CN1819175A - Surface installing emitting led - Google Patents
Surface installing emitting led Download PDFInfo
- Publication number
- CN1819175A CN1819175A CN 200510003522 CN200510003522A CN1819175A CN 1819175 A CN1819175 A CN 1819175A CN 200510003522 CN200510003522 CN 200510003522 CN 200510003522 A CN200510003522 A CN 200510003522A CN 1819175 A CN1819175 A CN 1819175A
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- circuit pattern
- resin
- pair
- resin substrate
- led wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- Led Device Packages (AREA)
Abstract
The invention provides a surface-mounted LED using a resin substrate which is not cracked, damaged, bent, etc. even if mold clamping pressure of a mold is applied when the resin substrate is resin-sealed by transfer molding. A pair of circuit patterns (4a, 5a) are formed at the opposite ends on the surface of an insulating resin body (3) constituting the resin substrate (2); and a pair of circuit patterns (4c, 5c) are extended inward to be opposite to each other from the ends (4b, 5b) on the inner side of the pair of circuit patterns (4a, 5a). Moreover, an LED chip (1) is mounted on the front end portion of the circuit pattern (4c), an upper electrode of the LED chip (1) is connected with an electrode pattern (5c) through a bonding wire (6), and the LED chip (1) and the bonding wire (6) are sealed with transparent resin. The shape of the ends (4b, 5b) on the inner side of the pair of circuit patterns other than the portion extending toward the inner side is different from the shape of the lower edges (14, 15) of the transparent sealing resin contacting the insulating resin body and the circuit pattern.
Description
(1) technical field
The invention relates to surface mounting luminous diode, in detail, about having used a surface mounting luminous diode that is formed with the resin substrate of circuit pattern on the surface of insulating resin body.
(2) background technology
At surface mounting luminous diode (being called for short LED down) in the past, just like following person.Be exactly one as shown in Figure 7, the face side of insulating resin body 50 to towards the end, two ends be formed with circuit pattern 51A, 51b, each circuit pattern 51a, 51b promptly form the state through entering to the rear side wraparound behind the side from edge portion.And circuit pattern 51a, the 51b of the face side of insulating resin body 50 are to extend into mutual subtend to the inside.
In addition, among resin substrate 52 inboard circuit pattern 51a, the 51b that extend of above-mentioned formation, leading section at a side circuit pattern 51a, conductive member (not shown) by welding or conductive adhesive etc. is installed LED wafer 53, to scheme the downside electrode of LED wafer 53 and conducting of circuit pattern 51a.The last lateral electrode of LED wafer 53 is connected in the opposing party's circuit pattern 51b promptly by closing line 54, seeks the last lateral electrode of LED wafer 53 and electrically conducting of circuit pattern 51b by this.
In addition; mat translucent resin 55 is resin-sealed, so that lining LED wafer 53 and closing line 54, from external environment conditions such as moisture, dust and gas protection LED wafer 53; and mechanically stressed protection closing line 54 (for example, with reference to patent documentation 1) from vibration and impact etc.
When making above-mentioned conventional surface mount type LED, in the resin-sealed engineering by means of translucent resin, generally speaking, the mat transfer moudling is carried out resin forming.Fig. 8 and Fig. 9 promptly show its method, and Fig. 8 is a plane graph, and Fig. 9 then is the A-A sectional drawing of Fig. 9.Mold 56 and bed die 57 with the transfer modling mould are clamped matched moulds with the resin substrate 52 that LED53 is installed, and then translucent resin 55 is flow in the cavity that is located at mold 56, to carry out the sealing resin moulding.
And say, aspect transfer modling, resin substrate that the LED wafer is installed mold and the bed die with the mold mould clipped, and the mat compressive load carries out matched moulds, so that prevent that sealing resin (translucent resin) from spilling to the unnecessary portions of resin substrate during mold.That kind, be added with loading in resin-based because of matched moulds, institute might produce crack 61.
The generation in crack 61, most reasons are to be to be formed on the shape of the circuit pattern of insulating resin body and relation from the pressing position of compressive load, thereby above-mentioned surface mounting LED becomes the form that is easy to generate crack 61 at resin substrate most.
Because, each medial end 59a, the 59b that are formed on a pair of circuit pattern 51a, the 51b of insulating resin body 50 form linearity, and end 59a, the 59b of circuit pattern 51a, the 51b of this linearity each, promptly be compressed loading with the cavity opening edge 60a of portion, the 60b of the mold 56 of the mold mould that is set as linearity equally with the line state of contact.For this reason, all loadings concentrate on end 59a, the 59b of circuit pattern 51a, 51b, consequently produce and extend the crack 61 of insulating resin body 50 inside from this end 59a, 59b, even make resin substrate 52 damages.If when the insulating resin body is glass epoxy resin, may encourage generation because of the bending of glass cloth to the crack 61 of resin substrate.
(3) summary of the invention
The object of the present invention is to provide the surface mounting LED that uses a kind of resin substrate, this resin substrate is when using transfer moudling to come sealing resin, although there is the clamping pressure of mold mould also can not produce crack, breakage, bending etc.
The present invention invents in order to address the above problem, with regard to first, a kind of surface mounting LED is provided, it is the circuit forming surface pattern at the insulating resin body that constitutes resin substrate, the LED wafer is installed on this circuit pattern, mat light transmission sealing resin seals so that seal this LED wafer, it is characterized in that: this resin substrate surface to towards a pair of edge portion form a pair of circuit pattern; The medial end of this a pair of circuit pattern extends into part subtend mutually respectively to the inside; The shape of the medial end of this a pair of circuit pattern except the part of Yan Shening forms a kind of following different shape that contacts with this insulating resin body and this circuit pattern with this light transmission sealing resin to the inside.
With regard to the present invention second with regard to, a kind of surface mounting LED is provided, it is the circuit forming surface pattern at the insulating resin body that constitutes resin substrate, the LED wafer is installed on this circuit pattern, mat light transmission sealing resin seals, this LED wafer person so that be covered is characterized in that: this resin substrate surface to towards one of edge portion is formed with a pair of circuit pattern; The medial end of this a pair of circuit pattern extends into part subtend mutually respectively to the inside; The medial end of this a pair of circuit pattern except the part of Yan Shening to the inside, by the curve more than at least one, for the linearity bottom of this light transmission sealing resin with this insulating resin body and the contact of this circuit pattern, become nonparallel at least one straight line, or the arbitrary of these combinations forms.
In the present invention's the second, aforementioned curve is characterised in that: its arcuation or these combination by a part that constitutes a round part or ellipse is formed.
In addition, in the present invention first and second, it is characterized in that: aforementioned light transmission sealing resin, be by one of in epoxy resin and the silicones become.
Surface mounting LED of the present invention, it is medial end with the face side of a pair of circuit pattern (being formed on the resin substrate that is used for installing the LED wafer), make by at least one curve or for the end (slightly becoming vertical direction) of resin substrate with the bearing of trend of circuit pattern become nonparallel at least one or more straight line or these make up formed, make the shape of the cavity opening edge portion (being located at the mold mould in the resin-sealed engineering of LED wafer) that the sealing resin moulding uses differ from the shape of the medial end of foregoing circuit patterned surfaces side by this.Its result, in resin-sealed engineering, the matched moulds compressive load that puts on resin substrate face side medial end is disperseed, and makes the part of its loading become the some pressurization, can suppress the ill-considered generation in crack, breakage, bending etc. to resin substrate by this.
(4) description of drawings
Fig. 1 is a plane graph, and it shows the resin-sealed engineering of example according to surface mounting LED of the present invention.
Fig. 2 is the A-A sectional drawing of Fig. 4.
Fig. 3 is an oblique view, and it shows the example according to surface mounting LED of the present invention.
Fig. 4 is a plane graph, and it shows the resin-sealed engineering according to other examples of surface mounting LED of the present invention.
Fig. 5 is the A-A sectional drawing of Fig. 4.
Fig. 6 is an oblique view, and it shows the example according to other surface mounting LEDs of the present invention.
Fig. 7 is an oblique view, and it shows the example according to existing surface mounting LED.
Fig. 8 is a plane graph, and it shows the resin-sealed engineering according to the example of existing surface mounting LED.
Fig. 9 is the A-A sectional drawing of Fig. 8.
(5) embodiment
Below, the limit is with reference to Fig. 1～Fig. 6, and the limit describes suitable example of the present invention (about with a part of note prosign) in detail.In addition, the example of the following stated is a suitable concrete example of the present invention, so though added the various qualifications of the technology that is suitable for, scope of the present invention, as long as not special in the following description record limits spirit of the present invention, just not limited by these examples.
Fig. 1 is the plane graph about the resin-sealed engineering of surface mounting LED of this example, and Fig. 2 is the A-A sectional drawing of Fig. 1, and Fig. 3 is for finishing figure.Be used for installing the resin substrate 2 of many chamferings of most LED wafers 1, be insulating resin body 3 face side to towards both ends, be formed with by a pair of circuit pattern 4a, 5a that conductive member became such as copper; Each circuit pattern 4a, 5a promptly form a kind of state of edge portion through entering to the rear side wraparound behind the side from exhausted resinite 3.
And medial end 4b, the 5b of each face side circuit pattern 4a, 5a of edge resinite 3 are to form roughly that the circular arc of same curvature is connected a plurality of states; A pair of circuit pattern 4c, 5c extend into towards the inboard from each end 4b, 5b, in a plurality of local mutual subtends respectively.
Among a pair of circuit pattern 4c, the 5c that extend towards the inboard of above-mentioned resin substrate 2, at side's circuit pattern 4c leading section, by conductive members (not shown) such as welding or conductive adhesives, LED wafer 1 is installed, to scheme the downside electrode of LED wafer 1 and electrically conducting of circuit pattern 4c, 4b.The last lateral electrode of LED wafer 1 promptly is connected in the opposing party's circuit pattern 5c by closing line 6, to scheme the last lateral electrode of LED wafer 1 and electrically conducting of circuit pattern 5c, 5a.
One as described, and the resin substrate 2 of a plurality of LED wafers 1 is installed, for resin-sealed LED wafer 1 and closing line 6 and with the mold 7 and the bed die 8 of transfer modling mould; Clamp matched moulds.In this case, because of matched moulds puts on each medial end 4b of a pair of circuit pattern 4a, the 5a of resin substrate 2, the compressive load of 5b,, and add promptly along the opening edge portion 10 of the cavity 9 that is provided with for the sealing resin moulding.At this moment, opening edge portion 10 and insulating resin body 3 and circuit pattern 4a, 4c, 5a, 5c contact, just form three materials of translucent resin 12, circuit pattern and insulating resin body 3 overlapping more than a contact 11.Contact point 11, structure has as compared with the past increased contact point everywhere 11 shown in Figure 3 at least.Have a plurality of contact points 11 by this, bear compressive load from matched moulds by them.In addition, opening edge portion 10 is also non-consistent in the straight line contact with the medial end of circuit pattern.
Therefore, put on the loading of the contact point 11 of resin substrate 2, only be added in a dispersed part among total loading of compressive load, thereby can not bear the pressure that can produce the crack degree from end 4b, the 5b of circuit pattern 4a, 5a, can resin substrate 2 be produced because of causing imappropriate in the crack in the transfer modling engineering.In addition resin substrate 2 can not damage yet, and the bending that can not produce glass cloth when insulating resin body 3 is glass epoxy resin can not encourage the generation to the crack of resin substrate 2 yet.In addition, because cavity opening edge portion 10, on straight line contacts, become inconsistently, just reduce, suppress the crack and produce so put on the pressure of insulating resin body 3 with insulating resin body 3.
Under this kind state, wait to clip resin substrate 2 in addition behind the matched moulds, with epoxy resin or silicones substrate 2 in addition behind the matched moulds, the translucent resin 12 of epoxy resin or silicones etc. is flow in the cavity 9 of mould 7 and hardened resin-sealed by this LED wafer 1 and closing line 6.Then, cut off, finish mounted on surface LED13 as shown in Figure 3 by this at last by resin-sealed resin substrate 2.
So, aspect the surface mounting LED of finishing 13, insulating resin body 3 face side to towards two edge portions, be formed with a pair of circuit pattern 4a, 5a, each circuit pattern 4a, 5a promptly form the state that edge portion from insulating resin body 3 enters through the side and to the rear side wraparound.
And medial end 4b, the 5b of each face side circuit pattern 4a, 5a of insulating resin body 3 form circular-arcly, and a pair of circuit pattern 4c, 5c promptly extend into towards the inboard from each end 4b, 5b, each mutual subtend.
Among a pair of circuit pattern 4c, the 5c that in above-mentioned resin substrate 2, stretches, at a side circuit pattern 4c leading section, by conductive members (not shown) such as welding or conductive adhesives, LED wafer 1 is installed, to scheme the downside electrode of LED wafer 1 and electrically conducting of circuit pattern 4c, 4a.The last lateral electrode of LED wafer 1 promptly is connected in the opposing party's circuit pattern 5c by closing line 6, to scheme the above-mentioned electrode of LED wafer 1 and electrically conducting of circuit pattern 5c, 5a.
And translucent resins 12 such as mat epoxy resin or silicones are resin-sealed, so that lining LED wafer 1 and closing line 6.Especially, the bottom the 14, the 15th that translucent resin 12 contacts with insulating resin body 3 and circuit pattern 4a, the 5a of resin substrate 2 forms linearity, and medial end 4b, the 5b of each face side circuit pattern 4a, 5a of insulating resin body then form circular-arc.Be exactly, the shape of the bottom 14,15 that translucent resin 12 is contacted with insulating resin body 3 and circuit pattern 4a, the 5a of resin substrate 12, with each face side thunder road pattern 4a of insulating resin body 3, the shape of 5a medial end 4b, 5b, make difformity, stop the imappropriate of crack for the resin substrate in the resin-sealed engineering 2, breakage, bending etc. by this, to guarantee to make yield.
Fig. 4 and Fig. 5 are the plane graphs of resin-sealed engineering that shows the surface mounting LED of other embodiment, and Fig. 5 is the A-A sectional drawing of Fig. 4.Fig. 6 becomes figure for it.
The different place of the resin-sealed engineering that shows among the resin-sealed engineering that shows among Fig. 4 and Fig. 5 and Fig. 1 and Fig. 2 only is: medial end 4b, the 5b of insulating resin body 3 each face side circuit pattern 4a, 5a among Fig. 4 and Fig. 5, formed by the nonparallel straight line for the end of resin substrate 2, wherein the direction of the end of this resin substrate 2 and circuit pattern 4a, the 4b direction of extending to the inside slightly meets at right angles.Other all are same with above-mentioned example.For this reason, detailed, what but will say is, as described in the explanation of Fig. 1 and Fig. 2, this moment too, because of matched moulds makes each medial end 4b of a pair of circuit pattern 4a, the 5a of resin substrate 2, the compressive load that 5b bears, be to add along the open end 10 that is located at the cavity 9 of mold 7 for the sealing resin moulding.At this moment, opening edge portion 10 and insulating resin body 3 and circuit pattern 4a, 4c, 5a, 5c contact, just form three materials of translucent resin 12, circuit pattern and insulating resin 3 overlapping a plurality of contact points 11.Contact point 11, structure as compared with the past increases at least and goes up contact 11 shown in Figure 6.Have a plurality of contact points 11 by this, bear compressive load from matched moulds by them.In addition, peristome 10 is also non-consistent in the straight line contact with the medial end of circuit pattern.
Therefore, put on the loading of the contact point 11 of resin substrate 2, only be added in a dispersed part among total loading of compressive load, can not produce the pressure of crack degree and can not bear, can resin substrate 2 be produced because of causing imappropriate in the crack in the transfer modling engineering from end 4b, the 5b of circuit pattern 4a, 5a.In addition resin substrate 2 can not damage yet, and the bending that can not produce glass cloth when insulating resin body 3 is glass epoxy resin can not encourage the generation to the crack of resin substrate 2 yet.In addition, because cavity opening edge portion 10, and that insulating resin body 3 becomes in the straight line contact is inconsistent, just reduces so put on the pressure of insulating resin body 3, can suppress the generation in crack.
Fig. 6 is the surface mounting LED that shows above-mentioned example.The place different with example shown in Figure 1 only is: each medial end 4b, the 5b of a pair of circuit pattern 4a, the 5a of insulated substrate 2, be to become nonparallel straight line to be formed by the end for resin substrate 2, wherein the direction that extends internally of the direction of the end of this resin substrate 2 and circuit pattern 4a, 4b slightly meets at right angles.Other all are identical with example shown in Figure 1.
In addition, each medial end 4b of a pair of circuit pattern 4a, 5a, the shape of 5b, so long as the cavity opening edge portion that uses with the close resin forming shape that connects into wire does not get final product, wherein this cavity is in resin-sealed engineering, is located at the mold mould.And, so long as by at least one with upper curve or for the end (its direction slightly becomes vertical with the bearing of trend of circuit pattern 4a, 5a) of resin substrate 2 become nonparallel at least one or more straight line or these make up formed and got final product.
For example, if each medial end 4b, the 5b of a pair of circuit pattern 4a, 5a be shaped as curve the time, can be by the arcuation of a part that constitutes circle or an oval part, or, these make up form.
As mentioned above, surface mounting LED of the present invention, be the medial end that will be formed at a pair of circuit pattern face side of resin substrate (be used for installing LED wafer), make by the curve more than at least one or for the end (its side slightly becomes vertical with the bearing of trend of circuit pattern) of resin substrate become nonparallel at least one above straight line or these make up formed; And, make the shape of the cavity opening edge portion that the sealing resin moulding that is located at mold mould (using in the resin-sealed engineering of LED wafer) uses, differ from the shape of the medial end of foregoing circuit patterned surfaces side.
Its result, in the close fat Seal of resin, put on the circuit pattern face side medial end matched moulds compressive load of resin substrate, promptly the part by dispersed loading puts on a little, therefore, present ill-considered excellent effect such as the crack that can suppress, breakage, bending for resin substrate.
Claims (4)
1. surface mounting luminous diode, it is the circuit forming surface pattern at the insulating resin body that constitutes resin substrate, on this circuit pattern, LED wafer is installed, mat light transmission sealing resin seals, so that be covered this LED wafer person, it is characterized in that: on this resin substrate surface relatively to a pair of edge portion be formed with a pair of circuit pattern; The medial end of this a pair of circuit pattern extends into part subtend mutually respectively to the inside; The shape of the medial end of this a pair of circuit pattern except the part of Yan Shening to the inside forms a kind of and the following different shape that this light transmission sealing resin is contacted with this insulating resin body and this circuit pattern.
2. surface mounting luminous diode, it is the circuit forming surface pattern at the insulating resin body that constitutes resin substrate, on this circuit pattern, LED wafer is installed, mat light transmission sealing resin seals, so that be covered this LED wafer person, it is characterized in that: on this resin substrate surface relatively to a pair of edge portion be formed with a pair of circuit pattern; The medial end of this a pair of circuit pattern extends into part subtend mutually respectively to the inside; The medial end of this a pair of circuit pattern except the part of Yan Shening to the inside, be by the curve more than at least one, the linearity bottom that contacts with this insulating resin body and this circuit pattern for this light transmission sealing resin, become nonparallel at least one straight line, or the arbitrary of these combinations forms.
3. surface mounting luminous diode as claimed in claim 2 is characterized in that: described curve is the arcuation by a part that constitutes a round part or ellipse, or these combinations form.
4. as each described surface mounting luminous diode of claim 1～3, it is characterized in that: described light transmission sealing resin, be by one of in epoxy resin and the silicones become.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005000691 | 2005-01-05 | ||
| JP2005000691A JP2006190764A (en) | 2005-01-05 | 2005-01-05 | Surface mounting led |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1819175A true CN1819175A (en) | 2006-08-16 |
| CN100481430C CN100481430C (en) | 2009-04-22 |
Family
ID=36797705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510003522 Expired - Fee Related CN100481430C (en) | 2005-01-05 | 2005-12-30 | Surface installing emitting LED |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2006190764A (en) |
| CN (1) | CN100481430C (en) |
| TW (1) | TWI387123B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109328378A (en) * | 2016-06-29 | 2019-02-12 | 三菱电机株式会社 | The manufacturing method of display device and display device |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101119172B1 (en) | 2007-02-05 | 2012-03-21 | 삼성전자주식회사 | Light emitting diode module and display device using the same |
| US7985980B2 (en) | 2007-10-31 | 2011-07-26 | Sharp Kabushiki Kaisha | Chip-type LED and method for manufacturing the same |
| US8354684B2 (en) | 2011-01-09 | 2013-01-15 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in an interconnect structure |
| US8652860B2 (en) | 2011-01-09 | 2014-02-18 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in a molded interconnect structure |
| US8536605B2 (en) | 2011-11-28 | 2013-09-17 | Bridgelux, Inc. | Micro-bead blasting process for removing a silicone flash layer |
| US9461023B2 (en) | 2011-10-28 | 2016-10-04 | Bridgelux, Inc. | Jetting a highly reflective layer onto an LED assembly |
| CN104170102B (en) * | 2012-02-02 | 2018-02-06 | 普瑞光电股份有限公司 | Being encapsulated in moulded-interconnect structure only has the photon structure block of top side connection |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0447976Y2 (en) * | 1985-07-04 | 1992-11-12 | ||
| JPS6210456A (en) * | 1985-07-05 | 1987-01-19 | Mitsubishi Heavy Ind Ltd | Piston of reciprocating type engine |
| JPS6213321A (en) * | 1985-07-11 | 1987-01-22 | Nippon Radiator Co Ltd | Method for mutually welding synthetic resin parts by high frequency induction heating method |
| JPH01163352U (en) * | 1988-04-30 | 1989-11-14 | ||
| JPH01282844A (en) * | 1988-05-09 | 1989-11-14 | Nec Corp | Resin-sealed semiconductor device |
| JPH01171055U (en) * | 1988-05-24 | 1989-12-04 | ||
| JP2667521B2 (en) * | 1989-07-04 | 1997-10-27 | 住友重機械工業株式会社 | Resin pressure detector for injection molding machine |
| US5623181A (en) * | 1995-03-23 | 1997-04-22 | Iwasaki Electric Co., Ltd. | Multi-layer type light emitting device |
| US5813753A (en) * | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
| US5962971A (en) * | 1997-08-29 | 1999-10-05 | Chen; Hsing | LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights |
| JP3553405B2 (en) * | 1999-03-03 | 2004-08-11 | ローム株式会社 | Chip type electronic components |
| JP3172947B2 (en) * | 1999-10-22 | 2001-06-04 | ラボ・スフィア株式会社 | Lighting device using luminous body |
| US20060189013A1 (en) * | 2005-02-24 | 2006-08-24 | 3M Innovative Properties Company | Method of making LED encapsulant with undulating surface |
-
2005
- 2005-01-05 JP JP2005000691A patent/JP2006190764A/en active Pending
- 2005-11-30 TW TW94142210A patent/TWI387123B/en not_active IP Right Cessation
- 2005-12-30 CN CN 200510003522 patent/CN100481430C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109328378A (en) * | 2016-06-29 | 2019-02-12 | 三菱电机株式会社 | The manufacturing method of display device and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100481430C (en) | 2009-04-22 |
| TW200625700A (en) | 2006-07-16 |
| JP2006190764A (en) | 2006-07-20 |
| TWI387123B (en) | 2013-02-21 |
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