CN1753182A - 堆叠式光源 - Google Patents

堆叠式光源 Download PDF

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CN1753182A
CN1753182A CNA200510080448XA CN200510080448A CN1753182A CN 1753182 A CN1753182 A CN 1753182A CN A200510080448X A CNA200510080448X A CN A200510080448XA CN 200510080448 A CN200510080448 A CN 200510080448A CN 1753182 A CN1753182 A CN 1753182A
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CN100541793C (zh
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柯丰峰
梅彦国
柯鹏林
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Agilent Technologies Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
    • H01L2224/4848—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本发明公开了一种发光器件，该器件具有两个安装在反射器杯中的堆叠式光生成器。在一个实施例中，光生成器发出互补颜色，这些互补颜色混合以形成白光。

Description

堆叠式光源
技术领域
本发明一般地涉及光源领域。更具体而言，本发明涉及用于混合来自光源的光的方法和装置。
背景技术
为了使发光二极管(LED)产生白光，已经使用了若干方法。第一种方法是使用与黄色荧光粉相结合的蓝色LED。来自LED的蓝光的一部分被荧光粉转换成黄光。黄光与剩余蓝光混合以形成白光。这种方法的缺点在于荧光粉的转换效率约为60％，因此光源效率不高。
第二种方法是使用具有不同颜色的LED的组合，以生成白光。在这种方法中，并排放置两个或三个LED晶片(dies)。例如，蓝色LED可以与琥珀色LED一起使用。但是，使用这种方法，难以获得形成白光所需的准确颜色混合。
发明内容
本发明公开了一种发光器件，该器件具有两个安装在反射器杯中的堆叠式光生成器。在一个实施例中，光生成器发出互补颜色，这些互补颜色混合以形成白光。
根据本发明的一个方面，其提出了一种用于生成可见光的器件，该器件包括：反射器杯；安装在反射器杯中的第一光生成器，该第一光生成器可操作为发出具有第一颜色的光；以及安装在反射器杯中，并位于第一光生成器之上的第二光生成器，所述第二光生成器可操作为发出具有第二颜色的光，其中具有第二颜色的光和具有第一颜色的光混合以生成所述可见光。
根据本发明的另一方面，提出了一种封装光源的方法，该方法包括：在反射器杯中安装第一光生成器，从而使第一光生成器电耦合到反射器杯，其中第一光生成器可操作为发出具有第一颜色的光；以及在第一光生成器之上安装第二光生成器，从而使第二光生成器电耦合到第一光生成器，其中第二光生成器可操作为发出具有第二颜色的光。
附图说明
在所附权利要求中提出了被认为是本发明特征的新颖特征。但是，通过结合附图参考以下对示例性实施例的详细描述，可以最好地理解发明本身，及其优选实施方式和其他目的以及优点，在附图中：
图1是本发明实施例的俯视图。
图2是本发明实施例的剖视图。
具体实施方式
虽然本发明可以具有很多不同形式的实施例，但是在附图中示出了，并且这里将详细描述一个或多个具体实施例，应该理解，本公开应被看作本发明原理的示例，并且本公开并非意在将发明局限于所示出并描述的具体实施例。在以下描述中，相同标号被用于描述附图的若干视图中的相同、相似或相应部分。
本发明涉及具有两个被安装在反射器杯(reflector cup)中的堆叠式光生成器的发光器件，例如发光二极管(LED)或激光二极管。在一个实施例中，光生成器发出互补颜色，这些互补颜色混合，从而形成白光。
在图1中示出了本发明实施例的俯视图。参考图1，反射器杯104被形成在第一引线框或衬底102中。第二光生成器108被同轴安装在反射器杯中。第二光生成器108被安装在第一光生成器(在该视图中未示出)之上。电连接器110将第二光生成器108耦合到第二引线框116。在该示例性实施例中，电连接器110分别通过焊球120和122被附接到第二光生成器和第二引线框。在图2中示出了剖面2-2，并且将在下文中对其进行描述。
在反射器杯中堆叠光生成器的做法使来自光生成器的光的混合得到了改善。
图2是通过第一引线框或衬底102的部分视图。第一引线框或衬底102包含反射器杯或井104。第一光生成器106被安装在反射器杯104的底部上。第二光生成器108被安装在第一光生成器106上。电功率通过第一引线框或衬底102并且通过电连接器110被提供到第一和第二光生成器。电连接器110例如可以是耦合到第二引线框116的引线接合。第一和第二光生成器被电耦合，从而第二光生成器108经由第一光生成器106被电耦合到第一引线框或衬底102，并且第一光生成器106经由第二光生成器108和引线接合110被电耦合到第二引线框116。
第一光生成器106发出具有第一波长或颜色的光112。该光的第一部分112-1被直接辐射，而该光的第二部分112-2在被辐射前，从反射器杯104的表面被反射。第二光生成器108发出具有第二波长或颜色的光114。该光的第一部分114-1被直接辐射，而该光的第二部分114-2在被辐射前，从反射器杯104的表面被反射。
可以对反射器杯104的形状进行选择，以控制反射光(112-2和114-2)的空间分布。此外，可以对反射器杯104的形状进行选择，以控制第一光112和第二光114的混合。反射器杯例如可以被定形为圆锥体或抛物面。当使用抛物面时，第一和第二光生成器可以被放置在抛物面焦点的任意一侧。
在本发明的一个实施例中，第一和第二光生成器被选择，从而使第一光112和第二光114混合以形成白光。第一和第二光生成器的颜色可以根据C.I.E(国际照明委员会)比色表而被选择为二元互补物(binarycomplements)。例如，蓝色光生成器可以与琥珀色光生成器一起使用，青色光生成器可以与橙红色光生成器一起使用，或者绿色光生成器可以与红色光生成器一起使用。
光生成器106和108彼此靠近放置，以使第一光与第二光的混合最大化。这可以通过减小光生成器的厚度来实现。在一个实施例中，第一和第二光生成器与反射器杯104同轴对齐。
本领域普通技术人员将会意识到，可以堆叠一个或多个附加的光生成器。例如，可以将红色、绿色和蓝色光生成器堆叠在反射器杯中。
还将意识到，所堆叠的光生成器也可以与荧光粉材料一起使用。
虽然已经参考优选实施例具体示出并描述了本发明，但是本领域技术人员将会理解，在不脱离本发明的精神和范围的情况下，可以在形式和内容上对其进行各种改变。因此，本发明想要包含落入所附权利要求范围内的所有这些替换、修改和变化。

Claims (15)

1.一种用于生成可见光的器件，包括：
a)反射器杯；
b)安装在所述反射器杯中的第一光生成器，该第一光生成器可操作以发出具有第一颜色的光；以及
c)安装在所述反射器杯中，并位于所述第一光生成器之上的第二光生成器，所述第二光生成器可操作以发出具有第二颜色的光，所述具有第二颜色的光和所述具有第一颜色的光混合以生成所述可见光。
2.如权利要求1所述的用于生成可见光的器件，其中所述第一颜色和所述第二颜色是二元互补物，并且其中所述具有第一颜色的光和所述具有第二颜色的光混合以形成白光。
3.如权利要求1所述的用于生成可见光的器件，其中所述第一光生成器和所述第二光生成器与所述反射器杯同轴对齐。
4.如权利要求1所述的用于生成可见光的器件，其中所述第一光生成器电耦合到所述第二光生成器。
5.如权利要求4所述的用于生成可见光的器件，其中所述反射器杯被形成在第一引线框中，所述第一引线框电耦合到所述第一光生成器，并且所述用于生成可见光的器件还包括第二引线框，该第二引线框电耦合到所述第二光生成器。
6.如权利要求1所述的用于生成可见光的器件，其中所述反射器杯被定形，以使所述具有第一颜色的光与所述具有第二颜色的光的混合最大化。
7.如权利要求1所述的用于生成可见光的器件，其中所述第一和第二光生成器中的光生成器是发光二极管半导体晶片。
8.如权利要求1所述的用于生成可见光的器件，其中所述第一和第二光生成器中的光生成器是激光二极管。
9.一种封装光源的方法，包括：
a)在反射器杯中安装第一光生成器，从而使所述第一光生成器电耦合到所述反射器杯，其中所述第一光生成器可操作以发出具有第一颜色的光；以及
b)在所述第一光生成器之上安装第二光生成器，从而使所述第二光生成器电耦合到所述第一光生成器，其中所述第二光生成器可操作以发出具有第二颜色的光。
10.如权利要求9所述的方法，其中所述第二颜色与所述第一颜色互补。
11.如权利要求9所述的方法，还包括将电连接器耦合到所述第二光生成器。
12.如权利要求9所述的方法，还包括在所述第二光生成器上安装第三光生成器，从而使所述第二光生成器电耦合到所述第三光生成器，其中所述第三光生成器可操作以发出具有第三颜色的光。
13.如权利要求9所述的方法，其中所述具有第一颜色的光和所述具有第二颜色的光组合以形成白光。
14.如权利要求9所述的方法，其中所述第一和第二光生成器中的光生成器是发光二极管半导体晶片。
15.如权利要求9所述的方法，其中所述第一和第二光生成器中的光生成器是激光二极管。
CNB200510080448XA 2004-09-21 2005-07-01 堆叠式光源 Expired - Fee Related CN100541793C (zh)

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CN101740557B (zh) * 2008-11-06 2012-08-08 晶元光电股份有限公司 垂直型交流发光二极管

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CN102593324A (zh) * 2012-03-22 2012-07-18 青岛镭创光电技术有限公司 可与其他光源集成的led基座

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