CN1794901A - Electronic circuit cell - Google Patents
Electronic circuit cell Download PDFInfo
- Publication number
- CN1794901A CN1794901A CN 200510138109 CN200510138109A CN1794901A CN 1794901 A CN1794901 A CN 1794901A CN 200510138109 CN200510138109 CN 200510138109 CN 200510138109 A CN200510138109 A CN 200510138109A CN 1794901 A CN1794901 A CN 1794901A
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- China
- Prior art keywords
- copper foil
- wiring pattern
- electronic circuit
- width dimensions
- circuit cell
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Abstract
The invention provides an electronic circuit unit without desquamation of wiring pattern, which comprises: insulating substrate (1), which is produced of paper phenol resin or paper epoxy resin, and whose thickness T is more than 0.8 mm; wiring pattern (2), which is produced of copper foils; and electronic ekements (9a, 9b), which is weld by lead-free solders. The wiring pattern (2) comprises copper foils removing part (8) on position of over 2 mm of width of signal wire (3) and earth pattern (4). The width among the signal wire (3), outside edge (2a) of the earth pattern (4), and the copper foils removing part (8) is less than 2 mm. When processes the lead-free soldering, air bubbles removes from the copper foils removing part (8) even the air bubbles occur in the insulating substrate (1) by water gasification, so that avoids the desquamation of the wiring pattern (2).
Description
Technical field:
The present invention relates to the suitable electronic circuit cell of a kind of FM of being used in tuner (tuner) etc.
Background technology:
Fig. 4 is the vertical view of the significant points in the existing electronic circuit cell.If the formation of existing electronic circuit cell is described, then on the surface of insulated substrate 51, be provided with Wiring pattern 52 based on this Fig. 4; This Wiring pattern 52, by holding wire 53, grounding pattern 54, be set at holding wire 53 an end pad 55a and be set at the pad 55b on the grounding pattern 54 and form.
In addition, near the periphery of the pad 55b of grounding pattern 54, when netted conduction road being set removing the 54a of portion, between pad 55a, 55b, welding electronic unit 56, when forming existing electronic circuit cell, the existence of removing the 54a of portion by netted conduction road, when even the thermal stress during owing to welding has produced crackle on the conduction road, the conduction road is guaranteed.(for example, with reference to patent documentation 1).
Existing electronic circuit cell with formation like this uses insulated substrate 51, and it is made of paper phenolic resin or paper epoxy resin, and to have thickness of slab T be the above thickness of 0.8mm; The width dimensions B2 of the width dimensions B1 of holding wire 53, grounding pattern 54 with Wiring pattern 52, and the width dimensions B3 of pad 55a, 55b surpass under the state at position of 2mm, when welding by the high Pb-free solder of melt temperature, moisture in the insulated substrate 51 gasifies and produces bubble, never exist the rear side of the insulated substrate 51 of Wiring pattern 52 to run away, do not have peeling off of Wiring pattern 52.
But, insulated substrate 51 is made of paper phenolic resin or paper epoxy resin, and to have thickness of slab T be the above thickness of 0.8mm, and have Wiring pattern 52 holding wire 53, grounding pattern 54, and the width dimensions B ultrasonic of pad 55a, 55b cross the width of 2mm, under this state, when carrying out welding on 56 pairs of Wiring patterns 52 of electronic unit by the high Pb-free solder of melt temperature, when this welds, moisture in the insulated substrate 51 gasifies and produces bubble, and the part of Wiring pattern 52 is stripped from from insulated substrate 51.
[patent documentation 1] opens clear 61-46766 communique in fact
Existing electronic circuit cell, general, insulated substrate 51 is to be made of paper phenolic resin or paper epoxy resin, its thickness of slab has the above thickness of 0.8mm; Have Wiring pattern 52 holding wire 53, grounding pattern 54, and the width dimensions of pad 55a, 55b surpass the width of 2mm.The problem that exists is: under this state, though electronic unit 56 is welded on the Wiring pattern 52 by the high Pb-free solder of melt temperature, but in this welding, the moisture in the insulated substrate 51 gasifies and produces bubble, and the part of Wiring pattern 52 is stripped from from insulated substrate 51.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of electronic circuit cell of peeling off that does not have Wiring pattern.
As the 1st solution that is used to solve described problem, electronic circuit cell of the present invention possesses: insulated substrate, and it is made of paper phenolic resin or paper epoxy resin, and to have thickness of slab T be the above thickness of 0.8mm; Wiring pattern, it is made of Copper Foil set on the surface of described insulated substrate; And electronic unit, it is soldered by Pb-free solder on described Wiring pattern; That adopts constitutes: described Wiring pattern has holding wire and grounding pattern; Surpass the position of 2mm at the width dimensions separately of described holding wire and described grounding pattern, have the Copper Foil that the described Copper Foil that forms described Wiring pattern has been removed and remove portion; With described holding wire, and the outer ledge of described grounding pattern and described Copper Foil when removing width dimensions between the portion and be made as below the 2mm, the width dimensions that described Copper Foil is removed between portion is made as below the 2mm.
Have, as the 2nd solution, the constituting of employing: described Wiring pattern has and is used for pad that described electronic unit is welded again; Width dimensions at described pad surpasses on the position of 2mm, described Copper Foil is set removes portion, and the width dimensions that the outer ledge and the described Copper Foil of described pad are removed between the portion is made as below the 2mm.
Have again, as the 3rd solution, the constituting of employing: described Pb-free solder, with tin, silver, copper as principal component.
Have, as the 4th solution, the constituting of employing: described Copper Foil is removed portion again, by the hole or/and notch form.
Have again, as the 5th solution, the constituting of employing: remove portion by the described Copper Foil that described hole constitutes, with identical size, intersperse regularly and form.
Electronic circuit cell of the present invention possesses: insulated substrate, and it is made of paper phenolic resin or paper epoxy resin, and to have thickness of slab T be the above thickness of 0.8mm; Wiring pattern, it is made of Copper Foil set on the surface of this insulated substrate; And electronic unit, it welds by Pb-free solder on described Wiring pattern; Described Wiring pattern has holding wire and grounding pattern; Surpass the position of 2mm at the width dimensions separately of described holding wire and described grounding pattern, have the Copper Foil that the described Copper Foil that will form described Wiring pattern has been removed and remove portion; With described holding wire, and the outer ledge of described grounding pattern and described Copper Foil to remove width dimensions between the portion be below the 2mm time, for the width dimensions described Copper Foil removed between portion is below the 2mm, when can make insulated substrate be cheapness, when implementing welding by the high Pb-free solder of melt temperature, even the moisture in the insulated substrate gasifies and produces bubble, so that bubble runs away from the Copper Foil portion of removing, can eliminate peeling off from the Wiring pattern of insulated substrate.
In addition, Wiring pattern, have and be used for pad that described electronic unit is welded, width dimensions at described pad surpasses on the position of 2mm, be provided with described Copper Foil and remove portion, because the width dimensions that the outer ledge and the described Copper Foil of described pad are removed between the portion is below the 2mm, when implementing welding by the high Pb-free solder of melt temperature, even the moisture in the insulated substrate gasifies and produces bubble, bubble is run away from the Copper Foil portion of removing, elimination is peeled off from the Wiring pattern of insulated substrate, can implement the reliable welding of electronic unit.
Have again because Pb-free solder, with tin, silver, copper as principal component, so the melt temperature of this Pb-free solder, high to 260 degree is during the Pb-free solder of the high melting temperature that the moisture gasification in making insulated substrate and gassing are such, effective especially.
Have, Copper Foil is removed portion again because by the hole or/and notch forms, it constitutes simple, can obtain the good parts of productivity.
Have again, remove portion by the Copper Foil that the hole constitutes because under identical size, intersperse regularly and form, so that it constitutes is simple, can obtain the good parts of productivity.
Description of drawings
Fig. 1 relates to the significant points sectional view in the electronic circuit cell of the present invention.
Fig. 2 is that expression relates to vertical view in the electronic circuit cell of the present invention, that cover removed state.
Fig. 3 relates to the vertical view of the insulated substrate in the electronic circuit cell of the present invention.
Fig. 4 relates to the significant points vertical view in the existing electronic circuit cell.
Among the figure: 1-insulated substrate, 1a-through hole, 2-Wiring pattern, 2a-outer ledge, 3-holding wire, 4-grounding pattern, 5,6,7-pad (land), 8-Copper Foil is removed portion, 9a, 9b-electronic unit, 10-cover (cover), T-thickness of slab, the width dimensions of B1-holding wire, the width dimensions of B2-grounding pattern, the width dimensions of B3-pad, D1-outer ledge and Copper Foil are removed the width dimensions between the portion, and D2-Copper Foil is removed the width dimensions between portion
Embodiment
If the accompanying drawing to electronic circuit cell of the present invention is described, Fig. 1 is the significant points sectional view in the electronic circuit cell of the present invention; Fig. 2 is the vertical view of expression state in the electronic circuit cell of the present invention, that cover is removed; Fig. 3 is the vertical view of the insulated substrate in the electronic circuit cell of the present invention.
Secondly, if the formation of electronic circuit cell of the present invention is described based on Fig. 1～Fig. 3, then insulated substrate 1, constitutes, has thickness of slab by paper phenolic resin or paper epoxy resin and formed by the parts of the thickness more than the 0.8mm; On insulated substrate 1, be provided with a plurality of through hole 1a.
In addition, on the surface of insulated substrate 1, be provided with the Wiring pattern 2 that constitutes by Copper Foil; This Wiring pattern 2, by: holding wire 3; With grounding pattern 4; The pad 5 of ring-type, its end side that is arranged on holding wire 3 do not have the position of through hole 1a; With pad 7, it is arranged on the grounding pattern 4 and form.
So, the width dimensions B2 of the width dimensions B1 of holding wire, grounding pattern 4, and the width dimensions B3 of pad 5,6,7 surpass 2mm everywhere, holding wire 3, grounding pattern 4, and pad 5,6,7 be provided with Copper Foil and remove portion 8, with form make holding wire 3, grounding pattern 4, and the width dimensions separately of pad 5,6,7 be below the 2mm.
That is, Copper Foil is removed portion 8, forms by hole or the notch that is made of circular port or dihedral hole; Holding wire 3, grounding pattern 4, and pad 5,6,7 in the outer ledge 2a of Wiring pattern 2 and Copper Foil to remove width dimensions D1 between the portion 8 be that 2mm is following the time, the width dimensions D2 that Copper Foil is removed in 8 in the portion is below the 2mm, by holding wire 3, grounding pattern 4, and pad 5,6,7 in the width dimensions of Copper Foil everywhere be below the 2mm, make the moisture gasification in the insulated substrate 1 and the running away easily of the bubble that produces.
And, among this embodiment,, the Copper Foil that is made of the hole constitutes by the size of same apertures, the parts that intersperse regularly though removing portion 8, also can intersperse by different size or irregular states.
The electronic unit 9b that constitutes, has the electronic unit 9a of lead or have chip (chip) type by capacitor or resistance, electronic unit 9a with lead, so that lead is under slotting logical state on the through hole 1a of insulated substrate 1, when pad 5,7 is implemented welding by Pb-free solder; The electronic unit 9b of chip (chip) type implements welding to pad 6 by Pb-free solder, has formed the electronic circuit of expectation.
In addition, be used for Pb-free solder that electronic unit 9a, 9b are welded, become: as principal component, the melt temperature of this Pb-free solder, high to 260 degree is so that gasify and the such high melting temperature of gassing the moisture in the insulated substrate 1 with tin, silver, copper.
The cover 10 of the box-shaped that is made of metallic plate under the state that electronic unit 9a, 9b are covered, is installed on insulated substrate 1, by this cover 10, so that carry out electric shield; Cover 10 by implement the suitable method of welding etc. on Wiring pattern 2, is installed on the insulated substrate 1, has formed electronic circuit cell of the present invention.
For this reason, the operation of welding electronic unit 9a, 9b is carried out all result of experiment on Wiring pattern 2, distinguish: use to constitute, have the insulated substrate 1 that thickness of slab T is the thickness of not enough 0.8mm by paper phenolic resin or paper epoxy resin, and have width dimensions B1, the grounding pattern 4 of the holding wire 3 of Wiring pattern 2 width dimensions B2, and the width dimensions B3 of pad 5,6,7 surpass under the state of position of 2mm, when welding by the high Pb-free solder of melt temperature, bubble by the gasification of the moisture in the insulated substrate 1 takes place is peeled off Wiring pattern 2.
Thereby, all experimental results, distinguish: as the present invention, use by paper phenolic resin or paper epoxy resin and constitute, have the insulated substrate 1 of thickness of slab T as the thickness more than the 0.8mm, the width dimensions B2 of the width dimensions B1 of the holding wire 3 of Wiring pattern 2, grounding pattern 4, and the width dimensions B3 of pad 5,6,7 surpass on the position of 2mm, Copper Foil is set to be removed under the state of portion 8, when welding by the high Pb-free solder of melt temperature, moisture gasification in the insulated substrate 1 and the bubble that takes place are removed portion 8 from Copper Foil and are run away, and Wiring pattern 2 does not have to be peeled off.
Claims (5)
1, a kind of electronic circuit cell is characterized in that,
Possess: insulated substrate, it is made of paper phenolic resin or paper epoxy resin, and to have thickness of slab be the above thickness of 0.8mm; Wiring pattern, it is made of Copper Foil set on the surface of described substrate; And electronic unit, it is soldered by Pb-free solder on described pattern; Described Wiring pattern has holding wire and grounding pattern; Surpass the position of 2mm at the width dimensions separately of described holding wire and described grounding pattern, have the Copper Foil that the described Copper Foil that forms described Wiring pattern has been removed and remove portion; With described holding wire, and the outer ledge of described grounding pattern and described Copper Foil to remove width dimensions between the portion be below the 2mm time, the width dimensions that described Copper Foil is removed between portion is below the 2mm.
2, electronic circuit cell according to claim 1 is characterized in that:
Described Wiring pattern has and is used for pad that described electronic unit is welded; Width dimensions at described pad surpasses on the position of 2mm, described Copper Foil is set removes portion, and the width dimensions that the outer ledge and the described Copper Foil of described pad are removed between the portion is below the 2mm.
3, electronic circuit cell according to claim 1 and 2 is characterized in that:
Described Pb-free solder, with tin, silver, copper as principal component.
4, electronic circuit cell according to claim 1 is characterized in that:
Described Copper Foil is removed portion, by the hole or/and notch form.
5, electronic circuit cell according to claim 4 is characterized in that:
Remove portion by the described Copper Foil that described hole constitutes, with identical size, intersperse regularly and form.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004373617 | 2004-12-24 | ||
| JP2004373617A JP2006179809A (en) | 2004-12-24 | 2004-12-24 | Electronic circuit unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1794901A true CN1794901A (en) | 2006-06-28 |
Family
ID=36733597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510138109 Pending CN1794901A (en) | 2004-12-24 | 2005-12-22 | Electronic circuit cell |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006179809A (en) |
| CN (1) | CN1794901A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112530464A (en) * | 2019-09-19 | 2021-03-19 | 株式会社东芝 | Disk device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008016725A (en) * | 2006-07-07 | 2008-01-24 | Sharp Corp | Printed wiring board, method for mounting components thereof, and the board for mounting the electronic components |
| KR101842176B1 (en) | 2017-10-27 | 2018-03-26 | 동우 화인켐 주식회사 | Connecting structure for electrode and electric device comprising the same |
| CN212677472U (en) | 2018-02-15 | 2021-03-09 | 株式会社村田制作所 | Multilayer substrate and electric element |
-
2004
- 2004-12-24 JP JP2004373617A patent/JP2006179809A/en active Pending
-
2005
- 2005-12-22 CN CN 200510138109 patent/CN1794901A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112530464A (en) * | 2019-09-19 | 2021-03-19 | 株式会社东芝 | Disk device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006179809A (en) | 2006-07-06 |
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