CN1816246A - Printed circuit board and formation method - Google Patents
Printed circuit board and formation method Download PDFInfo
- Publication number
- CN1816246A CN1816246A CN 200510006788 CN200510006788A CN1816246A CN 1816246 A CN1816246 A CN 1816246A CN 200510006788 CN200510006788 CN 200510006788 CN 200510006788 A CN200510006788 A CN 200510006788A CN 1816246 A CN1816246 A CN 1816246A
- Authority
- CN
- China
- Prior art keywords
- pcb
- printed circuit
- circuit board
- hole
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The printing circuit board (PCB) includes a base plate and conducting layers. There are through holes on the base plate. First aperture of the through holes is located at one side; and second aperture of the through holes is located at another side; the second aperture is larger than the first aperture. Being setup on walls of through holes, conducting layers are in use for connecting two sides of base plate electrically. Obstruct material are plugged to one side of through holes on PCB; and the other side of through holes are kept unobstructed state in order to adsorb metal conductor in melting state. Cooled melted metal is attached to conducting layer tightly in order to fix PCB on electronic equipment. The said obstruct material prevents any liquid matter from flooding to another surface form one surface in fabrication process.
Description
[technical field]
The present invention relates to a kind of printed circuit board (PCB) and forming method thereof, refer to a kind of printed circuit board (PCB) and forming method thereof especially with via.
[background technology]
Printed circuit board (PCB) is an indispensable element in the electronic industry, and it can be applicable to the mainboard (mother board) of electronic product, with fixing (mount) other electronic components and the cabling of other electronic components is provided.Perhaps printed circuit board (PCB) can also be as a certain half-finished keyset (adapter) to fix these semi-finished product on mainboard.The fabrication steps of known printed circuit board (PCB) includes boring, plating, circuit etching, pressing, anti-welding processing and spray tin ... Deng.When printed circuit board (PCB) used as keyset, wherein a kind of application process was boring and electroplating to produce a via on keyset, is positioned at the circuit in keyset front and the circuit at the keyset back side with electrical connection.Wherein the front of this keyset is used for being provided with an application circuit, and the back side then utilizes above-mentioned via to eat tin to be fixed on the mainboard, is positioned at positive application circuit thus and just can be electrically connected on the circuit of mainboard by via.
Sometimes in order to protect the application circuit oxidation or by outside destroy, the known method of a kind of industry is with application circuit encapsulating die press (mold).The back side of employed mixture (compound) from the via overflow to printed circuit board (PCB) in the pressing mold process must be sealed via in artificial mode with the paster with insulation characterisitic earlier and is positioned at a positive end.In addition, when fixed transfer plate during to mainboard, the paster with insulation characterisitic also can avoid scolding tin to overflow from the back side of printed circuit board (PCB) to positive and make the application circuit short circuit.Yet the shortcoming of this method is when the size of via is dwindled, the unfavorable manual work of meeting.Known another kind of method is to be positioned at a positive end at via to clog a barrier material, and for example: anti-welding glue, an end that makes via be positioned at the back side simultaneously keeps clear, with absorption scolding tin.But this method also has its restriction, be exactly when the aperture of via too hour, the end in the back side possibly can't fully adsorb scolding tin; And when the aperture of via was too big, barrier material can be sunk, and made the positive out-of-flatness of printed circuit board (PCB), the power that the barrier material possibility of clogging simultaneously can't be born pressing mold, and cause the broken glue that overflows in hole.
[summary of the invention]
Therefore, the object of the present invention is to provide a kind of printed circuit board (PCB) and forming method thereof to address the above problem.
The present invention be disclose a kind of printed circuit board (PCB) (printed circuit board, PCB), it includes:
One substrate has through hole on this substrate, and this through hole is corresponding one first aperture in a side of this substrate, and this through hole is corresponding one second aperture in the opposite side of this substrate; And
One conductive layer is arranged at the surface of this through hole, to be electrically connected the both sides of this substrate;
This second aperture is greater than this first aperture.
The present invention also discloses a kind of printed circuit board (PCB), it is characterized in that: it includes:
One substrate has a first surface, a second surface and through hole, and this through hole includes:
One first, it is corresponding one first aperture, one first end of this first is to be connected in this first surface;
One second portion, it is to correspond to one second aperture, and one second end of this first is one first end that connects this second portion, and one second end of this second portion is to be connected in this second surface; And
One conductive layer is arranged at the hole wall of this through hole, to be electrically connected this first surface and this second surface;
Wherein this second aperture is greater than this first aperture.
A barrier material is clogged by the first of through-holes of printed circuit boards of the present invention, and the second portion of through hole then must keep clear to adsorb the metallic conductor of a molten molten state.Can close attachment after should metallic conductor cooling of molten molten state on conductive layer, with fixed printed circuit board on an electronic installation.Barrier material is to be used for isolating first surface and second surface, with avoid in manufacture process any flowing material from the first surface overflow to second surface, perhaps from the second surface overflow to first surface.This of through-holes of printed circuit boards of the present invention second aperture is greater than this first aperture, thereby make the second portion of through hole can fully adsorb scolding tin, the barrier material of the first of through hole filling simultaneously can not sunk, the barrier material that can avoid clogging can't be born the power of pressing mold, and causes the broken glue that overflows in hole.
[description of drawings]
Fig. 1 is the profile of an embodiment of printed circuit board (PCB) of the present invention.
Fig. 2 is the enlarged diagram of a through hole among Fig. 1.
Fig. 3 is the front view of printed circuit board (PCB) shown in Figure 1.
Fig. 4 is the rearview of printed circuit board (PCB) shown in Figure 1.
[embodiment]
See also Fig. 1, Fig. 1 is the profile of an embodiment of printed circuit board (PCB) 10 of the present invention.In the present embodiment, printed circuit board (PCB) 10 includes a substrate 12 and a conductive layer.Substrate 12 has a surperficial S1, a surperficial S2 and is provided with several through holes 22,24,26,28,32.Through hole 22,24,26,28,32 can be divided into two parts up and down according to its diameter again, is respectively 22a and 22b, 24a and 24b, 26a and 26b, 28a and 28b, 32a and 32b.And first half 22a, the 24a of through hole 22,24,26,28,32,26a, 28a, 32a have identical diameter R1 and depth D 1 in the present embodiment, and Lower Half 22b, the 24b of through hole 22,24,26,28,32,26b, 28b, 32b have identical diameter R2 and depth D 2, and diameter R2 is greater than diameter R1.In addition, about the function of conductive layer and will describing in detail hereinafter of pattern.
See also Fig. 2, Fig. 2 is the enlarged diagram of through hole 22 among Fig. 1.As shown in FIG., the part that the hole wall of through hole 22 and through hole 22 are connected with surperficial S1, S2 is provided with a conductive layer 42, for example: copper or gold, being electrically connected surperficial S1 and S2, so through hole 22 and conductive layer 42 promptly constitute a via (via) with electrical characteristic.In the present embodiment, conductive layer 42 is produced in the mode of electroplating, and in addition, the first half 22a of through hole 22 is that the Lower Half 22b that is used for clogging a barrier material 44 through holes 22 then must keep clear to adsorb a metallic conductor that melts molten state.Can close attachment after should metallic conductor cooling of molten molten state on conductive layer 42, with fixed printed circuit board 10 on an electronic installation.In the present embodiment, barrier material 44 is an anti-welding glue (solder mask), and it is to be used for insulation surfaces S1 and surperficial S2, to avoid in manufacture process any flowing material from surperficial S1 overflow to surperficial S2, perhaps from surperficial S2 overflow to surperficial S1.And the diameter R1 of first half 22a is that 0.25 centimetre, depth D 1 are 0.1 centimetre in the present embodiment; The diameter R1 of Lower Half 22b is that 0.5 centimetre, depth D 2 are 0.7 centimetre.This be because if the diameter R1 of first half 22a too conference cause barrier material 44 to be sunk, and then the influence effect of isolating is if the diameter R2 of Lower Half 22b is too little or depth D 2 is not enough then can influence the effect that Lower Half 22b adsorbs above-mentioned metallic conductor.In addition, the end that through hole 22 is positioned at surperficial S1 is coated with an anti-welding material 46 in addition, to avoid through hole 22 and circuit (not shown) short circuit that is arranged on the surperficial S1.Please pay special attention to, anti-welding material 46 also is that above-mentioned anti-welding glue is made flow process to simplify in the present embodiment, but anti-welding material 46 used in the present invention and barrier material 44 also can be used different materials, and present embodiment does not exceed.In addition, through hole 24,26,28,32 can also be arranged in pairs or groups other conductive layers and be formed several vias, and its framework is all identical with through hole 22, so do not give unnecessary details one by one not influencing under the exposure situation of the present invention.
See also Fig. 3, Fig. 3 is the front view of printed circuit board (PCB) 10 among Fig. 1.Annular metal 92,94,96,98,102 shown in the figure is the partially conductive layer 42 that is positioned at surperficial S1 among the 2nd figure, is used for being connected with on every side circuit.Because the front (that is the surperficial S1 shown in the 1st figure) of printed circuit board (PCB) 10 is to be used for being provided with an application circuit.Therefore, surperficial S1 includes several metal gaskets 62,64 and several printed circuit cables 66,68,72,74,76,78,82,84,86,88.Several metal gaskets the 62, the 64th are used for fixing the electronic component of above-mentioned application circuit; Several printed circuit cables 66,68,72,74,76,78,82,84,86,88 then are to be used for being electrically connected above-mentioned electronic component and annular metal 92,94,96,98,102 (that is through hole 22,24,26,28,32 pairing vias) to constitute this application circuit.In the present embodiment, printed circuit board (PCB) 10 must carry out the known pressing mold of an industry in addition after application circuit is set handles, because material is blocked in filling among first half 22a, the 24a of through hole 22,24,26,28,32,26a, 28a, the 32a, though therefore employed mixture is a fluid in the pressing mold process, but this mixture can't flow to the back side (that is surperficial S2 shown in Figure 1) of printed circuit board (PCB) 10 via through hole 22,24,26,28,32, to keep the cleaning of printed circuit board (PCB) 10.
See also Fig. 4, Fig. 4 is the rearview of printed circuit board (PCB) 10 among Fig. 1.Annular metal 112,114,116,118,122 shown in the figure is the partially conductive layer 42 that is positioned at surperficial S2 among the 2nd figure.In the present embodiment, the back side of printed circuit board (PCB) 10 is to be used for being electrically connected on the mainboard of an electronic installation, or on other printed circuit board (PCB)s.Therefore, Lower Half 22b, the 24b of through hole 22,24,26,28,32,26b, 28b, 32b must keep clear, to adsorb the metallic conductor (not shown) of a molten molten state.Because material is blocked in filling among first half 22a, the 24a of through hole 22,24,26,28,32,26a, 28a, the 32a, therefore scolding tin can not overflow to the front of printed circuit board (PCB) 10, in case stop bit is in the application circuit short circuit in front via through hole 22,24,26,28,32 yet.The diameter that note that the through hole first half and Lower Half among the present invention can change to some extent along with the characteristic of barrier material and metallic conductor, do not exceed with the foregoing description, even through hole used in the present invention also can be a conical through-hole.Therefore any through hole with different-diameter all should belong to protection scope of the present invention.
So compared to known techniques, the present invention is provided with a through hole with different-diameter on a printed circuit board (PCB), therefore, can formulate the diameter of through hole according to the process requirement of the different flaggies of printed circuit board (PCB) or process requirements.
The above only is preferred embodiment of the present invention, and is all according to equalization variation and modification that the present invention did, all should belong to protection scope of the present invention.
[main element symbol description]
| 10 | Printed circuit board (PCB) | 12 | Substrate |
| 22、24、26、28、 32 | Through hole | 42 | Conductive layer |
| 44 | Barrier material | 46 | Anti-welding material |
| 62、64 | Metal gasket | 66、68、72、74、 76、78、82、84、 | Printed circuit cable |
| 92、94、96、98、 102、112、114、 116、118、122 | Annular metal | 86、88 | Printed circuit cable |
Claims (12)
1. printed circuit board (PCB), it is characterized in that: it includes:
One substrate has through hole on this substrate, and this through hole is corresponding one first aperture in a side of this substrate, and this through hole is corresponding one second aperture in the opposite side of this substrate; And
One conductive layer is arranged at the surface of this through hole, to be electrically connected the both sides of this substrate;
This second aperture is greater than this first aperture.
2. printed circuit board (PCB) as claimed in claim 1 is characterized in that: this through hole includes:
One first is to should first aperture; And
One second portion to should second aperture, be used for holding a metallic conductor to fix this printed circuit board (PCB) on an electronic installation.
3. printed circuit board (PCB) as claimed in claim 2 is characterized in that: this metallic conductor is a scolding tin.
4. printed circuit board (PCB) as claimed in claim 2, it is characterized in that: it includes in addition:
One barrier material is clogged in this first, to isolate this first surface and this second surface.
5. printed circuit board (PCB) as claimed in claim 4 is characterized in that: this barrier material is anti-welding glue.
6. printed circuit board (PCB) as claimed in claim 4, it is characterized in that: it includes in addition:
One anti-welding material is covered on this barrier material.
7. printed circuit board (PCB), it is characterized in that: it includes:
One substrate has a first surface, a second surface and through hole, and this through hole includes:
One first, it is corresponding one first aperture, one first end of this first is to be connected in this first surface;
One second portion, it is to correspond to one second aperture, and one second end of this first is one first end that connects this second portion, and one second end of this second portion is to be connected in this second surface; And
One conductive layer is arranged at the hole wall of this through hole, to be electrically connected this first surface and this second surface;
Wherein this second aperture is greater than this first aperture.
8. printed circuit board (PCB) as claimed in claim 7 is characterized in that: this second portion is to be used for holding a metallic conductor to fix this printed circuit board (PCB) on an electronic installation.
9. printed circuit board (PCB) as claimed in claim 8 is characterized in that: this metallic conductor is a scolding tin.
10. printed circuit board (PCB) as claimed in claim 7, it is characterized in that: it includes in addition:
One barrier material is clogged in this first, to isolate this first surface and this second surface.
11. printed circuit board (PCB) as claimed in claim 10 is characterized in that: this barrier material is an anti-welding glue.
12. printed circuit board (PCB) as claimed in claim 7 is characterized in that: it includes in addition:
One anti-welding material is arranged on this first end of this first.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100067888A CN100386006C (en) | 2005-02-04 | 2005-02-04 | Printed circuit board and formation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100067888A CN100386006C (en) | 2005-02-04 | 2005-02-04 | Printed circuit board and formation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1816246A true CN1816246A (en) | 2006-08-09 |
| CN100386006C CN100386006C (en) | 2008-04-30 |
Family
ID=36908126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100067888A Expired - Fee Related CN100386006C (en) | 2005-02-04 | 2005-02-04 | Printed circuit board and formation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100386006C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102159033A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for making flared hole on circuit board |
| US8048801B2 (en) | 2007-04-25 | 2011-11-01 | Infineon Technologies, Ag | Substrate with feedthrough and method for producing the same |
| CN102458040A (en) * | 2010-10-28 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN103258933A (en) * | 2012-04-09 | 2013-08-21 | 东莞市久祥电子有限公司 | Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board through copper plating |
| CN105101628A (en) * | 2014-05-07 | 2015-11-25 | 易鼎股份有限公司 | Circuit lapping structure of flexible circuit board |
| CN105122607A (en) * | 2013-04-24 | 2015-12-02 | 罗伯特·博世有限公司 | Circuit carrier, arrangement comprising a circuit carrier, and a method for producing an electrical contact |
| CN111432549A (en) * | 2019-01-09 | 2020-07-17 | 鸿富锦精密工业(武汉)有限公司 | Circuit board |
| CN112333929A (en) * | 2020-11-02 | 2021-02-05 | 梅虞进 | Large-scale integrated circuit chip production processing equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000332111A (en) * | 1999-05-25 | 2000-11-30 | Shinko Electric Ind Co Ltd | Method for forming wire, multi-layered wiring substrate, and substrate device |
| US6772515B2 (en) * | 2000-09-27 | 2004-08-10 | Hitachi, Ltd. | Method of producing multilayer printed wiring board |
-
2005
- 2005-02-04 CN CNB2005100067888A patent/CN100386006C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8048801B2 (en) | 2007-04-25 | 2011-11-01 | Infineon Technologies, Ag | Substrate with feedthrough and method for producing the same |
| CN102458040A (en) * | 2010-10-28 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN102159033A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for making flared hole on circuit board |
| CN103258933A (en) * | 2012-04-09 | 2013-08-21 | 东莞市久祥电子有限公司 | Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board through copper plating |
| CN103258933B (en) * | 2012-04-09 | 2017-05-17 | 东莞市久祥电子有限公司 | Method for preventing glue overflowing in packaging process of wafer-type light-emitting diode (LED) circuit board through copper plating |
| CN105122607A (en) * | 2013-04-24 | 2015-12-02 | 罗伯特·博世有限公司 | Circuit carrier, arrangement comprising a circuit carrier, and a method for producing an electrical contact |
| CN105101628A (en) * | 2014-05-07 | 2015-11-25 | 易鼎股份有限公司 | Circuit lapping structure of flexible circuit board |
| CN111432549A (en) * | 2019-01-09 | 2020-07-17 | 鸿富锦精密工业(武汉)有限公司 | Circuit board |
| CN112333929A (en) * | 2020-11-02 | 2021-02-05 | 梅虞进 | Large-scale integrated circuit chip production processing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100386006C (en) | 2008-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100386006C (en) | Printed circuit board and formation method | |
| US7615707B2 (en) | Printed circuit board and forming method thereof | |
| EP1350417B1 (en) | Method for the production of an electronic component | |
| CN103369868B (en) | A kind of manufacture method of pcb board and pcb board | |
| WO1991014015A1 (en) | Method and materials for forming multi-layer circuits by an additive process | |
| US9706667B2 (en) | Via in a printed circuit board | |
| US7956292B2 (en) | Printed circuit board manufacturing method, printed circuit board, and electronic apparatus | |
| CN1258959C (en) | Forming method of welding convex point | |
| KR100771293B1 (en) | Printed circuit board and method for manufacturing the same | |
| CN109246935B (en) | Manufacturing method of stepped groove with non-metalized side wall | |
| US6675472B1 (en) | Process and structure for manufacturing plastic chip carrier | |
| US20030089522A1 (en) | Low impedance / high density connectivity of surface mount components on a printed wiring board | |
| WO2006098863A1 (en) | A 2-metal flex circuit and a method of manufacturing the same | |
| CN103906354A (en) | Circuit board and method for manufacturing the same | |
| CN101102640A (en) | Printed circuit board and manufacturing method thereof | |
| JP2005322832A (en) | Wiring board and chip-type electronic component using the same | |
| KR101507913B1 (en) | Manufacturing method of printed circuit board | |
| US3396459A (en) | Method of fabricating electrical connectors | |
| KR100632579B1 (en) | How to Form Via Holes in Printed Circuit Boards | |
| CN101460015B (en) | Method and apparatus for mounting at least two types of electronic components | |
| CN211240284U (en) | PCB board that contains blind hole structure | |
| KR20020069675A (en) | Junction method for a flexible printed circuit board | |
| CN116940003A (en) | Double-sided crimping blind hole printed circuit board and manufacturing method thereof | |
| KR100627072B1 (en) | Method of forming through hole structure and through hole structure | |
| CN115087207A (en) | Hole sealing process of FPC substrate and manufacturing method of FPC |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Free format text: FORMER OWNER: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131212 Owner name: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131212 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 213166 CHANGZHOU, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20131212 Address after: 213166 Wujin high tech Industrial Development Zone, Jiangsu Province, Yang Lake Road, No. 88 Patentee after: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Patentee after: Lite-On Technology Corporation Address before: Taipei City, Taiwan, China Patentee before: Lite-On Technology Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080430 Termination date: 20170204 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |