CN1825609A

CN1825609A - Solid-state imager device, drive method of solid-state imager device and camera apparatus

Info

Publication number: CN1825609A
Application number: CNA2006100080035A
Authority: CN
Inventors: 马渊圭司; 唐泽信浩
Original assignee: Sony Corp
Current assignee: Sony Corp
Priority date: 2005-02-21
Filing date: 2006-02-21
Publication date: 2006-08-30
Anticipated expiration: 2026-02-21
Also published as: JP2012212911A; CN100442530C; JP5459357B2

Abstract

Solid-state imager device, drive method thereof, and camera apparatus. In a case when a structure of forming a p+ layer on a substrate rear surface side is employed in order to prevent dark current generation from the silicon boundary surface, various problems occur. According to this invention, an insulation film 39 is provided on a rear surface on a silicon substrate 31 and a transparent electrode 40 is further provided thereon, and by applying a negative voltage with respect to the potential of the silicon substrate 31 from a voltage supply source 41 to the insulation film 39 through the transparent electrode 40 , positive holes are accumulated on a silicon boundary surface of the substrate rear surface side and a structure equivalent to a state in which a positive hole accumulation layer exists on aforesaid silicon boundary surface is to be created. Thus, various problems in the related art can be avoided.

Description

Solid imaging element and driving method thereof and photographic means

Technical field

The present invention relates to the driving method of solid imaging element and solid imaging element, more particularly, the back side (forming the opposition side of side from circuit) that relates to from substrate receives the rear surface incident type solid imaging element of incident ray, the driving method and the photographic means thereof of this solid imaging element.

Background technology

In solid imaging element, for example, in the X-Y address type solid imaging element that with the cmos image sensor is representative, the dot structure of rear surface light-receiving type is used to the miniaturization and the high-NA ratio of pixel and realizes, wherein wiring layer is formed on the surface (front surface) of Semiconductor substrate, incident ray is received (for example, referring to patent documentation 1 or 2) from surface (rear surface) side of an opposite side with wiring layer.

Has as shown in Figure 1 structure according to the dot structure of the prior art of in patent documentation 1, describing, multilayer wired 106 the wiring layer 103 that wherein is furnished with by the interlayer insulation film is formed on a surface (also abbreviating " substrate front surface " hereinafter as) side of silicon layer (substrate) 101, photodiode 102 is formed on this silicon layer 101, and visible light will be received from another surface of silicon layer 101 sides, more particularly, the surface from an opposite side with wiring layer 103 sides (also abbreviating " substrate rear surface " hereinafter as) is received.Around photodiode 102, be formed with the p type well region 107 that reaches the substrate rear surface.

In the incident type cmos image sensor of rear surface, p+ layer 104 is formed on the side of substrate rear surface, to prevent to generate the dark current from the silicon border surface.There are two class methods to can be used as the method for making p+ layer 104.

First method is such method, and the wiring layer 103 that wherein comprises transistor and distribution is formed on substrate front surface side, and this substrate is reversed then, substrate rear surface side is polished etc. handle after, such as silica (SiO ₂) electronics of film and so on injects trapping layer 105 and be formed, inject by ion then to form p+ layer 104.

Second method is such method, wherein in the transistorized process on making substrate front surface side, inject by energetic ion from substrate front surface side, p+ floor 104 is formed in the dark district of substrate, distribution 106 is made to form wiring layer 103 subsequently, this substrate is reversed then, processing such as polishes, and is formed on the side of substrate back up to the position of p+ layer 104 and optical receiving surface.

Dot structure according to the prior art of describing in patent documentation 2 has structure shown in Figure 2, multilayer wired 207 the wiring layer 203 that wherein is furnished with by the interlayer insulation film is formed on a surface (front surface) side of silicon part (high resistant substrate) 201, photodiode 202 is formed on this silicon part 201, and in the rear surface incident type cmos image sensor of reception from the light of another surface (rear surface) side, photodiode 202 and p type well region 204 on every side thereof are arranged as the layer structure that does not reach the substrate rear surface, simultaneously, injecting the transparency electrode 206 that stops film 205 to be formed on the substrate rear surface by electronics is applied in negative voltage.

[patent documentation 1] early stage publication is announced No.2003-031785

[patent documentation 2] early stage publication is announced No.2003-338615

In the prior art of in above-mentioned patent documentation 1, describing, p+ layer 104 is formed on the side of substrate rear surface, to prevent dark current generation from the silicon border surface, therefore, even even be used to form in the situation of aforementioned p+ layer 104 or in the situation that aforementioned second method is employed, also there is below problem with explanation in aforementioned first method.

(in the situation of using first method)

Unless the p+ layer 104 that ion is injected applies the heat treatment that is used to activate, otherwise dark current reduces effect can not be maximized, carry out in the process that but ion is infused in distribution after forming, so, therefore can not use if utilize common diffusion furnace to wait to carry out heat treatment then distribution can be melted.

Therefore, be not used under the heat treated situation of activation, perhaps only the shallow zone on the side of substrate rear surface carried out under the heat treated situation, tolerate a large amount of dark current by laser annealing etc.Yet the device that is used for laser annealing is relatively more expensive, and it wants the sequential scanning wafer, so compare its output with diffusion furnace that can the many wafers of single treatment lower, in addition, uneven scan line occurred not sometimes in the picture of imaging.

(in the situation of using second method)

Ion is carried out before being infused in wiring layer 103, so can carry out the heat treatment that is used to activate, carries out in dark zone but ion injects by high-energy, so the distribution of p+ layer 104 has been expanded.When the distributed expansion of p+ layer 104, in the shallow zone on the side of substrate rear surface, for the blue light opto-electronic conversion, catch photoelectronic probability and reduced, more particularly, blue sensitivity has reduced.

This blue sensitivity reduces halation (vignetting) effect of desensitization not of having overthrown distribution 106, and this effect is rear surface light-receiving type pixel result's a feature.On the other hand, arrive the luminous sensitivity of redness in dark zone directly that increase with the halation distribution 106 that disappears owing to rear surface incident as many.With the raising of red coloration sensitivity, it is relatively poor relatively that blue sensitivity becomes, so spectrum diffraction imbalance.

On the other hand, in the prior art of in patent documentation 2, describing, wherein the negative voltage structure that is applied to transparency electrode 206 and produces the electric field on the depth direction in substrate is employed, so that in the situation when even the p type well area 204 layer structure that do not reach the substrate rear surface is employed therein, the photoelectron that enters from the substrate rear surface also suitably is induced to photodiode 203, and does not consider to reduce the dark current from the silicon border surface of substrate rear surface side.

Summary of the invention

Consider that the problems referred to above have invented the present invention, and the present invention concentrates on solid imaging element, is used for the driving method and the photographic means of this solid imaging element, wherein do not carry out ion is injected into substrate rear surface side, concentrate density or apply heat treatment with activation situation under, can reduce the dark current that produces from the border surface of substrate rear surface side.

Solid imaging element of the present invention makes the latent structure in the solid imaging element be: have wiring layer on first surface (substrate front surface) side of Semiconductor substrate, the pixel that comprises photo-electric conversion element is formed on the first surface side, and oneself receives incident light as second surface (substrate rear surface) side joint of the opposition side of this wiring layer this solid imaging element, wherein have the insulation film on the second surface of the Semiconductor substrate of being formed on, and the voltage bringing device that is used for the voltage opposite with the polarities of potentials of Semiconductor substrate is applied to this insulation film.

According to solid imaging element of the present invention and photographic means, when the voltage opposite with the polarities of potentials of Semiconductor substrate (is negative voltage when Semiconductor substrate is the n type, when for the p type is positive voltage) when being applied to the insulation film rear surface incident type (it receives light from the substrate rear surface side joint) solid imaging element, when for example Semiconductor substrate is the n type, go up accumulation hole (accumulation electronics when it is the p type) at the semiconductor border surface (and the border surface between the insulation film) of substrate rear surface, this becomes and the state equivalent that wherein has hole accumulation layer (perhaps electronics accumulation layer) on the border surface of substrate rear surface side.Then, because wherein hole (perhaps electronics) reduced the electronics (perhaps hole) that produces from the border surface of substrate rear surface side, and described electronics or hole is the main cause that produces dark current by the effect of the part of being accumulated.

Has such feature according to solid imaging element of the present invention and photographic means, wherein, the pixel that comprises photo-electric conversion element is formed on the Semiconductor substrate, insulating barrier is formed on the rear surface side of Semiconductor substrate, incident light is received from the rear surface side of Semiconductor substrate, the rear surface electrode is formed in the pixel array portion by insulation film, and provide the leakage current inhibition zone in the pad (pad) of rear surface electrode part below, be used to suppress the leakage current between pad portion and the Semiconductor substrate.

In solid imaging element of the present invention and photographic means, by as mentioned above the voltage opposite with the polarities of potentials of Semiconductor substrate being applied to the rear surface electrode, thereby reduced the dark current that produces from the border surface of substrate rear surface side.In addition, the leakage current inhibition zone can be provided below pad portion, even make repeatedly contact pad part of probe, can prevent that also the insulation film under the electrode of rear surface from damaging, even perhaps this insulation film is damaged, also can suppress the leakage current between pad portion and the Semiconductor substrate.

According to solid imaging element of the present invention and photographic means, by on the rear surface of Semiconductor substrate, forming insulation film and the voltage opposite with the polarities of potentials of Semiconductor substrate being applied to this insulation film, can make the structure of equal value with hole accumulation layer (or electronics accumulation layer) is arranged on the border surface of substrate rear surface side, thereby make do not carry out ion is injected into substrate rear surface side or do not apply heat treatment with activation situation under, can reduce the dark current that produces from the border surface of substrate rear surface side.

According to solid imaging element of the present invention and photographic means, can reduce from the dark current of the border surface generation of aforesaid substrate rear surface side, in addition, can also utilize the leakage current that suppresses between this pad portion and the Semiconductor substrate in the leakage current inhibition zone below the pad portion to produce, the feasible thinner thickness that can make the insulation film under the electrode of rear surface.

Description of drawings

Fig. 1 shows the sectional view of an example of the pixel in the rear surface incident type solid imaging element in the past;

Fig. 2 shows the sectional view of another example of the pixel in the rear surface incident type solid imaging element in the past;

Fig. 3 shows the block diagram of the structure of the whole C mos image sensor that the present invention is applied to;

Fig. 4 shows the circuit diagram of an example of the circuit structure of a pixel;

Fig. 5 shows the sectional view of the solid imaging element of the present invention's first exemplary embodiment, and this figure has specifically illustrated the major part of dot structure of the rear surface light-receiving type of this device;

Fig. 6 shows the sectional view of the solid imaging element of the present invention's the 3rd exemplary embodiment, and this figure has specifically illustrated the major part of dot structure of the rear surface light-receiving type of this device;

Fig. 7 shows the enlarged drawing of major part of the expectation embodiment of p type well region;

Fig. 8 shows the sectional view of major part of the solid imaging element of the present invention's the 4th exemplary embodiment;

Fig. 9 shows from the plan view of an example that how to derive the pad portion the solid imaging element of the present invention of substrate rear surface side observation;

Figure 10 shows from the plan view of another example of how to take out the pad portion the solid imaging element of the present invention of substrate rear surface side observation;

Figure 11 shows the sectional view of major part of the solid imaging element of the present invention's the 5th exemplary embodiment;

Figure 12 shows in the present invention the sectional view of an example of the contact part in the rear surface electrode of the double-layer structure of using;

Figure 13 shows in the present invention the sectional view of another example of the contact part in the rear surface electrode of the double-layer structure of using;

Figure 14 shows the sectional view of major part of the solid imaging element of the present invention's the 6th exemplary embodiment;

Figure 15 shows the sectional view of major part of the solid imaging element of the present invention's the 7th exemplary embodiment;

Figure 16 shows the sectional view of major part of the solid imaging element of the present invention's the 8th exemplary embodiment; And

Figure 17 is the sectional view of the photographic means of exemplary embodiment of the present invention.

Embodiment

To be elucidated in more detail with reference to the drawing exemplary embodiment of the present invention hereinafter.

Fig. 3 shows for example block diagram of the structure of cmos image sensor of whole solid imaging element that the present invention is applied to.It should be noted that, here the example in being applied to the situation of cmos type solid imaging element makes an explanation by reference, but the present invention is not by this application example limits, but it can be applied to similarly the various aspects of X-Y address system solid imaging element, for example, MOS type solid imaging element etc.

As shown in Figure 3, use the relevant cmos image sensor of example 10 therewith and have such system construction: wherein have the pixel array portion 12 that constitutes by a plurality of pixels 11, this pixel array portion 12 comprises the photo-electric conversion element with row-Lie form (matrix form) two-dimensional arrangement, and has vertical drive circuit 13, column signal treatment circuit 14, horizontal drive circuit 15, horizontal signal lines 16, output circuit 17 and control circuit 18 in addition.

In this system construction, control circuit 18 receives the data of the mode of operation of indicating this cmos image sensor 10 etc. from the outside, also draw together the data of the information of this cmos image sensor 10 to outside output packet, simultaneously, produce the clock signal of the work reference that becomes vertical drive circuit 13, column signal treatment circuit 14 and horizontal drive circuit 15 etc. based on vertical synchronizing signal Vsync, horizontal-drive signal Hsync and master clock MCK, and control signal etc., then they are applied to vertical drive circuit 13, column signal treatment circuit 14, horizontal drive circuit 15 etc.

In pixel array portion 12, pixel 11 is by two-dimensional arrangement, simultaneously, the capable control line that is used for each pixel column is routed in illustrated horizontal direction (left and right directions) with respect to pixel arrangement, and the vertical signal line 19 that is used for each pixel column is routed in illustrated longitudinal direction (above-below direction).Vertical drive circuit 13 is made of shift register etc., its order and selectively line by line to each pixel 11 of pixel array portion 12 by line sweep, and provide essential control impuls for each pixel of selected row by aforementioned capable control line.

The signal of exporting from each pixel of selected row is provided for column signal treatment circuit 14 by vertical signal line 19.Column signal treatment circuit 14 is disposed in for example each pixel column place of pixel array portion 12, and when the signal that receives from pixel 11 outputs of the delegation of each pixel column, this signal is carried out following signal processing, for example be used to remove the CDS (correlated-double-sampling) of pixel 11 distinctive fixed pattern noises, signal amplification etc.

As shown in Figure 4, the input stage of column signal treatment circuit 14 has the load transistor 141 as constant-current source.Load transistor 141 is connected between vertical signal line 19 and the reference potential (for example), and the grid of load transistor 141 is connected to load distribution 25, and constitute source follower circuit by the pixel amplifier transistor 114 with selected row, the signal of exporting from the pixel of selected row is output to vertical signal line 19.

The output stage of column signal treatment circuit 14 has horizontal selector switch (not shown), this horizontal selector switch be connected horizontal signal lines 16 and between.Should be noted that also and can use such structure that wherein column signal treatment circuit 14 has A/D (analog/digital) translation function.

Horizontal drive circuit 15 is made of shift register etc., and it is exported horizontal sweep pulse φ H1 by order and comes each column signal treatment circuit 14 of selective sequential to φ Hn, and makes each column signal treatment circuit 14 that picture element signal is outputed to horizontal signal lines 16.

17 pairs of signals that provide from each column signal treatment circuit 14 in proper order by horizontal signal lines 16 of output circuit apply various signal processing, then with they output.For the processing of the concrete signal in the output circuit 17, there is the situation of for example only carrying out buffering, perhaps the situation of the fluctuation correction of the every row of execution, black level adjustment, signal amplification, color relevant treatment etc. before buffering.

Fig. 4 shows the circuit diagram of an example of the circuit structure of pixel 11.As shown in Figure 4, the pixel 11 relevant with this examples of circuits is constructed to such image element circuit, its for example except photo-electric conversion element (for example, photodiode 111) outside, also has four transistors: transmission transistor 112, reset transistor 113, amplifier transistor 114 and selection transistor 115.Here, for example the N-channel MOS transistor is used as transistor 112 to 115.

Photodiode 111 is optical charge (being electronics here) with received light opto-electronic conversion, and this optical charge has and the corresponding quantity of electric charge of light quantity.The negative electrode of photodiode 111 (n type zone) is connected with the grid of amplifier transistor 114 by transmission transistor 112.The node 116 that is electrically connected to the grid of this amplifier transistor 114 is known as FD (diffusion of floating) part.

Transmission transistor 112 is connected between the negative electrode and FD part 116 of photodiode 111, thereby become conducting state by on its grid, applying transmission pulse φ TRG, and the optical charge of photodiode 111 opto-electronic conversion is transferred to FD part 116 via transmission line 21.

For reset transistor 113, its drain electrode is connected to pixel power supply Vdd and source electrode is connected to FD part 116, and by on its grid, applying reset pulse φ RST via reset line 22, and before signal charge is transferred to FD part 116 from photodiode 111, the electric charge of FD part 116 is discarded into pixel power supply Vdd, thereby it becomes conducting state, and this is reset aforementioned FD part 116.

For amplifier transistor 114, its grid is connected to FD part 116 and its drain electrode is connected to pixel power supply Vdd, and the electromotive force of the FD part 116 after the transistor 113 that will be reset resets is exported as reset level, in addition, it is exported the electromotive force of FD part 116 after signal charge is transmitted transistor 112 and is transferred to as signal level.

For selecting transistor 115, for example its drain electrode source electrode and its source electrode of being connected to amplifier transistor 114 is connected to vertical signal line 19, and by on its grid, applying strobe pulse φ SEL via selection wire 23 thereby it becomes conducting state, it makes pixel 11 be in selection mode, and will be from the signal relay of amplifier transistor 114 output to vertical signal line 19.

For distribution in a lateral direction, that is, transmission line 21, reset line 22 and selection wire 23, they are public by the pixel with delegation, and by vertical drive circuit 13 controls.But the p trap distribution 24 that is used for fixing the p trap electromotive force of pixel 11 is fixed to earth potential.

Should be noted that wherein it is connected between the drain electrode of pixel power supply Vdd and amplifier transistor 114 for selecting transistor 115 also can use such circuit structure.

In addition, as for pixel 11, it is not limited to aforesaid four transistor configurations, but can use even three transistorized structures, and wherein amplifier transistor 114 and selection transistor 115 are by dual-purpose.

In the pixel 11 of previous constructions, the dot structure of rear surface light-receiving type (rear surface incident type) is used to attempt to make the pixel miniaturization and realize the high-NA ratio, so that wiring layer is formed on the first surface (substrate front surface) of Semiconductor substrate, and incident ray is injected from second surface (substrate rear surface) side on the opposition side of aforementioned wiring layer.The concrete structure of the dot structure of this rear surface light-receiving type is a feature of the present invention.In addition, except the dot structure of rear surface light-receiving type, the structure that is formed on the pad portion that is used for bonding of substrate rear surface side also is a feature of the present invention.To make an explanation to it at concrete example embodiment of the present invention below.

[first exemplary embodiment]

Fig. 5 shows the sectional view of the major part of rear surface incident type cmos image sensor, and this figure specifically illustrates the dot structure of the rear surface light-receiving type of the present invention's first exemplary embodiment.In the dot structure of the rear surface of this exemplary embodiment light-receiving type, first conduction type for example n type (n-) silicon substrate is used as Semiconductor substrate.

In Fig. 5, by using CMP (chemico-mechanical polishing) to wafer polishing, form silicon part (hereinafter being described as " silicon substrate ") 31 of predetermined thickness, and photodiode 33 (corresponding to the photodiode 111 of Fig. 4) is formed in the silicon substrate 31 by utilizing aforesaid substrate (n-type zone 32).For visible light, the thickness of silicon substrate 31 is preferably about 5 μ m to 10 μ m.According to the thickness setting, can successfully carry out opto-electronic conversion by 33 pairs of visible lights of photodiode.

Photodiode 33 has becomes the n-of photoelectric conversion regions type zone 32, and comprises the n type zone 34 of accumulation by the optical charge (being electronics in this example) of n-type zone 32 opto-electronic conversion, and in addition, it is to bury (buried) diode (HAD; Hole accumulation diode), it also has the P+ layer 35 of the charge carrier (being the hole in this example) on the silicon border surface that accumulates substrate front surface (first surface) side, and is formed the rear surface (second surface) that reaches silicon substrate 31 with the p N-type semiconductor N well area (hereinafter being called p type well area) 36 around it.

Front surface side at silicon substrate 31, be formed with the wiring layer of the various types of distributions that are furnished with pixel 11, particularly comprise aforementioned transmission line 21, reset line 22, selection wire 23, p trap distribution 24 etc., and more particularly, wiring layer 37 comprises by multilayer wired 45 of interlayer insulation film.In this wiring layer 37, from the gate electrode 38 of transmission transistor 112, the gate electrode of other transistor (not shown) will be formed.

As mentioned above, p type well area 36 is formed the rear surface that reaches silicon substrate 31, and is applied in reference potential via wiring layer 37 (particularly being p trap distribution 24) simultaneously, for example (GND) electromotive force.In Fig. 5, only show transmission transistor as MOS transistor.Transmission transistor is formed and makes the source electrode of photodiode 33 (particularly being n type zone 34) as it, and it comprises n type source-drain regions 46 that becomes the FD part and the gate electrode 38 that forms by grid insulating film.

Like this, periphery by forming photodiode 33 is to reach the substrate rear surface, and, the optical charge of opto-electronic conversion suitably can be induced near the n type zone 34 in the zone of substrate rear surface by surrounding photodiodes 33 with the p type well area 36 that is applied with reference potential.

On the rear surface of silicon substrate 31, be formed with insulation film 39.Insulation film 39 for example has one deck silicon oxide film (SiO ₂) structure.But insulation film 39 is not limited to one deck silicon oxide film structure, but can be for example even adopt the double-layer structure of silicon oxide film and silicon nitride film.By adopting this double-layer structure, can obtain because the anti-reflection effect that silicon nitride film caused can receive more incident lights, so have the advantage that can improve sensitivity.

Be formed with electrode on insulation film 39, be used for for example will being applied to insulation film 39 from the negative voltage (for example, about-3V) of voltage source 41, this electrode is known as the rear surface electrode.In illustrated example, be formed with the transparency electrode 40 that constitutes by ITO (oxide of indium and tin).This transparency electrode 40 and voltage source 41 constitute voltage bringing device, are used for the opposite polarity voltage of electromotive force (is positive potential in this example) (that is negative voltage) with silicon substrate 31 is applied to insulation film 39.

It should be noted that, in this example, transparency electrode 40 will be used as the electrode that is used for applying to insulation film 39 voltage, but always must on whole surface, all not use transparency electrode, has the electrode that incident light can be transferred to the structure in n-type zone 32 but allow to use, for example with the 32 corresponding zones, n-type zone of wherein carrying out opto-electronic conversion at least in have a hole configuration electrode, perhaps in aforementioned areas, have the electrode of a plurality of through holes, or the like.

As mentioned above, by insulation film 39 is provided on the rear surface of silicon substrate 31, and voltage that will be opposite with the polarities of potentials of silicon substrate 31 (for example simultaneously, voltage about-3V) be applied to aforementioned dielectric film 39, thereby the hole is accumulated on the silicon border surface of substrate rear surface side, state at this moment become with aforementioned silicon border surface on have the state equivalent of hole accumulation layer.This moment, silicon substrate 31 and transparency electrode 40 are by insulation film 39 electric insulations, so that do not form electric field substantially in unspent p type well area 36.Then, according to the effect of the cuniculate silicon border surface of accumulation, the electronics that the silicon border surface on the side of substrate rear surface produces (this is the main cause that produces dark current) will reduce.

The effect of the P+ layer 35 in the effect of accumulating cuniculate border surface part (hole accumulation layer) and the photodiode 33 that buries diode configuration is identical.The effect of P+ layer 35 is for example as described below.More specifically, the free charge that exists in the P+ layer 35 on the front surface of photodiode 33 only is the hole, and electronics becomes spent condition.As a result, the silicon border surface is filled with the hole, so the electronics (this is the main cause that produces dark current) that produces from the silicon border surface will significantly reduce.According to the effect of P+ layer 35, can realize having the photodiode of few dark current.Similarly, for substrate rear surface side, this fact is true.

Like this, according to first example embodiment, have the structure of this rear surface electrode by employing, can on the silicon border surface of substrate rear surface side, make the structure with hole accumulation layer equivalence, make and to reduce the dark current that produces from the border surface of substrate rear surface side.Particularly, of the prior art no longer essential with the process of activation such as being used for ion is injected into substrate rear surface side, is used for concentrating density or is used to apply heat treatment, thereby make production process very simple, and can make the blue sensitivity maximum, this be since the distribution of the hole accumulation layer that on the substrate depth direction, forms very shallow due to.

Now, the photoelectron that in the incident type of rear surface, importantly on the side of substrate rear surface, produces will be not can by with hole combination, arrive front surface up to it.Particularly, in the situation of this example, when the front surface at photodiode 33 did not produce electrical potential difference more than or equal to silicon band gap to the rear surface, there was restriction in the ability that is used to collect the electronics of front surface, so the hole of pulling out opto-electronic conversion fast and being produced becomes very important.

Therefore, expectation is not provided for the fixedly contact of the electromotive force of p type well area 36 at the place, periphery of pixel 11 only and at each pixel place or in a position of plurality of pixels by the wiring (particularly utilizing p trap distribution 24 (referring to Fig. 4)) of passing pixel 11.Like this, when the hole becomes too much in p type well area 36, can pull out them fast, thereby can improve sensitivity.

(manufacture method)

The back is used to explanation to produce the process of the cmos image sensor of rear surface light-receiving type (rear surface incident type) dot structure with above-mentioned structure.

(1) photodiode 33 and p type well area 36 form from the front surface side of silicon substrate 31, and the transistor of pixel 11 (transmission transistor 112, reset transistor 113, amplifier transistor 114 and selection transistor 115) is formed on the front surface side of silicon substrate 31 simultaneously, subsequently, form these transistorized gate electrodes and the wiring layer 37 that comprises all kinds distribution (transmission line 21, reset line 22, selection wire 23, p trap distribution 24 etc.).

(2) support substrates is bonded, and wafer is reversed and polishes then, makes the rear surface side be formed and has silicon substrate 31 thickness of about 5 μ m to 10 μ m.

(3) according to LPCVD (low-pressure chemical vapor deposition), adopt about 320 ℃ low temperature prescription to form the insulation film 39 of about 20nm to 40nm, particularly be TEOS film (this film is a silicon oxide film).

(4), form the ito thin film as transparency electrode 40 of about 50nm to 100nm according to sputtering method.

According to said process, dot structure that can production rear surface light-receiving type.After this, if necessary can be formed on the transparency electrode 40 another electrode that forms lens on chromatic filter or the sheet and be used for light shield.

But the manufacture method of the cmos image sensor of rear surface light-receiving type dot structure is not limited by aforementioned manufacture method.For example, when using SOI substrate (substrate), can adopt to be used to remove the method that be used to form rear surface side of the method for sull and substrate side silicon as aforementioned process (2) with silicon oxide film silicon structure.

Perhaps, if find wherein silicon quilt method of oxidation thinly in about 300 ℃ low temperature that distribution 45 can not be melted, then also can in aforementioned process (3), form described film by oxidation according to this method.In addition, in process (3), also can be used to reflect the double-layer structure that prevents by after adopting silicon oxide film, adopting silicon nitride film immediately, insulation film 39 being made as.

[second example embodiment]

In first example embodiment, suppose by use transparency electrode 40 and voltage source 41 will make an appointment with-voltage of 3V is applied to insulation film 39, but in second example embodiment, the material that use has work function (work function) difference forms transparency electrode on insulation film 39, it applies negative voltage to silica-based, and it is constructed to make the negative voltage of work function difference of this transparency electrode and the negative voltage of voltage source 41 to be used together, and is applied to insulation film 39.

It should be noted that, have transparency electrode that the material of the work function difference that applies negative voltage constitutes not always must with the situation of first example embodiment on whole surface, form transparency electrode similarly, but allow to have for example following structure: with the 32 corresponding zones, n-type zone of carrying out opto-electronic conversion at least in have the structure of a through hole, perhaps in the aforementioned areas that incident light can be transferred in the n-type zone 32, have the structure of a plurality of through holes.

Like this, by utilizing the work function difference of transparency electrode, and the negative voltage of work function difference is assumed to be the material that is applied to substantially in the 0V state by using wherein, the power values of power supply 41 can be reduced aforementioned negative value.

As an example, film thickness (being silicon oxide film in this example) by making insulation film 39 is more than or equal to 20nm, and the semiconductor of the conduction type that use is different with the type of silicon substrate 31 (for example, the p type polysilicon membrane of about 30nm) forms transparency electrode as the material that has the work function difference that applies negative voltage, can obtain the negative voltage of pact-0.5V voltage, so the negative value of power supply 41 can be reduced to-2.5V as the work function difference of aforementioned transparency electrode.

In addition, if insulation film 39, promptly the film thickness of silicon oxide film is made as the very thin film of approximate number nanometer, then can only utilize the voltage of pact-0.5V to accumulate the hole on the silicon border surface, so the negative value of power supply 41 can be reduced to 0V.This means and need not to use power supply 41.

Because polysilicon has reduced blue sensitivity, thus preferably polysilicon (transparency electrode) is made above-mentioned very thin film, so that make its influence minimum.

[the 3rd example embodiment]

Fig. 6 shows the sectional view of major part of the rear surface incident type cmos image sensor of the present invention's the 3rd example embodiment, particularly show the dot structure of the rear surface light-receiving type of the present invention's the 3rd example embodiment, wherein with Fig. 5 in the corresponding part of those parts use the label identical to mark with them.

In the dot structure of the rear surface of the 3rd example embodiment light-receiving type, identical with the situation of first and second example embodiment, adopt such structure, wherein insulation film 39 is provided on the rear surface of silicon substrate, and simultaneously apply opposite polarity voltage with the electromotive force of silicon substrate 31 to aforementioned insulation film 39, the voltage of for example about-3V, the hole is accumulated on the silicon border surface of substrate rear surface side.

Be with the difference of first and second example embodiment, be used as Semiconductor substrate near the high resistant substrate 42 of intrinsic semiconductor, and p well area 43 do not reach the substrate rear surface.In addition, different with the prior art shown in Fig. 1, insulation film 39 is the films that do not allow the hole to pass through, and electronics injection trapping layer 205 is the films that allow the hole to pass through.

Photodiode 33 constitutes by P+ layer 35, n type zone 34 with in its high resistant area 42 than lower part.In having the rear surface light-receiving type dot structure of this structure, when the thinner thickness of high resistant substrate 42, depletion layer is from n type zone 34 expansions of photodiode 33 surface later, and making can be with most of electron collection to nearest photodiode.Perhaps, when the standard of blend color is loose, can make the thickness of high resistant substrate 42 thicker.

Insulation film 39 is provided on the rear surface of silicon substrate 31, thereby by identical in the situation that will be applied to aforementioned dielectric film 39 accumulates the hole on the silicon border surface of substrate rear surface side action effect and first and second example embodiment with respect to the negative voltage of the electromotive force of silicon substrate 31.

Next, the intended shape of the p well area 43 in the rear surface light-receiving type dot structure of the 3rd example embodiment will be explained.

As p well area 43 ' expectation embodiment, the opening of substrate rear surface side is made greatlyyer than the opening of substrate front surface side, as shown in Figure 7.Like this, by make p well area 43 in the dot structure (wherein p well area 43 ' do not reach substrate rear surface) ' substrate rear surface side on opening bigger, the advantage that exists the photoelectron by high resistant substrate 42 opto-electronic conversion in n type zone 34, to be collected easily.

For the p well area 43 with this shape ' production method, thereby for example by utilizing repeatedly ion to inject respectively iontophoretic injection when different depth forms, can use such formation method, this method adopts another kind of process, and the ion that wherein uses another kind of mask to carry out than the deep branch injects.

[the 4th example embodiment]

Fig. 8 shows the sectional view of major part of the rear surface incident type cmos image sensor of the present invention's the 4th example embodiment, more particularly, shows pixel array portion, peripheral circuit part and is used for the pad portion of bonding.As shown in Figure 8, the Semiconductor substrate that the CMOS type imageing sensor 50 of this example embodiment is formed on first conduction type (for example, n type silicon substrate 54) in the pixel array portion 51, pel array 51 is the two-dimensional arrangement according to a plurality of (many) pixels 60 of matrix form, and each pixel 60 (corresponding to the pixel among Fig. 3 11) is by constituting as the photodiode 55 (corresponding to the photodiode among Fig. 4 111) of photo-electric conversion element and a plurality of MOS transistor that provide in p type well area 56.MOS transistor is formed on the front surface side of silicon substrate 54, and in Fig. 8, only transmission transistor 57 (corresponding to the transmission transistor among Fig. 4 112) is illustrated as MOS transistor.Is that FD partly and by grid insulating film forms gate electrode 59 by using photodiode 55 as source electrode, n type source-drain regions 58, thereby forms transmission transistor 57.

In addition, in the peripheral circuit 52 of silicon substrate 54, be formed with the CMOS transistor.More specifically, by n type source-

drain regions

61 and 62 and be formed in the p type well area 56 by the n channel MOS transistor Trn that the gate electrode 63 that grid insulating film forms constitutes, and by p type source-

drain regions

66 and 67 and be formed in the n type well area 65 in the p type well area 56 by the p channel MOS transistor Trp that the gate electrode 68 that grid insulating film forms constitutes.

Be formed on the front surface side of silicon substrate 54 by multilayer wired 72 formed wiring layers 73 of interlayer insulation film 71, wherein in silicon substrate 54, be formed with the pixel 60 that comprises photodiode 55.

On the other hand, transparency electrode (for example, ito thin film: the oxide of indium and tin) 76 be formed on greatly on whole surface by insulation film 75, and form pad portion 53 in the rear surface of silicon substrate 54 side upper edge from pixel array portion 51 to peripheral circuit part 52.At the metallic film of locating on the transparency electrode 76 to be formed with except that the part corresponding to photodiode 55 as light shielding film (light shield electrode), for example the AlSi film 77.The rear surface electrode 78 of double-layer structure forms by transparency electrode 76 with as the AlSi film 77 of light shielding film.In addition, the passivation film 79 that is used to protect is formed on the surface of rear surface.On the periphery of the rear surface of silicon substrate 54 side, passivation film 79 is partly removed selectively, thereby forms pad portion (so-called bonding welding pad part) 53, and AlSi film 77 comes out from the opening 80 of passivation film 79 in pad portion 53.As mentioned above, when the signal charge of photodiode 55 was electronics, pad portion 53 was applied in essential negative voltage.

When the signal charge of photodiode is electronics, the purpose of rear surface electrode 78 is by the rear surface electrode that negative voltage is applied to pixel array portion 51 and need not the part of light shield, thereby induces charge carrier (hole) to produce dark current on the border surface that is suppressed at the substrate rear surface.Transparency electrode 76 is present on the whole surface of pixel array portion, and metallic film 77 is formed grill-shaped, so that only photo-electric conversion element (photodiode) 55 parts are formed with opening.The light shield part and the peripheral circuit thereof of pixel portion are covered by the rear surface electrode that comprises metallic film, can not enter thereby be configured to light.

Pad portion 53 is the parts that are used to obtain with on every side physical interface, and when checking, with the probe contact pad part 53 of testing fixture, applying voltage, and when mounted this pad portion is carried out the lead-in wire bonding.

Silicon substrate 54 is by for example polished to form necessary thickness according to CMP (chemico-mechanical polishing).For visible light, the thickness of silicon substrate 54 is preferably about 5 μ m to 10 μ m.By this thickness is set, photodiode 55 is the opto-electronic conversion visible light successfully.

Photodiode 55 is to bury diode (HAD; Hole accumulation diode), wherein the low-density n-zone that is formed by silicon substrate 54 is a photoelectric conversion regions, and it comprises the highdensity n zone of the optical charge (being electronics in this example) that is used to accumulate opto-electronic conversion, and comprises the p+ zone (so-called p+ accumulation layer) that is used for accumulating charge carrier (being the hole in this example) on the silicon border surface of substrate front surface side.

P type well area 56 is applied in reference potential via distribution 72 (particularly being p trap distribution 24, referring to Fig. 4), for example (GND) electromotive force.The reset transistor 113 of pixel 60, amplifier transistor 114 and selection transistor 115 (referring to Fig. 4) are formed on the p type well area 56.

Insulation film 75 on the substrate rear surface for example has one deck silicon oxide film (SiO ₂) structure.But insulation film 75 is not limited to one deck silicon oxide film structure, but can be to have the sandwich construction that is made of for example silicon oxide film and silicon nitride film.When employing has the structure of multilayer, thereby the thickness by every layer of suitable selection can obtain the anti-reflection effect that caused by silicon nitride film, and can receive more incident light, so can improve sensitivity.

Can be set to for example about 3V by pad portion 53 via the negative voltage that AlSi and transparency electrode 76 are applied to light shielding film 77.

As mentioned above, by insulation film 75 is provided on the rear surface of silicon substrate 54, and simultaneously will with the voltage of the signal charge identical polar of photodiode 45 (for example, the negative voltage of pact-3V) is applied on the insulation film 75, thereby the hole is induced on the silicon border surface of substrate rear surface side, and it becomes and the state equivalent that has hole accumulation layer (so-called p+ accumulation layer) on the silicon border surface.At this moment, silicon substrate 54 and transparency electrode 76 are by insulation film 75 insulation, so that do not form electric field substantially in unspent p type well area 56.Then, as mentioned above, according to the effect of the cuniculate silicon border surface of accumulation, the electronics that the silicon border surface on the side of substrate rear surface produces (this is the main cause that dark current produces) will reduce.

Owing to adopted the rear surface incident type, be formed on the front surface of silicon substrate 54 so comprise the circuit of the major part of pixel array portion 51.The rear surface electrode 78 of the double-layer structure that constitutes by transparency electrode 76 with as the AlSi film 77 of light shielding film is formed on the side of rear surface, and Fig. 9 shows its profile plane graph.It is constructed to light and passes and the corresponding part of the photodiode of pixel via the opening 77a as the AlSi film 77 of light shielding film in the rear surface electrode 78 at least, thereby and other parts be capped with the time conductively-closed.But, when under situations such as for example dark, detecting level, in the light shield pixel, do not form the opening of AlSi film 77.By hollowing out the passivation film 79 on the AlSi film 77, thereby form the above-mentioned pad portion 53 that is used for voltage is applied to AlSi film 77.In the example of Fig. 9, the pad portion of the distribution 72 on the front side is formed on the front side.For forming pad portion, as shown in figure 10, can on the side of rear surface, form the pad portion 53 of rear surface electrode 78, on the front side, form the pad portion 89 of distribution simultaneously, export to the rear surface side to pass silicon substrate 54.

Like this,, the structure of the hole accumulation layer equivalence on the silicon border surface with substrate rear surface side can be made, thereby the dark current that produces from the border surface of substrate rear surface side can be reduced for the rear surface incident type cmos image sensor 50 among Fig. 8.Particularly, of the prior art no longer essential with the process of activation such as being used for ion is injected into substrate rear surface side, is used for concentrating density or is used to apply heat treatment, thereby make production process very simple, and can make the blue sensitivity maximum, this be since the distribution of the hole accumulation layer that on the substrate depth direction, forms very shallow due to.

The rear surface incident type cmos image sensor 50 of above-mentioned the 4th example embodiment is a grown form, but the probe contact pad part 53 at testing fixture comes it is checked, when the bonding that perhaps goes between is performed, must stop that the leakage current that caused by following situation produces, described situation is that insulation film 75 is damaged rear surface, back electrode (transparency electrode 76 and as the AlSi film 77 of light shielding film) and silicon substrate 54 by short circuit.

Rear surface electrode 78 only applies voltage, and hypothesis stationary state (steady-states) electric current is mobile, but when worrying flow of leakage current, is necessary to stop definitely leakage current.When flow of leakage current, cause following inconvenience: underlayer voltage may become unstable, though perhaps also consumption of electric power in holding state, thus make output reduce.

The generation reason of leakage current is: because the thickness of the insulation film 75 on the substrate rear surface is more than or equal to about 100nm, the probe that will be used to check is contact pad part 53 or depend on how to carry out bonding repeatedly, insulation film 75 may be damaged, after this, rear surface electrode 78 and silicon substrate 54 electrical shorts.But if insulation film 75 is made thicklyer, the voltage that then is applied to rear surface electrode 78 must increase.

Next such example embodiment is shown, and wherein the problems referred to above improve, thereby and are the leakage current that low level can suppress the welding disk office by the voltage limit that will be applied to rear surface electrode 78.

Figure 11 shows the sectional view of the major part (with the similar portions of the 4th example embodiment) in the rear surface incident type cmos image sensor of the 5th example embodiment that relates to aforementioned improvement.Should be noted that in Figure 11, represent with identical label, and omit its repetition of explanation with the corresponding part among Fig. 8.The Semiconductor substrate that the cmos image sensor 81 of this example embodiment is formed on first conduction type similar to the abovely (for example, n type silicon substrate 54) in the pixel array portion 51, pel array 51 is the two-dimensional arrangement according to a plurality of (many) pixels 60 of matrix form, each pixel 60 is by constituting as the photodiode 55 of photo-electric conversion element and a plurality of MOS transistor on the substrate surface side, multilayer wired layer 73 is formed on the substrate front surface, and (for example comprise by transparency electrode, ito thin film) 76 and the rear surface electrode 78 of the double-layer structure that constitutes as the metallic film (for example, the AlSi film 77) of light shielding film be formed on the substrate rear surface by insulation film 75.

Then, in this example embodiment, particularly, transparency electrode 76 is by forming in the zone that is limited in pixel array portion 51, interlayer insulation film 91 is formed on the whole surface of substrate rear surface side on the top that comprises transparency electrode 76, is formed on the interlayer insulation film 91 as the AlSi film 77 of light shielding film.AlSi film 77 with grill-shaped be formed on except with photodiode 55 corresponding extra-regional pixel array portion 51 in.Then, in pixel array portion 51, AlSi film 77 and transparency electrode 76 are electrically connected by the contact part 92 that a plurality of parts place at interlayer insulation film 91 provides, and described part preferably interleaves four parts of each opening of AlSi film.In addition, the pixel array portion 51 and the peripheral circuit part 52 of substrate rear surface comprised, simultaneously, passivation film 79 is formed on the whole surface except that pad portion 53.Can form interlayer insulation film 91 with for example silicon oxide film, silicon nitride film etc. here.Just the interlayer insulation film 91 below pad portion 53 becomes the leakage current inhibition zone.Preferably make the thickness t1 of insulation film 75 thin as far as possible,, and for example can make it more than or equal to 60nm if the electrical isolation capabilities between silicon substrate 54 and the transparency electrode 76 can be kept.In addition, making the thickness t2 of the interlayer insulation film 91 under pad portion 53 just is that the thickness of such degree is just enough: even wherein check probe contact pad part 53, also can avoid the insulation fracture of silicon substrate 54, and will can not produce leakage current.For example, the total thickness that can make in pad portion 53 54 insulation film 75 and interlayer insulation film 91 from AlSi film 77 to silicon substrate is for example more than or equal to 100nm, and is preferably about 150nm to 800nm.Wherein the side that t3 is thicker is determined in such scope, and wherein its production process ratio is easier to, and focuses on easily by the light of its oblique incidence.For example, can make t3 is hundreds of nanometers.Structure outside above-mentioned and the structure of Fig. 8 are similar.

Next, the manufacture method of the cmos image sensor 81 of the 5th example embodiment among Figure 11 will be explained.To the processing of in process of production a plurality of parts of each

film

75,76,77,91 on the substrate rear surface of this example embodiment and 79 being carried out be shown here.

At first, employing CVD method or low-temperature oxidation method form the insulation film 75 of rear surface side, for example silicon oxide film (SiO on the whole surface of the rear surface of silicon substrate 54 ₂).

Then, adopt sputtering method on the whole surface of insulation film 75, to form transparency electrode 76, for example ito thin film.

Then, adopt wet etching to remove transparency electrode 76 selectively, and only on pixel array portion 51, keep transparency electrode 76.

Then, carry out annealing so that regulate the characteristic of transparency electrode 76.

Then, on whole surface, form interlayer insulation film 91.For example, form interlayer insulation film 91 by the CVD oxide-film that uses organosilan (TEOS) to adopt the low pressure chemical vapor deposition method to form.

Then, in the interlayer insulation film 91 of pixel array portion 51, form contact holes.

Then, the contact part that is formed by electric conducting material is embedded in the contact holes.

Then, the employing sputtering method forms the metallic film as light shielding film on whole surface, and for example the AlSi film 77.

Then, by selectively AlSi film 77 being carried out etching, thereby with pixel array portion 51 in photodiode 55 corresponding parts form openings.

Then, on whole surface, form passivation film 79, for example silicon nitride film (SiN).

Then, by selectively passivation film 79 being carried out etching, thereby forming opening 79a so that AlSi film 77 exposes, thereby forming pad portion 53 with pad portion 53 corresponding part places.

Embed for the contact, as shown in figure 12, for example can use such method, wherein common tungsten (W) layer 94 is embedded among the contact holes 91a of interlayer insulation film 91.In this case, preferably insert Ti/TiN film 95, be used to reduce absorption (adhesion) and contact resistance between tungsten layer 94 and the transparency electrode 76 and between AlSi layer 77 and the interlayer insulation film 91 as hiding hurdle (barrier) metal.When the aspect ratio of contact holes 91a hour, the contact telescopiny is omitted, and as shown in figure 13, and preferably adopts sputtering method that the mode that AlSi film 77 is directly embedded among the contact holes 91a is formed AlSi film 77.In this case, preferably interleave Ti/TiN film 95 as blocking metal, so that reduce absorption and contact resistance.

Though can almost keep transparency electrode (for example, ito thin film) 76 on the whole surface as described in figure 8 as above-mentioned, this example is constructed to only keep transparency electrode 76 in the adjacent domain of pixel array portion 51.When transparency electrode 76 exists on whole surface almost and is applied in negative voltage, work in parasitic mos transistor other parts outside pixel array portion 51, and such inconvenience takes place sometimes, wherein cause occurring leaking between the p of different electromotive forces trap etc.By only keeping transparency electrode 76 near side of silicon substrate and adjacent domain thereof on the pixel array portion 51, and, thereby can prevent to produce the aforementioned parasitic MOS transistor by the AlSi film 77 away from the Si substrate shields the peripheral circuit parts with passing through interlayer insulation film 91.In this case, usually be difficult to AlSi film 77 is carried out etching, due to this is due to the fact that: the step of the tens nanometer of on the interlayer insulation film 91 of the boundary between the position that position that transparency electrode 76 exists in lower floor and transparency electrode 76 do not exist in lower floor, having an appointment, but this step is less, and to carrying out on the thicker interlayer insulation film 91 of being etched in of AlSi film 77, so can carry out this process by increasing etching.Certainly, can insert landscaping treatment to interlayer insulation film 91.

In above-mentioned Fig. 8, insulation film 75 does not exist than transparency electrode 76 peripheries far away, but in the 5th example embodiment of Figure 11, insulation film 75 also exists at the periphery that surpasses transparency electrode 76.In the 4th example embodiment of Fig. 8, when etching AlSi film 77, also disappeared owing to cross the peripheral insulation film 75 of etching, but in the 5th example embodiment of Figure 11, owing to have thick interlayer insulative layer, make that peripheral insulation film 75 can be not etched up to silicon substrate 54.Incidentally, when transparency electrode 76 is carried out etching, can under the situation of repairing insulation film 75 hardly, adopt wet etching to carry out selective etch.

Lens on color filters or the sheet can also formed on the rear surface electrode 78.In the 5th example embodiment of Figure 11, each pixel is formed the opening of AlSi film 77, and the individual element to pixel array portion 51 forms the contact, but also can be with another kind of method construct, for example make entire pixel array part 51 all become the opening of AlSi film, and form the contact in the periphery of pixel array portion 51.

According to the 5th example embodiment, can form the insulation film 75 of very thin pixel array portion 51, so that can utilize rear surface voltage is applied to rear surface electrode 78 with respect to pixel 55 lower voltages.More specifically, can utilize low-voltage to induce the hole of such degree, these holes can be suppressed at the dark current that produces on the silicon border surface of substrate rear surface.In addition, there is heavy parting insulation film 91 53 times, so that can protect it to avoid the insulation fracture in pad portion.Although not shown in Figure 11, also can on the front surface side under the pad portion 53, make circuit.

[the 6th example embodiment]

In the 5th example embodiment, AlSi film 77 is formed on the position away from silicon substrate 54.In this case, if form opening 77a at each pixel on AlSi film 77, then it is from the distance of silicon substrate 54 and being of uniform thickness of interlayer insulation film 91, makes that the halation at opening 77a place skew ray is affected, and is unfavorable for that light focuses on.Next, will make an explanation to improved the 6th example embodiment of the problems referred to above wherein.

Figure 14 shows the sectional view of the major part (with the similar part of the 4th embodiment) in the rear surface incident type cmos image sensor of the 6th example embodiment.Should be noted that in Figure 14, represent with identical label, and omit its repetition of explanation with those the corresponding parts among Fig. 8.The Semiconductor substrate that the cmos image sensor 82 of this example embodiment is formed on first conduction type similar to the abovely (for example, n type silicon substrate 54) in the pixel array portion 51, pel array 51 is the two-dimensional arrangement according to a plurality of (many) pixels 60 of matrix form, each pixel 60 is made of photodiode 55 and a plurality of MOS transistor on the substrate surface side (only showing transmission transistor 57 among the figure) as photo-electric conversion element, multilayer wired layer 73 is formed on the substrate front surface, and (for example comprise by transparency electrode, ito thin film) 76 and the rear surface electrode 78 of the double-layer structure that constitutes as the metallic film (for example, the AlSi film 77) of light shielding film be formed on the substrate rear surface by insulation film 75.

Then, in this example embodiment, particularly, transparency electrode 76 is formed on the almost whole surface of substrate rear surface, simultaneously, as the AlSi film 77 of light shielding film by directly be deposited in only be formed on the transparency electrode 76 with pixel array portion 51 corresponding zones in.Opening 77a is formed on the AlSi film 77 at each pixel.Subsequently, interlayer insulation film 91 is formed on the whole surface, and only forms the film as second layer light shielding film in the zone of the peripheral circuit part 52 on interlayer insulation film 91 and pad portion 53, and for example the AlSi film 96.Second layer AlSi film 96 and ground floor AlSi film 77 are connected by the place, periphery of contact part 97 in pixel array portion 51.Interlayer insulation film 91 forms at the place, periphery around insulation film 75 and transparency electrode 76 and contacts with the substrate rear surface.In addition, passivation film 79 is formed on the whole surface, and by selectively passivation film 79 being carried out etching so that AlSi film 77 exposes, and forming opening 79a with pad portion 53 corresponding parts, thereby forms pad portion 53.Just the interlayer insulation film 91 below pad portion 53 becomes the leakage current inhibition zone.Structure outside above-mentioned and the structure of Figure 11 are similar.

According to the 6th example embodiment,, therefore be beneficial to light is gathered photodiode 55 as become little than in the situation of Figure 11 of the AlSi film 77 of light shielding film and the distance between the silicon substrate 54 in the pixel array portion 51.For other problems, be similar to the explanation among Figure 11, can prevent the insulation fracture in the pad portion 53, and when the rear surface voltage that is applied to rear surface electrode 78 is limited in the low level, can suppress the leakage current generation.

[the 7th example embodiment]

Figure 15 shows the sectional view of the major part (with the similar part of the 4th embodiment) in the rear surface incident type cmos image sensor of the 7th example embodiment.Should be noted that in Figure 15, represent with identical label, and omit its repetition of explanation with those the corresponding parts among Fig. 8.The Semiconductor substrate that the rear surface incident type cmos image sensor 83 of this example embodiment is formed on first conduction type similar to the abovely (for example, n type silicon substrate 54) in the pixel array portion 51, pel array 51 is the two-dimensional arrangement according to a plurality of (many) pixels 60 of matrix form, each pixel 60 is made of photodiode 55 and a plurality of MOS transistor on the substrate surface side (only showing transmission transistor 57 among the figure) as photo-electric conversion element, multilayer wired layer 73 is formed on the substrate front surface, and (for example by transparency electrode, ito thin film) 76 and the rear surface electrode 78 of the double-layer structure that constitutes as the metallic film (for example, the AlSi film 77) of light shielding film be formed on the substrate rear surface by insulation film 75.

Then, in this example embodiment, transparency electrode 76 is formed on the almost whole surface of substrate rear surface, simultaneously, interlayer insulation film (that is, interlayer insulation film 91A) as liner is formed on the transparency electrode 76, and be limited in pad portion 53 corresponding positions in.Metallic film (for example, the AlSi film 77) as light shielding film forms from this interlayer insulation film 91A upward to the almost whole surface that comprises pixel array portion 51 and peripheral circuit part 52.In addition, passivation film 79 is formed on the whole surface, and exposes AlSi film 77 by selectively passivation film 79 being etched with, and forming opening 79a with the corresponding parts of pad portion 53, thereby forms pad portion 53.Just the interlayer insulation film 91A below pad portion 53 just becomes the leakage current inhibition zone 53 times in pad portion.Interlayer insulation film 91A as liner is formed between transparency electrode 76 and the insulation film 75.But interlayer insulation film 91A is fabricated to the thickness that has more than or equal to 100nm as mentioned above, therefore preferably provides this interlayer insulation film 91A on transparency electrode 76, and it is played the part of etching and stops part when selective etch interlayer insulation film 91A.Structure outside above-mentioned and the structure of Fig. 8 are similar.

According to the 7th example embodiment, just form pad portion 53 times as the interlayer insulation film 91A of liner, make pad portion 53 far away to the distance of silicon substrate 54.On the other hand, in pixel array portion 51, be formed directly on the transparency electrode 76, therefore be beneficial to light is gathered photodiode 55 as the AlSi film 77 of light shielding film.Therefore, similar with the 6th example embodiment, will be improved to the light collection efficiency of photodiode, simultaneously, can prevent the insulation fracture in the pad portion 53, and when the rear surface voltage that is applied to rear surface electrode 78 is limited in the low level, can suppress the leakage current generation.

Here, step more than or equal to 100nm is arranged around the interlayer insulation film 91A that becomes liner, so when AlSi film 77 is advanced selective etch, be easy to generate the etching residue at this step part, but only because the interlayer insulation film 91A as liner only is formed on the pad portion 53, even so produced the etching residue, and the short circuit between other distributions also takes place never.

[the 8th example embodiment]

Figure 16 shows the sectional view of the major part (with the similar part of the 4th embodiment) in the rear surface incident type cmos image sensor of the 8th example embodiment.Should be noted that in Figure 16, represent with identical label, and omit its repetition of explanation with those the corresponding parts among Fig. 8.The cmos image sensor 84 of this example embodiment is similar to Fig. 8 is constructed to form double-layer structure on the substrate rear surface rear surface electrode 78.More specifically, transparency electrode (for example, ito thin film) 76 and for example form laminarly along the insulation film on the substrate rear surface 75 as the AlSi film 77 of light shielding film, and form openings in photodiode 55 corresponding parts with pixel array portion 51.Then, passivation film 79 is formed on the whole surface except that pad portion 53.

In this example embodiment, particularly, just be formed with semiconductor well zone 98 (it is that electricity floats or has the electromotive force identical with rear surface electrode 78) in the silicon substrate under pad portion 53 54, to contact with the substrate rear surface of silicon substrate 54 at least, and it is constructed to this semiconductor well zone 98 and is centered on by the semiconductor regions of films of opposite conductivity, and the semiconductor regions of this films of opposite conductivity is reverse biased with respect to the electromotive force of rear surface electrode 78.In the accompanying drawings, form semiconductor well zone 98 by p type well area with n type silicon substrate 54 films of opposite conductivity.This p type well area 98 is formed rear surface from silicon substrate 54 to its front surface, but also can be configured to its middle part on forming from the substrate rear surface to the substrate thickness direction, and less than the substrate front surface.Semiconductor well zone 98 becomes the leakage current inhibition zone.Structure outside above-mentioned and the structure of Fig. 8 are similar.

In the 8th example embodiment, n type silicon substrate 54 is applied in supply voltage, and rear surface electrode 78 has been applied in negative voltage.Therefore, even the insulation film 75 under the pad portion 53 is damaged and pad portion 53 and p type well area 98 by short circuit, the negative voltage of rear surface voltage also is applied to p type well area 98, so that the pn that is formed by p type well area 98 and n type silicon substrate 54 knot is reverse biased, thereby almost there is not leakage current.In fact, its should be constructed to that even insulation film 75 is damaged thereby silicon substrate 54 sides on the zone to pad portion 53 electrical shorts, it also can make to be reverse biased in case the stopping leak leakage current, so can be other substrate conductivity types or other semiconductor well structures outside Figure 16 with respect to the periphery.

According to the 8th example embodiment, even can also suppress leakage current by providing such semiconductor well zone 98 to make insulation film 75 be damaged, wherein this semiconductor well zone 98 is just in the substrate under pad portion 53 54, and electricity floats or reverse bias.Simultaneously, it is thinner that the thickness of insulation film 75 can be made, and makes that can attempt making the voltage that is applied to rear surface electrode 78 is low-voltage.

According to above-mentioned the 5th to the 8th example embodiment, in the incident type cmos image sensor of rear surface, can prevent in pad portion insulation fracture, the voltage that is applied to the rear surface electrode simultaneously is limited in the low level, even perhaps the insulation fracture also can suppress leakage current.

In above-mentioned example, the double-layer structure transparency electrode 76 of rear surface electrode 78 and light shielding film (light shield electrode) 77 is used on the almost whole surface of rear surface of silicon substrate 54, but also can be with the structure applications under the above-mentioned pad portion in the situation of other rear surface electrode structures.For example, using whole digital circuits to form in the situation of peripheral circuit part 52, just do not need light shield, light shielding film 77 only forms just enough at pixel array portion 51.

In above-mentioned each embodiment, suppose that n type substrate is used as Semiconductor substrate, but also can use p type substrate.In this case, needless to say more, for n type and p type, electronics and hole and polarity of voltage, can all use opposite configuration at each embodiment.

Figure 17 shows the sectional view of the photographic means of example embodiment of the present invention.The photographic means of this example embodiment is an example of camera head that can the taking moving picture.

The photographic means of this example embodiment has imageing sensor 10, optical system 310, shutter device 311, drive circuit 312 and signal processing circuit 313.

Optical system 310 on the imaging surface of imageing sensor 10 to image light (incident ray) imaging from object.Like this, aforementioned signal charge is accumulated in imageing sensor 10 and is continued for some time.

During the rayed on the shutter device 311 control chart image-position sensors 10, and during the light shield.

Drive circuit 312 provides drive signal, is used for the transmission operation of control chart image-position sensor 10 and the shutter operation of shutter device 311.The charge transfer of imageing sensor 10 is carried out according to the drive signal (timing signal) from drive circuit 312.Signal processing circuit 313 is carried out various types of signal processing.Vision signal after the signal processing is stored in the recording medium that injects memory and so on, and outputs to monitor.

Solid imaging element of the present invention and photographic means can be used as the image device of imaging device, for example, and camera head, digital camera etc., and can for example have the mobile phone of photographic means etc. as the image device of mobile device.

It will be appreciated by those skilled in the art that and depend on design requirement and other factors, can make various modifications, combination, sub-portfolio and replacement, as long as they are in appended claims or its equivalent scope.

The present invention comprises and Japanese patent application JP2005-043357 that submitted to Japan Patent office on February 21st, 2005 and the relevant theme of Japanese patent application JP2005-366916 of submitting to Japan Patent office on December 20th, 2005, and the full content of this application is incorporated herein by reference.

Claims

1. solid imaging element, on the first surface side of Semiconductor substrate, has wiring layer, the pixel that comprises photo-electric conversion element is formed on the described substrate, and oneself receives incident light as the second surface side joint of the opposition side of described wiring layer described solid imaging element, and described solid imaging element comprises:

Insulation film is formed on the second surface of described Semiconductor substrate; And

Voltage bringing device is used for the voltage opposite with the polarities of potentials of described Semiconductor substrate is applied to described insulation film.

2. solid imaging element as claimed in claim 1, wherein, described voltage bringing device is formed on the described insulation film, and has electrode that incident light can be received in the described Semiconductor substrate and the power supply that is used for described voltage is applied to described electrode.

3. solid imaging element as claimed in claim 2, wherein, described electrode is a transparency electrode.

4. solid imaging element as claimed in claim 1, wherein, described Semiconductor substrate is a silicon substrate, and described insulation film has one deck structure of silicon oxide film, the perhaps double-layer structure of silicon oxide film and silicon nitride film.

5. solid imaging element as claimed in claim 1, wherein said pixel has well area, and described well area applies with reference potential by described wiring layer.

6. solid imaging element as claimed in claim 5, wherein, described well area reaches the second surface of described Semiconductor substrate.

7. solid imaging element as claimed in claim 5, wherein, described well area does not reach the second surface of described Semiconductor substrate, and the opening on the described second surface side of the aperture efficiency on the described first surface side is big.

8. solid imaging element as claimed in claim 1, wherein, described photo-electric conversion element is to bury diode, the described diode that buries has the layer of accumulating charge carrier on the semiconductor border surface of described wiring layer side.

9. solid imaging element as claimed in claim 1, wherein, described voltage bringing device is formed on the described insulation film, and is the formed layer of the material by having work function difference that can apply described voltage to described insulation film.

10. solid imaging element as claimed in claim 9, wherein, described material is the semiconductor different with the conduction type of described Semiconductor substrate.

11. driving method that is used for solid imaging element, this solid imaging element has wiring layer on the first surface side of Semiconductor substrate, the pixel that comprises photo-electric conversion element is formed on the described substrate, and oneself receives incident light as the second surface side joint of the opposition side of described wiring layer described solid imaging element

Wherein, the voltage opposite with the polarities of potentials of described Semiconductor substrate is applied to the insulation film on the second surface that is formed on described Semiconductor substrate.

12. a solid imaging element, wherein

The pixel that comprises photo-electric conversion element is formed on the Semiconductor substrate;

Receive incident light from the rear surface side joint of described Semiconductor substrate;

Insulation film is formed on the side of described rear surface;

The rear surface electrode is formed in the pixel array portion by described insulation film at least; And

Under the pad portion of described rear surface electrode, provide the leakage current inhibition zone, be used to suppress the leakage current between described pad portion and the described Semiconductor substrate.

13. solid imaging element as claimed in claim 12, wherein

Described rear surface electrode have by the interlayer insulation divided thin film every double-layer structure;

Described double-layer structure is partly connected by contact; And

Described leakage current inhibition zone is formed by the described interlayer insulation film under the pad portion of described rear surface electrode.

14. solid imaging element as claimed in claim 12, wherein

Described rear surface electrode has double-layer structure;

Described interlayer insulation film be inserted in the corresponding described double-layer structure of the pad portion of described rear surface electrode in; And

Described leakage current inhibition zone is formed by described interlayer insulation film.

15. solid imaging element as claimed in claim 12, wherein

Semiconductor well zone with floating potential or electromotive force identical with the electromotive force of described rear surface electrode forms by contacting with the rear surface of described Semiconductor substrate under the described welding disking area at least;

Described semiconductor well zone quilt centers on the semiconductor regions of the conduction type of the conductivity type opposite in described semiconductor well zone, and the semiconductor regions of the conduction type of the conductivity type opposite in described and described semiconductor well zone has reverse bias with respect to the electromotive force of described rear surface electrode; And

Described leakage current inhibition zone is formed by described semiconductor well zone.

16. solid imaging element as claimed in claim 13, wherein

Only be formed in the adjacent domain of described pixel array portion in the described double-layer structure near the layer on the side of described silicon substrate.

17. solid imaging element, on the first surface side of Semiconductor substrate, has wiring layer, the pixel that comprises photo-electric conversion element is formed on the described substrate, and oneself receives incident light as the second surface side joint of the opposition side of described wiring layer described solid imaging element, and described solid imaging element comprises:

Voltage bringing device is used for the voltage identical with the polarity of the signal charge of described photo-electric conversion element is applied to described insulation film, and is used for inducing on the second surface side of described Semiconductor substrate and the opposite polarity electric charge of described signal charge.

18. photographic means with solid imaging element, this solid imaging element has wiring layer on the first surface side of Semiconductor substrate, the pixel that comprises photo-electric conversion element is formed on the described substrate, and oneself receives incident light as the second surface side joint of the opposition side of described wiring layer described solid imaging element, and described solid imaging element comprises: