CN1805651A - Compound wired circuit board - Google Patents

Abstract

The invention provides a circuit wiring composite substrate thinned by decreasing the total thickness of a composite structure of an RPC and an FPC. The circuit wiring composite substrate comprises at least one of rigid circuit board 1a in which a circuit wiring layer is formed on a rigid insulating substrate 2a, and a first and a second flexible circuit boards 11a and 11b in which circuit wiring layers are formed on flexible insulating substrates 12a and 12b, respectively. The first and the second flexible circuit boards 11a and 11b, respectively, have overlapped part Xa1 and Xb1 which is overlapped and fixed on respective sides of the board surfaces of the rigid circuit board, and deformable parts Ya and Yb which are not overlapped with the board surfaces. In the position where the rigid circuit board is overlapped with the flexible circuit boards, at least one of interlayer conduction path for electrically connecting circuit wiring layers of these circuit boards is made to go through.

Description

Compound wired circuit board

Technical field

The present invention relates to make up the compound wired circuit board of rigidity circuit board and flexible printed circuit board, particularly related to and be suitable for the compound wired circuit board installed on mobile phone and the miniaturized electronicss such as digital vedio recording, camera.

Background technology

For example so more and more slimming and lightweights of miniaturized electronics such as mobile phone, digital vedio recording, camera, corresponding therewith, electronic units such as circuit function element and wiring substrate are on the equipment that can be installed in little space, and its technological development develops to densification and light-weighted direction.

Along with functional requirement is increased, the wiring substrate is to the multifunction development, and seeks to help the structure of taking in to the equipment in little space.In the past, as an example of the circuit board that is fit to such structure, had and made up rigidity than higher rigidity circuit board (hereinafter referred to as RPC) with have the compound wired circuit board of the flexible printed circuit board (hereinafter referred to as FPC) of flexibility.Above-mentioned RPC is mainly used in circuit function elements such as integrated circuit component is installed, and above-mentioned FPC mainly undertakes the effect of internal circuit connecting line and transmission line etc.Above-mentioned FPC has flexibility, thereby can be out of shape and be accommodated in the little space.

This available circuit wiring composite base plate has above-mentioned FPC in its thick direction in central authorities, on its a part of two sides RPC is arranged respectively.In other words, in above-mentioned FPC and the overlapping part of above-mentioned RPC, above-mentioned FPC has constituted the internal layer as core, and above-mentioned RPC has constituted skin.

Also have, in order to be electrically connected each wiring layer of RPC and FPC mutually in these RPC and the overlapping part of FPC, for example form through hole (through hole) by punch, embodiment such as metal-plated in this through hole and form interlayer conduction road to above-mentioned each wiring layer (for example, with reference to flexible rigid construction printed base plate of the Fig. 4 of the open 2003-133728 communique of Japan's patent application).

Summary of the invention

Yet in above-mentioned prior art, widely used insulated substrate is made of for example glass epoxy resin material and polyimide resin material respectively among above-mentioned RPC and the FPC.The thickness of each insulated substrate is respectively the degree of 0.8mm and the degree of tens of μ m, and promptly RPC is thick more than FPC.

Like this, in thick above-mentioned RPC overlapped structure on the two sides of FPC, this part just had maximum thickness in whole composite base plate, and this thickness has determined the gross thickness of composite base plate.Also have,,, just need to strengthen the thickness of the above-mentioned metal-plated on the above-mentioned through hole inwall in order to ensure the reliability of interlayer conduction if this thickness is excessive.

Generally through hole is being implemented simultaneously the wiring layer that is in ragged edge of RPC is also implemented plating in the operation of thick metal-plated.As a result, the thickness that is in the wiring layer of ragged edge becomes big, and the overall flat degree of RPC outer surface descends, and when wanting to carry out the wiring figure of next, is difficult to carry out the formation of fine pattern, and this is the problem that exists.

Have again, because the overlapping part of RPC and FPC is thick, the long processing time of the formation of the through hole that punch carried out, punch is changed the frequency height, and the thick metal-plated on the through hole forms operation will increase the time.Just increase the process time made in one piece of compound wired circuit board thus, caused the increase of product cost.

The present invention proposes in order to address the above problem a little, a kind of gross thickness of the composite construction that has reduced RPC and FPC is provided and slimming compound wired circuit board.

According to an aspect of the present invention, compound wired circuit board is the compound wired circuit board of the 1st and the 2nd flexible printed circuit board that has at least one rigidity circuit board of comprising rigid insulation substrate and wiring layer and comprise the film like of flexible insulation substrate and wiring layer, the the above-mentioned the 1st and the 2nd flexible printed circuit board has with the two sides of above-mentioned rigidity circuit board overlapping respectively separately, the lap of having fixed and with the nonoverlapping deformable segment in above-mentioned two sides, and above-mentioned lap have each the wiring floor that is electrically connected this each circuit board perforation at least one interlayer conduction road.

Preferably, above-mentioned interlayer conduction road has connected above-mentioned the 1st, the 2nd flexible printed circuit board and above-mentioned rigidity circuit board.

Also have, preferably, above-mentioned rigidity circuit board is included in direction the separated from each other and juxtaposed the 1st and the 2nd rigidity circuit board with the thickness direction quadrature of above-mentioned rigidity circuit board, and the above-mentioned the 1st and the 2nd flexible printed circuit board is configured in the mode that the above-mentioned the 1st and the 2nd rigidity circuit board is built bridge.

Also have, preferably, above-mentioned rigidity circuit board is included in direction the separated from each other and juxtaposed the 1st and the 2nd rigidity circuit board with the thickness direction quadrature of composite base plate, above-mentioned the 1st flexible printed circuit board to be being configured the mode of each the 1st bridge formation of the above-mentioned the 1st and the 2nd rigidity circuit board, above-mentioned the 2nd flexible printed circuit board only with the above-mentioned the 1st and the 2nd rigidity circuit board in some the 2nd overlapping.

Have again, preferably, in compound wired circuit board, by at the compound wired circuit board that constitutes with the direction the separated from each other and juxtaposed the 1st of the thickness direction quadrature of above-mentioned composite base plate and the 2nd rigidity circuit board and the above-mentioned the 1st and the 2nd flexible printed circuit board that is configured in the mode that the above-mentioned the 1st and the 2nd rigidity circuit board is built bridge as the 1st unit bodies, by with the direction the separated from each other and juxtaposed the 1st and the 2nd rigidity circuit board of the thickness direction quadrature of above-mentioned composite base plate, above-mentioned the 1st flexible printed circuit board that is configured in the mode that the face of each side's side of the above-mentioned the 1st and the 2nd rigidity circuit board is built bridge and overlapping with the face of the opposing party's side of above-mentioned the 2nd rigidity circuit board, the compound wired circuit board that constitutes with nonoverlapping above-mentioned the 2nd flexible printed circuit board of the face of the opposing party's side of above-mentioned the 1st rigidity circuit board is as the 2nd unit bodies, overlapping optional a plurality of unit bodies from the above-mentioned the 1st and the 2nd unit bodies and constituting, at least one in the above-mentioned lap of above-mentioned flexible printed circuit board is configured in outermost layer.

Also have, according to a further aspect in the invention, compound wired circuit board has: the rigidity circuit board that comprises rigid insulation substrate and wiring layer; Only have that with above-mentioned rigidity circuit board the 1st is overlapping, the lap fixed and with the flexible printed circuit board of the nonoverlapping deformable segment of above-mentioned plate face; And at least one interlayer conduction road that has connected the above-mentioned lap of above-mentioned flexible printed circuit board and the wiring floor that is electrically connected above-mentioned flexible printed circuit board.

Preferably, compound wired circuit board is characterized in that, above-mentioned interlayer conduction road has connected above-mentioned flexible printed circuit board and above-mentioned rigidity circuit board.

Aspect any one, preferably, compound wired circuit board is characterized in that above-mentioned, on the part of the above-mentioned deformable segment of above-mentioned flexible printed circuit board lamination other rigidity circuit board.Also have, preferably, compound wired circuit board is characterized in that, above-mentioned rigidity circuit board is lamination a plurality of rigidity circuit board veneer and the multilayer laminated boards structure that constitutes.Also have, preferably, compound wired circuit board is characterized in that, with at least a portion of the overlapping flexible printed circuit board of above-mentioned rigidity circuit board comprise lamination a plurality of flexible printed circuit board veneers.Also have, preferably, compound wired circuit board is characterized in that, the wiring layer of flexible printed circuit board is one deck at the thickness direction of substrate.Also have, preferably, compound wired circuit board is characterized in that, exposes on the face with at least one of lap above-mentioned rigidity circuit board above-mentioned flexible printed circuit board, comprises to have the wiring layer figure that electronic unit is installed the welding disk of usefulness.

According to the present invention, constitute, core with rigidity circuit board (RPC) forming circuit wiring composite base plate, overlapping respectively, the fixing contact portion of supporting a plurality of flexible printed circuit boards (FPC) on two plate faces of this rigidity circuit board, thereby the thickness of lap of the RPC of the maximum ga(u)ge in the compound wired circuit board and FPC and the gross thickness of composite base plate compared with prior art, have been reduced to become significantly.

Therefore, this composite base plate is than former slimming, improved taking in property to the electronic equipment cabinet space of more and more narrower change, can reduce the degree of depth and plating layer thickness thereof that interlayer conduction road forms the through hole of usefulness, thereby have its processing technology time of shortening and the fine pattern on next the wiring figure of compound wired circuit board is formed effects such as easy acquisition.

Description of drawings

Fig. 1 is the local vertical profile perspective view of the related compound wired circuit board of expression the 1st execution mode of the present invention.

Fig. 2 is the vertical section of the related compound wired circuit board of expression the 2nd execution mode of the present invention.

Fig. 3 is the vertical section of the related compound wired circuit board of expression the 4th execution mode of the present invention.

Fig. 4 be used to illustrate interlayer conduction road involved in the present invention concrete example compound wired circuit board want portion's enlarged perspective.

Fig. 5 be used to illustrate interlayer conduction road involved in the present invention concrete example compound wired circuit board want portion's enlarged perspective.

Fig. 6 is the local vertical profile perspective view of the related compound wired circuit board of expression the 6th execution mode of the present invention.

Embodiment

Below, the 1st to the 6th execution mode of compound wired circuit board involved in the present invention is described referring to figs. 1 through Fig. 6 respectively.

The 1st execution mode:

Fig. 1 is the perspective view that provides the local vertical section of the compound wired circuit board of representing the 1st execution mode of the present invention.This compound wired circuit board has made up rigidity than higher a plurality of rigidity circuit boards (RPC) for example 1RPC 1a and 2RPC 1b and a plurality of flexible printed circuit boards (FPC) for example 1FPC 11a and 2FPC 11b with film like of flexibility.Above-mentioned RPC is undertaking the task that the circuit function element is installed, and above-mentioned FPC is mainly undertaking the task of internal circuit connecting line, transmission line etc.Above-mentioned FPC has flexibility, thereby can be out of shape and be accommodated in the little space.

Above-mentioned the 1st, 2RPC is in the central authorities of the thickness direction of this composite base plate, has constituted the internal layer of the core that becomes composite base plate.On the two sides that above-mentioned each FPC is overlapping, be configured in above-mentioned RPC, constituted the skin of composite base plate.

Above-mentioned the 1st, 2RPC 1a and 1b are separated from each other and and put with the direction of the thickness direction quadrature of composite base plate.All be on the two sides separately of rigid insulation substrate 2a that has for example used the glass epoxy resin material and 2b, to have a plurality of wiring layer 3a and the 3b that the wiring figure by the Copper Foil that adopts the printed circuit board wiring technology to make forms, promptly have the two sides Wiring structure.

The above-mentioned the 1st and 2FPC 11a and 11b be in for example position relation on opposite, all be to be configured in respectively on the upper and lower surface of each RPC in the mode that above-mentioned RPC 1a and 1b are built bridge.The above-mentioned the 1st and 2FPC have on the single face of flexible insulation substrate 12a and 12b that wiring figure by the Copper Foil that adopts the printed circuit board wiring technology to make forms a plurality of wiring layer 13a and 13b, promptly have the single face Wiring structure.

These wiring layers 13a and 13b on the flexible insulation substrate, at transverse direction along its plate face, in other words, the direction parallel with the plate face, with the direction of the configuration direction quadrature of above-mentioned rigid insulation substrate 2a, 2b, as a plurality of wiring layers and mutually and put.On the other hand, these wiring layers 13a and 13b with the direction of the plate face quadrature of flexible insulation substrate, promptly thickness direction all is configured as one deck Wiring structure.

Here, even superimposed a plurality of conductive material layer of wiring layer and the thing of integrated formation as long as have same function, in fact just can be regarded one deck Wiring structure as.

The flexible insulation substrate 12a of above-mentioned FPC and 12b with have for example using of flexibility the high film of surface smoothness of polyimide resin material form, have whole flexible insulation substrate 12a, the 12b surface that covers above-mentioned wiring layer 13a, 13b and have a side of these wiring layers of cover film 14a, 14b of the insulating properties of flexibility.

This cover film 14a, 14b use for example polyimide resin, are used to protect above-mentioned wiring layer 13a, 13b surface.The outer surface of cover film 14a, 14b is formed the occasion of other wiring layer thereon again by wiring figure, form level and smooth and smooth surface in order to form fine pattern easily.

The above-mentioned the 1st and 2FPC 11a and 11b have lap Xa1, Xa2 and Xb1, Xb2, in this part, make the above-mentioned the 1st and 2FPC 11a and 11b and the 1st and 2RPC 1a, 1b are overlapping, fixing respectively.Have again, the above-mentioned the 1st and 2FPC 11a and 11b have part Ya and the Yb that does not overlap each other with above-mentioned RPC respectively, this part deformability.When taking in the wiring composite base plate, being assembled in the electronic device circuitry, can make the deformable segment Ya of above-mentioned FPC and Yb Free Transform be shapes such as crooked and distortion.Particularly as present embodiment, the structure that above-mentioned FPC 11a and 11b build bridge between RPC 1a, 1b, and between above-mentioned deformable segment Ya and Yb for the structure of hollow is same structure, thereby become the outstanding thing of bendability.

The above-mentioned the 1st and lap Xa1, the Xa2 of 2FPC and Xb1, Xb2 and the 1st and the fastened to each other of 2RPC 1a, 1b be to be undertaken by the hot pressing of these parts, the epoxy resin of the Thermocurable that comprises among rigid insulation substrate 2a, the 2b by above-mentioned RPC is bonding mutually to fix.Also have, this mutual bonding above-mentioned hot pressing that is not limited to also can be carried out with bonding material.

Herein, the amount of information of packing in the equipment is many more, and the quantity of undertaking the wiring layer on the FPC of task of transmission line of information just needs to increase more.In above-mentioned prior art,,, and have on the two sides, be provided with not only on the single face of insulated substrate as the wiring layer on the single FPC of core, so the rigidity of FPC increases for the increase of corresponding informance amount.That is, the leisure decline of the distortion of FPC, but, in contrast to this, FPC in the present embodiment have on rigidity circuit board 1a and 1b build bridge, relative a plurality of (for example 2) FPC 11a and 11b, even thereby above-mentioned single face Wiring structure, also can have many wiring layer quantity.

Therefore, among each FPC 11a of present embodiment and the 11b certain is made one deck Wiring structure of single face wiring, can keep can high crooked flexibility, can keep or improve the easiness of taking in of composite base plate to cabinet space, and guarantee more wiring layer quantity easily.And above-mentioned FPC is owing to its high bendability has improved reliability as the cloth wire rod.

Also have, above-mentioned FPC 11a and 11b are in the outermost configuration relation of forming circuit wiring composite base plate, thereby in the occasion of wanting to form other wiring layer in the position corresponding with above-mentioned RPC, just can with lap Xa1, the Xa2 of the overlapping above-mentioned FPC of this RPC on form above-mentioned other wiring layer by wiring figure.

The insulated substrate of the glass epoxide system of above-mentioned the 1st, 2RPC 1a, 1b is the thing that has flooded epoxy resin in the glass fibre of braiding, because that the mesh of glass fibre causes is concavo-convex, the flatness of insulated substrate surface and wiring layer is poor.Therefore, as prior art, disposed the occasion of RPC at outermost layer, the fine pattern that just is difficult to carry out wiring layer forms.Having an even surface and smoothly of lap Xa1, the Xa2 of above-mentioned FPC in the present embodiment, thereby just carry out fine pattern formation easily at the wiring layer that the lap as outermost above-mentioned FPC forms, can make the spacing granular between a plurality of wiring layers.

As mentioned above, the compound wired circuit board of present embodiment, core as the internal layer that constitutes this composite base plate, have the 1st in the central authorities of the thickness direction of substrate, 2RPC 1a, 1b, have minimal thickness the 1st, 2FPC 11a, 11b, they clip these RPC from the two sides and constitute the skin of composite base plate.Therefore, the gross thickness that becomes the thickness of lap of the RPC of the maximum ga(u)ge in the compound wired circuit board and FPC and composite base plate has compared with prior art reduced significantly.

Come the words of comparison thickness with numerical value, adopted in use the about 0.8mm of thickness glass epoxy resin RPC and adopted the occasion of FPC of the polyimide film of the about 25 μ m of thickness, only from the thickness of insulated substrate, the thickness of above-mentioned overlapping portion, has reduced by half to about 0.85mm (present embodiment) substantially from about 1.63mm (prior art).

Like this slimming composite base plate, and compared in the past, significantly help taking in to the little space of the electronic equipment internal of densification more and more.Particularly make FPC high crooked, folding and be installed on occasion in the equipment box, more help taking at foregoing circuit wiring composite base plate.

Generally,, need obtain the conducting between substrate in order to supply with the signal of telecommunication, electric power in the part of overlapping substrate.Particularly, be through hole to be set at overlapping, in through hole, implement plating and conduct electricity the road between cambium layer.

Overlapping at above-mentioned RPC and FPC is provided with through hole, implement plating and the occasion on conduction road between cambium layer in through hole, because the gross thickness of this overlapping portion is little, through hole formation just is easy to, this plating layer thickness is littler than in the past, but also can fully obtain the conducting reliability of interlayer.

Therefore, for process time of forming this interlayer conduction road than significantly having shortened in the past.Also have, plating layer thickness in the through hole can reduce, thereby the plating layer thickness of the outermost wiring layer of the compound wired circuit board that derives from the plating operation also can reduce just acquisition easily of the formation of the fine pattern on the wiring figure of the wiring layer of Xing Chenging secondarily.

Have again, can obtain long lifetime, the effects such as shortening of plating time of the through hole shortening of process time, punch, multiply each other, just can realize the reduction of product cost by these effects.

The 2nd execution mode:

Fig. 2 is the longitudinal section of compound wired circuit board of expression the 2nd execution mode of the present invention, for above-mentioned the 1st execution mode in the component parts parts that function is identical in fact of compound wired circuit board pay with same numeral, omit its explanation.

In the present embodiment, with respect to 1RPC 1a, in the drawings the direction of representing to the right side separately and and put 3RPC 1c.This 3RPC 1c is a multi-layer circuit structure.That is, the compound wired circuit board of present embodiment have on the two sides printed wiring respectively a plurality of wiring layer 3c1 ground floor rigid insulation substrate 2c1 and thereon lamination second layer rigid insulation substrate 2c2.Second layer rigid insulation substrate 2c2 in the drawings in the above the expression the surface on printed wiring wiring layer 3c2.

The 2FPC 11b of above-mentioned below has and the 1st and corresponding respectively lap Xb1 and the Xb3 of 3RPC 1a and 1c, and with these the 1st, the nonoverlapping deformable segment Yb of 3RPC 1a, 1c.Below the above-mentioned 3RPC 1c, on partly overlapping, as to be fixed on above-mentioned 2FPC 11b side's lap Xb3, which FPC all to be contactless state with above it.

The above-mentioned the 1st and 2RPC 1a and 1b above the 1FPC 11a of configuration, same with the 1st execution mode, have with the lap Xa1 of above-mentioned RPC 1a and 1b and Xa2 and with the nonoverlapping deformable segment Ya of these RPC.Top and the above-mentioned contact portion Xa2 of a side of above-mentioned 2RPC 1b is overlapping, fixing.Following and the above-mentioned 2FPC11b of above-mentioned 2RPC 1b is not overlapping, with which FPC all be contactless state.

Also have, the above-mentioned 1RPC 1a that represents at the central portion of Fig. 2 is provided with the through hole TH that connects them with the contact portion Xa1 of above-mentioned each FPC and the lap of Xb1, enforcement metal-plated in this through hole TH and formed interlayer conduction road 4.

Like this, above-mentioned 2RPC 1b and 3RPC 1c, their regard to each FPC 11a and 11b spatially is open, thereby can freely select, use thin FPC of substrate thickness or thick RPC.Therefore,, as mentioned above, can assemble the more 3RPC 1c of the multi-layer circuit structure of heavy back formation, assemble the RPC of various structures, just can make the commodity of the more type of composite base plate as an example.

And, with respect to the above-mentioned 1RPC 1a (substantial middle of Fig. 2) as the core of composite base plate, the 2FPC 11b of the 1FPC 11a of a side of expression and the side represented below can be configured in mutually different direction various directions such as (left and right directions of Fig. 2) in the above in the drawings.That is, the compound mode of FPC and RPC and was compared in the past, and was more rich and varied.

Have, the circuit key element that is installed in the circuit key element such as function element, wiring of the upside of 2RPC 1b and is installed in the downside of above-mentioned 3RPC 1c can be electrically connected by the 2FPC 11b of the 1FPC 11a of above-mentioned upper face side, above-mentioned interlayer conduction road 4 and above-mentioned downside again.Like this, particularly the electrical connection between each circuit key element that RPC installs with showing back of the body two sides 3 dimensions is mutual just can be carried out easily.

That is, the one side of RPC is overlapping with FPC, and another side is a contactless state, gets this structure and just can guarantee in the mutual conducting of the two substrates wiring layer of overlapping portion, and improve the design freedom of wiring figure.

Also have, the thickness of the lap of RPC and FPC is also little in the present embodiment, thereby it is same with above-mentioned the 1st execution mode, circuit composite wiring composite base plate helps to the taking in of the little space of electronic equipment internal, and has the effects such as fine pattern formation of the wiring layer that long lifetime, the shortening of plating time, the cost of the through hole shortening of process time, punch reduce and secondly form.

But, especially nearest in the printed circuit board wiring technical field, wish RPC each other, FPC each other or RPC and FPC combine, advance with the technological development that is connected between their the corresponding substrate of various combinations.Corresponding therewith, also the compound wired circuit board that can represent the above-mentioned the 1st and the 2nd execution mode is respectively as unit bodies, a plurality of unit bodies of lamination and constitute multi-layer circuit structure (the 3rd execution mode).Also have,, between the constituent parts body, can get involved other RPC (the 4th execution mode) in this occasion.Have again, also can be and partly constitute multi-layer circuit structure (the 5th execution mode) to the part of unit bodies other unit bodies of lamination of above-mentioned composite base plate.

Secondly, the concrete example for the related compound wired circuit board of the present invention of above-mentioned the 3rd to the 5th execution mode that is suitable for connecting between aforesaid substrate describes.

The 3rd execution mode:

In the present embodiment, as the 1st unit bodies, superimposed a plurality of above-mentioned unit bodies have the compound wired circuit board that multilayer laminated boards is constructed thereby constitute the compound wired circuit board shown in Figure 1 relevant with above-mentioned the 1st execution mode.One side's of constituent parts body 1RPC 1a is in the position that overlaps each other each other, and the opposing party's 2RPC 1b is in the position that overlaps each other each other.

And, on the outermost layer of the upper and lower surface of above-mentioned lamination structure, disposed FPC respectively, in that centre position 1FPC 11a and 2FPC 11b overlap each other up and down.That is, FPC is connected each other.

Also have, equally, also can be the compound wired circuit board shown in Figure 2 relevant as the 2nd unit bodies with above-mentioned the 2nd execution mode, with respect to the paper of accompanying drawing in the superimposed successively a plurality of unit bodies of above-below direction, thereby form the compound wired circuit board of multilayer laminated boards structure.

Have again, equally, also can descend superimposed successively above-mentioned the 1st unit bodies that constitutes by compound wired circuit board shown in Figure 1 of direction and above-mentioned the 2nd unit bodies that constitutes by compound wired circuit board shown in Figure 2 on paper, thereby form the compound wired circuit board of multilayer laminated boards structure.

That is, various combined methods are allowed in the compound wired circuit board of present embodiment combination, overlapping optional a plurality of unit bodies from the above-mentioned the 1st and the 2nd unit bodies and constitute.

The 4th execution mode:

The compound wired circuit board of the 4th execution mode is described with reference to Fig. 3.Be configured in the 1RPC 31 of lamination structure of central authorities of thickness direction (above-below direction among the figure) of substrate and interval that direction (left and right directions among the figure) that 2RPC32 intersects at the thickness direction with substrate has regulation mutually and and put.

Above-mentioned 1RPC 31 comes bonding RPC veneer 31b and 31c to constitute by for example bonding material on the two sides of the RPC of central authorities veneer 31a, and above-mentioned 2RPC 32 comes bonding RPC veneer 32b and 32c to constitute by for example bonding material on the two sides of the RPC of central authorities veneer 32a.For the thickness of slab of above-mentioned each RPC, more mutual relation, RPC31a and RPC32a, RPC31b and RPC32b, RPC31c and RPC32c have roughly the same thickness respectively.

Above-mentioned 1RPC 31 and above-mentioned 2RPC 32 all have lamination separately a plurality of RPC substrate each other between be connected.

On the upper and lower surface of above-mentioned 1RPC 31 and 2RPC 32, for being built bridge mutually, these RPC disposed 1FPC 11a and 2FPC 11b bonding.Here, 1FPC 11a and 2FPC 11b have provided the FPC identical with each FPC shown in Figure 1 as an example, pay with same label for the part identical with Fig. 1, omit its explanation.Certainly, above-mentioned each FPC also can adopt and the difform FPC of the thing of the 1st execution mode.

Therefore, above-mentioned 1RPC 31 and 2RPC 32 are equivalent to the 1st and 2RPC 1a and 1b in the 1st execution mode respectively, and the compound wired circuit board of the 4th execution mode also can be similarly to constitute with the compound wired circuit board of above-mentioned the 1st execution mode basically.

Also have, in the present embodiment, all expose on the surface of 1FPC 11a and lap Xa1 above-mentioned 1RPC 31 and surface with lap Xb2 above-mentioned 2RPC 32 2FPC 11b.Can form other wiring layer figure on above-mentioned each surface of having exposed, the surface of at least more than one that select from above-mentioned lap Xa1, Xa2, Xb1 and Xb2 can be used as such face that exposes.

Also can guarantee under the above-mentioned situation of optionally exposing face, in the position of for example 1FPC 11a and lap Xa2 above-mentioned 2RPC 32,2FPC 11b and lap Xb1 above-mentioned 1RPC 31 etc., according to the desired function of circuit, additional respectively bonding 4RPC 33,5RPC 34.

Have again, also can be on FPC 11b, the above-mentioned the 1st and 2RPC 31,32 in the middle of, promptly on the two sides of the part of deformable segment Yb, additional again lamination 6RPC 35,7RPC36.Can make the above-mentioned the 6th and 7RPC 35,36 have for example electric relay function between the circuit function of the circuit function of above-mentioned 1RPC 31 and above-mentioned 2RPC 32.Also have, also can be on the part of above-mentioned deformable segment Yb any one party lamination among the above-mentioned RPC 35,36.

But, making up the occasion that a plurality of above-mentioned RPC and FPC come assembling circuit wiring composite base plate, can in advance separately make up, assemble these a plurality of unit bodies by various unit bodies.Secondly, the example that it is concrete is described.

(assemble method example 1):

" the 1st step ";

The 1st unit bodies that preparation is made of the composite base plate of above-mentioned 1FPC 11a, above-mentioned RPC 31b, 32b and 4RPC 33.

" the 2nd step ";

The 2nd unit bodies that preparation is made of 2FPC 11b, above-mentioned RPC 31c, 32c, the the 5th to 7RPC 34 to 36 composite base plate.

" the 3rd step ";

With the interval of regulation and put above-mentioned RPC 31a and 32a, down come lamination the above-mentioned the 1st and the 2nd unit bodies thereon, assembling circuit wiring composite base plate at grade by the such formation of Fig. 3.

(assemble method example 2):

" the 1st step ";

The 3rd unit bodies that preparation is made of the composite base plate of above-mentioned 1FPC 11a and above-mentioned 4RPC 33.

" the 2nd step ";

The 4th unit bodies that preparation is made of above-mentioned 2FPC 11b, above-mentioned the the 5th to 7RPC 34 to 36 composite base plate.

" the 3rd step ";

Above-mentioned 1RPC 31 (the lamination structure of RPC31a, 31b, 31c) as the 5th unit bodies, is prepared above-mentioned 2RPC 32 (the lamination structure of RPC31a, 32b, 32c) as the 6th unit bodies.

" the 4th step ";

With the interval of regulation and put above-mentioned the 5th unit bodies (above-mentioned 1RPC 31) and the 6th unit bodies (2RPC 32), down come lamination the above-mentioned the 3rd and the 4th unit bodies thereon at grade, the assembling circuit composite base plate that connects up by the such formation of Fig. 3.

In addition, also can be the RPC32b of the upside of above-mentioned 1FPC 11a, above-mentioned 2RPC 32 and 4RPC 33 as unit bodies, perhaps the RPC 31c of the downside of above-mentioned 2FPC 11b, above-mentioned 1RPC31, the the 5th to 7RPC 34 to 36 as unit bodies.Can suitably select to be suitable for the formation and the combination of the unit bodies of the rationalization of assembling procedure line, the reductionization of technology cost etc.In addition, the order of above steps can be selected arbitrarily.

The compound wired circuit board of present embodiment has the effect same with the occasion of the respective embodiments described above, can also carry out connecting between the substrate of variety of way.

Also have, in the figure of present embodiment, the structure of constructing pairing interlayer conduction road for laminations such as FPC and RPC has omitted diagram, and but, interlayer conduction road forms with the described later the 6th and the 7th execution mode equally in the position of hope.In addition, structure, the RPC of the insulated substrate of each above-mentioned RPC, wiring layer etc. reach bonding that FPC waits each other each other, can adopt common technology.Therefore, its diagram and explanation have been simplified here.

The 5th example:

Compound wired circuit board in the 5th execution mode is a plurality of unit bodies move left and right in the drawings that makes the related compound wired circuit board of above-mentioned the 1st execution mode shown in Figure 1, and the 2RPC 1b that makes the 1RPC 1a of side's unit bodies and the opposing party's unit bodies becomes the position overlapped relation and partly superimposed thing.

Also have, the compound wired circuit board of present embodiment also can be a plurality of unit bodies move left and right in the drawings that makes the related compound wired circuit board shown in Figure 2 of above-mentioned the 2nd execution mode, and the 2RPC 1b that makes the 1RPC 1a of side's unit bodies and the opposing party's unit bodies becomes the position overlapped relation and partly superimposed thing.

Have, the unit bodies that also can make each related compound wired circuit board of the above-mentioned the 1st and the 2nd execution mode is equally partly superimposed and constitute the compound wired circuit board of the multilayer laminated boards structure of present embodiment again.

Promptly, the unit bodies of each related compound wired circuit board of the above-mentioned the 1st and the 2nd execution mode respectively as the constituent parts body, make optional a plurality of unit bodies move left and right, combination from these unit bodies, just can obtain the compound wired circuit board of variety of way.Such execution mode has the effect same with the occasion of the respective embodiments described above.

(interlayer conduction road):

Secondly, describe above-mentioned interlayer conduction road in detail with reference to Fig. 4 and Fig. 5.Fig. 4 amplifies the part that is provided with above-mentioned interlayer conduction road etc. on the 2RPC1b be illustrated in the related compound wired circuit board of the 1st execution mode shown in Figure 1.In Fig. 4, the part identical with Fig. 1 paid with same numeral, omits its explanation.

In exposing on the face of the lap Xa2 of 1FPC 11a and 2RPC 1b, except wiring layer 13a, formed another wiring layer figure of representing with dot pattern among the figure with fine pattern.This wiring layer figure has comprised for example a plurality of welding disks 41, a plurality of wiring layers 42 that are connected with each welding disk 41 and a plurality of interlayer links 43 that are connected with a part of wiring layer 42 of the configuration of four frame shape ground.

Formed in the position corresponding and to have connected overlapping 1FPC11a, 2RPC 1b and through hole (through hole) TH of 2FPC 11b with above-mentioned interlayer link 43.Plating by good conductive metal such as embodiment such as copper on each through hole TH inner face has formed interlayer conduction road 44.

From for example independently the lead terminal (pin) that stretches out of electronic circuit components such as the independent semiconductor of semiconductor, IC chip, band encapsulation or IC equipment be electrically connected, be fixed on above-mentioned a plurality of welding disk 41 by upside-down mounting connection, soldering.

Also have, also can be in the exposing on the face of the lap Xa2 of above-mentioned 1FPC 11a, replace above-mentioned electronic circuit component and additional or other the complementary 4RPC 33 (with reference to Fig. 3) shown in the 4th execution mode is set.In this occasion, the wiring layer figure that forms on the face in exposing of above-mentioned lap Xa2 make corresponding to the graphics shape of the connected mode of the wiring layer of above-mentioned 4RPC 33.

As mentioned above, 1FPC 11a, lap Xa1 2FPC 11b and above-mentioned each RPC, Xa2, Xb1 and Xb2 can install above-mentioned electronic circuit component, additional or complementary electronic units such as RPC on their at least a portion of exposing face or outer surface, can be as the zone that forms its wiring layer figure.

In above-mentioned the 1st to the 5th execution mode, at least a portion with lap RPC above-mentioned FPC can be as the zone that can form such wiring layer figure.

And above-mentioned interlayer conduction road 44 is electrically connected the mutual 3 dimension ground of each substrate wiring layer of 1FPC 11a, the 2RPC 1b overlapping respectively on the ground, top, two sides of 2RPC 1b and 2FPC 11b get up.

Fig. 5 amplifies the figure be illustrated in the part that is provided with above-mentioned interlayer conduction road etc. on the part corresponding with the 2RPC 1b of the compound wired circuit board of the 2nd execution mode shown in Figure 2.The part identical with Fig. 2 paid with same numeral, omits its explanation.

That is, the compound wired circuit board of present embodiment is only gone up overlapping, as to have formed a 1FPC 11a part in the one side (above among the figure) of 2RPC 1b, and the another side of 2RPC 1b (below among the figure) becomes and exposes face.

Lap Xa2 at above-mentioned 2RPC 1b and 1FPC 11a, formed the through hole TH that partly connects 1FPC 11a and 2RPC 1b, on each through hole TH inner face, formed interlayer conduction road 44 with the same good conductive metal plating in interlayer shown in Figure 4 conduction road.

And above-mentioned interlayer conduction road 44 partly is electrically connected the interlayer link 43 of the wiring layer figures that form on the outer surface of the lap Xa2 of 1FPC 11a with at the above-mentioned interlayer link that exposes the wiring floor 3b that forms on the face of 2RPC 1b.

According to the compound wired circuit board of present embodiment, the overlapping gross thickness of RPC and FPC is thinner than thing shown in Figure 4.And the outer surface of above-mentioned lap Xa2 can be used to install the zone of the wiring layer figure of electronic unit, and forms fine pattern.And, in above-mentioned the 2nd execution mode, as mentioned above, have the effects such as degree of freedom increase of the thickness selection of 1RPC 1a owing to the existence of exposing face of 1RPC 1a.

In addition, above-mentioned interlayer conduction road can form by Fig. 4 and through hole mode shown in Figure 5, also can replace the via hole mode and form, and perhaps the combination in two modes forms.For example, occasion at the wiring layer of wiring layer that connects above-mentioned 2RPC 1b and above-mentioned 1FPC 11a, also can be only on the above-mentioned 1FPC11a of the lap Xa2 of these substrates, form through hole, the above-mentioned interlayer conduction road of each the wiring floor that above-mentioned each substrate is set in the path mode between mutually.

The 6th execution mode:

Secondly, with reference to Fig. 6 the compound wired circuit board that the 6th execution mode is related is described.The compound wired circuit board of present embodiment is that the compound wired circuit board to the 1st execution mode shown in Figure 1 appends, the overlapping thing of other FPC.The part identical with Fig. 1 paid with identical label, omits its explanation.

That is, the 1st and the one side (above among the figure) of 2RPC 1a, the 1b 1FPC11a that goes up configuration for example have 2 FPC veneer 11a1 and FPC veneer 11a2 lamination structure.1FPC in above-mentioned FPC veneer 11a1 and the 1st execution mode is same, is one deck Wiring structure with wiring layer 13a, and FPC veneer 11a2 is one deck Wiring structure with wiring layer 13c too.Therefore, 1FPC 11a is the multi-layer circuit structure that is made of foregoing circuit wiring layer 13a and 13c at thickness direction.

Also have, the 2FPC11b that goes up configuration at the another side (among the figure below) of above-mentioned each RPC 1a, 1b for example has the lamination of 2 FPC veneer 11b1 and FPC veneer 11b2 and constructs.2FPC in above-mentioned FPC veneer 11b1 and the 1st execution mode is same, is one deck Wiring structure with wiring layer 13b, and FPC veneer 11b2 is one deck Wiring structure with wiring layer 13d too.Therefore, 2FPC 11b is the multi-layer circuit structure that is made of foregoing circuit wiring layer 13b and 13d at thickness direction.

Like this, the above-mentioned the 1st with 2FPC as the FPC in the 1st execution mode, be not limited to one deck Wiring structure, also can be a plurality of layer (multilayer) Wiring structure of the lamination of the lamination of above-mentioned FPC 11a1 and FPC 11a2, above-mentioned FPC veneer 11b1 and FPC11b2.In Fig. 6 expression stride comprehensively and lamination a plurality of FPC, but, also can make part with lamination and not the structure of the part of lamination implement the present invention.Also have, foregoing circuit wiring layer 13c can come arbitrary decision according to the requirement to system to wire distribution distance or the graphics shape of 13d, can also be different.

Like this, be configured in above-mentioned above and following on the 1st, 2FPC has the multilayer laminated boards structure of a plurality of layer (for example 2 layers) at least in a part.The number of plies of FPC can suitably increase and decrease according to the amount of the handled information of electronic apparatus system.Certainly, can be that top FPC is 2 layers, below FPC be 1 layer thing, perhaps upper side FPC is 4 layers, downside FPC is 3 layers various combinations such as thing.

The overlapping number of plies of each FPC of above-mentioned multilayer laminated boards structure can wait suitably according to the quantity of the length of desired deformable segment when the taking in of equipment cabinets and width, deformation extent (pliability), the wiring layer related with the amount of information of electronic apparatus system and select.The so just requirement of the corresponding various electronic apparatus systems of energy.Much less, the compound wired circuit board of present embodiment has the effect same with the respective embodiments described above.

Also have, in Fig. 6, omitted the structure that laminations such as FPC and RPC are constructed pairing interlayer conduction road, but, can form Fig. 4 and interlayer conduction road 44 shown in Figure 5 equally in the position of hope.In addition, this multilayer laminated boards structure of above-mentioned the 1st, 2FPC is also applicable in above-mentioned arbitrary execution mode.

Also have, as long as above-mentioned the 1st to the 6th execution mode of appropriate combination and forming circuit wiring composite base plate, just can bring into play the thickness thin typeization that makes composite base plate integral body to greatest extent, be used for to fine pattern circuit formation that the outermost electronic unit of substrate is installed, on the circuit design the degree of freedom and to the long lifetime of the shortening of process time of the assembleability of equipment cabinets, through hole, punch, the shortening of plating time, the effects such as cost degradation on the manufacturing process.

Above reference several preferred implementations of the present invention have illustrated the present invention, and but, the present invention is not limited by above-mentioned execution mode.People with the common technology in present technique field can implement the present invention by the correction or the distortion of execution mode based on the foregoing invention content.

Claims (12)

1. compound wired circuit board, have at least one rigidity circuit board that comprises rigid insulation substrate and wiring layer and the 1st and the 2nd flexible printed circuit board that comprises the film like of flexible insulation substrate and wiring layer, it is characterized in that, the lap that the described the 1st and the 2nd flexible printed circuit board has separately is overlapping respectively with the two sides of described rigidity circuit board, fixed and with the nonoverlapping deformable segment in described two sides, and described lap have each wiring floor of being electrically connected this each circuit board perforation at least one interlayer conduction road.

2. compound wired circuit board according to claim 1 is characterized in that, described interlayer conduction road has connected described the 1st, the 2nd flexible printed circuit board and described rigidity circuit board.

3. compound wired circuit board according to claim 1, it is characterized in that, described rigidity circuit board is included in direction the separated from each other and juxtaposed the 1st and the 2nd rigidity circuit board with the thickness direction quadrature of described rigidity circuit board, and the described the 1st and the 2nd flexible printed circuit board is configured in the mode that the described the 1st and the 2nd rigidity circuit board is built bridge.

4. compound wired circuit board according to claim 1, it is characterized in that, described rigidity circuit board is included in direction the separated from each other and juxtaposed the 1st and the 2nd rigidity circuit board with the thickness direction quadrature of composite base plate, described the 1st flexible printed circuit board to be being configured the mode of each the 1st bridge formation of the described the 1st and the 2nd rigidity circuit board, described the 2nd flexible printed circuit board only with the described the 1st and the 2nd rigidity circuit board in some the 2nd overlapping.

5. compound wired circuit board, it is characterized in that, by at the compound wired circuit board that constitutes with the direction the separated from each other and juxtaposed the 1st of the thickness direction quadrature of the described composite base plate of claim 3 record and the 2nd rigidity circuit board and the described the 1st and the 2nd flexible printed circuit board that is configured in the mode that the described the 1st and the 2nd rigidity circuit board is built bridge as the 1st unit bodies, by with the direction the separated from each other and juxtaposed the 1st and the 2nd rigidity circuit board of the thickness direction quadrature of the described composite base plate of claim 4 record, described the 1st flexible printed circuit board that is configured in the mode that the face of each side's side of the described the 1st and the 2nd rigidity circuit board is built bridge and overlapping with the face of the opposing party's side of described the 2nd rigidity circuit board, the compound wired circuit board that constitutes with nonoverlapping described the 2nd flexible printed circuit board of the face of the opposing party's side of described the 1st rigidity circuit board is as the 2nd unit bodies, overlapping optional a plurality of unit bodies from the described the 1st and the 2nd unit bodies and constituting, at least one in the described lap of described flexible printed circuit board is configured in outermost layer.

6. a compound wired circuit board is characterized in that having: the rigidity circuit board that comprises rigid insulation substrate and wiring layer; Only have that with described rigidity circuit board the 1st is overlapping, the lap fixed and with the flexible printed circuit board of the nonoverlapping deformable segment of described plate face; And at least one interlayer conduction road that has connected the described lap of described flexible printed circuit board and the wiring floor that is electrically connected described flexible printed circuit board.

7. compound wired circuit board according to claim 6 is characterized in that, described interlayer conduction road has connected described flexible printed circuit board and described rigidity circuit board.

8. according to any described compound wired circuit board in the claim 1 to 6, it is characterized in that, on the part of the described deformable segment of described flexible printed circuit board lamination other rigidity circuit board.

9. according to any described compound wired circuit board in the claim 1 to 6, it is characterized in that described rigidity circuit board is lamination a plurality of rigidity circuit board veneer and the multilayer laminated boards that constitutes structure.

10. according to any described compound wired circuit board in the claim 1 to 6, it is characterized in that, with at least a portion of the overlapping flexible printed circuit board of described rigidity circuit board comprise lamination a plurality of flexible printed circuit board veneers.

11. any described compound wired circuit board according in the claim 1 to 6 is characterized in that the wiring layer of flexible printed circuit board is one deck at the thickness direction of substrate.

12. according to any described compound wired circuit board in the claim 1 to 6, it is characterized in that, expose on the face with at least one of lap described rigidity circuit board described flexible printed circuit board, comprise the wiring layer figure of welding disk with electronic unit installation usefulness.

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