CN1789928A - Resin level detection method for ultraviolet curing quick forming process - Google Patents
Resin level detection method for ultraviolet curing quick forming process Download PDFInfo
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- CN1789928A CN1789928A CN 200510096499 CN200510096499A CN1789928A CN 1789928 A CN1789928 A CN 1789928A CN 200510096499 CN200510096499 CN 200510096499 CN 200510096499 A CN200510096499 A CN 200510096499A CN 1789928 A CN1789928 A CN 1789928A
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Abstract
The invention discloses a resin liquid-level detecting method of light solidifying rapid patterning technique, which is characterized by the following: setting semiconductor laser device and semiconductor position sensitive device to receive liquid-level reflecting light on the resin groove liquid-level; transmitting the resin liquid level into the electric signal to accomplish the precise measurement of liquid level; adapting high frequency modulation laser to overcome the interference of stray light; changing the laser strength according to the detected liquid level reflectance adaptively; measuring kinds of liquid-level reflectance through closed-loop feedback; adjusting the laser strength according to the proportional integral; making the current I1+I2 equal to constant automatically. The invention overcomes the big error deflect of traditional chip when the reflecting light is weaker, which simplifies the calculation and improves the measuring precision.
Description
Technical field
The invention belongs to the rapid shaping technique field, particularly a kind of resin level detection method that is used for photocurable quick shaping process.
Background technology
Photocureable rapid shaping is raw material with the photosensitive resin, and the track while scan by the computer control Ultra-Violet Laser makes its coagulation forming.At first in groove, fill with liquid photosensitive resin, the UV laser beam that laser instrument sends branch layer cross section information by part under the control of deflection system is carried out point by point scanning on the photosensitive resin surface, the thin resin layer that is scanned the zone solidify to form a thin layer of part because of being produced photopolymerization reaction by UV-irradiation.After this, worktable moves down a thickness of thin layer, so that the resin surface that solidified in last time applies the new liquid resin of one deck, by scanning processing to following one deck, on one deck, so repeat to finish before new one deck that solidifies will be bonded in, obtain the 3D solid prototype until the part manufacturing.
In order to guarantee the making precision of part, and take into account shaping efficiency, make-up machine is at different parts and accuracy requirement, when data hierarchy is handled, can adopt different lift heights (0.1～0.3mm), so both can select less lift height, to guarantee higher surface quality of workpieces, also can adopt big lift height, to reduce Production Time.
Guaranteeing accurate bed thickness, is the key that guarantees rapid shaping product Z directional precision.At present, one of gordian technique of taking is that vacuum suction is wipeed system off, and it mainly acts on and is to guarantee the smooth of liquid level, and really will guarantee accurate bed thickness, just must guarantee the constant of liquid level position.Before not adopting the laser liquid-level detection, liquid level is mainly kept stable by resin overflow mode, but overflow makes the resin liquid level in the groove produce gradient, causes workpiece to tilt to a direction, and the variation of excess flow makes above-mentioned inclination be uncertain, can influence the quality of profiled member.
The liquid level laser TT﹠C system of photocureable rapid shaping machine is the vitals of make-up machine.It detects the variation of resin level in the groove, makes the resin liquid level remain on reasonable range, guarantees that workpiece has accurate bed thickness.The resin storage tank Level Detection of make-up machine adopts the non-contact laser liquid level gauge mostly both at home and abroad.Based on the optical triangulation principle, with laser direct projection resin liquid level, collect scattered light then from the side, be imaged on PSD (Positon Sensitive Device) or the CCD (Charge CoupledDevice) through the lens luminous point.By detecting the change in location of luminous point, can record the liquid level height accurately.But, facts have proved the photosensitive resin of this method to transparence, because scattered light intensity is very weak, can't record liquid level signal.
Summary of the invention
Defective or deficiency at above-mentioned prior art exists the objective of the invention is to, and a kind of resin level detection method that is used for photocurable quick shaping process is provided.
In order to realize above-mentioned task, the technical solution that the present invention adopts is that a kind of resin level detection method that is used for photocurable quick shaping process is characterized in that, this method adopts reflective measurement of dip angle method to detect the amount of movement Δ x of resin level, specifically may further comprise the steps:
1) semiconductor laser instrument and one at first are set and are used to receive the catoptrical semiconductor optoelectronic position sensor of semiconductor laser above the resin storage tank resin liquid level of photocureable rapid shaping machine, and laser carried out high frequency modulated, make the semiconductor laser response be high-frequency pulse signal, and the method for employing high-pass filtering in circuit is with signal and interference separation;
2) light beam irradiates sent of semiconductor laser is on tested resin liquid level and be reflected on the sensing surface of semiconductor optoelectronic position sensor, and the displacement of resin storage tank liquid level is converted to electric signal, and the incident angle of semiconductor laser is α; The displacement Δ x of liquid level in the pass of the length distance AB of semiconductor optoelectronic position sensor is: AB=2 Δ xsin α.
Light source of the present invention has adopted high frequency modulated laser to overcome the interference of parasitic light, laser intensity can be surveyed the liquid level of various reflectivity according to tested liquid level reflectivity and adaptively modifying, adopts close-loop feedback, the passing ratio integration is regulated and is changed laser intensity, automatic electric current I with PSD
1+ I
2=constant.Overcome traditional employing division chip and become big shortcoming, simplified calculating, improved measuring accuracy at the more weak time error of reflected light.
Method Measurement Resolution height of the present invention can satisfy the detection requirement of photocuring moulding to liquid level, can improve the quality of profiled member.
Description of drawings
Fig. 1 is the basic structure and the characteristic of PSD device;
Fig. 2 is reflective measurement of dip angle method schematic diagram;
Fig. 3 is the laser liquid-level detection compensation system block diagram according to method exploitation of the present invention;
Fig. 4 is a high frequency modulated method schematic diagram.
The present invention is described in further detail below in conjunction with accompanying drawing and know-why of the present invention.
Embodiment
The resin level detection method that is used for photocurable quick shaping process of the present invention, adopt semiconductor luminous point position sensor PSD as sensitive element, semiconductor laser diode (LD) detects the amount of movement of resin level as light source based on reflective measurement of dip angle principle.
1.PSD the basic structure of device and characteristic
PSD is a semiconductor luminous point position sensor, and its basic structure as shown in Figure 1.When certain is some on its light-sensitive surface, will produce certain photogenerated current I as light beam irradiates at light-sensitive surface
0This electric current is with I
1And I
2Flow to two output electrodes respectively, I
1And I
2Divide flow relation to depend on the equivalent resistance of incident light spot position to the two poles of the earth, again because the P layer impedance uniformity of semiconductor luminous point position sensor then has following minute flow relation to set up:
And then have:
In the following formula, position output signal x value is only relevant with minute flow relation.
2. reflective measurement of dip angle method principle
Laser in the reflective inclination angle measurement method does not overlap with pedal line, but certain angle is arranged.Principle such as accompanying drawing 2.The light beam irradiates that light source (LD) is sent is on tested resin liquid level and be reflected, and is radiated on the sensing surface of PSD.Because the liquid level height is corresponding one by one with the position that imaging point drops on the PSD, so can go out the liquid level height by the calculated signals that the PSD testing circuit obtains.Be that the laser incident angle is α, the displacement Δ x of resin liquid level in the pass of the length distance AB of photoelectric sensor is: AB=2 Δ xsin α.
3. the influence of parasitic light and dark current and countermeasure
From formula (2) as can be seen, in the detection, if except working beam, also have other spurious rays to enter, as daylight lamp in the room and the illuminating lamp in the make-up machine etc., the capital produces extra current on semiconductor optoelectronic position sensor PSD, destroy the establishment of relational expression.This undoubtedly can EVAC (Evacuation Network Computer Model) normal detection, precision is reduced, even system can't be worked.In instruments design, must consideration how to solve the interference of stray light problem.
When not having light beam incident, the electric current that semiconductor optoelectronic position sensor PSD two output electrodes are exported is called dark current, dark current changes with bias voltage and temperature variation, the rising of environment temperature can cause the increase of semiconductor optoelectronic position sensor PSD dark current, the existence of dark current not only will bring the sum of errors noise, and has the adverse effect that similar bias light produces.Should be eliminated when therefore using.
Consideration disturbs parasitic light mostly to be natural light or artificial light in instrument uses, the characteristics of this class interference source are that its brightness variation is slowly, the response that causes on semiconductor optoelectronic position sensor PSD is direct current and low frequency signal, if laser is carried out high frequency modulated, make semiconductor optoelectronic position sensor PSD response be high-frequency pulse signal, then the method that can adopt high-pass filtering in circuit by linear detection, is converted to direct current signal with AC signal again with signal and interference separation.
In Fig. 1, ask
The time, general method is to realize the following formula division arithmetic with the division chip.The application adopts close-loop feedback, regulates by PI (proportional integral), changes laser intensity, automatic output current I with semiconductor optoelectronic position sensor PSD
0(be I
1+ I
2)=constant.Read I like this
1Or I
2One can record the liquid level height.Facts have proved that this scheme is feasible.
In the reflective inclination angle measurement method of the present invention, light beam and pedal line that semiconductor laser sends have certain included angle.Principle as shown in Figure 2.The light beam irradiates that semiconductor laser (LD) is sent is on the resin liquid level and be reflected, and is radiated on the sensing surface of semiconductor optoelectronic position sensor PSD.Semiconductor optoelectronic position sensor PSD testing circuit through being provided with detects, and calculates in view of the above then and the height that draws the resin liquid level changes.
Δ x among Fig. 2 is the resin liquid level variation, and AB length is the change of reflection spot on the PSD device, and incident angle is α.According to the knowledge of plane geometry, the pass of AB and Δ x is AB=2 Δ xsin α.
When a branch of light is mapped on the photosurface of semiconductor optoelectronic position sensor PSD, will have electric current between with the different electrodes on the one side and flow through, this voltage or electric current change along with light spot position and the phenomenon that changes is called semi-conductive lateral light electrical effect.Therefore, can detect the irradiation position of incident luminous point, have and do not have the dead band, resolution height, characteristics such as adapter circuit is simple.
Referring to Fig. 3, Fig. 3 provides a kind of laser liquid-level pick-up unit block diagram according to method of the present invention, it comprises: the PSD device, semiconductor laser (LD), PSD connects a data collecting card at the semiconductor optoelectronic position sensor, this data collecting card carries out the A/D conversion to the displacement Δ x of the resin liquid level of collection, and be input to industrial computer, be connected with stepping motor control card on the industrial computer, stepping motor control card is connected with stepper motor driver, is used for rotation, the location and spacing of control step motor.
When the worktable of photocureable rapid shaping machine descends, behind the strickling of the scraper plate in resin storage tank resin, send instruction by industrial computer and carry out the liquid level control program, then, the resin storage tank liquid level is adjusted to given position by stepping motor control card and stepper motor driver control control step motor.
The measured value of semiconductor optoelectronic position sensor PSD is applicable to that by one the high-performance of PC, the multifunctional data acquisition card of high speed carry out the A/D conversion, (as, grind the ADAM-4017 eight tunnels analogy amount load modules of magnificent company with Taiwan, this module resolution 16Bit can guarantee enough precision) through the conversion after digital quantity carry out data communication by RS-485 and industrial computer (computing machine).
Fig. 4 is a high frequency modulated method schematic diagram, the high frequency modulated method adopts close-loop feedback, two output terminals A of semiconductor optoelectronic position sensor, B connect current/voltage converter, AC amplifier and linear detector respectively, and import in the totalizer, passing ratio integrator and light modulation triode change the laser intensity of semiconductor laser, automatic output current I with the semiconductor optoelectronic position sensor
0=I
1+ I
2=constant, wherein I
0Be total current, I
1, I
2Be two output terminals A of semiconductor optoelectronic position sensor, the current value of B, read I
1Or I
2One of them can record the liquid level height.
Through facts have proved of applicant, Measurement Resolution height of the present invention can improve the fabricating quality of shaping workpiece effectively.
In view of domestic and international laser liquid level gauge all is to use constant intensity laser, can only survey the liquid opaque, that reflectivity is big, transparency liquid is difficult to measure.Laser intensity of the present invention can be surveyed the surface of various reflectivity according to tested liquid level reflectivity and adaptively modifying.
Claims (2)
1. a resin level detection method that is used for photocurable quick shaping process is characterized in that, this method adopts reflective measurement of dip angle method to detect the amount of movement Δ x of resin level, specifically may further comprise the steps:
1) semiconductor laser instrument and one at first are set and are used to receive the catoptrical semiconductor optoelectronic position sensor of semiconductor laser above the resin storage tank resin liquid level of photocureable rapid shaping machine, and laser carried out high frequency modulated, make the semiconductor laser response be high-frequency pulse signal, and the method for employing high-pass filtering in circuit is with signal and interference separation;
2) light beam irradiates sent of semiconductor laser is on tested resin liquid level and be reflected on the sensing surface of semiconductor optoelectronic position sensor, and the displacement of resin storage tank liquid level is converted to electric signal, and the incident angle of semiconductor laser is α; The displacement Δ x of liquid level in the pass of the length distance AB of semiconductor optoelectronic position sensor is: AB=2 Δ xsin α.
2. the method for claim 1, it is characterized in that, described high frequency modulated method adopts close-loop feedback, it is direct current signal that two output terminals of semiconductor optoelectronic position sensor are connected the current conversion that current/voltage converter, AC amplifier and linear detection make output terminal respectively, and import in the totalizer, passing ratio integrator and light modulation triode change the laser intensity of semiconductor laser, automatic output current I with the semiconductor optoelectronic position sensor
0=I
1+ I
2=constant, wherein I
0Be total current, I
1, I
2Be the electric current of two output terminals of semiconductor optoelectronic position sensor, read I
1Or I
2One of them can record the liquid level height.
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|---|---|---|---|
| CNB2005100964991A CN100340844C (en) | 2005-12-07 | 2005-12-07 | Resin level detection method for ultraviolet curing quick forming process |
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|---|---|---|---|
| CNB2005100964991A CN100340844C (en) | 2005-12-07 | 2005-12-07 | Resin level detection method for ultraviolet curing quick forming process |
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| Publication Number | Publication Date |
|---|---|
| CN1789928A true CN1789928A (en) | 2006-06-21 |
| CN100340844C CN100340844C (en) | 2007-10-03 |
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|---|---|---|---|
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| CN103076065A (en) * | 2013-01-27 | 2013-05-01 | 中国科学院合肥物质科学研究院 | Laser measuring device for detecting liquid level of liquid metal |
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| US5247180A (en) * | 1991-12-30 | 1993-09-21 | Texas Instruments Incorporated | Stereolithographic apparatus and method of use |
| SG94314A1 (en) * | 1998-05-08 | 2003-02-18 | Univ Singapore | Method for determining resin curing areas in an optical stereolithography process |
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