CN2904306Y - Total reflection SMD LED supporter - Google Patents

Total reflection SMD LED supporter Download PDF

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Publication number
CN2904306Y
CN2904306Y CNU2006200125493U CN200620012549U CN2904306Y CN 2904306 Y CN2904306 Y CN 2904306Y CN U2006200125493 U CNU2006200125493 U CN U2006200125493U CN 200620012549 U CN200620012549 U CN 200620012549U CN 2904306 Y CN2904306 Y CN 2904306Y
Authority
CN
China
Prior art keywords
rubber base
functional areas
metal pin
metal
smd led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2006200125493U
Other languages
Chinese (zh)
Inventor
周万顺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
I Chiun Precision Ind Co Ltd
Original Assignee
I Chiun Precision Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by I Chiun Precision Ind Co Ltd filed Critical I Chiun Precision Ind Co Ltd
Priority to CNU2006200125493U priority Critical patent/CN2904306Y/en
Application granted granted Critical
Publication of CN2904306Y publication Critical patent/CN2904306Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A total-reflection SMD LBD bracket includes a rubber base and two metal pins. The rubber base is equipped with a hollow functional zone, wherein are the two metal pins. Part of the two metal pins extrudes to the external area of the functional zone, buried inside of the rubber base, making the other part of the metal pin in the functional zone appears on the bottom of the functional zone, in order to improve the reflection range of the metal pins in the functional zone. The other terminal of the metal pins extends from the inside of the rubber base to both sides of the outside rubber base. So the reflection range of the metal pin in the functional zone is high, and the light generated to the area around the luminous chip can enable the total reflection effect. The effect of light concentration is good. When being applied to IT products, the color and the light of the model can be uniformity effective.

Description

Fully-reflected type SMD LED support
Technical field
The utility model relates to a kind of light-emitting diode and improves support, refers in particular to a kind of improvement structure relevant for SMD (surface adhesion type) LED support, and it can increase the reflection effect.
Background technology
Light-emitting diode (Light Emitting Diode, semi-conductor electricity sub-element that can be luminous during LED) for energising, life-span is about more than 100,000 hours, and have that volume is little, fast, the low characteristic of polluting etc. of low power consumption, reaction speed, be widely used in the light source of the information products of miniaturization day by day.
As shown in Figures 1 and 2, (it includes a rubber base 10, two metal pins 11, a luminescence chip 12 and two leads 13 for Surface Mount Device, SMD) LED support for the known surface binding type.Rubber base 10 has the functional areas 101 of a hollow form, metal pin 11 is formed at respectively in the rubber base 10, and before the metal pin 11, back two sides are revealed in the functional areas 101, and two metal pins, 11 left sides or right side are by extending to rubber base 10 external left in the functional areas 101 respectively, right two sides, with contact as successive process, luminescence chip 12 is fixed in wherein on the metal pin 11, and luminescence chip 12 connects two leads, 13 to two metal pins 11 respectively, 11 of two metal pins are formed with interval block 14 to separate two metal pins, 11 polarity, in rubber base 10, cover last layer epoxy resin (not icon), cover luminescence chip 12 and lead 13, can make luminescence chip 12 colorific radiance in order to do apply voltage with two metal pins 11.
Above-mentioned known surface binding type light-emitting diode support structure, rubber base 10 is with the affixed two metal pins 11 of the mode of ejection formation, and metal pin 11 2 sides are revealed in respectively in the functional areas 101, in order to increase the zygosity of metal pin 11 and rubber base 10.Yet, luminescence chip 12 is to the radiance that produce all around, because of being subjected to metal pin 11 2 sides to be revealed in influence in the functional areas 101, reflector space is little, radiance can't reach even reflection, easily make radiance centrality deficiency and brightness disproportionation, when being used in information products in a large number, the radiance of luminescence chip 12 and color promptly produce the uneven facts.
Because of skin, the improving of the above-mentioned defective of the design people's thoughts is that the spy concentrates on studies and cooperates the utilization of scientific principle, proposes a kind of reasonable in design and effectively improve the utility model of above-mentioned defective finally.
The utility model content
The purpose of this utility model provides a kind of fully-reflected type SMD LED support, its reflector space height, so that luminescence chip can reach the effect of total reflection all around to the radiance that produce, and the radiance centrality is good, when applying to information products in a large number, can reach color and even brightness effect.
For reaching above-mentioned purpose, the utility model provides a kind of fully-reflected type SMD LED support, comprising: a rubber base, and it has the functional areas of a hollow form; A plurality of metal pins, be located at respectively in the functional areas of this rubber base, these metal pin two sides parts protrude in respectively outside these functional areas, and be embedded in this rubber base inside, make the metal pin of the another part that is positioned at these functional areas be obvious from this bottom, functional areas respectively, these metal pin opposite sides extend to outside two sides of this rubber base respectively by this rubber base inside; And more than one interval block, be formed in the functional areas of this rubber base, to separate the polarity of these pins.
Further, above-mentioned rubber base is a macromolecule non-conducting material spare.
Further, above-mentioned functional areas are rectangle, circular, oval, square or polygon.
Further, these metal pin surfaces are respectively equipped with a metallic reflector.
Further, these metal pin two sides are respectively equipped with several peristomes, and these peristomes are positioned at this rubber base inside respectively.
Forward and backward two pleurapophysis of metal pin of the present utility model are for outside the functional areas and be positioned at rubber base, make the reflector space height between metal pin and functional areas, luminescence chip can reach the effect of total reflection all around in functional areas to the radiance that produce, and the radiance centrality is good, metallic reflector on the metal pin further increases the effect of radiance reflection simultaneously, radiance brightness is promoted again, when the utility model is used in information products in a large number, can reach color and even brightness effect.
Moreover, the utility model metal pin is charged into rubber base inside, can be by the formed peristome of metal pin two sides, reduce the area of metal pin two sides, rubber base wears peristome 1, improve the polarization of metal pin, and the associativity of metal pin and rubber base, further avoid producing the effect in gap.
In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet appended accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Fig. 1 is the stereogram of known light-emitting diode support structure.
Fig. 2 is the plane graph of known light-emitting diode support structure.
Fig. 3 is first stereogram of the utility model fully-reflected type SMD LED support.
Fig. 4 is second stereogram of the utility model fully-reflected type SMD LED support.
Fig. 5 is first plane graph of the utility model fully-reflected type SMD light-emitting diode support structure.
Fig. 6 is second plane graph of the utility model fully-reflected type SMD LED support.
The main element symbol description:
Known:
10 rubber bases, 11 metal pins
101 functional areas
12 luminescence chips, 13 leads
14 interval blocks
The utility model:
20 metal tablets
30 rubber bases
31 functional areas 32 are block at interval
40 metal pins
41 peristomes
50 luminescence chips
60 leads
70 adhesive layers
Embodiment
See also Fig. 3 and Fig. 4, the utility model provides a kind of fully-reflected type SMD LED support, and it is formed at earlier on the metal tablet 20, and this SMD LED support includes a rubber base 30 and a plurality of metal pin 40.
At first, in accompanying drawing of the present utility model, metal pin 40 quantity are two, and metal pin 40 is plural shape in stamping forming mode, are formed on the metal tablet 20, and metal tablet 20 can be conducting metals such as copper, iron.And rubber base 30 presents plural shape with the affixed two metal pins 40 of the mode of ejection formation on metal tablet 20.Can further use the mode of plating on the metal tablet 20, make the surface of metal pin 40 be formed with layer of metal reflector (not icon) respectively, as the contour reflective metal of silver.
The rubber base 30 external forms shape that roughly is rectangle, it forms the functional areas 31 of a hollow form, and functional areas 31 are rectangle, also can be rounded, oval, square or polygon etc.Rubber base 30 can be a macromolecule non-conducting material spare, as poly-O-phthalic vinegar amine (Polyphthalamide, PPA) etc.
See also shown in Figure 5, metal pin 40 is located at respectively in the functional areas 31 of rubber base 30, and metal pin 40 forward and backward two sides parts protrude in respectively outside the functional areas 31, and be embedded in rubber base 30 inside, make the metal pin 40 of the another part that is positioned at functional areas 31 be obvious from 31 bottoms, functional areas respectively, promptly two metal pins 40 are covered with 31 bottoms in functional areas respectively, improve the reflector space of metal pin 40 in functional areas 31.Wherein, in the functional areas of rubber base 30 31 and form a block 32 at interval, it is in order to the polarity of two metal pins 40 at interval.In addition, the quantity of block 32 can further increase according to the quantity of metal pin 40 at interval.And can further be provided with several peristomes 41 respectively around metal pin 40 forward and backward two sides, and its external form roughly is the semicircle arcuation, and peristome 41 lays respectively at rubber base 30 inside, in order to increase the associativity of metal pin 40 and rubber base 30.
Please consult shown in Figure 4ly again, metal pin 40 left sides or right side extend to outside left and right two sides of rubber base 30 respectively by rubber base 30 inside, extend one section suitable length, and the bent bottom that extends to rubber base 30, with the contact as successive process.
As shown in Figure 6, be the light-emitting diode forming operation.Can put a luminescence chip 50 in the functional areas 31 of rubber base 30; it is fixed in wherein on the metal pin 40; luminescence chip 50 also is connected with two leads 60 and is connected to respectively on the two metal pins 40; in functional areas 31, cover last layer adhesive layer 70 (as epoxy resin etc.); avoid being subjected to the influence of aqueous vapor etc. and damage with protection luminescence chip 50; and luminescence chip 50 can be gold-tinted, blue light etc., can make luminescence chip 50 produce radiance in order to do apply voltage with two metal pins 40.
Outer and be positioned at rubber base 30 by aforementioned the utility model metal pin 40 forward and backward two pleurapophysis for functional areas 31, make the reflector space height of 31 of metal pin 40 and functional areas, luminescence chip 50 can reach the effect of total reflection all around in functional areas 31 to the radiance that produce, and the radiance centrality is good, metallic reflector on the metal pin 40 further increases the effect of radiance reflection simultaneously, radiance brightness is promoted again, when the utility model is used in information products in a large number, can reach color and even brightness effect.
Moreover, metal pin 40 is the element of unlike material with rubber base 30, after finishing, combination process is subject to the factor of material, 40 of rubber base 30 and metal pins easily produce the gap, cause aqueous vapor to infiltrate and damage luminescence chip 50, the utility model metal pin 40 is charged into rubber base 30 inside, can be by the formed peristome 41 of metal pin 40 2 sides, reduce the area of metal pin 40 2 sides, rubber base 30 wears peristome 41, improve the polarization of metal pin 40, and the associativity of metal pin 40 and rubber base 30, further avoid producing the effect in gap.
But; the above only is a preferable possible embodiments of the present utility model; non-so promptly limit to scope of patent protection of the present utility model; so the equivalent structure that uses the utility model specification and accompanying drawing content to do such as changes; all in like manner all be contained in the protection range of the present utility model explanation hereby.

Claims (5)

1, a kind of fully-reflected type SMD LED support is characterized in that, comprising:
One rubber base, it has the functional areas of a hollow form;
A plurality of metal pins, be located at respectively in the functional areas of this rubber base, these metal pin two sides parts protrude in respectively outside these functional areas, and be embedded in this rubber base inside, make the metal pin of the another part that is positioned at these functional areas be obvious from this bottom, functional areas respectively, these metal pin opposite sides extend to outside two sides of this rubber base respectively by this rubber base inside; And
More than one interval block is formed in the functional areas of this rubber base, to separate the polarity of these pins.
2, fully-reflected type SMD LED support as claimed in claim 1 is characterized in that, this rubber base is a macromolecule non-conducting material spare.
3, fully-reflected type SMD LED support as claimed in claim 1 is characterized in that, these functional areas are rectangle, circular, oval, square or polygon.
4, fully-reflected type SMD LED support as claimed in claim 1 is characterized in that, these metal pin surfaces are respectively equipped with a metallic reflector.
5, fully-reflected type SMD LED support as claimed in claim 1 is characterized in that, these metal pin two sides are respectively equipped with several peristomes, and these peristomes are positioned at this rubber base inside respectively.
CNU2006200125493U 2006-04-29 2006-04-29 Total reflection SMD LED supporter Expired - Fee Related CN2904306Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2006200125493U CN2904306Y (en) 2006-04-29 2006-04-29 Total reflection SMD LED supporter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2006200125493U CN2904306Y (en) 2006-04-29 2006-04-29 Total reflection SMD LED supporter

Publications (1)

Publication Number Publication Date
CN2904306Y true CN2904306Y (en) 2007-05-23

Family

ID=38079719

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2006200125493U Expired - Fee Related CN2904306Y (en) 2006-04-29 2006-04-29 Total reflection SMD LED supporter

Country Status (1)

Country Link
CN (1) CN2904306Y (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101916756A (en) * 2010-07-20 2010-12-15 昆山市华英精密模具工业有限公司 Improved SMD-LED (Surface Mount Device-Light Emitting Diode) full color module
CN101483208B (en) * 2008-01-07 2011-10-26 亿光电子工业股份有限公司 LED encapsulation construction and assembling method thereof
CN102800787A (en) * 2012-07-23 2012-11-28 惠州雷曼光电科技有限公司 Surface mount type light-emitting diode (LED) bracket, surface mount type LED and display screen module
EP4270501A1 (en) * 2022-04-24 2023-11-01 Brightek Optoelectronics Co., Ltd. Packaging structure and display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101483208B (en) * 2008-01-07 2011-10-26 亿光电子工业股份有限公司 LED encapsulation construction and assembling method thereof
CN101916756A (en) * 2010-07-20 2010-12-15 昆山市华英精密模具工业有限公司 Improved SMD-LED (Surface Mount Device-Light Emitting Diode) full color module
CN102800787A (en) * 2012-07-23 2012-11-28 惠州雷曼光电科技有限公司 Surface mount type light-emitting diode (LED) bracket, surface mount type LED and display screen module
EP4270501A1 (en) * 2022-04-24 2023-11-01 Brightek Optoelectronics Co., Ltd. Packaging structure and display device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee