CN1801431A

CN1801431A - Method for making plasma display screen lower substrate

Info

Publication number: CN1801431A
Application number: CN 200610041638
Authority: CN
Inventors: 罗向辉
Original assignee: Irico Group Electronics Co Ltd
Current assignee: Sichuan Sterope Orion Display Co., Ltd.
Priority date: 2006-01-11
Filing date: 2006-01-11
Publication date: 2006-07-12
Anticipated expiration: 2026-01-11
Also published as: CN100452281C

Abstract

The manufacture method for lower base in plasma display screen comprises: printing barrier slurry and drying on glass base with addressing electrode graph, then sintering; sticking one layer of acid-resistant un-alkali-resistant photosensitive etch-resistant dry film on sintered barrier layer or direct printing or coating one layer of photosensitive etch-resistant film to form etch-resistant layer; exposing and developing to the etch-resistant layer by barrier master plate to form barrier figure as mask for etching by hydrochloric acid solution according to require height; using alkali solution to peel the etch-resistant layer on top of barrier wall; then, coating red, green and blue fluorescent powder by silk-screen printing method. this invention reduces process and cost.

Description

A kind of manufacture method of plasma display screen lower substrate

Technical field

The invention belongs to technical field of flat panel display, be specifically related to a kind of manufacture method of plasma display screen lower substrate.

Background technology

Color plasma display is a kind of flat-panel monitor by the excited by vacuum ultraviolet red, green, blue light-emitting phosphor of gas discharge generation, have in light weight, characteristics such as volume is little, wide visual angle, in present Display Technique field, have very strong competitiveness.

Plasma panel has generally included prebasal plate and metacoxal plate, is manufactured with transparency electrode, Bus electrode, transparent medium and mgo protection layer on prebasal plate respectively, is manufactured with addressing electrode, dielectric layer, barrier and fluorescent material on metacoxal plate usually.The manufacture method of barrier adopts the efficient height more, makes the meticulous sand-blast of figure at present, and the method is by the impact of sand grains unnecessary barrier material to be removed, thereby forms required barrier figure.But when above-mentioned sand-blast forms barrier; because the impulsive force of sand grains is bigger; in sandblast, be easy to destroy the addressing electrode below the barrier; addressing electrode is in case destroyed in this operation; can't repair again; cause scrapping of whole infrabasal plate, therefore when sandblast, will protect addressing electrode.The at present employing printed a dielectric layer more on addressing electrode, again the dielectric layer sintering is formed the purpose that glassy layer reaches guard electrode.The shortcoming of the method is the processing procedure of more than once high temperature sintering in whole infrabasal plate manufacturing process, easily causes the distortion of glass to make the contraposition between each figure deviation occur through sintering, causes contraposition inaccurate, has also wasted the energy of sintering furnace simultaneously.

Summary of the invention

The objective of the invention is to overcome the shortcoming of above-mentioned prior art, a kind of manufacture method of plasma display screen lower substrate is provided, the making of this lower plate barrier forms by etching method, dielectric layer then directly replaces with the barrier layer of bottom, reduced the operation that one deck is made medium, promptly reduce the printing and the sintering of dielectric layer, reduced once heat treated step, effectively reduced the distortion of glass.

The technical solution used in the present invention is in order to achieve the above object: at first, print thickness is the white barrier size of 180um-220um and the black barrier slurry that thickness is 20um-50um on the glass substrate of addressing electrode pattern having, drying forms white barrier layers and black barrier layer under 130 ℃-160 ℃ then, and the gross thickness of white barrier layer and black barrier layer equals the height of dielectric layer and barrier layer; Secondly, to white barrier size layer and black barrier pulp layer at 550 ℃ of-570 ℃ of sintering; Then, on the black barrier layer behind the sintering, paste one deck acidproof not alkaline-resisting photonasty dry film against corrosion or directly print or apply the photosensitive etchant resist of one deck and form resist layer, resist layer is exposed with the barrier mother matrix by common process again and develop, form the barrier figure; Be that the hydrochloric acid solution of 1.0-10% carries out etching and control etching speed white barrier layer and black barrier layer as the mask of etching with the barrier figure on the resist layer again be 0.5m/min-3.0m/min, thereby form barrier material dielectric layer and barrier according to the time of the height control etching of the barrier that obtains of require according to the height mass concentration of the barrier that obtains of required; At last, peel the resist layer at barrier top off, between barrier, apply red, green, blue fluorescent material by silk screen print method again and get final product with aqueous slkali.

Because the present invention adopts etching method to prepare barrier; and replace dielectric layer to protect following addressing electrode with the barrier bottom; thereby reduced the operation of one-step print medium and sintered medium; reduced cost of manufacture; reduced the number of times of high-temperature heat treatment; also just reduced the distortion of glass, guaranteed the making precision of fine pattern and the aligning accuracy between different graphic, the image frame that makes plasma show is meticulousr.

Description of drawings

Fig. 1 to Fig. 8 is a manufacture craft flow chart of the present invention.

Embodiment

Below in conjunction with accompanying drawing the present invention is described in further detail.

Referring to Fig. 1,2,3, at first, print thickness is the white barrier size of 180um-220um and the black barrier slurry that thickness is 20um-50um on the glass substrate 1 that has addressing electrode pattern 2, drying forms white barrier layers 3 and black barrier layer 4 under 130 ℃-160 ℃ then, and the gross thickness of white barrier layer 3 and black barrier layer 4 equals the height of dielectric layer and barrier layer; Referring to Fig. 4,5, secondly, to white barrier size layer 3 and black barrier pulp layer 4 at 550 ℃ of-570 ℃ of sintering; Then, on the black barrier layer behind the sintering 4, paste one deck acidproof not alkaline-resisting photonasty dry film against corrosion or directly print or apply the photosensitive etchant resist of one deck and form resist layer 5, resist layer 5 is exposed with the barrier mother matrix by common process again and develop, form barrier figure 6; Referring to Fig. 6,7, be that the hydrochloric acid solution of 1.0-10% carries out etching and control etching speed white barrier layer 3 and black barrier layer 4 as the mask of etching with the barrier figure 6 on the resist layer 5 again be 0.5m/min-3.0m/min, thereby form barrier material dielectric layer 7 and barrier 8 according to the time of the THICKNESS CONTROL etching of the height of the barrier that obtains of require and dielectric layer according to the height mass concentration of the barrier that obtains of required; Referring to Fig. 8, last, peel the resist layer 5 at barrier top off with aqueous slkali, between barrier, apply red, green, blue fluorescent material by silk screen print method again and get final product.So just can reduce the distortion of glass, make the making of figure more meticulous by the once sintered making of finishing medium and barrier of barrier.Also make the manufacture craft of infrabasal plate simpler, saved cost.

Claims

1, a kind of manufacture method of plasma display screen lower substrate is characterized in that:

1) at first, going up print thickness at the glass substrate that has addressing electrode pattern [2] [1] is the white barrier size of 180um-220um and the black barrier slurry that thickness is 20um-50um, drying forms white barrier layers [3] and black barrier layer [4] under 130 ℃-160 ℃ then, and the gross thickness of white barrier layer [3] and black barrier layer [4] equals the height of dielectric layer and barrier layer;

2) secondly, to white barrier size layer [3] and black barrier pulp layer [4] at 550 ℃ of-570 ℃ of sintering;

3) then, black barrier layer behind sintering [4] is gone up to paste one deck acidproof not alkaline-resisting photonasty dry film against corrosion or directly print or apply the photosensitive etchant resist of one deck and is formed resist layer [5], resist layer [5] is exposed with the barrier mother matrix by common process again and develop, form barrier figure [6];

4) be that the hydrochloric acid solution of 1.0-10% carries out etching and control etching speed white barrier layer [3] and black barrier layer [4] as the mask of etching with the barrier figure [6] on the resist layer [5] again be 0.5m/min-3.0m/min, thereby form barrier material dielectric layer [7] and barrier [8] according to the time of the height control etching of the barrier that obtains of require according to the height mass concentration of the barrier that obtains of required;

5) last, peel the resist layer [5] at barrier top off with aqueous slkali, between barrier, apply red, green, blue fluorescent material by silk screen print method again and get final product.