CN1774792A - 进行热处理的装置和方法 - Google Patents
进行热处理的装置和方法 Download PDFInfo
- Publication number
- CN1774792A CN1774792A CN200480010264.XA CN200480010264A CN1774792A CN 1774792 A CN1774792 A CN 1774792A CN 200480010264 A CN200480010264 A CN 200480010264A CN 1774792 A CN1774792 A CN 1774792A
- Authority
- CN
- China
- Prior art keywords
- zone
- thermal treatment
- flow
- air
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Drying Of Solid Materials (AREA)
- Coating Apparatus (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Furnace Details (AREA)
- Heat Treatments In General, Especially Conveying And Cooling (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46348103P | 2003-04-17 | 2003-04-17 | |
US60/463,481 | 2003-04-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1774792A true CN1774792A (zh) | 2006-05-17 |
CN100364040C CN100364040C (zh) | 2008-01-23 |
Family
ID=33300077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200480010264XA Expired - Fee Related CN100364040C (zh) | 2003-04-17 | 2004-04-13 | 进行热处理的装置和方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7019264B2 (zh) |
EP (1) | EP1618596B1 (zh) |
JP (1) | JP4234173B2 (zh) |
CN (1) | CN100364040C (zh) |
AT (1) | ATE408893T1 (zh) |
DE (1) | DE502004008087D1 (zh) |
TW (1) | TWI325043B (zh) |
WO (1) | WO2004093161A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102243011A (zh) * | 2011-06-29 | 2011-11-16 | 天津杰科同创科技发展有限公司 | 一种热风式干燥机 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101046520B1 (ko) | 2007-09-07 | 2011-07-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 내부 챔버 상의 부산물 막 증착을 제어하기 위한 pecvd 시스템에서의 소스 가스 흐름 경로 제어 |
TWM394568U (en) * | 2010-07-23 | 2010-12-11 | Chen Long Technology Corp Ltd | Multiplexing wafer baking processing system |
CN104930837A (zh) * | 2014-03-19 | 2015-09-23 | 上海空间电源研究所 | 一种锌银电池负极片高效干燥系统及方法 |
DE102018103145A1 (de) | 2018-02-13 | 2019-08-14 | Ebner Industrieofenbau Gmbh | Anordnung mit mehreren Temperierstationen zur Wärmebehandlung von Bauteilen und deren Handhabung |
CN111972445B (zh) * | 2020-08-28 | 2022-03-18 | 湖南易老头食品有限公司 | 一种用于制作腊制品的烘烤装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63244429A (ja) * | 1987-03-31 | 1988-10-11 | Hitachi Chem Co Ltd | 光デイスク用基板の製造方法ならびにこれに用いられる金型装置および連続製造装置 |
US4987856A (en) | 1989-05-22 | 1991-01-29 | Advanced Semiconductor Materials America, Inc. | High throughput multi station processor for multiple single wafers |
JPH0651777U (ja) * | 1991-12-26 | 1994-07-15 | 日空工業株式会社 | 真空乾燥装置 |
GB2279585B (en) * | 1993-07-08 | 1996-11-20 | Crystalox Ltd | Crystallising molten materials |
DE19904045C1 (de) | 1999-02-02 | 2000-07-27 | Singulus Technologies Ag | Vorrichtung und Verfahren zum Trocknen von Substraten |
-
2004
- 2004-04-06 US US10/818,827 patent/US7019264B2/en not_active Expired - Fee Related
- 2004-04-13 JP JP2006504171A patent/JP4234173B2/ja not_active Expired - Fee Related
- 2004-04-13 DE DE502004008087T patent/DE502004008087D1/de not_active Expired - Fee Related
- 2004-04-13 EP EP04726945A patent/EP1618596B1/de not_active Expired - Lifetime
- 2004-04-13 WO PCT/CH2004/000223 patent/WO2004093161A1/de active IP Right Grant
- 2004-04-13 AT AT04726945T patent/ATE408893T1/de not_active IP Right Cessation
- 2004-04-13 CN CNB200480010264XA patent/CN100364040C/zh not_active Expired - Fee Related
- 2004-04-16 TW TW093110596A patent/TWI325043B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102243011A (zh) * | 2011-06-29 | 2011-11-16 | 天津杰科同创科技发展有限公司 | 一种热风式干燥机 |
Also Published As
Publication number | Publication date |
---|---|
CN100364040C (zh) | 2008-01-23 |
ATE408893T1 (de) | 2008-10-15 |
DE502004008087D1 (de) | 2008-10-30 |
EP1618596A1 (de) | 2006-01-25 |
JP4234173B2 (ja) | 2009-03-04 |
US20050035108A1 (en) | 2005-02-17 |
WO2004093161A1 (de) | 2004-10-28 |
TWI325043B (en) | 2010-05-21 |
EP1618596B1 (de) | 2008-09-17 |
US7019264B2 (en) | 2006-03-28 |
JP2006523906A (ja) | 2006-10-19 |
TW200500585A (en) | 2005-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: UNAXIS BALZERS AG Free format text: FORMER OWNER: OC OERLIKON BALZERS AG Effective date: 20080509 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20080509 Address after: Swiss Te Lui Bach Patentee after: Unaxis Balzers AG Address before: Liechtenstein Barr Che J Patentee before: OC Oerlikon Balzers AG |
|
ASS | Succession or assignment of patent right |
Owner name: XINGULESI TECHNOLOGY STOCK CO., LTD. ADDRESS Free format text: FORMER OWNER: UNAXIS BALZERS AG ADDRESS Effective date: 20081121 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20081121 Address after: German Messe Carle Patentee after: Singulus Technologies AG Address before: Swiss Te Lui Bach Patentee before: Unaxis Balzers AG |
|
ASS | Succession or assignment of patent right |
Owner name: XINGULESI TECHNOLOGY STOCK CO., LTD. Free format text: FORMER OWNER: UNAXIS BALZERS AG Effective date: 20081121 |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080123 Termination date: 20100413 |