CN1762631A - 微带电容的实用焊接工艺 - Google Patents
微带电容的实用焊接工艺 Download PDFInfo
- Publication number
- CN1762631A CN1762631A CN 200410085478 CN200410085478A CN1762631A CN 1762631 A CN1762631 A CN 1762631A CN 200410085478 CN200410085478 CN 200410085478 CN 200410085478 A CN200410085478 A CN 200410085478A CN 1762631 A CN1762631 A CN 1762631A
- Authority
- CN
- China
- Prior art keywords
- welding
- microstrip
- chip
- microstrip capacitor
- technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000003990 capacitor Substances 0.000 title claims abstract description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 229920003266 Leaf® Polymers 0.000 claims 1
- 238000007429 general method Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 13
- 239000002184 metal Substances 0.000 abstract description 13
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 230000009970 fire resistant effect Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 6
- 230000004927 fusion Effects 0.000 description 5
- 238000009736 wetting Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (2)
- 技术特征 焊接微带电容使用一般的方法易造成外观不理想或虚焊和脱落。采用本工艺方法以后,可使外观达到理想的效果,提高焊接的温度并可避免微带电容往线路板上焊接时形成虚焊或脱落。另外本焊接工艺操作方便、模具简单,一般常用的焊接设备都可使用,不需要在焊接设备上化费更多的投资。权力要求1、在微带电容焊接时,用弹簧或弹簧片等材料对银片和芯片施加一外力,以减小或抵消焊料的表面张力对焊接效果的影响,要求对此保证焊接质量的工艺方法进行保护。
- 2、对根据本工艺方法所设计的模具进行保护。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100854785A CN100372642C (zh) | 2004-10-20 | 2004-10-20 | 微带电容的实用焊接工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100854785A CN100372642C (zh) | 2004-10-20 | 2004-10-20 | 微带电容的实用焊接工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1762631A true CN1762631A (zh) | 2006-04-26 |
CN100372642C CN100372642C (zh) | 2008-03-05 |
Family
ID=36747071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100854785A Expired - Fee Related CN100372642C (zh) | 2004-10-20 | 2004-10-20 | 微带电容的实用焊接工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100372642C (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108788374A (zh) * | 2018-08-10 | 2018-11-13 | 无锡铭方科技有限公司 | 一种电阻装配治具 |
CN110091022A (zh) * | 2019-04-11 | 2019-08-06 | 零八一电子集团有限公司 | 微带电路模盒的焊接方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2131328C3 (de) * | 1971-06-21 | 1975-09-11 | Wilhelm 6800 Mannheim Westermann | Verfahren zur Herstellung von Elektrolyt-Kondensatoren |
CN1057300A (zh) * | 1991-05-29 | 1991-12-25 | 抚顺石油学院 | 无引线瓷介电容局部化学镀镍或铜方法 |
DE4219177C2 (de) * | 1992-06-09 | 1996-07-18 | Mannesmann Ag | Gehäuseeinspannung für einen Sensor |
JP3031268B2 (ja) * | 1996-11-20 | 2000-04-10 | 株式会社村田製作所 | 磁器コンデンサ |
CN1466158A (zh) * | 2002-06-21 | 2004-01-07 | 佳叶科技有限公司 | 金属帽式的同轴芯片电容器制造方法 |
FR2848338B1 (fr) * | 2002-12-05 | 2005-05-13 | Cit Alcatel | Procede de fabrication d'un module electronique comportant un composant actif sur une embase |
-
2004
- 2004-10-20 CN CNB2004100854785A patent/CN100372642C/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108788374A (zh) * | 2018-08-10 | 2018-11-13 | 无锡铭方科技有限公司 | 一种电阻装配治具 |
CN108788374B (zh) * | 2018-08-10 | 2023-08-11 | 无锡铭方科技有限公司 | 一种电阻装配治具 |
CN110091022A (zh) * | 2019-04-11 | 2019-08-06 | 零八一电子集团有限公司 | 微带电路模盒的焊接方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100372642C (zh) | 2008-03-05 |
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Legal Events
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C06 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Dalian Dalike Co., Ltd. Assignor: Gui Dee|Lin Zengjian Contract fulfillment period: 2009.6.15 to 2014.6.15 contract change Contract record no.: 2009210000166 Denomination of invention: Practical welding procedure of microstrip capacitor Granted publication date: 20080305 License type: Exclusive license Record date: 2009.6.19 |
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LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.6.15 TO 2014.6.15; CHANGE OF CONTRACT Name of requester: DALIAN DALIKAI CO., LTD. Effective date: 20090619 |
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EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Dalian Dalike Co., Ltd. Assignor: GUI Di| Lin Zengjian Contract record no.: 2009210000166 Date of cancellation: 20130709 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: LIN ZENGJIAN Effective date: 20140305 Owner name: DALIAN DALICAP TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: GUI DI Effective date: 20140305 |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140305 Address after: 116600 No. 17, Harbin Road, Dalian economic and Technological Development Zone, Liaoning, China Patentee after: Dalian Dali Kaipu Technology Co., Ltd. Address before: 116600 No. 17, Harbin Road, Dalian economic and Technological Development Zone, Dalian, Liaoning Patentee before: Gui Di Patentee before: Lin Zengjian |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080305 Termination date: 20141020 |
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EXPY | Termination of patent right or utility model |