KR970068767A - FIXING STRUCTURE FOR PRINT SUBSTRATE - Google Patents

FIXING STRUCTURE FOR PRINT SUBSTRATE Download PDF

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Publication number
KR970068767A
KR970068767A KR1019970008906A KR19970008906A KR970068767A KR 970068767 A KR970068767 A KR 970068767A KR 1019970008906 A KR1019970008906 A KR 1019970008906A KR 19970008906 A KR19970008906 A KR 19970008906A KR 970068767 A KR970068767 A KR 970068767A
Authority
KR
South Korea
Prior art keywords
tongue
metal frame
solder
conductive pattern
tongues
Prior art date
Application number
KR1019970008906A
Other languages
Korean (ko)
Inventor
히데끼 와따나베
Original Assignee
가다오까 마사다까
아루푸스 덴키 가부시키 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가다오까 마사다까, 아루푸스 덴키 가부시키 가이샤 filed Critical 가다오까 마사다까
Publication of KR970068767A publication Critical patent/KR970068767A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Connection Or Junction Boxes (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

금속 프레임에 프린트기판을 땜납 접속한 구조에 있어서, 프린트기판의 열팽창/열수축에 의한 땜납크랙 발생을 방지하기 위하여, 접속부의 땜납을 다량으로 고이게 하여 접속강도를 높인다.In a structure in which a printed circuit board is soldered to a metal frame, in order to prevent solder cracks caused by thermal expansion / shrinkage of the printed circuit board, a large amount of solder is connected to increase the connection strength.

금속 프레임(11)의 측판(12)에 대해 서로 근접위치에 제 1설편(舌片)(15)과 제 2설편(17)을 형성하고, 제 1설편(15)을 금속 프레임(11)의 내방으로 절곡하여 금속 프레임에 수납된 프린트기판(4)을 고정하고, 프린트기판(4)에 설치한 도전패턴(9)과 제 1설편(15) 및 제 2설편(17) 사이를 납땜하였다. 땜납(10)은 제 1설편(15)의 선단부(15b)와 제 2설편(17)의 기부(17a)와, 이들 양자 사이에 고여지고, 도전패턴(9)상에서는 단부(9b)측으로부터 내부(9a)측에 걸쳐 땜납(10)이 고여지므로, 접속강도가 높은 구조로 된다.The first tongue 15 and the second tongue 17 are formed in close proximity to the side plate 12 of the metal frame 11, and the first tongue 15 is formed on the metal frame 11. The printed board 4 accommodated in the metal frame was fixed by bending inward and soldered between the conductive pattern 9 provided on the printed board 4 and the first tongue 15 and the second tongue 17. The solder 10 is held between the tip portion 15b of the first tongue 15 and the base 17a of the second tongue 17 and both of them, and on the conductive pattern 9, it is internal from the end 9b side. Since the solder 10 is accumulated over the (9a) side, it becomes a structure with high connection strength.

Description

프린트기판의 고정구조(FIXING STRUCTURE FOR PRINT SUBSTRATE)FIXING STRUCTURE FOR PRINT SUBSTRATE

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

도 1은 본 발명의 제 1실시예에 있어서의 땜납접속한 요부의 단면도.BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a sectional view of a main portion in which solder is connected in the first embodiment of the present invention.

Claims (3)

상면이 개구된 사각 테두리 모양의 금속 프레임과, 적어도 한쪽에 도전패턴이 설치되고 상기 금속 프레임에 수납된 프린트기판과, 상기 금속 프레임의 측판에 펀칭에 의해 형성되고 서로 근방에 설치된 제 1설편과 제 2설편을 구비하고, 상기 제 1설편은 상기 프린트기판의 단부에 당접하여 상기 금속 프레임의 내부로 절곡되어 있고, 상기 제 2설편은 상기 프린트기판면에 대하여 상기 제 2설편과는 다른 각도를 이루고, 상기 제 1 및 제 2 설편과 상기 도전패턴을 땜납에 의해 접속한 것을 특징으로 하는 프린트기판의 고정구조.A first frame and a first frame formed by punching in the side plate of the metal frame and a printed board accommodated in the metal frame and having a conductive pattern provided on at least one side of the metal frame having an open upper surface. Two tongues, the first tongues being bent into the metal frame in contact with an end portion of the printed board, and the second tongues have an angle different from that of the second tongues with respect to the printed board surface. And the first and second tongue pieces and the conductive pattern are connected by solder. 제 1항에 있어서, 상기 제 2설편을 금속 프레임의 측판보다 바깥으로 절곡한 것을 특징으로 하는 프린트기판의 고정구조.The fixed structure of a printed circuit board according to claim 1, wherein the second tongue is bent outwardly from the side plate of the metal frame. 제 1항 또는 제 2항에 있어서, 상기 제 1설편의 일부에 제 2설편을 형성한 것을 특징으로 하는 프린트기판의 고정구조.The fixing structure for a printed circuit board according to claim 1 or 2, wherein a second tongue is formed in a part of the first tongue. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019970008906A 1996-03-18 1997-03-17 FIXING STRUCTURE FOR PRINT SUBSTRATE KR970068767A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8087113A JPH09260884A (en) 1996-03-18 1996-03-18 Fixing structure of printed board
JP8-087113 1996-03-18

Publications (1)

Publication Number Publication Date
KR970068767A true KR970068767A (en) 1997-10-13

Family

ID=13905912

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970008906A KR970068767A (en) 1996-03-18 1997-03-17 FIXING STRUCTURE FOR PRINT SUBSTRATE

Country Status (6)

Country Link
JP (1) JPH09260884A (en)
KR (1) KR970068767A (en)
CN (1) CN1070684C (en)
DE (1) DE19711325C2 (en)
GB (1) GB2311416B (en)
TW (1) TW363337B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3333811B2 (en) * 1996-10-25 2002-10-15 アルプス電気株式会社 Manufacturing method of high frequency equipment
JP3267521B2 (en) * 1996-11-08 2002-03-18 アルプス電気株式会社 PCB mounting structure
JP4716972B2 (en) * 2006-11-07 2011-07-06 シャープ株式会社 Electronic tuners and electronic equipment
KR101371055B1 (en) * 2013-07-25 2014-03-07 (주)드림텍 Sturucture for soldering attatchment between pcb and receiver module in mobile apparatus
CN106817874A (en) * 2017-02-15 2017-06-09 中山市修本照明有限公司 A kind of circuit method of plate installation and its mounting bracket

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1761253U (en) * 1957-12-31 1958-02-13 Max Grundig CHASSIS FRAMEWORK FOR NEWS DEVICES WITH PRINTED CIRCUIT, IN PARTICULAR RADIO OR TELEVISION DEVICES.
DE1242726B (en) * 1965-11-26 1967-06-22 Telefunken Patent Chassis for an electrical engineering device from a printed circuit board and a frame-shaped carrier
DE3233620C2 (en) * 1982-09-10 1984-07-26 Standard Elektrik Lorenz Ag, 7000 Stuttgart Circuit board arrangement with a circuit board and a metal wall attached to it by means of soldering points
JPH0225273Y2 (en) * 1986-04-30 1990-07-11
JP3347888B2 (en) * 1994-08-11 2002-11-20 アルプス電気株式会社 Printed circuit board holding structure

Also Published As

Publication number Publication date
TW363337B (en) 1999-07-01
DE19711325A1 (en) 1997-10-30
CN1070684C (en) 2001-09-05
JPH09260884A (en) 1997-10-03
GB9704013D0 (en) 1997-04-16
GB2311416A (en) 1997-09-24
DE19711325C2 (en) 2003-04-17
CN1162899A (en) 1997-10-22
GB2311416B (en) 1999-11-17

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E902 Notification of reason for refusal
E601 Decision to refuse application