CN1757111A - Printed wiring board, method for manufacturing same, lead frame package and optical module - Google Patents

Printed wiring board, method for manufacturing same, lead frame package and optical module Download PDF

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Publication number
CN1757111A
CN1757111A CNA2004800058083A CN200480005808A CN1757111A CN 1757111 A CN1757111 A CN 1757111A CN A2004800058083 A CNA2004800058083 A CN A2004800058083A CN 200480005808 A CN200480005808 A CN 200480005808A CN 1757111 A CN1757111 A CN 1757111A
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CN
China
Prior art keywords
tongue piece
conductor plate
liner
electrode
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2004800058083A
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Chinese (zh)
Other versions
CN100440500C (en
Inventor
白井武广
岩瀨正幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Publication date
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Publication of CN1757111A publication Critical patent/CN1757111A/en
Application granted granted Critical
Publication of CN100440500C publication Critical patent/CN100440500C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3873—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
    • G02B6/3885—Multicore or multichannel optical connectors, i.e. one single ferrule containing more than one fibre, e.g. ribbon type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
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    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Light Receiving Elements (AREA)

Abstract

The invention relates to a printing wiring base plate (10) and the manufacture method thereof, and a leading wire frame packaging piece and a light module which adopting the printing wiring base plate. The wiring base plate (10) is provided with a plurality of conductor plates (10a); namely, at least a conductor plate as a leading wire used for being eclectically connected with an external circuit and mutually separated spatially; an isolation layer (10b), which is formed by crossing on the conductor plates and/or a plurality of conductor plates; a plurality of wiring patterns (10d) formed on the isolation layer, at least one of which is eclectically connected with at least one of the conductor plate through through holes (11a).

Description

Printed wiring board, its manufacture method, lead frame package and optical module
Technical field
The present invention relates to printed wiring board, its manufacture method, lead frame package and optical module.
Background technology
In the past, connect by bonding wire between known semiconductor element that lift-launch arranged and the Wiring pattern and the conductor means (No. 2528192 communique of reference example such as Japan Patent) of resin-encapsulated.In addition, the end of the Wiring pattern that forms on main film body surface is outstanding and become the contact probe of contact pin from main film body, known formation photoresist floor and form the technology of Wiring pattern, by through hole with Wiring pattern with the technology that contact the pin electrical connection and the technology (for example with reference to TOHKEMY 2001-194387 communique) of guaranteeing to design the space of through hole.
In such semiconductor device, for example the optical module shown in the 22nd figure 1 has lead frame package 5, intermediate member 7a and carries piece 8, after these structure members are connected by bonding wire W, by the sealing of the synthetic resin of electrical insulating property, integrated and make with the lasso with optical fiber 9a (ferrule) 9.
At this moment, lead frame package 5 is formed by synthetic resin 4 molded printed wiring boards (PWB:PrintedWiring Board) 2 and lead frame 3.On the other hand, printed wiring board 2 has in little line (the マ イ Network ロ ス ト リ Star プ ラ イ Application) structure that is configured as the fine interconnection pattern 2d that forms insulating barrier 2b on the conductor plate 2a of regulation shape in turn and be made of conductor layer, and the semiconductor element of lift-launch (circuit element) 6 is connected by bonding wire with Wiring pattern 2d.In addition, carry optical semiconductor 9b, plate light-emitting component (the VCSEL:Vertical Cavity SurfaceEmitting Laser that is subjected to for example are set on the piece 8; Vertical cavity becomes the surface launching layer), dull and stereotyped PD (Photo Diode; Photic diode)), its relative real estate is vertically injected ejaculation light.Printed wiring board 2 adopts microstrips structure to realize the impedance coupling of optical module 1, suppresses the deterioration of signal transmission characteristic.
Connect by bonding wire between structure member in the optical module 1, then no matter whether select the printed wiring board 2 of microstrips structure for use, because because of the influence of the impedance of the length of bonding wire W, and make the transmission characteristic deterioration of high-frequency signal, and the processing number is increased.In addition, constitute the printed wiring board 2 of lead frame package 5 and lead frame 3 and make the back assembling respectively with intermediate member 7a that lead frame package 5 together is used, so the manufacturing cost height, optical module 1 cost raises.
In addition, in the existing optical module 1, the plate light-emitting component 8b that is subjected to is fixed on first 8a1 that carries piece 8, and is fixed on the intermediate member 7a in the face 8a2 vertical with first 8a1.The leading section of conductor plate 7b is to make and to carry between first 8a1 of piece 8 operation by bonding wire easy, and along the end face of intermediate member 7a warpage downward vertically, the part of this warpage engages the end that bonding wire W is arranged.Therefore, the manufacturing cost of intermediate member 7a uprises.
The present invention researches and develops in view of the above problems, its purpose is to provide the position of reducing wire-bonded, suppress the deterioration of the signal transmission characteristic that the length owing to bonding wire causes, in addition, wire-bonded operation between the plate semiconductor element that carries becomes easily, and low-cost printed wiring board, its manufacture method, lead frame package and the optical module of making.
Summary of the invention
Printed wiring board of the present invention is characterised in that, comprising: a plurality of conductor plates, and it has at least one the conductor plate that uses as being used for the lead-in wire that is electrically connected with external circuit, mutual apart; Insulating barrier, on the described a plurality of conductor plates of its span with and/or described a plurality of conductor plate and forming; A plurality of Wiring patterns, it is formed on the described insulating barrier, and the conductor plate of at least one of described a plurality of conductor plates is by at least one electrical connection of the described a plurality of Wiring patterns of through hole.
According to this invention, owing to the wire-bonded between the lead-in wire of Wiring pattern that does not need wiring part and external circuit connection usefulness, so the restriction of the signal transmission characteristic that the length that is difficult to be subjected to bonding wire brings can be provided, and can the low-cost wiring substrate of making.At this, a plurality of Wiring patterns can form the little line that has a conductor plate of a plurality of conductor plates as liner, perhaps also can be that a conductor plate that has a plurality of conductor plates as liner, the liner that will be connected with this liner are configured in two plate transmission roads of belt material sheet between signals transmission road with Wiring pattern.
In addition, in above-mentioned invention, described printed wiring board is characterised in that, comprising: have one leading part in separated described a plurality of conductor plates; Have another and the wiring part that is electrically connected with described leading part in separated described a plurality of conductor plates.
In addition, in above-mentioned invention, described printed wiring board is characterised in that, the conductor plate of described leading part also is separated into the signal of the defined amount corresponding with described a plurality of Wiring patterns with going between, and the signal of described defined amount is electrically connected by the self-corresponding described Wiring pattern of through hole and each with lead-in wire.
In addition, in above-mentioned invention, described printed wiring board is characterised in that, at least one liner of configuration is with lead-in wire between two signals of adjacency are with lead-in wire for described leading part, and described at least one liner is integrally formed and by the through hole Wiring pattern electrical connection corresponding with described a plurality of Wiring patterns from the conductor plate of described wiring part with lead-in wire.
Thus, the liner of the printed wiring board earthing potential stabilisation of lead-in wire, the signal of adjacency effective electromagnetic shielding between lead-in wire.Therefore, printed wiring board effectively suppress or anti-stop signal with the generation (cross talk: crosstalk) of electromagnetic interference between lead-in wire, suppress or the anti-stop signal transmission characteristic deterioration of S/N ratio for example.
In addition, in above-mentioned invention, printed wiring board of the present invention is characterised in that, described printed wiring board also has the equipped section, its described Wiring pattern with described leading part and regulation is electrically connected, and have and be used for a plurality of signals electrode tongue piece of being electrically connected with many raceway grooves optical semiconductor with a plurality of optical semiconductors, each signal is with forming electrode pattern on the electrode tongue piece, the conductor plate of this equipped section further is divided into the signal conductor plate tongue piece of the defined amount corresponding with the raceway groove of described many raceway grooves optical semiconductor, constitute with the conductor plate tongue piece as described a plurality of signals together with corresponding electrode pattern, described signal is electrically connected by the self-corresponding described electrode pattern of through hole and each with the conductor plate tongue piece.
Thus, printed wiring board is owing to the wire-bonded between the lead-in wire of Wiring pattern that does not need wiring part and external circuit connection usefulness, so be difficult to be subjected to the restriction of the signal transmission characteristic that the length of bonding wire brings, and the Wiring pattern of each raceway groove in the time of will using many raceway grooves optical semiconductor (for example array laser diode, the photic diode of array etc.) is as the electrode tongue piece corresponding with each raceway groove, the lead-in wire that is connected usefulness with external circuit is made simultaneously, can the low-cost printed wiring board of making so can provide.At this, a plurality of Wiring patterns form the little line that has the conductor plate of wiring part as liner, perhaps also can be to have the conductor plate of wiring part as liner, the liner that will be connected with this liner be configured in two plate transmission roads of belt material sheet between signals transmission road with Wiring pattern.
In addition, in foregoing invention, printed wiring board of the present invention is characterised in that, described equipped section, at described a plurality of signals two signals of adjacency at least one liner of configuration electrode tongue piece between the electrode tongue piece in the electrode tongue piece, this at least one liner has the liner conductor plate tongue piece that is made of the described conductor plate that extends continuously towards described equipped section side from described wiring part side with the electrode tongue piece, the insulating barrier of lamination on this liner usefulness conductor plate tongue piece, and being formed on liner electrode pattern on this insulating barrier, described liner is electrically connected with electrode pattern with described liner by through hole with the conductor plate tongue piece.
Thus, the liner earthing potential stabilisation of electrode tongue piece in the printed wiring board, the signal of adjacency is used between the electrode tongue piece by effective electromagnetic shielding.Therefore, printed wiring board effectively suppress or anti-stop signal electricity consumption utmost point tongue piece between the generation (crosstalking) of electromagnetic interference, suppress or prevent on many raceway grooves optical semiconductor or from the signal transmission characteristic of the many raceway grooves optical semiconductor deterioration of S/N ratio for example.
In addition, the manufacture method of printed wiring board of the present invention is characterized in that having following operation: first operation, prepare by conductor plate, lamination is at the insulating barrier on this conductor plate and be formed on the substrate that the conductor layer on this insulating barrier constitutes; Second operation, the specified part of the described at least conductor layer of etching or/and laser processing and form described a plurality of Wiring pattern; The 3rd operation, the described conductor plate of etching and be separated into a plurality of conductor plates is at residual described insulating barrier in the position of the separated described a plurality of conductor plates of span and Wiring pattern; The 4th operation is electrically connected at least one at least one conductor plates by through hole and the described a plurality of conductor plates that separate of described a plurality of Wiring patterns.
In addition, in foregoing invention, the manufacture method of printed wiring board of the present invention is characterised in that, in described the 3rd operation by being separated into described conductor plate a plurality of, thereby form one leading part in the described a plurality of conductor plates with separation, with have the described a plurality of conductor plates that separate in another and the wiring part that is electrically connected with described leading part.
In addition, in foregoing invention, the manufacture method of printed wiring board of the present invention is characterised in that, in described the 3rd operation, the conductor plate of described leading part further is separated into the signal of the defined amount corresponding with described a plurality of Wiring patterns with going between, and the signal of described defined amount is electrically connected by the self-corresponding described Wiring pattern of through hole and each with lead-in wire.
Thus, in the manufacture method of printed wiring board, can from by conductor plate and lamination at the insulating barrier on this conductor plate be formed on the substrate that the conductor layer on this insulating barrier constitutes, is connected the lead-in wire while of usefulness with external circuit and forms the printed wiring board of the Wiring pattern that is provided with regulation by single substrate.In addition, lead-in wire is connected via through hole with each Wiring pattern, so do not need wire-bonded between them, can provide the printed wiring board of the restriction of the signal transmission characteristic that the length that is not subjected to bonding wire brings.
In addition, in foregoing invention, the manufacture method of printed wiring board of the present invention is characterised in that, in described the 3rd operation, also have and form the operation of at least one liner with lead-in wire, this liner, is formed by the conductor plate of described wiring part between two signals of adjacency are with lead-in wire with lead-line configuration, and by the through hole Wiring pattern electrical connection corresponding with described a plurality of Wiring patterns.
Thus, can on printed wiring board, form signal in the manufacture method of printed wiring board simultaneously with going between and the liner lead-in wire.In addition, the signal that connects with the liner that can the integrally formed conductor plate that extends continuously to the first of leading part side by second portion between lead-in wire constitutes from the wiring part side with going between, so the liner earthing potential stabilisation of lead-in wire in the printed wiring board, the signal of adjacency are used between lead-in wire by effective electromagnetic shielding.Therefore, printed wiring board constructed in accordance effectively suppress or anti-stop signal with the generation (crosstalking) of the electromagnetic interference between lead-in wire, inhibition or anti-stop signal transmission characteristic be the deterioration of S/N ratio for example.
In addition, in foregoing invention, the manufacture method of printed wiring board of the present invention is characterised in that, described the 3rd operation also has following operation: form the equipped section, this equipped section has described leading part, another of described a plurality of conductor plates of wiring part and separation, the described Wiring pattern of described leading part and regulation is electrically connected, and have and be used for a plurality of signals electrode tongue piece of being electrically connected with many raceway grooves optical semiconductor with a plurality of optical semiconductors, each signal is with forming electrode pattern on the electrode tongue piece, the signal that the conductor plate of this equipped section further is separated into the defined amount corresponding with the raceway groove of described many raceway grooves optical semiconductor with the conductor plate tongue piece and with corresponding electrode pattern as described a plurality of signals electrode tongue piece, and, described signal is electrically connected by the self-corresponding described electrode pattern of through hole and each with the conductor plate tongue piece.
Thus, in the manufacture method of printed wiring board, the electrode pattern of each raceway groove that will be electrically connected with many raceway grooves optical semiconductor is formed on the corresponding electrode tongue piece that separates with each raceway groove, in addition, this electrode tongue piece is connected the lead-in wire of usefulness to be made simultaneously with external circuit, so the printed wiring board when using many raceway grooves optical semiconductor can low-costly be made.
In addition, in foregoing invention, the manufacture method of printed wiring board of the present invention is characterised in that, described the 3rd operation contain be formed on described a plurality of signal with two signals of adjacency in the electrode tongue piece with the operation of at least one liner that disposes between the electrode tongue piece with the electrode tongue piece, this at least one liner is formed by etching or/and laser processing with the electrode tongue piece, has the liner conductor plate tongue piece that constitutes by the described conductor plate that extends continuously towards described equipped section side from described wiring part side, the insulating barrier of lamination on this liner usefulness conductor plate tongue piece, and being formed on liner electrode pattern on this insulating barrier, described liner is electrically connected with electrode pattern with described liner by through hole with the conductor plate tongue piece.
Thus, in the printed wiring board, can on printed wiring board, form signal electrode tongue piece and liner electrode tongue piece simultaneously.In addition, the liner electrode tongue piece that signal constitutes with the integrally formed conductor plate that is extended continuously to the third part of equipped section side by the second portion from the wiring part side between the electrode tongue piece, so the liner earthing potential stabilisation of electrode tongue piece in the printed wiring board, the signal of adjacency are used between the electrode tongue piece by effective electromagnetic shielding.Therefore, the printed wiring board that makes effectively suppress or anti-stop signal electricity consumption utmost point tongue piece between the generation (crosstalking) of electromagnetic interference, effectively suppress or prevent on many raceway grooves optical semiconductor or from the signal transmission characteristic of the many raceway grooves optical semiconductor deterioration of S/N ratio for example.
In addition, lead frame package of the present invention is characterised in that, comprising: a plurality of conductor plates, and it contains as at least one the conductor plate that is used for the lead-in wire of external circuit connecting line, apart mutually; Insulating barrier, on the described a plurality of conductor plates of its span with and/or described a plurality of conductor plate and forming; A plurality of Wiring patterns, it is formed on the described insulating barrier; The synthetic resin of electrical insulating property, it is molded with carrying out below at least one conductor plate of described a plurality of conductor plates, and at least one conductor plate of described a plurality of conductor plates is electrically connected by at least one with described a plurality of Wiring patterns of through hole.
In addition, in foregoing invention, lead frame package of the present invention is characterised in that described lead frame package comprises: have one leading part of described a plurality of conductor plate of separation, with another and the wiring part that is electrically connected with described leading part with described a plurality of conductor plates of separating.
In addition, in foregoing invention, lead frame package of the present invention is characterised in that, the conductor plate of described leading part further is separated into the signal of the defined amount corresponding with described a plurality of Wiring patterns with going between, and the signal of described defined amount is electrically connected by the self-corresponding described Wiring pattern of through hole and each with lead-in wire.
Thus, do not need the Wiring pattern of wiring part and external circuit to connect wire-bonded between the lead-in wire of usefulness in the lead frame package, thus can provide the signal transmission characteristic that the deviation etc. of the length that is difficult to be subjected to bonding wire brings restriction and can the low-cost lead frame package of making.
In addition, in foregoing invention, lead frame package of the present invention is characterised in that, described leading part goes between with having at least one liner usefulness between going between at two signals of adjacency, described at least one liner is integrally formed from the conductor plate of described wiring part with lead-in wire, and is situated between by the through hole Wiring pattern electrical connection corresponding with described a plurality of Wiring patterns.
Thus, in the lead frame package between signal is with lead-in wire configuration from the integrally formed liner of the conductor plate that extends continuously from wiring part side direction leading part side with lead-in wire, so the liner earthing potential stabilisation of lead-in wire in the lead frame package, the signal of adjacency effective electromagnetic shielding between lead-in wire.Therefore, printed wiring board effectively suppress or anti-stop signal with the generation (crosstalking) of electromagnetic interference between lead-in wire, suppress or the anti-stop signal transmission characteristic deterioration of S/N ratio for example.
In addition, in foregoing invention, lead frame package of the present invention is characterised in that, described lead frame package also has the equipped section, its described Wiring pattern with described leading part and regulation is electrically connected, and have and be used for a plurality of signals electrode tongue piece of being electrically connected with many raceway grooves optical semiconductor with a plurality of optical semiconductors, each signal is with forming electrode pattern on the electrode tongue piece, the conductor plate of this equipped section is separated into the signal conductor plate tongue piece of the defined amount corresponding with the raceway groove of described many raceway grooves optical semiconductor, and constitute with the electrode tongue pieces as described a plurality of signals together with corresponding electrode pattern, described signal is electrically connected by the self-corresponding described electrode pattern of through hole and each with the conductor plate tongue piece.
Thus, lead frame package is owing to the wire-bonded between the lead-in wire of Wiring pattern that does not need wiring part and external circuit connection usefulness, so be difficult to be subjected to the restriction of the signal transmission characteristic that the length of bonding wire brings, and the Wiring pattern of each raceway groove in the time of will using many raceway grooves optical semiconductor (for example array laser diode, the photic diode of array etc.) as with each raceway groove for the electrode tongue piece lead-in wire that is connected usefulness with external circuit make simultaneously, so can provide can the low cost manufacturing lead frame package.
In addition, in foregoing invention, lead frame package of the present invention is characterised in that, have described a plurality of signals with the electrode tongue piece at least one liner electrode tongue piece of disposing between with the electrode tongue piece of two signals of adjacency, this at least one liner comprises with the electrode tongue piece: by the liner conductor plate tongue piece that constitutes towards the continuous described conductor plate that extends of described equipped section side from described wiring part side, use the insulating barrier of lamination on the conductor plate tongue piece at this liner, and being formed on liner electrode pattern on this insulating barrier, described liner is electrically connected with electrode pattern with described liner by through hole with the conductor plate tongue piece.
Thus, in the lead frame package between signal is with lead-in wire configuration from the integrally formed liner of the conductor plate that extends continuously from wiring part side direction leading part side with lead-in wire, the liner earthing potential stabilisation of electrode tongue piece in the printed wiring board, the signal of adjacency are used between the electrode tongue piece by effective electromagnetic shielding.Therefore, printed wiring board effectively suppress or anti-stop signal electricity consumption utmost point tongue piece between the generation (crosstalking) of electromagnetic interference, suppress or prevent on many raceway grooves optical semiconductor or from the signal transmission characteristic of the many raceway grooves optical semiconductor deterioration of S/N ratio for example.
Optical module of the present invention is characterised in that, comprising:
Printed wiring board, it has: a plurality of conductor plates, it contains at least one conductor plate that uses as the lead-in wire that is electrically connected with external circuit, and mutual apart; Insulating barrier, on the described a plurality of conductor plates of its span with and/or described a plurality of conductor plate and forming; A plurality of Wiring patterns, it is formed on the described insulating barrier, and at least one conductor plate of described a plurality of conductor plates is electrically connected by at least one with described a plurality of Wiring patterns of through hole;
The synthetic resin molded shell of electrical insulating property, its coat described a plurality of conductor plates at least one conductor plate below; Optical semiconductor, it is electrically connected with described Wiring pattern; Optical fiber, it combines with described optical semiconductor light.
In addition, in foregoing invention, optical module of the present invention is characterised in that described printed wiring board comprises one leading part in the described a plurality of conductor plates with separation, with have the described a plurality of conductor plates that separate in another and the wiring part that is electrically connected with described leading part.
Thus, optical module is not owing to need the Wiring pattern of wiring part to be connected wire-bonded between the lead-in wire of usefulness with external circuit.So can provide the signal transmission characteristic that the deviation etc. of the length that is difficult to be subjected to bonding wire brings restriction and can the low-cost optical module of making.
In addition, in foregoing invention, optical module of the present invention is characterised in that, the conductor plate of described leading part further is separated into the signal of the defined amount corresponding with described a plurality of Wiring patterns with going between, and the signal of described defined amount is electrically connected by the self-corresponding described Wiring pattern of through hole and each with lead-in wire.
Thus, in the optical module spare between signal is with lead-in wire configuration from the integrally formed liner of the conductor plate that extends continuously from wiring part side direction leading part side with lead-in wire, so the liner earthing potential stabilisation that goes between in the optical module, the signal of adjacency effective electromagnetic shielding of quilt between lead-in wire.Therefore, effectively suppress in the optical module or anti-stop signal with the generation (crosstalking) of the electromagnetic interference between lead-in wire, inhibition or anti-stop signal transmission characteristic be the deterioration of S/N ratio for example.
In addition, in foregoing invention, optical module of the present invention is characterised in that, at least one circuit element is installed in described wiring part or the liner portion, and this circuit element and described wiring part or liner portion are by the bonding wire adjacency.
In addition, in foregoing invention, optical module of the present invention is characterised in that, and is fixing or connect at least one electronic circuit component on the described wiring part, and described electronic circuit component utilizes flip-chip bond and fixing or be connected on the described wiring part.
Thus, provide and electronic circuit component between needn't use wire-bonded, and can suppress or the optical module of the deterioration of anti-stop signal transmission characteristic.
In addition, in foregoing invention, described optical module is characterised in that, described printed wiring board also has the equipped section, its described Wiring pattern with described leading part and regulation is electrically connected, and have and be used for a plurality of signals electrode tongue piece of being electrically connected with many raceway grooves optical semiconductor with described a plurality of optical semiconductors, each signal is with forming electrode pattern on the electrode tongue piece, the conductor plate of described equipped section further is separated into the signal conductor plate tongue piece of the defined amount corresponding with the groove of described many raceway grooves optical semiconductor, and constitute with the electrode tongue pieces as described a plurality of signals together with corresponding electrode pattern, described signal is electrically connected by the self-corresponding described electrode pattern of through hole and each with the conductor plate tongue piece.
Thus, optical module is owing to the wire-bonded between the lead-in wire of Wiring pattern that does not need wiring part and external circuit connection usefulness, so be difficult to be subjected to the restriction of the signal transmission characteristic that the deviation etc. of the length of bonding wire brings, and the Wiring pattern of each raceway groove will use many raceway grooves optical semiconductor (for example array laser diode, the photic diode of array etc.) time as with each raceway groove for the electrode tongue piece be connected the lead-in wire of usefulness with external circuit integrally manufactured.Therefore, needn't prepare in addition to be used to install the intermediate member of many raceway grooves optical semiconductor, can the low-cost printed wiring board of making so can provide.
In addition, in the present invention, optical module of the present invention is characterised in that, described equipped section is at described a plurality of signals two signals of adjacency at least one liner of configuration electrode tongue piece between the electrode tongue piece in the electrode tongue piece, this at least one liner has the liner conductor plate tongue piece that is made of the described conductor plate that extends continuously towards described equipped section side from described wiring part side with the electrode tongue piece, the insulating barrier of lamination on this liner usefulness conductor plate tongue piece, and being formed on liner electrode pattern on this insulating barrier, described liner is situated between with the conductor plate tongue piece and is electrically connected with electrode pattern with described liner by through hole.
Thus, in the optical module spare between signal is with lead-in wire configuration by the integrally formed liner of the conductor plate that extends continuously from wiring part side direction leading part side with lead-in wire, therefore in the optical module liner with the earthing potential stabilisation of electrode tongue piece, the signal of adjacency with between the electrode tongue piece by effective electromagnetic shielding.Therefore, effectively suppress in the optical module or anti-stop signal electricity consumption utmost point tongue piece between the generation (crosstalking) of electromagnetic interference, suppress or prevent on many raceway grooves optical semiconductor or from the signal transmission characteristic of the many raceway grooves optical semiconductor deterioration of S/N ratio for example.
In addition, in foregoing invention, optical module of the present invention is characterised in that, described many raceway grooves optical semiconductor is plate, be fixed on first that carries piece, this lift-launch piece has second that pitches with described first hand-deliver, this second with towards described printed wiring board, the state that engages and be fixed on described printed wiring board top, each raceway groove of described many raceway grooves optical semiconductor are situated between by at least one piece lead-in wire and corresponding described electrode tongue piece electrical connection of direct wire-bonded at the end face of the conductor plate of the described electrode tongue piece of correspondence.
Thus, can be provided in the optical module that utilizes wire-bonded to connect easily between plate many raceway grooves optical semiconductor and the Wiring pattern.
In addition, in foregoing invention, optical module of the present invention is characterised in that, described many raceway grooves optical semiconductor is plate, be fixed on first that carries piece, this lift-launch piece have with second of the described first hand-deliver fork and with described first and described second Wiring pattern that forms continuously, second Wiring pattern of this lift-launch piece is fixed on the described printed wiring board with the Wiring pattern state of contact with the equipped section of described printed wiring board.
The optical module at the position of having reduced wire-bonded is provided thus.
In addition, in foregoing invention, optical module of the present invention is characterised in that, fixes or be connected with at least one circuit element on the described wiring part.Described circuit element is fixed by flip-chip bond or is connected on the described wiring part.
Thus, optical module needn't use wire-bonded between circuit element and printed wiring board, suppresses or anti-stop signal transmission characteristic.
In addition, in foregoing invention, optical module of the present invention is characterised in that described optical semiconductor is a plurality of in the assigned position configuration on two-dimensional directional.
In addition, in foregoing invention, optical module of the present invention is characterised in that to have described circuit element and at least one described optical semiconductor, and being situated between is electrically connected with at least one electrode of described circuit element and the described Wiring pattern of regulation by the scolding tin bead.
In addition, in above-mentioned invention, optical module of the present invention is characterised in that, comprising:
Printed wiring board, it has: a plurality of conductor plates, it contains at least one conductor plate that uses as the lead-in wire that is electrically connected with external circuit, and mutual apart; Insulating barrier, on the described a plurality of conductor plates of its span with and/or described a plurality of conductor plate and forming; A plurality of Wiring patterns, it is formed on the described insulating barrier, and at least one conductor plate of described a plurality of conductor plates is electrically connected by at least one with described a plurality of Wiring patterns of through hole;
Fixed part, at least one conductor plate that it is fixed with a plurality of conductor plates makes the position that is electrically connected with described a plurality of conductor plates at least have electrical insulating property; Optical semiconductor, it is electrically connected with described Wiring pattern; Optical fiber, it combines with described optical semiconductor light.
In addition, in above-mentioned invention, optical module of the present invention is characterised in that to have the base plate that described fixed part is set, and disposes temperature control component between described fixed part and described base plate.
In addition, in above-mentioned invention, optical module of the present invention is characterised in that described optical semiconductor is a plurality of in the assigned position configuration on two-dimensional directional.
In addition, in above-mentioned invention, optical module of the present invention is characterised in that to have described circuit element and the described optical semiconductor of at least one, and the described Wiring pattern of at least one electrode of described circuit block and regulation is situated between and is electrically connected by the scolding tin bead.
Description of drawings
Fig. 1 is the profile of the printed wiring board of expression first execution mode of the present invention;
Fig. 2 is the profile of substrate of manufacturing that is used for the printed wiring board of first execution mode of the present invention;
Fig. 3 represent the printed wiring board of first embodiment of the invention manufacture method, be the profile that the conductor layer of etching substrates forms the state of Wiring pattern;
Fig. 4 represent the printed wiring board of first execution mode of the present invention manufacture method, be the profile that forms the state of the recess that through hole uses by the insulating barrier that is etched with and/or substrate is removed in laser processing;
Fig. 5 represent the printed wiring board of first execution mode of the present invention manufacture method, be the profile that is separated into the state of wiring part liner and a plurality of lead-in wire and a plurality of electrode tongue pieces by the conductor plate of etching substrates;
Fig. 6 represent the lead frame package of second execution mode of the present invention manufacture method, be the profile of the state that is molded as by synthetic resin of the printed wiring board of Fig. 1;
Fig. 7 is that printed wiring board that expression is molded as from synthetic resin will go between and the conductor plate tongue piece cuts into the stereogram of wishing length and forming the state of lead frame package;
Fig. 8 is the stereogram of the optical module of expression the 3rd execution mode of the present invention;
Fig. 9 is the profile that is equipped with many raceway grooves optical semiconductor on the lead frame package shown in Figure 7 and drives the circuit block (semiconductor element) of usefulness;
Figure 10 is the profile of the optical module that will be engaged by the lead frame package of the synthetic resin of electrical insulating property sealing and lasso and form;
Figure 11 A is the profile that warpage is processed the optical module that goes between and make in the lead frame package of the Figure 10 that is sealed by synthetic resin;
Figure 11 B is the profile of Width of the optical module of Figure 11 A;
Figure 12 A is the stereogram of the user mode of expression optical module shown in Figure 11;
Figure 12 B is the stereogram of other states of expression optical module;
Figure 13 be in the optical module of the 3rd execution mode except that the synthetic resin and plating layer of sealing, the stereogram of expression printed wiring board, circuit block, bonding wire, lead-in wire and electrode tongue piece;
Figure 14 is a ground plan of seeing the equipped section among Figure 13 from following side;
Figure 15 A is the profile along the liner electrode tongue piece of Figure 13;
Figure 15 B is along the profile of signal with the electrode tongue piece;
Figure 16 is the stereogram of variation of the optical module of expression the 3rd execution mode;
Figure 17 is the profile of lift-launch example of end face light emitting-type optical semiconductor of representing only to have the printed wiring board of wiring part and leading part;
Figure 18 A is the profile that does not use the structure example of bonding wire in the expression optical module;
Figure 18 B is the profile of the connection status of the electrode of circuit block (semiconductor element) of presentation graphs 18A and through hole;
Figure 18 C is the electrode of indication circuit parts (semiconductor element) and the plane graph of the example of the fixed position of the conductor layer that constitutes Wiring pattern;
Figure 19 A is the figure of other modes of expression equipped section;
Figure 19 B is the figure of the another way of expression equipped section;
Figure 20 is an enlarged drawing of seeing the equipped section PM of Figure 13 from the top;
Figure 21 is the profile of the optical module of expression the 4th execution mode of the present invention;
Figure 22 is the profile of the structure of the existing optical module of expression.
Embodiment
The suitable execution mode of printed wiring board of the present invention, its manufacture method, lead frame package and optical module is described with reference to the accompanying drawings.
(first execution mode)
The printed wiring board of first execution mode of the present invention at first, is described.Fig. 1 is the profile of expression printed wiring board.Fig. 2 is a profile of making the employed substrate of printed wiring board.Fig. 3～Fig. 5 is the profile of the manufacture method of expression printed wiring board.
In addition, illustrate the section of a unit of printed wiring board among Fig. 1～Fig. 5.When in fact printed wiring board was made, a unit shown in these figure carried out (among the figure about about and/or table back of the body direction) repeatedly at a plurality of units midplane, and it carries out in the lump with the processing that will illustrate below.
As shown in Figure 1, printed wiring board 10 comprises: wiring part PW, the leading part PL and the equipped section PM that are formed with a plurality of Wiring pattern 10d of the microstrips structure that is made of conductor layer via insulating barrier 10b on conductor plate 10a.The substrate B shown in Figure 2 that is formed with conductor layer 10c via insulating barrier 10b on conductor plate 10a is etched with printed wiring board 10 and/or laser processing is made, and conductor plate 10a is by being etched with and/or laser processing is separated into wiring part liner 10e and a plurality of lead-in wire 10f and conductor plate tongue piece 10h.And the through hole 11a that the plating layer 11 that is formed with the Wiring pattern 10d that stipulates by formation on a plurality of Wiring pattern 10d is connected with lead-in wire 10f and conductor plate tongue piece 10h.At this moment, can replace through hole 11a to use through hole, for example lead-in wire 10f and conductor plate tongue piece 10h can be electrically connected.
At this, the insulating barrier 10b that the insulator that substrate B is the conductor plate 10a that will be made of iron-nickel alloys such as copper, copper alloy or 42 alloys, be made of elastomer, solid or their complex etc. for example is made of polyimide piece, by conductor for example the conductor layer 10c that constitutes of Copper Foil do not use bonding agent and utilize punching press and crimping forms, be about 30 μ m and conductor layer 10c thickness 20 μ m so each conductor plate 10a thickness is the thickness of about 0.2mm, insulating barrier 10b.Wherein, each thickness of conductor plate 10a, insulating barrier 10b and conductor layer 10c is considered the dielectric constant of the characteristic impedance of hope and insulating barrier 10b and can suitably be changed.
During the manufacturing of printed wiring board 10 of the present invention, at first below conductor plate 10a and the integral body of side and became afterwards on the surface of conductor layer 10c of Wiring pattern 10d and form photoresist mask, the conductor layer 10c of exposed portions serve comes etching by etching solution.Thus, substrate B forms Wiring pattern 10d as shown in Figure 3, and exposes insulating barrier 10b partly.Then, the insulating barrier 10b that exposes goes up except that the part that forms through hole and forms photoresist mask, and insulating barrier 10b has the etching of hydrazine or laser ablation to remove by use.Thus, on insulating barrier 10b, be formed up to the recess 10g of conductor plate 10a among the substrate B as shown in Figure 4.In addition, etching solution is selected arbitrarily according to the metal species of object, etch processes temperature and time etc.Solution of ferrous chloride etc. for example when for example metal is copper or copper alloy.In addition, etching solution can divide a plurality of kinds to come the established part of etching substrates B.At this, etching can be dry ecthing.
Then, utilize photoresist that the top integral body of the formation Wiring pattern 10d of conductor plate 10a and following suitable position are formed mask, by etching solution come etched conductors plate 10a below.Thus, as shown in Figure 5, conductor plate 10a is separated into the first of leading part PL side, the second portion of wiring part PW side, the third part of equipped section PM side.At this moment, in the first of leading part PL side, between the lead-in wire 10f of adjacency also etching simultaneously remove and form a plurality of lead-in wire 10f, in addition, the third part of equipped section PM side also forms a plurality of conductor plate tongue piece 10h.Afterwards, the Wiring pattern 10d of the hope of substrate B and recess 10g go up the plating layer 11 that forms copper, form Wiring pattern 10d and lead-in wire 10f, or the through hole 11a of Wiring pattern (electrode pattern) 10d and conductor plate tongue piece 10h electrical connection.Like this, make wiring substrate shown in Figure 1 10.
Like this, printed wiring board 10 of the present invention will be made via substrate B etching or the laser processing of the integrally formed conductor layer 10c of insulating barrier 10b on conductor plate 10a, it comprises the leading part PL that is formed with a plurality of lead-in wire 10f, wiring part PW with a plurality of Wiring pattern 10d of little line formation, the equipped section PM of a plurality of electrode tongue piece 10i that have conductor plate tongue piece 10h and constitute by the insulating barrier 10b on this top and Wiring pattern (electrode pattern) 10d, lead-in wire 10f and Wiring pattern (electrode pattern) 10d corresponding and conductor plate tongue piece 10h and be electrically connected by through hole 11a with its corresponding Wiring pattern (electrode pattern) 10d with it.Therefore, in the printed wiring board 10, wire-bonded between lead-in wire 10f and Wiring pattern 10d or conductor plate tongue piece 10h and Wiring pattern (electrode pattern) 10d becomes and does not need, therefore, be not subjected to the restriction of the signal transmission characteristic that the deviation etc. of the length of bonding wire causes, and wiring part PW and leading part PL, equipped section PM can be made of single substrate simultaneously, so cost is low.
In addition, in the printed wiring board 10 of above-mentioned first execution mode, a plurality of Wiring pattern 10d form as little line with wiring part liner (second portion) 10e, but also can with a plurality of Wiring pattern 10d as have wiring part liner 10e, will and the liner of wiring part liner 10e adjacency be configured in the transmission road of two belt material sheet coplanar types between signals transmission road with Wiring pattern and form.
(second execution mode)
Secondly, the lead frame package of second execution mode of the present invention is described.Fig. 6 represent the lead frame package of second execution mode of the present invention manufacture method, be profile by the state of the molded printed wiring board 10 of synthetic resin.To be expression cut into the profile of the situation of wishing length formation lead frame package from will go between 10f and conductor plate tongue piece 10h of the molded printed wiring board 10 of synthetic resin to Fig. 7.
The lead frame package 20 of second execution mode of the present invention is made by the lead-in wire wiring substrate 10 with the leading part PL shown in first execution mode and equipped section PM.At first, by having electrical insulating property and thermoplastic polyphenylene sulfides (PSP) resin, polybutyleneterephthalate (PBT) resin or having electrical insulating property and synthetic resin 21 such as heat cured epoxy resin, as shown in Figure 6, utilize below the conductor plate 10a that inserts model (イ Application サ one ト モ one Le De) encirclement printed wiring board 10 and equipped section PM.At this moment, form the stage portion 21a that carries lift-launch piece described later on PM top, the equipped section of printed wiring board 10 by synthetic resin 21.
Then, shown in Fig. 7 dotted line, will from synthetic resin 21 extended a plurality of lead-in wire 10f and conductor plate tongue piece 10h cut into wish length after, their cut-out end face ground and carry out the Au plating, form lead frame package 20.
Like this, lead frame package 20 is to utilize the printed wiring board 10 of synthetic resin 21 molded first execution modes, and after will go between 10f and conductor plate tongue piece 10h cut into and wish length, grinding, plating were handled the cut-out end face and made.Therefore, lead frame package 20 handling eases, low cost of manufacture, and the wire-bonded position is few, so impedance operator is also stable.
(the 3rd execution mode)
The 3rd execution mode of the present invention then is described.Fig. 8 is the stereogram of optical module 30 of the 3rd execution mode of this invention of expression.Fig. 9 carries the optical semiconductor 32 of many raceway grooves and the profile that drives the circuit block (semiconductor element) 33 of usefulness on the lead frame package 20 shown in Figure 7; Figure 10 is the profile that lead frame package 20 and lasso 35 by the sealing of the synthetic resin of electrical insulating property are engaged the optical module 30 that forms.
Optical module 30 has the optical semiconductor 32 of four horizontal one-tenth one row configurations, as shown in Figure 8, will be engaged by the lead frame package 20 and the lasso 35 of synthetic resin housing 34a sealing, and bending machining is to the extended a plurality of lead-in wire 10f in side.Lasso 35 is provided with guide finger 35b on main body 35a, and with the optical semiconductor 32 corresponding horizontal one-tenth one of four of horizontal one-tenth one row configurations four optical fiber 35c is set with being listed as.
As optical semiconductor 32 for example use along be subjected to perpendicular to the direction incident of its real estate or emergent light plate light-emitting device array (VCSEL, PD) etc.In the manufacturing of optical module 30, as shown in Figure 9, at first first 31a of the lift-launch piece (silicon substrate) 31 on the stage portion 21a that is arranged at lead frame package 20 goes up horizontal one-tenth one row and fixes four optical semiconductors 32, vertical with this face second 31b and stage portion 21a relative fixed.Thus, the real estate of each optical semiconductor 32 and conductor plate 10a's is top vertical.In addition, the driving that IC etc. is set on the plating layer 11 of wiring part PW is with circuit block 33.And, carry between piece 31 and each optical semiconductor 32, carry between piece 31 and the conductor plate tongue piece 10h, connect by bonding wire W respectively between the plating layer 11 at circuit block 33 and two positions.
In addition, not shown, on first 31a that carries piece 31, form and carry out being electrically connected necessary Wiring pattern with optical semiconductor 32, the electrical connection of each optical semiconductor 32 and conductor plate tongue piece 10h is carried out via this Wiring pattern.And the bonding wire that connect to carry Wiring pattern on first 31a of piece 31 and conductor plate tongue piece 10h is connected and carries in conductor plate tongue piece 10h side on the end face 10j of first 31a almost parallel of piece 31.
Then as shown in figure 10, center on optical semiconductor 32 and the circuit block 33 that is fixed on the lead frame package 20 by synthetic resin housing 34a, the lasso 35 that is fixed with a plurality of optical fiber 35cs corresponding with each raceway groove of four optical semiconductors 32 is engaged with synthetic resin housing 34a, so that each optical fiber 35c combines with each raceway groove light of four optical semiconductors 32.At this moment, a plurality of lead-in wire 10f of the leading part PL of lead frame package 20 extend specific length from synthetic resin housing 34a.And, at the volume inside filled synthetic resin 34b that surrounds by synthetic resin housing 34a and lead frame package 20.In addition, lasso 35 has in main body 35a and is used for two guide finger 35b cooperating with multicore connecting pipe 42 (with reference to Figure 12 A) position.
Then, be that the section of Figure 11 A and broad ways is shown in Figure 11 B as section along Figure 10 length direction, 10f is processed by warpage in predefined position from the extended lead-in wire of synthetic resin housing 34a, makes optical module 30.Like this, the optical module 30 that makes shown in Figure 12 A, carries on the circuit substrate 40 that is formed with allocated circuit, is connected with the circuit of regulation via each lead-in wire 10f, utilizes guide finger 35 to be connected with multicore connecting pipe 42 in addition.Thus, optical module 30 and four optical semiconductors 32 are connected with ribbon-type optical fiber 43 corresponding fiber optics.
In addition, shown in the optical module 30 of other forms of optical module shown in Figure 12 B, shape behind the warpage processing lead-in wire 10f is a L word shape roughly, inserts logical being fixed in the through hole that is provided with on the assigned position of circuit substrate 40, is electrically connected with the circuit of regulation via each lead-in wire 10f.In addition, dispose a plurality of optical semiconductors 32 on the inherent two-dimensional directional in the plane of assigned position in the optical module shown in Figure 12 B 30.Promptly, the optical module shown in Figure 12 B 30 has the optical semiconductor 32 of four of the two horizontal one-tenth that are listed as, one row configurations up and down.Therefore, the corresponding optical semiconductors 32 of two row up and down of lasso 35 are shown in main body 35a as Figure 12 B and go up horizontal one-tenth one row ground and two be listed as four optics 35c are set up and down.
In addition, a plurality of optical semiconductors 32 for example can amount to 12 with vertical 2, horizontal 6; Vertical 3, horizontal 3 amount to 9; Or its above number is configured on the two-dimensional directional respectively.
In addition, lead-in wire 10f can not carry out warpage processing, and parallel with the plate face of circuit substrate 40.For example, the hole that can accommodate optical module is arranged on the assigned position of circuit substrate 40, and mobile optical module is to the position that the wired electric of lead-in wire 10f and circuit substrate 40 can be connected, and the 10f that then goes between does not need warpage processing.In addition, the distribution platform for example is set, make to be wired to the position that the wired electric of lead-in wire 10f and circuit substrate 40 can be connected, thereby lead-in wire 10f does not need warpage processing by assigned position at circuit substrate 40.Like this, the shape of lead-in wire 10 can design arbitrarily.
Thus, in the optical module 30 for example when optical semiconductor 32 is VCSEL, shown in Figure 11 A, mobile like this from the drive current of circuit substrate 40 sides input: the lead-in wire 10f of right-hand member → through hole 11a → bonding wire W → circuit block 33 → bonding wire W → through hole 11a → conductor plate tongue piece 10h → bonding wire W → lift-launch piece 31 → bonding wire W → optical semiconductor 32, the light that optical semiconductor 32 penetrates is transmitted by the ribbon-type optical fiber 43 that is installed on the multicore connecting pipe 42.
In addition, when optical semiconductor 32 is dull and stereotyped PD, along the optical signal current directed outwards circuit that optical semiconductor 32 is produced with above-mentioned opposite path.
Like this, 30 pairs of optical modules be situated between on conductor plate 10a that substrate B by the integrally formed conductor layer 10c of insulating barrier 10b is etched with and/or laser processing and form simultaneously wiring part PW and leading part PL with and/or equipped section PM, more than each one be electrically connected by through hole 11a.Therefore, optical module 30 is owing to the position of comparing wire-bonded with existing optical module is few, the influence of the deviation of the impedance that the deviation of the length of the bonding wire W that wants etc. causes reduces, in addition, Wiring pattern 10d can form on high accuracy zero deflection ground, so impedance operator is also stable, the deterioration of signal transmission characteristic is suppressed.In addition, optical module 30 is owing to handling ease, so can low-costly make.
In addition, plate optical semiconductor 32 is fixed on first 31a that carries piece 31, with vertical second 31b of this face on by engaging with stage portion 21a, thereby its real estate and conductor plate 10a's is top vertical.Therefore, light coincide to the incident exit direction of the light of the incident exit direction of optical fiber 35c and plate optical semiconductor 32.And, simultaneously, first 31a of the two ends of the bonding wire W that plate optical semiconductor 32 and conductor plate tongue piece 10h are electrically connected and lift-launch piece 31 and engage with the end face 10i of the conductor plate tongue piece 10h of its almost parallel is so can efficiently carry out the operation of wire-bonded.
At this, Figure 13 represents printed wiring board 10 in the optical module 30, circuit block 33 and bonding wire W, and a plurality of lead-in wire 10f of leading part PL are processed by warpage.Wherein, among Figure 13, the diagram of plating layer 11 is omitted.In addition, Figure 14 is the figure that sees the equipped section PM of Figure 13 from following side; Figure 15 A be a plurality of electrode tongue pieces shown in Figure 13 along the profile of liner with electrode tongue piece 10i (G); Figure 15 B is along the profile of signal with electrode tongue piece 10i (S).
Shown in Figure 14, Figure 15 A, Figure 15 B, between the signal of the adjacency of equipped section PM is with electrode tongue piece 10i (S), set by the liner that extends continuously towards equipped section PM from the conductor plate 10a of wiring part PW (wiring part liner 10e) with conductor plate tongue piece 10h (G), at this liner with conductor plate tongue piece 10h (G) upper span equipped section PM and wiring part PW and the insulating barrier 10b of lamination, Wiring pattern (liner electrode pattern) 10d that on this insulating barrier 10b, forms and the liner usefulness electrode tongue piece 10i (G) that constitutes.Like this, each signal across liner electrode tongue piece 10i (G) alternate configurations, constitutes a plurality of electrode tongue piece 10i with electrode tongue piece 10i (S).In addition, be easy two signals electrode tongue piece 10i (S) that only shows among the figure.
And liner uses conductor plate tongue piece 10h (G) shown in Figure 15 A with the liner of electrode tongue piece 10i (G), is electrically connected Wiring pattern (liner electrode pattern) 10d that links to each other with wiring part PW by through hole 11a.In addition, signal uses conductor plate tongue piece 10h (S) shown in Figure 15 B with the signal of electrode tongue piece 10i (S), is electrically connected Wiring pattern (signal electrode pattern) 10d that links to each other with wiring part PW by through hole 11a.Thus, liner is with among the electrode tongue piece 10i (G), and liner all is electrically connected with wiring part liner 10e with Wiring pattern (liner electrode pattern) 10d of conductor plate tongue piece 10h (G) and formation on it.And signal is used among the electrode tongue piece 10i (S), and signal is not electrically connected with wiring part liner 10e with Wiring pattern (signal electrode pattern) 10d of conductor plate tongue piece 10h (S) and formation on it, and links to each other with the Wiring pattern 10d of wiring part PW.
Like this, in the printed wiring board 10, shown in Figure 13～15, liner forms the liner of one with conductor plate tongue piece 10h (G), so its earthing potential is stable with electrode tongue piece 10i (G) continuously owing to having with wiring part liner 10e.Therefore, liner configuration signal electrode tongue piece 10i (S) between the electrode tongue piece 10i (G), thus between a plurality of signals are with electrode tongue piece 10i (S), carry out electromagnetic shielding effectively.Therefore, use in the optical module 30 of printed wiring board 10, signal is effectively suppressed with the electromagnetic interference between electrode tongue piece 10i (S), so the interference between raceway groove crosstalks and effectively suppressed, and the signal transmission characteristic for example deterioration of S/N ratio is suppressed or prevents.
Such liner can form with electrode tongue piece 10i (S) with signal when making printed wiring board 10 simultaneously with electrode tongue piece 10i (G).Promptly, when the etching of equipped section PW by conductor plate 10a is separated into a plurality of electrode tongue piece 10i, become liner and can form etching mask with the part of conductor plate tongue piece 10h (G), not separate from the conductor plate 10a (wiring part liner 10e) of wiring part PW, that is, be not separated into the second portion of wiring part PW side and the third part of equipped section PM side.Like this, liner can form by very easy method with electrode tongue piece 10i (G).
In addition, in above-mentioned, the electrode tongue piece 10i that equipped section PM has been described goes up the situation of formation liner with electrode tongue piece 10i (G), equally, about the lead-in wire 10f of leading part PL, also can configuration and the continuous and integrally formed liner lead-in wire 10f (G) of wiring part liner 10e between signal is with lead-in wire 10f (S).According to such structure, in the optical module 30, liner uses the earthing potential of lead-in wire 10f (G) stable, and the signal of adjacency is with going between between 10f (S) by liner effectively electromagnetic shielding of lead-in wire 10f (G).Therefore, in the optical module 30, the signal that transmits from the circuit substrate shown in Figure 12 A 40 is because the electromagnetic interference that effectively suppresses or prevent to be caused by leading part PL is suppressed so the interference between raceway groove is crosstalked, and the signal transmission characteristic for example deterioration of S/N ratio is suppressed or prevents.
At this moment, liner is same with electrode tongue piece 10i (G) with liner with lead-in wire 10f (G), by constituting towards the conductor plate 10a that leading part PL extends continuously, when making printed wiring board 10, can form simultaneously with lead-in wire 10f (S) with signal from the conductor plate 10a of wiring part PW (wiring part liner 10e).Promptly, when equipped section PM is separated into a plurality of lead-in wire 10f by the etching of conductor plate 10a, become liner with the lead-in wire 10f (G) the position can form etching mask, not separate from the conductor plate 10a (wiring part liner 10e) of wiring part PW, that is, be not separated into the second portion of wiring part PW side and the first of leading part PL side.
At this, Figure 20 is the enlarged drawing of an example of seeing the equipped section PM of Figure 13 from the top.As shown in figure 20, among a plurality of electrode tongue piece 10i of equipped section PM, the through hole 11a that Wiring pattern 10d and conductor plate tongue piece 10h are electrically connected forms to such an extent that the position of length direction of electrode tongue piece 10i is different between the electrode tongue piece 10i of adjacency.Because the electrical connection of Wiring pattern 10d and conductor plate tongue piece 10h is reliable, through hole 11a size to a certain degree becomes necessary, and it is bigger than the width of Wiring pattern 10d and conductor plate tongue piece 10h that its diameter becomes.Therefore, like this with large diameter through hole in assortment on the length direction of electrode tongue piece 10i on same position, then the spacing between each electrode tongue piece 10i becomes big, and spacing cooperates between the raceway groove of the optical semiconductor of many raceway grooves that can not make with the spacing (for example 250 μ m) that cooperates the fiber array that adopts usually.Therefore,, thereby avoid the problems referred to above, can dwindle the spacing between electrode tongue piece 10i by the position of through hole 11a of between the electrode tongue piece 10i of adjacency, staggering.Thus, use printed wiring board 10 of the present invention, can make small-sized optical module 30.In addition, the spacing of fiber array can be designed to spacing arbitrarily according to the kind of optical fiber, for example width, shape (section shape, the multi-core types of optical cable or band etc.) in addition etc.
In addition, optical module 30 is the three parts that becomes the rear portion of rear side with respect to being provided with the front portion of guide finger 35b side by side in the Width both sides extended structures of a plurality of lead-in wire 10f that make progress, but also can be the structure of only extending a plurality of lead-in wire 10f as shown in figure 16 in the Width both sides according to purposes and design.In addition, lead-in wire 10f is also can be only one-sided or extend below optical module 30 from Width.
In addition, shown in Figure 18 A, in the optical module 30, also can form first 31a of the lift-launch piece 31 that is fixed with optical semiconductor 32 and with second perpendicular 31b continuously and with the Wiring pattern 31c that connects between optical semiconductor 32 and the Wiring pattern 10d, carry piece 31 second 31b Wiring pattern 31c with Wiring pattern 10d (plating layer 11) state of contact of the equipped section PM of printed wiring board 10 under will carry piece 31 and be fixed on the printed wiring board 10.
In addition, circuit block 33 is when being situated between by configuration a plurality of electrodes in the plane planar when conductive layer 10c as Wiring pattern 10d is connected, and shown in Figure 18 B, Jie is by being connected with conductive layer 10c with scolding tin bead 36 that electrode pair is answered.
At this moment, shown in Figure 18 C, each link position L11～L33 of a plurality of electrodes and a plurality of conductive layer 10c be vertical 3 * when horizontal 3 or its are above, have conductive layer 10c on each link position L11～L33.Therefore, the link position L22 that is surrounded by other link positions L11～L33 on every side is owing to the restriction on the space is difficult to be provided with conductive layer 10c.Therefore, when circuit block 33 has the link position L22 that is surrounded by other link positions L11～L33, in link position L22, as shown in figure 18, be connected with conductor layer 10k by through hole 37.Thus, in the circuit block 33, the electrode that is positioned at link position L22 is situated between and is connected with Wiring pattern 10d (conductive layer 10c) by scolding tin bead 36, through hole 37, conductor layer 10k.
At this moment, can replace through hole 37 to use through hole to carry out perhaps also can directly connecting scolding tin bead 36 and conductor layer 10k continuously.Like this, even circuit block 33 electrode numbers increase, produce the link position that is surrounded by other link positions on every side, also can be connected with conductor layer.In addition, thereby conductive layer 10k itself also can form the distribution that Wiring pattern can form hope shown in Wiring pattern 10d, perhaps also can be electrically connected with the Wiring pattern of regulations such as through hole 11a.
In addition, catoptrical influence for the surface that suppresses plate optical semiconductor 32, shown in Figure 19 A, also can form stage portion 21a, thereby make the real estate that is fixed on the plate optical semiconductor 32 on first 31a that carries piece 31 top out of plumb with respect to conductor plate 10a by top inclined-plane with inclination angle with 3 °～10 ° preferably 6 °～9 ° of degree with respect to conductor plate 10a.In addition, shown in Figure 19 B, also can be or not the angular cross at right angle and form and carry piece 31 with first 31a carrying piece 31 and second 31b, second 31b is fixed on the top stage portion 21a that forms abreast with respect to conductor plate 10a, thereby makes the top out of plumb of the real estate relevant with respect to conductor plate 10a with plate optical semiconductor 32.In addition, though not shown, also can be, with carry piece 31 around with above the conductor plate 10a vertical rotated the fixed-site of 3 °～10 ° preferably 6 °～9 ° of degree at stage portion 21a, or, the incident outgoing end face of optical fiber 35c is tiltedly processed.According to said structure, in the optical module 30, because the incident outgoing end face of the incident exit facet (parallel with real estate) of plate optical semiconductor 32 and optical fiber 35c is non-parallel, so inhibition or prevent the baneful influence that reverberation brings.
In addition, in the optical module 30, can be fixed on the wiring part PW by the circuit blocks such as IC 33 of flip-chip bond with the driving usefulness of optical semiconductor 32.According to this structure, can further reduce the bonding wire that the Wiring pattern 10d with the wiring part PW of circuit block 33 and printed wiring board 10 is connected, so optical module 30 can further suppress the reduction of signal transmission characteristic.
In addition, in the optical module 30 of the present invention, circuit block 33 can be set, the lead-in wire 10f of leading part PL can not be situated between with the optical semiconductor 32 that equipped section PM upward carries and is connected by circuit block 33.In addition, in the printed wiring board 10, equipped section PM not necessarily can only be provided with wiring part PW and leading part PL.At this moment, as shown in figure 17, the fixing optical semiconductor 32 of the semiconductor laser diode of end face outgoing type or the photic diode of guided wave type (end face is subjected to the light type) etc. on the plating layer 11 of wiring part PW, by bonding wire W connect and Wiring pattern 10d between.
(the 4th execution mode)
Next illustrates the 4th execution mode of the present invention.Figure 21 is the profile of the optical module 50 of expression the 4th execution mode of the present invention.The optical module 30 of the 3rd execution mode is equipped with the lead frame package 20 of the circuit block (semiconductor element) 33 of optical semiconductor 32 and driving usefulness by the synthetic resin sealing of electrical insulating property.With respect to this, in the optical module 50, the lead frame package 20 that is equipped with the circuit block 33 of optical semiconductor 32 and driving usefulness is sealed by lid 51, sidewall 52, base plate 54 and lasso 55.The inside of optical module 50 preferably for example seals by the gas of having controlled nitrogen (N2) and amount of moisture etc.
As shown in figure 21, optical module 50 is at fixing fixed part 53 above conductor plate 10e, 10f, 10h are fixed on the base plate 54, and conductor plate 10f is situated between and is extended to the outside from sidewall 52 by insulator 56.At this moment, optical module 50 has a plurality of optical semiconductor 32 of horizontal one-tenth one row configuration.In addition, circuit block 33 engages with a plurality of lead-in wire 33a and conductive layer 10c by scolding tin.Therefore, lasso 55 has a plurality of optical fiber 55cs corresponding with the number of optical semiconductor 32, and each optical fiber 55c combines with the raceway groove light of each optical semiconductor 32.Optical module 50 utilizes the guide finger 55b of the main body 55a that is arranged on lasso 55 to be connected with multicore connecting pipe (not shown), and optical semiconductor 32 is situated between and is connected with the fiber optics of described multicore connecting pipe by optical fiber 55c.
At this moment, fixed part 53 part of preferably joining with conductor plate 10e, 10f, 10h at least has electrical insulating property and thermal conductivity.Fixed part 53 is if having thermal conductivity, and then optical module 50 can be situated between by base plate 54 heat radiations or heating.In addition, fixed part 53 uses in the part of joining with conductor plate 10e, 10f, 10h at least and is formed with the metal of electric insulation layer or synthetic resin, the aluminium oxide (Al of thermal conductivity 2O 3), aluminium nitride (AIN) etc. is nonmetal.And base plate 54 can use metal, the synthetic resin of thermal conductivity, aluminium oxide (Al such as copper, copper alloy 2O 3), aluminium nitride (AlN) etc. is nonmetal.
In addition, optical module 50 adds temperature control component between fixed part 53 and base plate 54, can for example follow variations in temperature optical semiconductor 32 and circuit block 33 to be controlled to the temperature of hope from the outside.And then the assigned position of the inside of optical module 50 is provided with temperature detection sensor, then can be according to controlling temperature exactly.
In addition, optical module of the present invention combines with each raceway groove light of optical semiconductor by the optical fiber that lasso had, and the light parts by described lasso and outside light connecting pipe etc. combine.But the optical fiber that for example cover figure is had in the optical module of the present invention forms long size, and this optical fiber combines with each raceway groove light of optical semiconductor, and derives outside.At this moment, derive outside optical fiber and combine with other optical fiber light, or combine with other optical fiber light by the fusion connection by the light connecting pipe that is arranged on the end.
In addition, under the situation of optical module with light-emitting component and photo detector, also can be, the size of the electric luminous signal luminous with making light-emitting component is compared, photo detector be subjected to light and by electric conversion be subjected to light signal little, so luminous signal and be subjected to produce between the light signal electromagnetic interference (interference is crosstalked).Therefore, in such optical module, for example the liner of the liner of light-emitting component and photo detector separates and forms a plurality of conductor plates.
Industrial application
As mentioned above, printed wiring board of the present invention, its manufacture method, lead frame package and Optical module reduces the position of wire-bonded, and the signal that the deviation of the length of inhibition bonding wire etc. causes passes Send the deterioration of characteristic, in addition, and the wire-bonded between the plate optical semiconductor that carries Operation is carried out easily, but and low cost fabrication.

Claims (35)

1. a printed wiring board is characterized in that, comprising: a plurality of conductor plates, and it has at least one the conductor plate that uses as being used for the lead-in wire that is electrically connected with external circuit, mutual apart; Insulating barrier, on the described a plurality of conductor plates of its span with and/or described a plurality of conductor plate and forming; A plurality of Wiring patterns, it is formed on the described insulating barrier,
The conductor plate of at least one of described a plurality of conductor plates is electrically connected by at least one with described a plurality of Wiring patterns of through hole.
2. printed wiring board as claimed in claim 1 is characterized in that, described printed wiring board comprises: have one leading part in separated described a plurality of conductor plates; Have another and the wiring part that is electrically connected with described leading part in separated described a plurality of conductor plates.
3. printed wiring board as claimed in claim 2, it is characterized in that, the conductor plate of described leading part also is separated into the signal of the defined amount corresponding with described a plurality of Wiring patterns with going between, and the signal of described defined amount is electrically connected by the self-corresponding described Wiring pattern of through hole and each with lead-in wire.
4. as claim 2 or 3 described printed wiring boards, it is characterized in that, at least one liner of configuration is with lead-in wire between two signals of adjacency are with lead-in wire for described leading part, and described at least one liner is integrally formed and by the through hole Wiring pattern electrical connection corresponding with described a plurality of Wiring patterns from the conductor plate of described wiring part with lead-in wire.
5. as each described printed wiring board of claim 2～4, it is characterized in that, also has the equipped section in the described printed wiring board, its described Wiring pattern with described leading part and regulation is electrically connected, and have and be used for a plurality of signals electrode tongue piece of being electrically connected with many raceway grooves optical semiconductor with a plurality of optical semiconductors, each signal is with forming electrode pattern on the electrode tongue piece
The conductor plate of this equipped section further is divided into the signal conductor plate tongue piece of the defined amount corresponding with the raceway groove of described many raceway grooves optical semiconductor, constitutes with the conductor plate tongue piece as described a plurality of signals together with corresponding electrode pattern,
Described signal is electrically connected by the self-corresponding described electrode pattern of through hole and each with the conductor plate tongue piece.
6. printed wiring board as claimed in claim 5 is characterized in that, described equipped section, and at described a plurality of signals two signals of adjacency at least one liner of configuration electrode tongue piece between the electrode tongue piece in the electrode tongue piece,
This at least one liner have with the electrode tongue piece liner that constitutes by the described conductor plate that extends continuously towards described equipped section side from described wiring part side with conductor plate tongue piece, lamination at this liner with the insulating barrier on the conductor plate tongue piece and be formed on liner electrode pattern on this insulating barrier, described liner is electrically connected with electrode pattern with described liner by through hole with the conductor plate tongue piece.
7. the manufacture method of a printed wiring board is characterized in that, has following operation: first operation, prepare by conductor plate, lamination is at the insulating barrier on this conductor plate and be formed on the substrate that the conductor layer on this insulating barrier constitutes; Second operation, the specified part of the described at least conductor layer of etching or/and laser processing and form described a plurality of Wiring pattern; The 3rd operation, the described conductor plate of etching or/and laser processing and be separated into a plurality of conductor plates is at residual described insulating barrier in the position of the separated described a plurality of conductor plates of span and Wiring pattern; The 4th operation is electrically connected at least one at least one conductor plates by through hole and the described a plurality of conductor plates that separate of described a plurality of Wiring patterns.
8. the manufacture method of printed wiring board as claimed in claim 7, it is characterized in that, in described the 3rd operation by being separated into described conductor plate a plurality of, thereby form one leading part in the described a plurality of conductor plates with separation, with have the described a plurality of conductor plates that separate in another and the wiring part that is electrically connected with described leading part.
9. the manufacture method of printed wiring board as claimed in claim 8, it is characterized in that, in described the 3rd operation, the conductor plate of described leading part further is separated into the signal of the defined amount corresponding with described a plurality of Wiring patterns with going between, and the signal of described defined amount is electrically connected by the self-corresponding described Wiring pattern of through hole and each with lead-in wire.
10. the manufacture method of printed wiring board as claimed in claim 9, it is characterized in that, in described the 3rd operation, also have and form the operation of at least one liner with lead-in wire, this liner is used between the lead-in wire at two signals of adjacency with lead-line configuration, conductor plate by described wiring part forms, and is electrically connected by the through hole Wiring pattern corresponding with described a plurality of Wiring patterns.
11. the manufacture method as each described printed wiring board of claim 8～10 is characterized in that, described the 3rd operation also has following operation:
Form the equipped section, this equipped section has another of described a plurality of conductor plates of described leading part, wiring part and separation, the described Wiring pattern of described leading part and regulation is electrically connected, and have and be used for a plurality of signals electrode tongue piece of being electrically connected with many raceway grooves optical semiconductor with a plurality of optical semiconductors, each signal is with forming electrode pattern on the electrode tongue piece
The signal that the conductor plate of this equipped section further is separated into the defined amount corresponding with the raceway groove of described many raceway grooves optical semiconductor with the conductor plate tongue piece and with corresponding electrode pattern as described a plurality of signals electrode tongue piece, and,
Described signal is electrically connected by the self-corresponding described electrode pattern of through hole and each with the conductor plate tongue piece.
12. manufacture method as each described printed wiring board in the claim 7～11, it is characterized in that, described the 3rd operation contain be formed on described a plurality of signal with two signals of adjacency in the electrode tongue piece with the operation of at least one liner that disposes between the electrode tongue piece with the electrode tongue piece
This at least one liner is formed by etching or/and laser processing with the electrode tongue piece, have the liner that constitutes by the described conductor plate that extends continuously towards described equipped section side from described wiring part side with conductor plate tongue piece, lamination at this liner with the insulating barrier on the conductor plate tongue piece and be formed on liner electrode pattern on this insulating barrier, described liner is electrically connected with electrode pattern with described liner by through hole with the conductor plate tongue piece.
13. a lead frame package is characterized in that, comprising: a plurality of conductor plates, it contains as at least one the conductor plate that is used for the lead-in wire of external circuit connecting line, apart mutually; Insulating barrier, on the described a plurality of conductor plates of its span with and/or described a plurality of conductor plate and forming; A plurality of Wiring patterns, it is formed on the described insulating barrier; The synthetic resin of electrical insulating property, it is molded with carrying out below at least one conductor plate of described a plurality of conductor plates,
At least one conductor plate of described a plurality of conductor plates is electrically connected by at least one with described a plurality of Wiring patterns of through hole.
14. lead frame package as claimed in claim 13, it is characterized in that, described lead frame package comprises: have one leading part of described a plurality of conductor plate of separation, with another and the wiring part that is electrically connected with described leading part with described a plurality of conductor plates of separating.
15. lead frame package as claimed in claim 14 is characterized in that, the conductor plate of described leading part further is separated into the signal lead-in wire of the defined amount corresponding with described a plurality of Wiring patterns,
The signal of described defined amount is electrically connected by the self-corresponding described Wiring pattern of through hole and each with lead-in wire.
16., it is characterized in that described leading part goes between with having at least one liner usefulness between going between at two signals of adjacency as claim 14 or 15 described lead frame package,
Described at least one liner is integrally formed from the conductor plate of described wiring part with lead-in wire, and is electrically connected by the through hole Wiring pattern corresponding with described a plurality of Wiring patterns.
17. as each described lead frame package in the claim 14～16, it is characterized in that, described lead frame package also has the equipped section, its described Wiring pattern with described leading part and regulation is electrically connected, and have and be used for a plurality of signals electrode tongue piece of being electrically connected with many raceway grooves optical semiconductor with a plurality of optical semiconductors, each signal is with forming electrode pattern on the electrode tongue piece
The conductor plate of this equipped section is separated into the signal conductor plate tongue piece of the defined amount corresponding with the raceway groove of described many raceway grooves optical semiconductor, and uses the electrode tongue piece to constitute as described a plurality of signals together with corresponding electrode pattern,
Described signal is electrically connected by the self-corresponding described electrode pattern of through hole and each with the conductor plate tongue piece.
18. lead frame package as claimed in claim 17 is characterized in that, have described a plurality of signals with the electrode tongue piece at least one liner electrode tongue piece of disposing between with the electrode tongue piece of two signals of adjacency,
This at least one liner comprises with the electrode tongue piece: by from described wiring part side towards liner that the described conductor plate that described equipped section side is extended continuously constitutes with the conductor plate tongue piece, this liner with the conductor plate tongue piece on lamination insulating barrier and be formed on liner electrode pattern on this insulating barrier, described liner is electrically connected with electrode pattern with described liner by through hole with the conductor plate tongue piece.
19. an optical module is characterized in that, comprising:
Printed wiring board, it has: a plurality of conductor plates, it contains at least one conductor plate that uses as the lead-in wire that is electrically connected with external circuit, and mutual apart; Insulating barrier, on the described a plurality of conductor plates of its span with and/or described a plurality of conductor plate and forming; A plurality of Wiring patterns, it is formed on the described insulating barrier, and at least one conductor plate of described a plurality of conductor plates is electrically connected by at least one with described a plurality of Wiring patterns of through hole;
The synthetic resin molded shell of electrical insulating property, its coat described a plurality of conductor plates at least one conductor plate below;
Optical semiconductor, it is electrically connected with described Wiring pattern;
Optical fiber, it combines with described optical semiconductor light.
20. optical module as claimed in claim 19, it is characterized in that, described printed wiring board comprises one leading part in the described a plurality of conductor plates with separation, with have the described a plurality of conductor plates that separate in another and the wiring part that is electrically connected with described leading part.
21. optical module as claimed in claim 20 is characterized in that, the conductor plate of described leading part further is separated into the signal lead-in wire of the defined amount corresponding with described a plurality of Wiring patterns,
The signal of described defined amount is electrically connected by the self-corresponding described Wiring pattern of through hole and each with lead-in wire.
22. as claim 20 or 21 described optical modules, it is characterized in that, fix or be connected with at least one circuit element on the described wiring part.
23. optical module as claimed in claim 22 is characterized in that, described circuit element is fixed by flip-chip bond or is connected on the described wiring part.
24. as each described optical module of claim 20～23, it is characterized in that, described printed wiring board also has the equipped section, its described Wiring pattern with described leading part and regulation is electrically connected, and have and be used for a plurality of signals electrode tongue piece of being electrically connected with many raceway grooves optical semiconductor with described a plurality of optical semiconductors, each signal is with forming electrode pattern on the electrode tongue piece
The conductor plate of described equipped section further is separated into the signal conductor plate tongue piece of the defined amount corresponding with the groove of described many raceway grooves optical semiconductor, and uses the electrode tongue piece to constitute as described a plurality of signals together with corresponding electrode pattern,
Described signal is electrically connected by the self-corresponding described electrode pattern of through hole and each with the conductor plate tongue piece.
25. optical module as claimed in claim 24 is characterized in that, two signals at least one liner of configuration electrode tongue piece between the electrode tongue piece of described equipped section adjacency in described a plurality of signals usefulness electrode tongue pieces,
This at least one liner have with the electrode tongue piece liner that constitutes by the described conductor plate that extends continuously towards described equipped section side from described wiring part side with conductor plate tongue piece, lamination at this liner with the insulating barrier on the conductor plate tongue piece and be formed on liner electrode pattern on this insulating barrier, described liner is electrically connected with electrode pattern with described liner by through hole with the conductor plate tongue piece.
26., it is characterized in that described many raceway grooves optical semiconductor is plate as claim 24 or 25 described optical modules, be fixed on first that carries piece,
This lift-launch piece has second that pitches with described first hand-deliver, and this second state to engage towards described printed wiring board is fixed on described printed wiring board top,
Each raceway groove of described many raceway grooves optical semiconductor is situated between by at least one piece lead-in wire and corresponding described electrode tongue piece electrical connection of direct wire-bonded at the end face of the conductor plate of the described electrode tongue piece of correspondence.
27., it is characterized in that described many raceway grooves optical semiconductor is plate as claim 24 or 25 each described optical modules, be fixed on first that carries piece,
This lift-launch piece have with second of the described first hand-deliver fork and with described first and described second Wiring pattern that forms continuously,
Second Wiring pattern of this lift-launch piece is fixed on the described printed wiring board with the Wiring pattern state of contact with the equipped section of described printed wiring board.
28. as each described optical module of claim 24～27, it is characterized in that, fix or be connected with at least one circuit element on the described wiring part.
29. optical module as claimed in claim 28 is characterized in that, described circuit element is fixed by flip-chip bond or is connected on the described wiring part.
30., it is characterized in that described optical semiconductor is a plurality of in the assigned position configuration on two-dimensional directional as each described optical module of claim 19～29.
31. optical module as claimed in claim 30 is characterized in that, has described circuit element and at least one described optical semiconductor, being situated between is electrically connected with at least one electrode of described circuit element and the described Wiring pattern of regulation by the scolding tin bead.
32. an optical module is characterized in that, comprising:
Printed wiring board, it has: a plurality of conductor plates, it contains at least one conductor plate and the mutual apart of using as the lead-in wire that is electrically connected with external circuit; Insulating barrier, on the described a plurality of conductor plates of its span with and/or described a plurality of conductor plate and forming; A plurality of Wiring patterns, it is formed on the described insulating barrier, and at least one conductor plate of described a plurality of conductor plates is electrically connected by at least one with described a plurality of Wiring patterns of through hole;
Fixed part, at least one conductor plate that it is fixed with a plurality of conductor plates makes the position that is electrically connected with described a plurality of conductor plates at least have electrical insulating property;
Optical semiconductor, it is electrically connected with described Wiring pattern;
Optical fiber, it combines with described optical semiconductor light.
33. want 32 described optical modules as right, it is characterized in that having the base plate that described fixed part is set, between described fixed part and described base plate, dispose temperature control component.
34., it is characterized in that described optical semiconductor is a plurality of in the assigned position configuration on two-dimensional directional as claim 32 or 33 described optical modules.
35., it is characterized in that having described circuit element and the described optical semiconductor of at least one as each described optical module of claim 32～34,
The described Wiring pattern of at least one electrode of described circuit block and regulation is situated between and is electrically connected by the scolding tin bead.
CNB2004800058083A 2003-03-11 2004-03-04 Printed wiring board, method for manufacturing same, lead frame package and optical module Expired - Fee Related CN100440500C (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104142543A (en) * 2013-05-07 2014-11-12 日立金属株式会社 OPTICAL WIRING SUBSTRATE, MANUFACTURING METHOD OF the OPTICAL WIRING SUBSTRATE, AND OPTICAL MODULE
CN107548244A (en) * 2017-08-30 2018-01-05 景旺电子科技(龙川)有限公司 The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10228634A1 (en) * 2002-06-26 2004-01-22 Osram Opto Semiconductors Gmbh Surface-mountable miniature luminescence and / or photo diode and process for their production
JP5197156B2 (en) * 2007-06-19 2013-05-15 キヤノン株式会社 Wiring board
KR101580925B1 (en) * 2009-04-28 2015-12-30 삼성전자주식회사 Chip On Board Type Package
CN102263086B (en) * 2010-05-28 2013-04-17 日月光半导体制造股份有限公司 Semiconductor packaging structure
US20120074131A1 (en) * 2010-09-29 2012-03-29 Seagate Technology Llc Integrated resistive heaters for microelectronic devices and methods utilizing the same
KR101434395B1 (en) * 2011-09-21 2014-09-02 한국전자통신연구원 Bidirectional optical transmitting and receiving device
US8491315B1 (en) * 2011-11-29 2013-07-23 Plastronics Socket Partners, Ltd. Micro via adapter socket
JP6005362B2 (en) * 2012-01-19 2016-10-12 日本航空電子工業株式会社 Optical module and optical transmission module
JP2013225595A (en) * 2012-04-20 2013-10-31 Shinko Electric Ind Co Ltd Lead frame, semiconductor package, and manufacturing methods of lead frame and semiconductor package
DE102012215449A1 (en) 2012-08-31 2014-03-27 Osram Opto Semiconductors Gmbh HOUSING FOR AN ELECTRONIC COMPONENT, ELECTRONIC MODULE, METHOD FOR MANUFACTURING A HOUSING FOR AN ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC MODULE
JP6790372B2 (en) * 2016-02-05 2020-11-25 富士電機株式会社 Semiconductor device
JP6412900B2 (en) * 2016-06-23 2018-10-24 株式会社東芝 High frequency semiconductor package
WO2018110513A1 (en) * 2016-12-15 2018-06-21 株式会社村田製作所 Active element, high-frequency module, and communication device

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845313A (en) * 1985-07-22 1989-07-04 Tokyo Communication Equipment Co., Ltd. Metallic core wiring substrate
JPH01199497A (en) * 1987-11-10 1989-08-10 Ibiden Co Ltd Electronic component mounting substrate
JP2528192B2 (en) 1990-01-12 1996-08-28 株式会社三井ハイテック Semiconductor device
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5483100A (en) * 1992-06-02 1996-01-09 Amkor Electronics, Inc. Integrated circuit package with via interconnections formed in a substrate
JPH0697318A (en) * 1992-09-16 1994-04-08 Dainippon Printing Co Ltd Wiring board for semiconductor device
US5661086A (en) * 1995-03-28 1997-08-26 Mitsui High-Tec, Inc. Process for manufacturing a plurality of strip lead frame semiconductor devices
JP2917868B2 (en) * 1995-07-31 1999-07-12 日本電気株式会社 Semiconductor device and manufacturing method thereof
KR100203934B1 (en) * 1996-02-17 1999-06-15 윤종용 Multi chip package using lead flame with patterning
JPH09260560A (en) 1996-03-21 1997-10-03 Toppan Printing Co Ltd Lead frame and its manufacturing method
US5869898A (en) * 1997-04-25 1999-02-09 Nec Corporation Lead-frame having interdigitated signal and ground leads with high frequency leads positioned adjacent a corner and shielded by ground leads on either side thereof
JP3171172B2 (en) * 1998-09-25 2001-05-28 日本電気株式会社 Hybrid integrated circuit
JP3434473B2 (en) * 1999-07-23 2003-08-11 古河電気工業株式会社 Silicon platform for optical module
JP4190111B2 (en) 1999-10-29 2008-12-03 富士通株式会社 High frequency module
JP2001194387A (en) 2000-01-11 2001-07-19 Mitsubishi Materials Corp Contact probe and manufacturing method thereof
JP3650001B2 (en) * 2000-07-05 2005-05-18 三洋電機株式会社 Semiconductor device and manufacturing method thereof
KR100528950B1 (en) * 2001-01-29 2005-11-16 제이에스알 가부시끼가이샤 Composite Particle for Dielectrics, Ultramicroparticulate Composite Resin Particle, Composition for Forming Dielectrics and Use Thereof
JP2002333552A (en) * 2001-05-08 2002-11-22 Fujitsu Ltd Optical device
JP2003007916A (en) * 2001-06-19 2003-01-10 Sanyo Electric Co Ltd Method of manufacturing circuit device
JP2003031755A (en) 2001-07-18 2003-01-31 Sumitomo Electric Ind Ltd Laminated lead frame, optical communication module and manufacturing method therefor
JP2003060281A (en) 2001-08-14 2003-02-28 Sumitomo Electric Ind Ltd Light emission module and manufacturing method therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104142543A (en) * 2013-05-07 2014-11-12 日立金属株式会社 OPTICAL WIRING SUBSTRATE, MANUFACTURING METHOD OF the OPTICAL WIRING SUBSTRATE, AND OPTICAL MODULE
CN104142543B (en) * 2013-05-07 2017-03-22 日立金属株式会社 OPTICAL WIRING SUBSTRATE, MANUFACTURING METHOD OF the OPTICAL WIRING SUBSTRATE, AND OPTICAL MODULE
CN107548244A (en) * 2017-08-30 2018-01-05 景旺电子科技(龙川)有限公司 The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based

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JP4514709B2 (en) 2010-07-28
EP1603158A4 (en) 2009-07-15
EP1603158A1 (en) 2005-12-07
US7355862B2 (en) 2008-04-08
US7832092B2 (en) 2010-11-16
EP1603158B1 (en) 2021-06-09
CN100440500C (en) 2008-12-03
US20050208789A1 (en) 2005-09-22
WO2004082019A1 (en) 2004-09-23
US20080172871A1 (en) 2008-07-24

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