CN1802723A - 用于膨胀热等离子体的电感耦合的系统和方法 - Google Patents
用于膨胀热等离子体的电感耦合的系统和方法 Download PDFInfo
- Publication number
- CN1802723A CN1802723A CNA2004800158912A CN200480015891A CN1802723A CN 1802723 A CN1802723 A CN 1802723A CN A2004800158912 A CNA2004800158912 A CN A2004800158912A CN 200480015891 A CN200480015891 A CN 200480015891A CN 1802723 A CN1802723 A CN 1802723A
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- China
- Prior art keywords
- plasma
- inductance coupling
- coupling high
- etp
- hot
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- Granted
Links
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Cleaning In General (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/609,958 US6969953B2 (en) | 2003-06-30 | 2003-06-30 | System and method for inductive coupling of an expanding thermal plasma |
US10/609,958 | 2003-06-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1802723A true CN1802723A (zh) | 2006-07-12 |
CN100517553C CN100517553C (zh) | 2009-07-22 |
Family
ID=33540988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800158912A Expired - Fee Related CN100517553C (zh) | 2003-06-30 | 2004-06-14 | 用于膨胀热等离子体的电感耦合的系统和方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6969953B2 (zh) |
EP (1) | EP1642314A2 (zh) |
JP (1) | JP2007521614A (zh) |
KR (1) | KR20060082400A (zh) |
CN (1) | CN100517553C (zh) |
WO (1) | WO2005006386A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103117201A (zh) * | 2011-11-17 | 2013-05-22 | 中芯国际集成电路制造(上海)有限公司 | Pecvd装置及半导体器件的形成方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3940095B2 (ja) * | 2003-05-08 | 2007-07-04 | 忠弘 大見 | 基板処理装置 |
US9659758B2 (en) | 2005-03-22 | 2017-05-23 | Honeywell International Inc. | Coils utilized in vapor deposition applications and methods of production |
US9950481B2 (en) * | 2007-05-01 | 2018-04-24 | Exatec Llc | Edge healing and field repair of plasma coating |
US20100183825A1 (en) * | 2008-12-31 | 2010-07-22 | Cambridge Nanotech Inc. | Plasma atomic layer deposition system and method |
DE112012002786A5 (de) * | 2011-07-01 | 2014-03-20 | Reinhausen Plasma Gmbh | Vorrichtung und Verfahren zur Plasmabehandlung von Oberflächen |
US11183373B2 (en) | 2017-10-11 | 2021-11-23 | Honeywell International Inc. | Multi-patterned sputter traps and methods of making |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3717985A1 (de) * | 1986-05-28 | 1987-12-03 | Minolta Camera Kk | Elektrochrome vorrichtung |
GB8713986D0 (en) * | 1987-06-16 | 1987-07-22 | Shell Int Research | Apparatus for plasma surface treating |
NL8701530A (nl) * | 1987-06-30 | 1989-01-16 | Stichting Fund Ond Material | Werkwijze voor het behandelen van oppervlakken van substraten met behulp van een plasma en reactor voor het uitvoeren van die werkwijze. |
GB8718756D0 (en) * | 1987-08-07 | 1987-09-16 | Unilever Plc | Supporting means |
US4853250A (en) * | 1988-05-11 | 1989-08-01 | Universite De Sherbrooke | Process of depositing particulate material on a substrate |
JPH03211284A (ja) * | 1990-01-17 | 1991-09-17 | Nippon Koshuha Kk | 多段熱プラズマ反応装置 |
JPH05266991A (ja) * | 1992-03-16 | 1993-10-15 | Nippon Steel Corp | 磁気駆動プラズマ反応装置 |
JP3152548B2 (ja) * | 1993-09-21 | 2001-04-03 | 日本電子株式会社 | 高周波誘導プラズマ成膜装置 |
JP2770753B2 (ja) * | 1994-09-16 | 1998-07-02 | 日本電気株式会社 | プラズマ処理装置およびプラズマ処理方法 |
JP3426382B2 (ja) * | 1995-01-24 | 2003-07-14 | アネルバ株式会社 | プラズマ処理装置 |
US5653811A (en) * | 1995-07-19 | 1997-08-05 | Chan; Chung | System for the plasma treatment of large area substrates |
JP3951003B2 (ja) * | 1995-11-17 | 2007-08-01 | 俊夫 後藤 | プラズマ処理装置および方法 |
US6536449B1 (en) * | 1997-11-17 | 2003-03-25 | Mattson Technology Inc. | Downstream surface cleaning process |
US6231725B1 (en) * | 1998-08-04 | 2001-05-15 | Applied Materials, Inc. | Apparatus for sputtering material onto a workpiece with the aid of a plasma |
JP2965293B1 (ja) * | 1998-11-10 | 1999-10-18 | 川崎重工業株式会社 | 電子ビーム励起プラズマ発生装置 |
US6153852A (en) * | 1999-02-12 | 2000-11-28 | Thermal Conversion Corp | Use of a chemically reactive plasma for thermal-chemical processes |
US6426125B1 (en) * | 1999-03-17 | 2002-07-30 | General Electric Company | Multilayer article and method of making by ARC plasma deposition |
US6517687B1 (en) * | 1999-03-17 | 2003-02-11 | General Electric Company | Ultraviolet filters with enhanced weatherability and method of making |
US6420032B1 (en) * | 1999-03-17 | 2002-07-16 | General Electric Company | Adhesion layer for metal oxide UV filters |
US6239553B1 (en) * | 1999-04-22 | 2001-05-29 | Applied Materials, Inc. | RF plasma source for material processing |
US6287643B1 (en) * | 1999-09-30 | 2001-09-11 | Novellus Systems, Inc. | Apparatus and method for injecting and modifying gas concentration of a meta-stable or atomic species in a downstream plasma reactor |
JP2001118697A (ja) * | 1999-10-18 | 2001-04-27 | Tadahiro Sakuta | 誘導プラズマの発生装置 |
DE10104613A1 (de) * | 2001-02-02 | 2002-08-22 | Bosch Gmbh Robert | Plasmaanlage und Verfahren zur Erzeugung einer Funktionsbeschichtung |
DE10104614A1 (de) * | 2001-02-02 | 2002-08-22 | Bosch Gmbh Robert | Plasmaanlage und Verfahren zur Erzeugung einer Funktionsbeschichtung |
US6397776B1 (en) * | 2001-06-11 | 2002-06-04 | General Electric Company | Apparatus for large area chemical vapor deposition using multiple expanding thermal plasma generators |
WO2003018867A1 (en) | 2001-08-29 | 2003-03-06 | Applied Materials, Inc. | Semiconductor processing using an efficiently coupled gas source |
US6660177B2 (en) * | 2001-11-07 | 2003-12-09 | Rapt Industries Inc. | Apparatus and method for reactive atom plasma processing for material deposition |
US6681716B2 (en) * | 2001-11-27 | 2004-01-27 | General Electric Company | Apparatus and method for depositing large area coatings on non-planar surfaces |
KR100446619B1 (ko) * | 2001-12-14 | 2004-09-04 | 삼성전자주식회사 | 유도 결합 플라즈마 장치 |
-
2003
- 2003-06-30 US US10/609,958 patent/US6969953B2/en not_active Expired - Lifetime
-
2004
- 2004-06-14 CN CNB2004800158912A patent/CN100517553C/zh not_active Expired - Fee Related
- 2004-06-14 EP EP04755160A patent/EP1642314A2/en not_active Withdrawn
- 2004-06-14 WO PCT/US2004/018820 patent/WO2005006386A2/en active Application Filing
- 2004-06-14 KR KR1020057025235A patent/KR20060082400A/ko not_active Application Discontinuation
- 2004-06-14 JP JP2006517245A patent/JP2007521614A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103117201A (zh) * | 2011-11-17 | 2013-05-22 | 中芯国际集成电路制造(上海)有限公司 | Pecvd装置及半导体器件的形成方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1642314A2 (en) | 2006-04-05 |
JP2007521614A (ja) | 2007-08-02 |
CN100517553C (zh) | 2009-07-22 |
WO2005006386A3 (en) | 2005-02-24 |
US6969953B2 (en) | 2005-11-29 |
US20040263083A1 (en) | 2004-12-30 |
WO2005006386A2 (en) | 2005-01-20 |
KR20060082400A (ko) | 2006-07-18 |
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Owner name: SHABO BASE CREATION PLASTICS INTELLECTUAL PROPERT Free format text: FORMER OWNER: GENERAL ELECTRIC CO. Effective date: 20081107 |
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Effective date of registration: 20081107 Address after: Bergen Op Zoom Holland Applicant after: Sabic Innovative Plastics Ip Address before: American New York Applicant before: General Electric Company |
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C14 | Grant of patent or utility model | ||
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C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: Bergen Op Zoom Holland Patentee after: Sabic Innovative Plastics IP Address before: Bergen Op Zoom Holland Patentee before: Sabic Innovative Plastics Ip Address after: Bergen Op Zoom Holland Patentee after: Sabic Innovative Plastics IP Address before: Bergen Op Zoom Holland Patentee before: Sabic Innovative Plastics Ip |
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