CN102458040A - A printed circuit board - Google Patents

A printed circuit board Download PDF

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Publication number
CN102458040A
CN102458040A CN 201010523399 CN201010523399A CN102458040A CN 102458040 A CN102458040 A CN 102458040A CN 201010523399 CN201010523399 CN 201010523399 CN 201010523399 A CN201010523399 A CN 201010523399A CN 102458040 A CN102458040 A CN 102458040A
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CN
China
Prior art keywords
circuit board
printed circuit
opening
layer
copper foil
Prior art date
Application number
CN 201010523399
Other languages
Chinese (zh)
Inventor
白育彰
赖盈佐
Original Assignee
鸿富锦精密工业(深圳)有限公司
鸿海精密工业股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 鸿富锦精密工业(深圳)有限公司, 鸿海精密工业股份有限公司 filed Critical 鸿富锦精密工业(深圳)有限公司
Priority to CN 201010523399 priority Critical patent/CN102458040A/en
Publication of CN102458040A publication Critical patent/CN102458040A/en

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Abstract

The invention discloses a printed circuit board. One layer of the printed circuit board is provided with copper foil, a plug-in hole and a heat radiation preventing groove, wherein the copper foil is paved on the surface of the layer; the plug-in hole passes through the whole printed circuit board; the heat radiation preventing groove is arranged in the surface of the layer and is not covered by the copper foil; and the heat radiation preventing groove is surrounded at the circumference of the plug-in hole and comprises a first opening facing to a power supply device on the printed circuit board and a second opening not communicated with the first opening. The printed circuit board has a better effect for preventing cold welding.

Description

印刷电路板 A printed circuit board

技术领域 FIELD

[0001] 本发明涉及一种印刷电路板。 [0001] The present invention relates to a printed circuit board. 背景技术 Background technique

[0002] 印刷电路板的电源层及接地层为了有较低的阻抗,一般都会铺设大面积的铜箔。 [0002] The power source layer and the ground layer of the printed circuit board in order to have a low impedance, usually a large area of ​​laying a copper foil. 如此,当连接到电源层和接地层的插件经过锡炉加热后,若插件的接脚没有做适当的热隔离,热就会迅速的被电源层及接地层上大面积的铜箔带走,从而使得电源层及接地层的贯孔吃锡率低而造成冷焊,即不容易将插件焊接上。 Thus, when connected to the power supply layer and the ground layer of the plug after heating furnace, if the plug pins do not proper thermal insulation, heat will be carried away quickly from the copper foil large area power and ground planes, such that the through hole of the power and ground planes low tin of food caused by cold welding, i.e. the plug is not easily welded.

发明内容 SUMMARY

[0003] 鉴于以上内容,有必要提供一种防止冷焊效果佳的印刷电路板。 [0003] In view of the above, it is necessary to provide an excellent effect of the printed circuit board to prevent cold welding.

[0004] 一种印刷电路板,其一层上设置有一铜箔、一插件孔及一防散热凹槽,该铜箔铺设于该层的表面,该插件孔贯穿整个印刷电路板,该防散热凹槽为设置于该层表面的凹槽且不被铜箔所覆盖,该防散热凹槽环绕于插件孔的周围且包括一朝向位于该印刷电路板上的电源供应器的第一开口及一不与该第一开口相连通的第二开口。 [0004] A printed circuit board is provided with a copper foil, an insert hole and a heat prevention recess, a copper foil laid on the surface of the layer, the plug hole through the entire printed circuit board, on which the heat radiation preventing layer grooves are provided in the recess of the layer surface is not covered with the copper foil, the periphery of the heat radiation preventing circumferential groove in a plug hole and comprising a first opening positioned toward the power supply of the printed circuit board and a a second opening communicating with the first opening not.

[0005] 上述印刷电路板通过设置防散热凹槽减小了插件孔周围铜箔的散热面积,减慢了该印刷电路板经过回流焊后的散热速度,避免了因散热过快而导致的插件组件出现冷焊的情况。 [0005] The printed circuit board is reduced by providing the groove preventing heat of the copper foil around the plug hole cooling area, it slows the cooling rate of the printed circuit board after reflow, to avoid excessive plug cooling caused by case of cold welding components appear.

附图说明 BRIEF DESCRIPTION

[0006] 图1是本发明印刷电路板的较佳实施方式的示意图。 [0006] FIG. 1 is a schematic view of a preferred embodiment of the present invention is a printed circuit board.

[0007] 图2是本发明印刷电路板的另一较佳实施方式的示意图。 [0007] FIG. 2 is a schematic diagram of another preferred embodiment of the present invention is a printed circuit board.

[0008] 主要元件符号说明 [0008] Main reference numerals DESCRIPTION

[0009] 电源层 10 [0009] The power supply layer 10

[0010]铜箔 12 [0010] The copper foil 12

[0011] 插件孔 15 [0011] plug bore 15

[0012] 防散热凹槽 16 [0012] Anti-radiating groove 16

[0013] 电源供应器 18 [0013] Power supply 18

[0014]第一开口 160 [0014] The first opening 160

[0015]第二开口 162 [0015] The second opening 162

[0016]第三开口 165 [0016] The third opening 165

具体实施方式 Detailed ways

[0017] 下面结合附图及较佳实施方式对本发明作进一步详细描述: [0017] The present invention will be described in further detail in conjunction with the accompanying drawings and preferred embodiments:

[0018] 请参考图1,本发明印刷电路板的较佳实施方式包括一电源层10及一电源供应器18。 [0018] Referring to FIG 1, a preferred embodiment of the present invention is a printed circuit board 10 includes a power source layer 18, and a power supply. 该电源层10上设置有一层铜箔12、一插件孔15、一防散热凹槽(Thermal Relief) 16。 The power supply layer 10 disposed on a layer of copper foil 12, an insert hole 15, a heat radiation preventing recess (Thermal Relief) 16. 本实施方式中,假设该电源供应器18设置于整个印刷电路板的顶层,则该电源供应器18设置于电源层10上。 The present embodiment, it is assumed that the power supply 18 disposed on top of a whole printed circuit board, the power supply 18 disposed on the power supply layer 10. 其它实施方式中,该电源供应器18—般设置于整个印刷电路板的顶层或底层,且通过其它的过孔与电源层10以及接地层相连。 In other embodiments, the power supply 18 as provided in the top or bottom of the entire printed circuit board, and the other connected through vias to the power source layer 10 and ground layer.

[0019] 该铜箔12铺设于该电源层10的表面。 [0019] The copper layer 12 is laid on the surface 10 of the power supply. 该插件孔15贯穿整个印刷电路板,用于使得插入该插件孔15的组件的引脚对应与印刷电路板的电源层10、接地层或者讯号层上的传输线相连通,比如当组件的电源引脚与电源层相连,接地引脚则对应与接地层相连。 The plug aperture 15 through the entire printed circuit board, a power supply layer such that the corresponding pin of the printed circuit board assembly 15 is inserted into the plug hole 10, the ground layer or layers of the transmission line on the signal in communication, such as when the power source lead assembly feet and is connected to the power supply layer, a ground pin is connected to the corresponding ground layer.

[0020] 该防散热凹槽16为一设置于电源层10表面的凹槽且不被铜箔12所覆盖,其深度大于或等于铜箔12的厚度即其穿透该铜箔12,该凹槽呈环形设置于该插件孔15的周围。 [0020] The anti-radiating groove 16 is a groove provided on the surface of the power supply layer 10 is not covered by the copper foil 12 having a depth greater than or equal to the thickness of the copper foil 12, i.e., it penetrates the foil 12, the recess an annular groove is provided around the plug hole 15. 该防散热凹槽16还开设有一第一开口160及一长度较小的第二开口162,其中,该防散热凹槽16的第一开口160朝向该电源供应器18的输出端,且第一开口160不与该第二开口162相连通。 The heat radiation preventing further recess 16 defines a first opening 160 and a small length of the second opening 162, wherein the anti-heat output terminal toward a first recess 160 opening 16 of the power supply 18, and the first the opening 160 is not connected to the second through opening 162. 本实施方式中,该防散热凹槽16的开口的长度可以设置为凹槽长度的三分之一。 In the present embodiment, the length of the opening 16 of the recess preventing heat radiation can be set to one third of the length of the groove. 当然其它实施方式中该开口的长度可以适当调整。 Of course, in other embodiments the length of the opening may be appropriately adjusted.

[0021] 如此,当组件插接于印刷电路板的插件孔15中时,由于防散热凹槽16将插件孔15 部分包围起来,从而减小了插件孔15周围铜箔12的散热面积,减慢了该印刷电路板经过回流焊后的散热速度,避免了因散热过快而导致的插件组件出现冷焊的情况。 [0021] Thus, when the assembly is inserted in the plug hole 15 in a printed circuit board, since the anti-radiating portion of the insert 15 to the recess 16 surrounded by the hole, thereby reducing the heat dissipation area of ​​the copper foil 15 around the plug hole 12, reducing the slow rate of heat through the printed circuit board after reflow, to avoid excessive heat due to the plugin component caused by cold welding occurs. 另外,防散热凹槽16并未将该插件孔15完全封闭,从而使得电源层10上的铜箔12仍为一个整体,使得电源层10仍然具有较低的阻抗。 Further, heat radiation preventing groove 16 is not completely closed the plug hole 15, so that the foil 10 on a power layer 12 remains integral, so that the power supply layer 10 still has a low impedance. 更进一步,由于该防散热凹槽16的开口朝向该电源供应器18的输出端,从而可以有效地缩短组件的接脚与电源供应器18的输出端之间的距离,以降低组件的接脚到电源供应器18之间的电阻值。 Still further, since the heat radiation preventing recess towards the opening 16 of the power supply output terminal 18, so as to effectively shorten the distance between the output end of the assembly pin and the power supply 18 to reduce the pin assembly the resistance value between the power supply 18. 并且,该防散热凹槽16还增加了第二开口162,以改善插件孔15受热不均之问题。 Further, the recess 16 preventing further increases the heat dissipation of the second opening 162, plug holes 15 in order to improve the problem of uneven heating.

[0022] 本实施方式以电源层10为例进行说明,其它实施方式中,该防散热凹槽16亦可设置于其它层上。 [0022] In the present embodiment, the power supply layer 10 as an example, in other embodiments, the recess 16 may also be provided preventing heat on other layers. 另外,该防散热凹槽16的形状亦可根据设计者的需要选择,只需满足该防散热凹槽16环绕在插件孔15的周围且其第一开口160朝向该电源供应器18的输出端即可。 Further, the shape of the groove 16 preventing heat radiation may also be selected according to the designer's needs, just meet its first end toward the output opening 160 of the power supply 18 to the heat sink preventing recess 16 surrounds the hole 15 and plug It can be.

[0023] 请参考图2,其它实施方式中,该防散热凹槽16可包括第一开口160、第二开口162 及第三开口165,其中第一开口160朝向电源供应器18的输出端,且第一开口160、第二开口162以及第三开口165均不相连通。 [0023] Please refer to FIG 2, in other embodiments, the anti-cooling groove 16 may include a first opening 160, second opening 162 and third opening 165, wherein opening 160 toward the first power supply output terminal 18, and the first opening 160, second opening 162 and a third opening 165 are not in communication. 当然其它实施方式中,该防散热凹槽16还可开设有更多开口。 Of course, in other embodiments, the recess 16 may also preventing heat more defines an opening.

Claims (5)

1. 一种印刷电路板,其一层上设置有一铜箔、一插件孔及一防散热凹槽,该铜箔铺设于该层的表面,该插件孔贯穿整个印刷电路板,该防散热凹槽为设置于该层表面的凹槽且不被铜箔所覆盖,该防散热凹槽环绕于插件孔的周围且包括一朝向位于该印刷电路板上的电源供应器的第一开口及一不与该第一开口相连通的第二开口。 1. A printed circuit board is provided thereon with a layer of copper, a plug-in hole and a heat prevention recess, a copper foil laid on the surface of the layer, the plug hole through the entire printed circuit board, the heat radiation preventing recess grooves are provided in the recess of the layer surface is not covered with the copper foil, the heat radiation around the circumferential groove in the anti-plug hole comprises a first opening and a power supply located toward the printed circuit board and is not a a second opening communicating with the first opening.
2.如权利要求1所述的印刷电路板,其特征在于:该防散热凹槽的深度均大于或等于该铜箔的厚度。 2. The printed circuit board according to claim 1, wherein: the depth of the groove is greater than the heat dissipation preventing or equal to the thickness of the copper foil.
3.如权利要求1所述的印刷电路板,其特征在于:该防散热凹槽为弧形。 The printed circuit board according to claim 1, wherein: the arcuate recess preventing heat.
4.如权利要求3所述的印刷电路板,其特征在于:该防散热凹槽呈环形设置于插件孔的周围。 4. The printed circuit board according to claim 3, wherein: the anti-shape around the annular cooling groove is provided in the plug hole.
5.如权利要求1所述的印刷电路板,其特征在于:该防散热凹槽还包括一第三开口,该第三开口与第一及第二开口均不相连通。 The printed circuit board according to claim 1, wherein: the recess preventing further comprises a third heat opening, the third opening and the first and second openings are not in communication.
CN 201010523399 2010-10-28 2010-10-28 A printed circuit board CN102458040A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN 201010523399 CN102458040A (en) 2010-10-28 2010-10-28 A printed circuit board

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5451720A (en) * 1994-03-23 1995-09-19 Dell Usa, L.P. Circuit board thermal relief pattern having improved electrical and EMI characteristics
US20020180004A1 (en) * 2001-04-25 2002-12-05 International Business Machines Corporation Circuitized substrate for high-frequency applications
CN1816246A (en) * 2005-02-04 2006-08-09 光宝科技股份有限公司 Printed circuit board and formation method
CN1956625A (en) * 2005-10-24 2007-05-02 鸿富锦精密工业(深圳)有限公司 A printed circuit board
CN201608971U (en) * 2009-10-28 2010-10-13 国基电子(上海)有限公司;鸿海精密工业股份有限公司 Circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5451720A (en) * 1994-03-23 1995-09-19 Dell Usa, L.P. Circuit board thermal relief pattern having improved electrical and EMI characteristics
US20020180004A1 (en) * 2001-04-25 2002-12-05 International Business Machines Corporation Circuitized substrate for high-frequency applications
CN1816246A (en) * 2005-02-04 2006-08-09 光宝科技股份有限公司 Printed circuit board and formation method
CN1956625A (en) * 2005-10-24 2007-05-02 鸿富锦精密工业(深圳)有限公司 A printed circuit board
CN201608971U (en) * 2009-10-28 2010-10-13 国基电子(上海)有限公司;鸿海精密工业股份有限公司 Circuit board

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