CN1761381A - Method of installing integrated circuit package, its method and formed assembly thereof - Google Patents
Method of installing integrated circuit package, its method and formed assembly thereof Download PDFInfo
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- CN1761381A CN1761381A CN 200410085097 CN200410085097A CN1761381A CN 1761381 A CN1761381 A CN 1761381A CN 200410085097 CN200410085097 CN 200410085097 CN 200410085097 A CN200410085097 A CN 200410085097A CN 1761381 A CN1761381 A CN 1761381A
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Abstract
The method installs BGA electronic components onto print circuit board through its mountable surfaces. The method uses first and second arrays of soldering balls (3,6) with different characteristics. In process period of reflow soldering, interval between soldering balls (3) in first array and each soldering illuvium on print circuit board is controlled based on different characteristics of soldering balls. Thus, soldering balls (3) and each soldering illuvium are melted fully before they are contacted. Delayed fusion of soldering balls (6) is in use for keep interval between soldering balls (3) in first array and each soldering illuvium in order to moisten melted surfaces and guarantee their holding together to form high integrated electrical and mechanical contacts without interspace and/or breaking.
Description
Invention field
The present invention relates to a kind ofly electronic component is installed to method on the printed circuit board (PCB), electronic device and the assembly that forms thus.
The invention particularly relates to (but not being exclusive) surperficial installable ball grid array (BGA) electronic component and be installed to printed circuit board (PCB), to improve the reliability that the welded contact between BGA electronic component and the printed circuit board (PCB) can be installed in the surface.
Background of invention
In 10 years, increased for example utilization of the electronic device of personal computer, portable computer (laptop computer), PDA(Personal Digital Assistant), mobile phone, digital camera and so on significantly in the past.And, increased the needs of functional and compactness stronger in this electronic device.Seek the needs to the bigger manufacture of device with bigger functional and compactness, the manufacturer of electronic device is forced to develop automatic assembling technique to keep competitiveness.
The significant advantage of electronic device manufacturing is to have developed surface mounting technology, wherein the pad of welding compound is in the predetermined array of silk screen printing on printed circuit board (PCB), the terminals of electronic components of placing for example integrated circuit encapsulation contacts with welded gasket, and handle component is placed on to be examined in the stove etc. with " refluxing (reflow) " welded gasket, the terminal separately that forms printed circuit board (PCB) with its on mechanical between the electronic components mounted and being electrically connected.
Usually, the quite thick layer of welding compound is applied on the conducting on the printed circuit board surface " island ", when welding the round dot that " round dot " liquefaction and surface tension are diffused into area top, island, with the remarkable minimizing of compensation thickness and the increase of surface area.This minimizing of the amount of liquid flux usually produces between element and printed circuit board (PCB) and weakens or defective electrical connection in the zone of the electric terminal of electronic component.
When generally being effective to its main purpose, the old model of surface mounting technology has extra shortcoming, for example electronic component has caused bad machinery and electrical connection between electronic component and the printed circuit board (PCB) with respect to the misalignment of the welded gasket separately on the printed circuit board (PCB).
In order to satisfy the needs of the stronger functional and bigger compactness of electronic device, become on the printed circuit board (PCB) integrated circuit encapsulation that more is full of electric terminal, and require to be used for the needs of encapsulation even the littler marking of integrated circuit simultaneously with very large amount.Because the requirement of these obvious contradictions has produced ball grid array (BGA) electronic package.
A kind of typical B GA encapsulation comprises the basic peripheral solder sphere of row, solder sphere is adhered on base plate for packaging or electronic component collide corresponding electronics contact mat on the side of frame, and the terminals of electronic components of the integrated circuit on contact mat and other side that for example is installed in the collision frame is electrically connected.BGA encapsulation is positioned on the printed circuit board (PCB) with solder sphere, the welded gasket separately on the solder sphere contact print circuit board, and subsequently in reflow ovens or smelting furnace heating component receive and welded gasket with melting.
A kind of consideration that the BGA electronic component is installed is by making printed circuit board (PCB) different with the thermal coefficient of expansion that electronic component collides in the frame, making stress can introduce welded contact.Comprise the heat of printed circuit board (PCB) of introducing fin to dissipate and to produce by electronic component for a kind of proposal that reduces thermal stress and reduction electronic component performance.
Another kind of location of proposing to be included in the elongated rectangle welded gasket that the diagonal angle is arranged on the printed circuit board (PCB) is to reduce the trend of welded contact along the diagonal axis crack of expanding and shrinking.Another proposal comprises that the array of arranging solder sphere is positioned at external array that is installed in the marking outside of colliding the integrated circuit on the frame and the local array that is positioned at the marking of integrated circuit with formation.
Also having a kind of proposal to comprise along electronic component collides the diagonal and/or the angle of frame or arrange a plurality of " illusory " solder sphere in other high stress locations; so that some protections to the solder sphere that source terminal is arranged that is connected to electronic component to be provided; disperse the fervent change tension force of top, bigger zone, " illusory " solder sphere does not connect the source terminal that has of electronic component.Dummy balls only provides the mechanical connection between printed circuit board (PCB) and the electronic component collision frame thus.
In recent years to the consideration of environment encourage to utilize can be copper (
Cu), silver (
Ag) and tin (
Sn) alloy or copper (
Cu), indium (
In) and tin (
Sn) alloy or these alloys mixture unleaded (
Pb) solder flux.The solder sphere that is used for the General Principle of unleaded solder and time requirement BGA electronic component and welding compound all be essentially identical composition to avoid fusing point different, influence the integrality of the electric coupling of welded contact.May be a problem like this, be coated with tin in one of leaded solder flux or welding compound pad, and solder sphere be unleaded and other are leaded, so that run into different fusion temperatures at arbitrary printed circuit board (PCB) and/or the electric terminal that collides on the frame contact pad.Even essentially identical solder alloy is arranged in the welding compound of the solder sphere of welded gasket on being formed on circuit board and BGA, the fusion temperature of also being not difficult to run into space or blocking-up, especially solder sphere in the BGA welded contact is lower than the words of the fusion temperature of welded gasket.These spaces or blocking-up can cause the decay or because the field failure of the back that mechanical or electric inefficacy causes in the welded contact of electronic device.
Summary of the invention
According to a scheme of the present invention, provide a kind of and the BGA electronic component can be installed to the surface and be installed to method on the printed circuit board (PCB), this element has first array of solder sphere and second array of solder sphere, and described method comprises:
On printed circuit board (PCB), determine the two the position of second array of first array of solder sphere and solder sphere, locate first array and second array and aim at welding deposit separately on the installation pad of described printed circuit board (PCB) to form assembly; And
Making described assembly be subjected to reflow soldering handles, wherein second array of solder sphere fusing after first array of solder sphere and described welding deposit, described second array of solder sphere has delayed the contact between described first array and the described welding deposit separately thus, after described first array and their described welding deposits separately that abundant melting is received.
Suitably, second array comprises the solder sphere with diameter bigger than the solder sphere of described first array.
Preferably, first array is spaced apart with described welding deposit separately during the initial period that described reflow soldering is handled.
Suitably, second array comprises the welding alloy with fusing point higher than described first array.Selectively, described second array can comprise the welding alloy with fusing point higher than described first array.
Suitably, the fusing point of described welding deposit is than the described first array height.
Preferably, described second array keep the melting welding of described first array receive and described welding deposit separately between separate a period of time, be enough to during this period of time between described first array and the described welding deposit separately the contact before make the welding stick (solder paste flux) evaporation.
Suitably, second array is not electrically coupled to the active tube core electrode that the BGA electronic component can be installed in the surface.
According to another aspect of the present invention, provide a kind of surface that the BGA electronic component can be installed, comprise that the described electronic component of BGA collision frame has:
First array of solder sphere;
Second array of solder sphere, make described second array during reflow soldering is handled, be suitable for delaying aiming at contact between the welding deposit on described first array and the installation pad, melt up to described first array and described welding deposit separately at printed circuit board (PCB).
Preferably, described second array comprises the big solder sphere of diameter that has than the solder sphere of described first array.Suitably, described second array comprises the alloy that has with the essentially identical fusing point of described first array.Selectively, described second array can comprise the alloy with fusing point higher than described first array.
Suitably, select described second array of solder sphere to have the fusing point higher than the fusing point of described welded gasket.
Preferably, described second array is positioned at the relative angle of diametric(al) of contiguous described collision frame.In an interchangeable arrangement, the opposite side edge of the contiguous described collision frame of described second array is set.Yet, in another interchangeable arrangement, arrange described second array by cross configuration.
Suitably, second array is not electrically coupled to the active tube core electrode that the BGA electronic component can be installed in the surface.
According to another aspect of the present invention, provide a kind of electronic device assembly, described assembly comprises:
The BGA electronic component can be installed in the surface; And
Have tape welding thereon and connect the printed circuit board (PCB) that one of deposit is listed as the installation pad, described surface can be installed the BGA electronic component and be comprised first array of solder sphere and second array of solder sphere, described assembly is characterised in that described second array has one or more characteristics different with described first array, make in the fusion (fusion) that has delayed during the reflow soldering between described first array and the described welding deposit separately, up to after described first array and described welding deposit fusing separately.
Suitably, the described solder sphere of first array all forms the welded contact littler than the solder sphere volume of described second array.
Preferably, second array is not electrically coupled to the active tube core electrode that the BGA electronic component can be installed in the surface.
Description of drawings
For ease of understanding the various schemes of invention more fully, and be committed to practice, referring now to the preferred embodiment of example shown in the accompanying drawing, wherein:
Fig. 1 shows the vertical view that the BGA electronic component can be installed in the surface;
Fig. 2 shows the encapsulation of Fig. 1 by reverse position;
The end view of the assembly of BGA electronic component and printed circuit board (PCB) can be installed in the surface that Fig. 3 schematically shows Fig. 1 before reflow soldering is handled;
Fig. 4 showed before reflow soldering is handled the enlarged drawing of institute's region surrounded among Fig. 3;
Fig. 5 shows the assembly of Fig. 3 during reflow soldering is handled;
Fig. 6 shows during reflow treatment the enlarged drawing of institute's region surrounded among Fig. 3;
Fig. 7 shows the end view of the assembly of Fig. 3 after reflow treatment is finished;
Fig. 8 shows the enlarged drawing of institute's region surrounded among Fig. 7;
Fig. 9 shows the surperficial end view that the replaceable component of BGA electronic component and printed circuit board (PCB) can be installed during reflow treatment;
Figure 10 shows the enlarged drawing of institute's region surrounded among Fig. 9; And
Figure 11 and 12 shows the alternative embodiment of second welded ball array structure.
For simplicity, in the place of needs, represent same characteristic features with identical reference number.
In this specification and claims, term " comprises (comprises) ", " comprising (including) ", " constitute (comprising) " or similarly term be used to represent the inclusion of non-special use, make the method or the device that comprise the element tabulation just not comprise those elements, and can comprise other element of not listing fully.
Embodiment
Fig. 1 schematically shows the vertical view that BGA electronic component 1 can be installed in the surface that often is called the encapsulation of BGA integrated circuit.
As being first array 2 that is arranged in the conventional solder sphere 3 of the spaced array that is combined with the contact mat 4 that collides frame (bump frame) 0 as shown in the outstanding analogous diagram, these contact mats 4 with contain part surface and the electronic circuit of BGA electronic component 1 can be installed be electrically connected.Electronic circuit generally is formed on the semi-conducting material and is commonly referred to tube core, and tube core is protected by the sealing shell 13 that is generally rectangular shape.In the inside at each angle of shell 13 are the additional corresponding contact pads 4 that contain conventional solder sphere 3a, conventional solder sphere 3a can or not be electrically connected to the electronic circuit (not shown), is adhered on the printed circuit board (PCB) (not shown) and help mechanically to make the surface that BGA electronic component 1 can be installed in addition.
Be positioned at separately contact mat 5, be second array at the relative place, angle of the diametric(al) of first array 2 with solder sphere 6 bigger than the diameter of the solder sphere 3 of first array 2.Witness marker symbol 7 is provided, during handling in conventional automatic component, the mechanical treatment and the direction that help the surface that BGA electronic component 1 can be installed determine that wherein electronic circuit or tube core are connected on the solder sphere 3,6 of the contact mat separately 4,5 (often being called electrode) that is positioned at tube core.Should be clearly as those skilled in the art institute, first array and second array needn't have the pattern of rule, and in this manual, array can just have group, cover or a plurality of broad sense.
The converse digraph of BGA electronic component 1 can be installed in the surface that Fig. 2 shows Fig. 1, and wherein first array 2 of solder sphere 3 and the angle array of ball 6 are apparent.Witness marker symbol 7 also is apparent.
Fig. 3 shows the surface that is installed in the Fig. 1 and 2 on the printed circuit board (PCB) 8 can install BGA electronic component 1, and printed circuit board (PCB) 8 has a plurality of welding deposits 9,10, and welding deposit 9,10 is deposited on respectively on installation pad 9a, the 10a that forms the array that pad is installed.Pad 9a is installed is electrically connected at least on the conduction runner on the printed circuit board (PCB) 8 (conductive runner), and the solder sphere separately 3 that pad 9a alignment surface can be installed BGA electronic component 1 is installed.The solder sphere separately 6 that pad 10 can be installed BGA electronic component 1 by printed circuit board (PCB) 8 supports and alignment surface is installed.Install on pad 10 runners of conduction separately that can or not be electrically connected on the printed circuit board (PCB) 8, in other words, these install pad 10 can be " illusory pad ".Similarly, solder sphere 6 can or not be electrically connected to the surface (for example, active tube core electrode) on the circuit of BGA electronic component 1 can be installed.
Fig. 4 is the enlarged drawing of institute's region surrounded among Fig. 3, makes the gap between solder sphere 3 and the welding deposit 9 separately more cheer and bright thus.Among Fig. 3 and Fig. 4 the structure example that represents of signal go out in reflow ovens or smelting furnace (not shown), be subjected to the normal reflux soldering before, second array of first array 2 of solder sphere 3, big ball 6 and their juxtaposition relationship that welds deposit 9,10 separately on pad 9a, 10a separately.
Fig. 5 and 6 schematically example the progress that reflow soldering is handled can be installed after BGA electronic component 1 is placed in reflow ovens or the smelting furnace on the surface of supporting by the printed circuit board (PCB) shown in Fig. 38.
At first, solder sphere 3 and welding deposit 9 separately reach their fusing point, and when the composition of ball 3 and the welding alloy of welding in the deposit 9 is identical, their fusing point will be identical.Along with ball 3 and 9 fusings of welding deposit, as among Fig. 6 more clearly shown in, surface tension makes cross section profile to a certain degree smooth, and be tending towards keeping the perpendicular separation between solder sphere 3 and the welding deposit 9 to arrive to a certain degree, shell 13 and printed circuit board (PCB) that BGA electronic component 1 can be installed in present thus surface separate one apart from d2.
Because the big quality of solder sphere 6, these bigger balls will spend the longer time and reach the fusion temperature identical with solder sphere 3 and welding deposit 9, although solder sphere 6 begins to penetrate welding deposit 10 separately, because thermal energy shifts and enters solder sphere 6,10 kinds of speed that increase temperature of welding deposit have been hindered in a way.Trial is after increase is used for the net effect of the time that fusion temperature spent that solder sphere 6 reaches them, make solder sphere 6 fusing and fully softening before solder sphere 3 and welding deposit 9 separately fully melt, so that can installing BGA electronic component 1 shell 13, the surface moves towards printed circuit board (PCB) 8, the complete moistening convex surface 11,12 of solder sphere 3 and welding deposit 9 is lumped together, shown in Fig. 6 plants more clearly.
Fig. 7 and 8 schematically shows the conclusion that reflow soldering is handled, wherein the solder sphere 3 of Fig. 3 to Fig. 6 and 6 welding deposits 9 and 10 thorough and separately merge, with abundant formation moistening noncrystal 14, noncrystal 14 show electricity high holonmic space or that do not have blocking-up and mechanical bond between the shell 13 that the surface can be installed by BGA electronic component 1 and the printed circuit board (PCB) 8, can install between the shell 13 of BGA electronic component 1 and the printed circuit board (PCB) 8 on the surface to have final separation distance d3.In for the Fig. 8 that centers on regional enlarged drawing among Fig. 7, can be clear that more, noncrystal is than big a little rear portion similar (post-like) structure of nearby contact that is used to install pad 9a, and provide the surface that the mechanical contacts that strengthens can be installed between BGA electronic component 1 and the printed circuit board (PCB) 8 thus, noncrystally provide corresponding original larger-diameter fillet welding to receive 6 and the electricity and the mechanical contacts 14a of welding deposit 10 separately.In other words, the solder sphere 3 of first array 2 forms the little welded contact of solder sphere 6 volumes than second array respectively.
From the above, should understand the position of second array of first array by on printed circuit board (PCB) 8, determining solder sphere and solder sphere, form the assembly that BGA electronic component 1 and printed circuit board (PCB) 8 can be installed in the surface.The position of determining first array 2 and second array is to install the welding deposit 9a, 10 that aims on the pad separately.Make this assembly be subjected to reflow soldering then and handle, make second array of solder sphere after first array 2 of solder sphere and welding deposit 9,10, melt.Therefore, as mentioned above, second array of solder sphere has delayed the contact between described first array and the welding deposit separately, after first array 2 of solder sphere melts fully with their welding deposits 9 separately.The special advantage that is contacted generation by delaying between solder sphere 3 and the welding deposit 9 separately is, before the complete moistening convex surface of ball as shown in Figure 63 and welding deposit 9 combines, allow the longer time and be used to weld the interior residue flux evaporates of deposit 9.In addition, the present invention will allow two welding systems, and wherein supposition welding deposit 9,10 comprises the fluxless lead-in wire, and the fluxless lead-in wire generally has specific surface the high a little fusion temperature of lead-in wire that contains solder sphere on the BGA electronic component 1 can be installed.By utilizing the second solder sphere array of fusing the first solder sphere array after, melting receive contact with it before, this will make more that the welded gasket of high melting temperature fully melts.
Should be readily understood that for those skilled in the art, under the situation that does not break away from the spirit and scope of the invention, can make many modifications and variations various schemes of the present invention.
For example, Fig. 9 and 10 shows interchangeable embodiment, wherein has than the high fusion temperature of the solder sphere 3 of main or first array 2 except that the selected solder sphere 3a of second array, and all solder sphere 3 diameters that BGA electronic component 1 can be installed in the surface are identical.Figure 10 is the enlarged drawing that centers on the zone among Fig. 9.
Simultaneously, before reflow soldering is handled, as shown in Figure 9, all solder sphere 3 welding deposit 9 initial with 3a and separately contacts, surface tension in the convex surface 11,12 of solder sphere 3 and welding deposit 9 separately makes melting solid planarization and produces interval between it thus, up to higher fusion temperature, ball 3a begins fusion and softening.During reflow soldering was handled, ball 3a was used as the fin that welds deposit 10 separately to a certain extent, and therefore postponed its fusing.In case ball 3a begins fusing, the shell 13 that BGA electronic component 1 can be installed in the surface moves towards printed circuit board (PCB) 8, begins (occlusion free) electricity and the mechanical contacts that contacts and form solid-state space (solid void) or do not have blocking-up up to solder sphere 3 and the complete moistening convex surface 11,12 that welds deposit 9.
Figure 11 and 12 shows the cross selected and the edge configuration of second array 15 of solder sphere 6 respectively, although wherein example second array 15 comprise larger-diameter solder sphere 6, for ease of clear, should understand that ball 6 can also the solder sphere of high melting temperature constitutes by having with the first array same diameter more, as the embodiment institute illustration of Fig. 9 and 10.
Among embodiment shown in all, the solder sphere of second array can be used as the surface can install electric coupling between BGA electronic component 1 and the printed circuit board (PCB), and perhaps they can comprise " illusory " coupling that mechanical connection only is provided simply.
Should understand at an easy rate also that to those skilled in the art the shortcoming that various schemes of the present invention can be installed BGA electronic component 1 electric contact at the surface of the prior art that forms during handling in reflow soldering provides a kind of simple and exquisite solution.By first and second arrays of the solder sphere of utilizing different qualities on the BGA electronic component 1 can be installed on the surface, can be before second array fusing of solder sphere, the solder sphere of first array and the welded gasket separately on the printed circuit board (PCB) are melted fully, so that the solder sphere and the fusion between the welded gasket separately on the printed circuit board (PCB) of fusing fully of first array.The solder sphere of second array and between first array and their welded gaskets separately controlled separation is arranged when their welding deposits separately on the pad being installed allowing in fusion fully, this delay in the gathering of moistening melted surface fully simultaneously can make the residue solder flux evaporate from the flux constituent of welding deposit.
Claims (16)
1, a kind ofly the BGA electronic component can be installed to the surface and be installed to method on the printed circuit board (PCB), this element has first array of solder sphere and second array of solder sphere, and described method comprises:
On printed circuit board (PCB), determine the two the position of second array of first array of solder sphere and solder sphere, locate first array and second array and aim at welding deposit separately on the installation pad of described printed circuit board (PCB) to form assembly; And
Making described assembly be subjected to reflow soldering handles, wherein second array of solder sphere fusing after first array of solder sphere and described welding deposit, described second array of solder sphere has delayed the contact between described first array and the described welding deposit separately thus, after described first array and their described welding deposits separately that abundant melting is received.
2, as the desired method of claim 1, wherein, described second array comprises the solder sphere with diameter bigger than the solder sphere of described first array.
3, as the desired method of claim 1, wherein, during the initial period that described reflow soldering is handled, described first array separates with separately described welding deposit.
4, as the desired method of claim 3, wherein, described second array comprises the welding alloy that has with the essentially identical fusing point of described first array.
5, as the desired method of claim 3, wherein, described second array comprises the welding alloy with fusing point higher than described first array.
6, as the desired method of claim 2, wherein, described second array comprises the welding alloy with fusing point higher than described first array.
7, as the desired method of claim 1, wherein, described second array keep the melting welding of described first array receive and described welding deposit separately between separate a period of time, be enough to before contact between described first array and the described welding deposit separately, make welding stick evaporation during this period of time.
8, as the desired method of claim 1, wherein, second array is not electrically coupled to the active tube core electrode that the BGA electronic component can be installed in the surface.
9, the BGA electronic component can be installed in a kind of surface, and the described electronic component that contains BGA collision frame has:
First array of solder sphere;
Second array of solder sphere, make described second array during reflow soldering is handled, be suitable for delaying aiming at contact between the welding deposit on described first array and the installation pad, melt up to described first array and described welding deposit separately at printed circuit board (PCB).
10, as the desired electronic component of claim 9, wherein, described second array comprises the big solder sphere of diameter that has than the solder sphere of described first array.
11, as the desired electronic component of claim 9, wherein, described second array comprises the alloy that has with the essentially identical fusing point of described first array.
12, as the desired electronic component of claim 9, wherein, described second array comprises the alloy with fusing point higher than described first array.
13, as the desired electronic component of claim 9, wherein, second array is not electrically coupled to the active tube core electrode that the BGA electronic component can be installed in the surface.
14, a kind of electronic device assembly, described assembly comprises:
The BGA electronic component can be installed in the surface; And
Have tape welding thereon and connect the printed circuit board (PCB) of the installation pad array of deposit, described surface can be installed the BGA electronic component and be comprised first array of solder sphere and second array of solder sphere, described assembly is characterised in that described second array has one or more characteristics different with described first array, make in the fusion that has delayed during the reflow soldering between described first array and the described welding deposit separately, up to after described first array and described welding deposit fusing separately.
15, as the desired assembly of claim 14, wherein, each in the described solder sphere of first array all forms the welded contact littler than the solder sphere volume of described second array.
16, as the desired assembly of claim 14, wherein, second array is not electrically coupled to the active tube core electrode that the BGA electronic component can be installed in the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410085097 CN1761381A (en) | 2004-10-12 | 2004-10-12 | Method of installing integrated circuit package, its method and formed assembly thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410085097 CN1761381A (en) | 2004-10-12 | 2004-10-12 | Method of installing integrated circuit package, its method and formed assembly thereof |
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| Publication Number | Publication Date |
|---|---|
| CN1761381A true CN1761381A (en) | 2006-04-19 |
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ID=36707275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410085097 Pending CN1761381A (en) | 2004-10-12 | 2004-10-12 | Method of installing integrated circuit package, its method and formed assembly thereof |
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| Country | Link |
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| CN (1) | CN1761381A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219310A (en) * | 2013-03-18 | 2013-07-24 | 三星半导体(中国)研究开发有限公司 | Mixed solder ball arrangement and forming method thereof |
| CN110677991A (en) * | 2019-09-19 | 2020-01-10 | 华为技术有限公司 | Packaging structure, finished circuit board, electronic device, electronic equipment and welding method |
-
2004
- 2004-10-12 CN CN 200410085097 patent/CN1761381A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219310A (en) * | 2013-03-18 | 2013-07-24 | 三星半导体(中国)研究开发有限公司 | Mixed solder ball arrangement and forming method thereof |
| CN110677991A (en) * | 2019-09-19 | 2020-01-10 | 华为技术有限公司 | Packaging structure, finished circuit board, electronic device, electronic equipment and welding method |
| CN110677991B (en) * | 2019-09-19 | 2021-08-20 | 华为技术有限公司 | Packaging structure, finished circuit board, electronic device, electronic equipment and welding method |
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