CN1070684C - Fixing structure of printed circuit board - Google Patents
Fixing structure of printed circuit board Download PDFInfo
- Publication number
- CN1070684C CN1070684C CN97103602A CN97103602A CN1070684C CN 1070684 C CN1070684 C CN 1070684C CN 97103602 A CN97103602 A CN 97103602A CN 97103602 A CN97103602 A CN 97103602A CN 1070684 C CN1070684 C CN 1070684C
- Authority
- CN
- China
- Prior art keywords
- tongue piece
- circuit board
- printed circuit
- metal frame
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Combinations Of Printed Boards (AREA)
- Connection Or Junction Boxes (AREA)
Abstract
A fixing structure for a printed circuit board, includes a first tongue piece 15 and a second tongue piece 17 are formed at positions close to each other on a side plate 12 of a metal frame 11, the first tongue piece 15 is bent inside the metal frame 11 to fix a printed circuit board 4, and a conductive pattern 9 arranged on the printed circuit board 4 is soldered on the first tongue piece 15 and the second tongue piece 17. Solder 10 is filled on an end portion 15b of the first tongue piece 15, a base portion 17a of the second tongue piece 17, and a portion therebetween, and the solder 10 is filled over a portion extending from an end portion 9b side to an internal portion 9a side on the conductive pattern 9, so that a structure having high connection strength can be obtained.
Description
The present invention relates to a kind of device that in electronic circuit equipment printed circuit board (PCB) is fixed on the metal frame, described electronic circuit equipment is as comprising the electronic tuning equipment that constitutes the metal frame of the printed circuit board (PCB) of electronic circuit and shielding case with being.
General electronic equipment all comprises printed circuit board (PCB), is equipped with on it such as circuit elements such as resistance, diode, capacitor, register and inductors.
Printed circuit board (PCB) is following making.Here it is is processed into predetermined shape with copper-plated multilayer phenol plate, and makes predetermined circuit patterns on this multi-layer sheet.Make a plurality of circuit element installing holes, in the electrode insertion installing hole with circuit element, with scolder each electrode is received on the circuit diagram again, constitute electronic device circuitry.
Particularly a kind of electronic equipment, as comprise the electronic tuning unit of great number oscillating circuit, adopt and a kind ofly printed circuit board (PCB) is fixed to its upper surface structure on the square metal frame of one opening is arranged, in order to avoiding unnecessary radiation, and be used for fixing electrode or the joint that connects other circuit to other circuit or miscellaneous equipment.In this case, for making the electric upward ground connection of metal frame, a conduction pattern and a metal frame that forms by the Copper Foil of peripheral part etching at this printed circuit board (PCB) is connected together with scolder.
As this printed circuit board (PCB) is fixed in the structure of metal frame, Japanese unsettled utility model discloses a kind of fixture of describing among the clear 62-178596 and has belonged to known.As a kind of specific embodiment of this fixture, Figure 11 is the perspective view that concerns between an expression metal frame and the printed circuit board (PCB), and Figure 12 is the profile of main coupling part between an expression metal frame and printed circuit board (PCB).Shown in Figure 11 and 12, a side plate 2 of metal frame 1 struck out one be the punch-out 3 of " fall U " shape, form tongue piece 5, also cut this side plate 2 and be bent to below the tongue piece 5, form a plate shape brace 8.When printed circuit board (PCB) 4 is put into metal frame 1, from the upper open end of metal frame 1 printed circuit board (PCB) 4 is embedded, flatly be placed on a position, printed circuit board (PCB) 4 is contacted with plate shape brace 8, the end 5b with tongue piece 5 is pressed into metal frame 1 the inside again.At this moment, foundation part 5a contacts and is bent with the end face of printed circuit board (PCB) 4, with fixed printed circuit board 4.When heat being melted scolder 10 and inserts tongue piece 5 and be arranged in position between the conduction pattern 9 of printed circuit board (PCB) 4 peripheral part, make it to cool off and condense, scolder 10 is bonded on tongue piece 5 and the conduction pattern 9, and insert in the slit of tongue piece 5 and 9 in pattern of conduction, thereby tongue piece 5 and conduction pattern 9 are connected together mutually with scolder.According to the method, by mechanical fixation and electrical connection, printed circuit board (PCB) 4 is fixed on the metal frame 1.
Yet in this prior art, when making tongue piece 5 by bending as shown in Figure 12, though tongue piece 5 is wide with conducting electricity the slit of 9 in pattern at 5b place, the end of tongue piece 5, this slit narrows down towards foundation part 5a, and disappears in foundation part 5a place.For this reason, when tongue piece 5 and conduction were welded to connect between the pattern 9, the scolder 10 on the conduction pattern 9 was only filled out on the inner 9b, has only very small amount of scolder 10, the end 9a that does not perhaps have scolder 10 to be filled out to accumulate.Therefore, towards the end 9a that accumulates, the connection of conduction pattern 9 is variation nocuously.
This problem has just caused following problem.When the temperature cycle test that is used to test achieved reliability (for example, the test in 10 cycles hockets in-20 ℃ to 60 ℃ environment), because the intrinsic thermal coefficient of expansion of metal frame 1 and printed circuit board (PCB) 4 material therefors is different, to act on the scolder 10 by the different stress that produce between the amount of metal frame 1 and printed circuit board (PCB) 4 thermal expansions (or contraction).If the amount of scolder 10 is less, to forms the slit in the scolder 10, so that cause cracking nocuously.
Consider the above-mentioned situation of prior art and make the present invention, the objective of the invention is to propose a kind of fixture of printed circuit board (PCB), a large amount of scolders are received in the slit of tongue piece 5 and 9 in pattern of conduction, to strengthen bonding strength.
For addressing the above problem, the present invention proposes a kind of fixture of printed circuit board (PCB), comprising: a upper surface has the square metal frame of opening; A printed circuit board (PCB) is placed in the described metal frame, and this printed circuit board (PCB) has the conduction pattern that forms at least on a face; First and second tongue pieces are formed on position close to each other on the side plate of described metal frame by punching press; Wherein, first tongue piece contacts with an end of described printed circuit board (PCB), and bending into described metal frame the inside, second tongue piece has an angle different with first tongue piece about printed circuit board surface, and first and second tongue pieces are connected with described conduction pattern by scolder.
According to this device, since first and second tongue pieces under the different angles situation towards described printed circuit board (PCB), so first and second tongue pieces are welded on the described conduction pattern, make the tongue piece of winning between end and conduction pattern, have suitable slit, and second tongue piece has a slit, can weld between foundation part and conduction pattern., scolder is filled out in the end of first tongue piece for this reason, and scolder is filled out foundation part at second tongue piece in end one side of accumulating in the inboard.In addition, because first tongue piece and second tongue piece are adjacent to each other, and have different angles, so fill scolder, in order to connecting first and second tongue pieces, and the amount of scolder is more than conducting electricity the summation of the amount of solder that part is filled out between pattern and two tongue pieces.For this reason, the area of scolder and thickness increase, and can provide to have the printed circuit board retaining device that height is welded to connect intensity.
According to apparatus of the present invention, except that These characteristics, because second tongue piece is bent towards the outside of described metal frame side plate, so the slit between second tongue piece and the conduction pattern increases, more the scolder of volume is received in this slit.For this reason, can provide printed circuit board retaining device with higher bonding strength.
According to apparatus of the present invention,,, do not need to make the second required tongue piece partly to be bent if first tongue piece is bent because except that above-mentioned feature, first tongue piece partly forms second tongue piece.For this reason, can provide a kind of printed circuit board retaining device of being bent of being easy to.
Hereinafter with reference to accompanying drawing specific embodiments of the invention are described, wherein:
Fig. 1 is the major part profile that the process of expression first embodiment is welded to connect;
Fig. 2 is the top view that expression first embodiment is welded to connect the state major part;
Fig. 3 is the front view of metal frame test specimen 1 major part among expression first embodiment;
Fig. 4 is the front view of metal frame test specimen 2 major parts among expression first embodiment;
Fig. 5 is the front view of metal frame test specimen 3 major parts among expression first embodiment;
Fig. 6 is the front view of metal frame test specimen 4 major parts among expression first embodiment;
Fig. 7 is the major part profile that the process of expression second embodiment is welded to connect;
Fig. 8 is the front view of metal frame test specimen 5 major parts among expression second embodiment;
Fig. 9 is the major part profile that the process of expression the 3rd embodiment is welded to connect;
Figure 10 is the front view of expression metal frame test specimen 6 major parts;
Figure 11 is the perspective view of jockey between expression prior art metal frame and the printed circuit board (PCB);
Figure 12 is the major part profile of expression prior art through being welded to connect.
Main reference label representative among the figure:
1.11.21.31.41.51.61.71: metal frame
2.12.22.32.42.52.62.72: side plate
3.13.23.33.63.73: punch-out
43a: first punch-out
43b: second punch-out
4: printed circuit board (PCB)
5: tongue piece
15.25.35.45.55.65.75: first tongue piece
5a.15a.65a.75a: the foundation part
5b.15b.65b.75b: the end
16.26.66.76: cutting part
17.27.37.417.57.67.77: second tongue piece
17a.57a: base part
77b: end
8.18: the circuit board brace
9: the conduction pattern
9a: inside
9b: end
10: scolder
Referring to figs. 1 through Fig. 3, the position of laying printed circuit board (PCB) 4 that constitutes the side plate 12 of metal frame 11 is stamped into the hole of " U " shape, forms punch-out 13, and, on the tongue-shaped member that punch-out 13 is centered on, form first tongue piece 15 and second tongue piece 17 by cutting part 16.Side plate 12 partly is bent to the metal frame the inside, forms circuit board brace 18.Make first tongue piece 15, second tongue piece 17 and circuit board brace 18 in due form, make when adding mutual metal frame 11, adopt metal die (not shown) stamped metal frame 11.
To narrate a kind of method of printed circuit board (PCB) 4 being put into metal frame 11 just like first tongue piece 15 and second tongue piece 17 of above-mentioned formation of utilizing below.
The upper, open end (not shown) of printed circuit board (PCB) 4 from metal frame 11 flatly inserted, and be placed on one and make metal frame 11 and circuit board brace 18 contacted positions.When with a suitable clamping device (not shown) end 15b of first tongue piece 15 being pressed onto metal frame 11 the insides, foundation part 15a contacts with the end face of printed circuit board (PCB) 4, and is bent, and forms a slit between end 15b and printed circuit board (PCB) 4.Just make first tongue piece 15 at an angle about the surface of printed circuit board (PCB).Can suitably set this angle, make first tongue piece 15 and printed circuit board (PCB) 4 press contacts, but not roll and decrease printed circuit board (PCB) 4.In this case, the foundation part 15a of first tongue piece 15 be in printed circuit board (PCB) 4 press contacts in., printed circuit board (PCB) 4 mechanically is fixed on the metal frame 11 for this reason, has avoided drawing off or shakiness of printed circuit board (PCB) 4.At this moment, second tongue piece 17 meets at right angles with printed circuit board surface.
When heat being melted scolder 10 and introduce between the conduction pattern 9 that is arranged on the printed circuit board (PCB) 4 and first, second tongue piece 15 and 17, scolder 10 is attached to conduct electricity on pattern 9, first tongue piece 15 and second tongue piece 17.At this moment, because the slit between first tongue piece 15 and the conduction pattern 9 increases towards end 15b, increase so insert the amount of part scolder 10 between first tongue piece 15 and the conduction pattern 9.Because second tongue piece 17 meets at right angles with conduction pattern 9, scolder 10 is filled out on the foundation part 17a.In addition, the scolder on end 15b that fills out at first tongue piece 15 and second tongue piece, the 17 foundation part 17a is adjacent to each other, so that these scolders are linked on the conduction pattern.When being condensed, can obtain being electrically connected when making the above-mentioned heat of inserting melt scolder 10 coolings.As the method for on conduction pattern 9, fusion welding 10 being put into slit between first tongue piece 15 and second tongue piece 17, generally adopt the method for the thread scolder of fusion.Also adopt and a kind of the method that heat is melted solder bath immersed in the coupling part, or a kind of with the paste solder coating on the coupling part, the method by localized heating or this paste scolder of backflow melting fusion again.As the method for cooling off and condensing, adopt the method for at room temperature shelving soldered part.As a result, the scolder 10 that area is big, thickness is also big is received on the end 9a and inner 9b of conduction pattern 9, and is received in mid portion therebetween.Thereby bonding strength is strengthened.
In first embodiment, Fig. 4 to Fig. 6 is the front view of expression metal frame test specimen 2 to 4 major parts.Followingly will only narrate different part between metal frame test specimen 1 and the metal frame test specimen 2 to 4 with reference to Fig. 4 to Fig. 6.
Metal frame test specimen 2 shown in Figure 4 comprises first tongue piece 25 and second tongue piece 27 that is formed by punch-out 23 and cutting part 26 on the side plate 22 of metal frame 21.Second tongue piece 27 is formed at the both sides of first tongue piece 25, first tongue piece 25 is clipped in the middle, and each second tongue piece 27 is all short than first tongue piece 25.
In metal frame test specimen 3 shown in Figure 5, first tongue piece 35 and second tongue piece 37 form a spacer segment, make to form a punch-out 33 on the side plate 32 of metal frame 31.
In metal frame test specimen 4 shown in Figure 6, first tongue piece 45 and second tongue piece 47 are formed at position close to each other, make to form two punch-out 43a and 43b on the side plate 42 of metal frame 41.
In Fig. 4 to Fig. 6, utilize the method for describing among first embodiment, respectively printed circuit board (PCB) 4 is fixed in metal frame 21,31 and 41, can obtain just like the same intensity that is welded to connect described in first embodiment.
Fig. 7 is the major part profile that the process of expression second embodiment is welded to connect.Utilize the described method of first embodiment, on the side plate 52 of metal frame 51, form first tongue piece 55 and second tongue piece 57, and as shown in Figure 7, second tongue piece 57 is bent to side plate 52 outsides.When processing metal frame 51, carry out this bending in advance.Utilize the method described in first embodiment, realize printed circuit board (PCB) 4 is put into metal frame 51,, and between conduction pattern 9 and first, second tongue piece 55 and 57, weld by first tongue piece 55 fixed printed circuit board 4 mechanically.As a result, the interval between the foundation part 57a of the conduction pattern 9 and second tongue piece 57 is strengthened, and has a large amount of scolders to be received in the slit of conducting electricity between pattern 9 and the described foundation part 57a.For this reason, can obtain the bonding strength higher according to second embodiment than first embodiment.
In a second embodiment, any one in the test specimen of metal frame shown in Fig. 4 to 62 to 4 can be adopted, and the bonding strength higher can be obtained than first embodiment.
Fig. 8 is the front view of metal frame test specimen 5 major parts among expression second embodiment.As shown in Figure 8, on the side plate 62 of metal frame 61, form first tongue piece 65, and on the part of first tongue piece 65, form second tongue piece 67 with " U " shape cutting part 66 with " U " shape punch-out 63.Simultaneously, second tongue piece 67 is bent to the outside (not shown) of side plate 62.In this example, utilize the method described in first embodiment, realize printed circuit board (PCB) 4 is put into metal frame 61, by first tongue piece 65 fixed printed circuit board 4 mechanically, and between conduction pattern 9 and first, second tongue piece 65 and 67, weld.As a result, insert the scolder of Duoing, and bonding strength is enhanced than the first embodiment amount.In this embodiment, when the end 65b of first tongue piece 65 is pressed into metal frame 11 the insides, can obtain following characteristic.Just, owing to there is not bending stress to act on second tongue piece that is centered on by cutting part 66, so foundation part 65a can easily be bent, it is bent into an end face of printed circuit board (PCB) 4 and contacts.
As the 3rd embodiment, Fig. 9 is the profile that expression is welded to connect major part; And Figure 10 is the front view of expression metal frame test specimen 6 major parts.Below will only narrate first embodiment part different with the 3rd embodiment.With reference to Fig. 9 and 10, on the side plate 72 of metal frame 71, form first tongue piece 75 with " U " shape punch-out 73, and on the part of first tongue piece 75, form second tongue piece 77 with " U " shape cutting part 76.Simultaneously, second tongue piece 77 is bent to the outside (not shown) of side plate 72.In this example, when with method described in first embodiment printed circuit board (PCB) 4 being put into metal frame 71, and when the foundation part 75a of first tongue piece 75 was pressed into metal frame 71, it was bent into and makes it to contact with an end face of printed circuit board (PCB) 4.At this moment, second tongue piece 77 moves with the end 75b of first tongue piece 75, and end 77b consequently forms a slit in the face of metal frame 71 outsides between the end of end 77b and printed circuit board (PCB) 4.
When utilizing that method is welded described in first embodiment, a large amount of scolders 10 can be filled out on the end 75b and the part between the 77b of conduction pattern 9 and first, second tongue piece 75 and 77.For this reason, can obtain being equal to bonding strength among second embodiment.In addition, owing to when fixed printed circuit board 4 mechanically, can easily make first tongue piece 75, thereby can obtain the effect same just like metal frame test specimen among second embodiment 5 by these characteristics of bending.
According to top each embodiment the present invention is achieved, and following characteristics are arranged.
The amount of solder of being filled out part between conduction pattern and first and second tongue piece in order to weld is mutually increased.Owing to the bonding area of coupling part is increased, make that the tensile strength between each tongue piece and the conduction pattern strengthens.Increased owing to fill out the solder thickness of part between each tongue piece and the conduction pattern, make the warpage intensity enhancing of scolder itself.Therefore, bonding strength advantageously is enhanced.
Owing to form first and second tongue pieces by forming punch-out,, can prevent in the welding process that promptly scolder from flowing on the described side plate so except the advantage that can easily realize above-mentioned bending processing, can also obtain an advantage.
When adopting immersed solder to be welded to connect in due form, because air is charged into the stenosis of coupling part, so that frequent generation scolder is not applied the shortcoming on joint face fully.According to the present invention, even first tongue piece is bent, be in and the printed circuit board (PCB) press contacts, the end of second tongue piece and printed circuit board (PCB) is not in the press contacts, thereby has kept the slit between second tongue piece and the printed circuit board (PCB).For this reason, air is discharged from between second tongue piece and conduction pattern the slit of welding portion, and makes scolder be inserted part between second tongue piece and conduction pattern fully, consequently can obtain to realize reliably the advantage of welding.
When the paste scolder being sent into described tongue piece and the part of conduction between pattern, when carrying out reflow soldering, in first or second embodiment, can vertically insert a nozzle from the upper opening of described metal frame.For this reason, can obtain a kind of attachment device, it is suitable for automation equipment, and a plurality of nozzles that are arranged in a plurality of coupling parts are respectively arranged, and with activation the paste scolder is delivered to a plurality of coupling parts simultaneously.
Claims (3)
1. the fixture of a printed circuit board (PCB), comprising: a upper surface has the square metal frame of opening; A printed circuit board (PCB) is placed in the described metal frame, and this printed circuit board (PCB) has the conduction pattern that forms at least on a face; First and second tongue pieces are formed on position close to each other on the side plate of described metal frame by punching press; It is characterized in that, first tongue piece contacts with an end of described printed circuit board (PCB), and bending into described metal frame the inside, second tongue piece has an angle different with first tongue piece about printed circuit board surface, and first and second tongue pieces are connected with described conduction pattern by scolder.
2. the fixture of a printed circuit board (PCB) as claimed in claim 1 is characterized in that, second tongue piece is bent to the side plate outside of described metal frame.
3. the fixture of a printed circuit board (PCB) as claimed in claim 1 or 2 is characterized in that, first tongue piece partly forms second tongue piece.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8087113A JPH09260884A (en) | 1996-03-18 | 1996-03-18 | Fixing structure of printed board |
| JP087113/96 | 1996-03-18 | ||
| JP087113/1996 | 1996-03-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1162899A CN1162899A (en) | 1997-10-22 |
| CN1070684C true CN1070684C (en) | 2001-09-05 |
Family
ID=13905912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97103602A Expired - Fee Related CN1070684C (en) | 1996-03-18 | 1997-03-18 | Fixing structure of printed circuit board |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPH09260884A (en) |
| KR (1) | KR970068767A (en) |
| CN (1) | CN1070684C (en) |
| DE (1) | DE19711325C2 (en) |
| GB (1) | GB2311416B (en) |
| TW (1) | TW363337B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3333811B2 (en) * | 1996-10-25 | 2002-10-15 | アルプス電気株式会社 | Manufacturing method of high frequency equipment |
| JP3267521B2 (en) * | 1996-11-08 | 2002-03-18 | アルプス電気株式会社 | PCB mounting structure |
| JP4716972B2 (en) * | 2006-11-07 | 2011-07-06 | シャープ株式会社 | Electronic tuners and electronic equipment |
| KR101371055B1 (en) * | 2013-07-25 | 2014-03-07 | (주)드림텍 | Sturucture for soldering attatchment between pcb and receiver module in mobile apparatus |
| CN106817874A (en) * | 2017-02-15 | 2017-06-09 | 中山市修本照明有限公司 | A kind of circuit method of plate installation and its mounting bracket |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1761253U (en) * | 1957-12-31 | 1958-02-13 | Max Grundig | CHASSIS FRAMEWORK FOR NEWS DEVICES WITH PRINTED CIRCUIT, IN PARTICULAR RADIO OR TELEVISION DEVICES. |
| DE1242726B (en) * | 1965-11-26 | 1967-06-22 | Telefunken Patent | Chassis for an electrical engineering device from a printed circuit board and a frame-shaped carrier |
| DE3233620C2 (en) * | 1982-09-10 | 1984-07-26 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Circuit board arrangement with a circuit board and a metal wall attached to it by means of soldering points |
| JPH0225273Y2 (en) * | 1986-04-30 | 1990-07-11 | ||
| JP3347888B2 (en) * | 1994-08-11 | 2002-11-20 | アルプス電気株式会社 | Printed circuit board holding structure |
-
1996
- 1996-03-18 JP JP8087113A patent/JPH09260884A/en not_active Withdrawn
-
1997
- 1997-02-12 TW TW086101533A patent/TW363337B/en active
- 1997-02-26 GB GB9704013A patent/GB2311416B/en not_active Expired - Fee Related
- 1997-03-17 KR KR1019970008906A patent/KR970068767A/en not_active Application Discontinuation
- 1997-03-18 CN CN97103602A patent/CN1070684C/en not_active Expired - Fee Related
- 1997-03-18 DE DE19711325A patent/DE19711325C2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09260884A (en) | 1997-10-03 |
| GB2311416A (en) | 1997-09-24 |
| DE19711325A1 (en) | 1997-10-30 |
| GB9704013D0 (en) | 1997-04-16 |
| TW363337B (en) | 1999-07-01 |
| GB2311416B (en) | 1999-11-17 |
| CN1162899A (en) | 1997-10-22 |
| DE19711325C2 (en) | 2003-04-17 |
| KR970068767A (en) | 1997-10-13 |
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| C14 | Grant of patent or utility model | ||
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