CN1822107A - 磁头组件的焊锡球结合方法 - Google Patents
磁头组件的焊锡球结合方法 Download PDFInfo
- Publication number
- CN1822107A CN1822107A CN 200610003281 CN200610003281A CN1822107A CN 1822107 A CN1822107 A CN 1822107A CN 200610003281 CN200610003281 CN 200610003281 CN 200610003281 A CN200610003281 A CN 200610003281A CN 1822107 A CN1822107 A CN 1822107A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- solder ball
- electrode pad
- laser
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP031827/2005 | 2005-02-08 | ||
JP2005031827A JP2006221690A (ja) | 2005-02-08 | 2005-02-08 | 磁気ヘッドアッセンブリの半田ボール接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1822107A true CN1822107A (zh) | 2006-08-23 |
CN100517469C CN100517469C (zh) | 2009-07-22 |
Family
ID=36923427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100032811A Expired - Fee Related CN100517469C (zh) | 2005-02-08 | 2006-02-08 | 磁头组件的焊锡球结合方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2006221690A (zh) |
CN (1) | CN100517469C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101947677A (zh) * | 2010-05-26 | 2011-01-19 | 惠州市奥申特光电技术有限公司 | 一种非接触式激光焊接工艺 |
CN105855656A (zh) * | 2015-01-21 | 2016-08-17 | 新科实业有限公司 | 焊接方法及焊接装置 |
CN114206534A (zh) * | 2020-04-02 | 2022-03-18 | Tdk电子股份有限公司 | 电钎焊连接、具有钎焊连接的传感器和制造方法 |
CN114501791A (zh) * | 2020-11-12 | 2022-05-13 | 荣耀终端有限公司 | 电路板组件及电子设备 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008089743A1 (de) * | 2007-01-24 | 2008-07-31 | Pac Tech - Packaging Technologies Gmbh | Verfahren und vorrichtung zur kontaktierung, platzierung und beaufschlagung mittels laserenergie eines lotkugelverbands |
US7830638B1 (en) | 2007-08-13 | 2010-11-09 | Magnecomp Corporation | Structure and method for localizing solder ball strain on hard disk drive suspension gimbal |
CN114145080B (zh) * | 2019-07-30 | 2024-05-28 | 三菱电机株式会社 | 芯片部件、芯片部件的制造方法以及电子设备的制造方法 |
US11626133B1 (en) | 2022-03-30 | 2023-04-11 | Sae Magnetics (H.K.) Ltd. | Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive |
US11749302B1 (en) | 2022-05-12 | 2023-09-05 | Sae Magnetics (H.K.) Ltd. | Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive |
US11763842B1 (en) | 2022-05-12 | 2023-09-19 | Sae Magnetics (H.K.) Ltd. | Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive |
US11887638B1 (en) | 2022-11-04 | 2024-01-30 | Sae Magnetics (H.K.) Ltd. | Laser diode, thermally assisted magnetic head, head gimbal assembly, hard disk drive and method of manufacturing a head gimbal assembly |
-
2005
- 2005-02-08 JP JP2005031827A patent/JP2006221690A/ja active Pending
-
2006
- 2006-02-08 CN CNB2006100032811A patent/CN100517469C/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101947677A (zh) * | 2010-05-26 | 2011-01-19 | 惠州市奥申特光电技术有限公司 | 一种非接触式激光焊接工艺 |
CN105855656A (zh) * | 2015-01-21 | 2016-08-17 | 新科实业有限公司 | 焊接方法及焊接装置 |
CN114206534A (zh) * | 2020-04-02 | 2022-03-18 | Tdk电子股份有限公司 | 电钎焊连接、具有钎焊连接的传感器和制造方法 |
CN114501791A (zh) * | 2020-11-12 | 2022-05-13 | 荣耀终端有限公司 | 电路板组件及电子设备 |
Also Published As
Publication number | Publication date |
---|---|
JP2006221690A (ja) | 2006-08-24 |
CN100517469C (zh) | 2009-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: TDK CORP. Free format text: FORMER OWNER: ALPS ELECTRIC CO., LTD. Effective date: 20080125 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20080125 Address after: Tokyo, Japan, Japan Applicant after: TDK Corp. Address before: Tokyo, Japan, Japan Applicant before: Alps Electric Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090722 Termination date: 20180208 |