date: 20180111 |