CN1741716A - Method for producing multi-layer circuit board by scorifying thickened dielectric material of laser beam - Google Patents
Method for producing multi-layer circuit board by scorifying thickened dielectric material of laser beam Download PDFInfo
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- CN1741716A CN1741716A CN 200410057060 CN200410057060A CN1741716A CN 1741716 A CN1741716 A CN 1741716A CN 200410057060 CN200410057060 CN 200410057060 CN 200410057060 A CN200410057060 A CN 200410057060A CN 1741716 A CN1741716 A CN 1741716A
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- dielectric material
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- copper
- laser beam
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Abstract
A method for preparing multiplayer circuit board with dielectric material includes coating dielectric material on substrate with copper surface circuit, baking coated substrate for forming dielectric material layer on substrate by polymerization, pressing copper foil with back glue on dielectric material layer, forming hole position at connection point of copper foil to expose copper surface circuit on substrate, then forming top layer of copper circuit being connected through to copper surface circuit on substrate and being set on surface of hole position .
Description
Technical field
The invention belongs to method of manufacturing circuit board, particularly a kind of multilayer circuit board fabrication method of thunder laser beam scorifying thickened dielectric material.
Background technology
General circuit board only has the circuit of single face, and because design of electronic circuits becomes increasingly complex, if with existing single face circuit production, then the area of circuit board can be very big, so can't use in response to the big circuit of complexity.
Thereby the dealer is made the circuit board of single face into two-sided circuit board, and is able to circuit design is become the two sides, so as to dwindling the area of circuit board, uses with the circuit in response to complexity.
Existing again double-sided PCB is in the two sides of circuit board design circuit, and is provided with insulation board between the circuit of the two sides of circuit board.When if the partial circuit on two sides must connect conducting, usually when the plug-in mounting electronic component, after the pin of electronic component passed circuit board, the circuit in circuit component pin both sides welded, and the circuit that makes the circuit board two sides to connect connects conducting by pin; Or pass circuit board with stitch, and weld at the two ends of stitch, make circuit be able to conducting and connect.Yet the mode of this kind connection double-sided PCB is quite inconvenient, and will be at the pin of the two sides of circuit board welding circuit part, often be inconvenient to weld because of narrow space, and the speed of welding is very slow, and omits easily, so quite trouble inconvenience on circuit board manufacturing.
Moreover known double-layer circuit board only can be designed to the two sides circuit, and therefore, it is limited that it can reach the effect of dwindling board area.If for bigger more complicated circuit, also only can dwindle the area of half at most, and because of reserving the space of power supply road part pin connecting circuit, for big circuit, the area that must reserve more bigger, so can't effectively bring into play the purpose of dwindling the circuit board usable floor area.
Summary of the invention
The purpose of this invention is to provide a kind of multilayer circuit board fabrication method of making the thunder laser beam scorifying thickened dielectric material that simply, effectively dwindles board area.
The present invention includes following steps:
(a) on substrate, apply dielectric material with copper face circuit;
(b) again the substrate with copper face circuit that applies dielectric material is toasted, make dielectric material polymerization on substrate form dielectric materials layer;
(c) pressing has the Copper Foil of gum on dielectric materials layer;
(d) form the position, hole in the tie point position of Copper Foil again, the copper face circuit on the substrate is revealed;
(e) again in the surface of position, hole form with substrate on the upper strata copper circuit of copper face circuit turn-on.
Wherein:
Dielectric material is an epoxy resin.
For the dielectric material of Araldite is the dry film shape.
For the dielectric material of Araldite is ink-like.
The Kong Weiwei at Copper Foil tie point position becomes with the thunder laser beam scorification.
With copper face circuit turn-on upper strata copper circuit on the substrate be surface in the position, hole with metallization and electroplate, and form through chemical etching.
Because the present invention includes (a) applies dielectric material on the substrate with copper face circuit; (b) again the substrate with copper face circuit that applies dielectric material is toasted, make dielectric material polymerization on substrate form dielectric materials layer; (c) pressing has the Copper Foil of gum on dielectric materials layer; (d) form the position, hole in the tie point position of Copper Foil again, the copper face circuit on the substrate is revealed; (e) again in the surface of position, hole form with substrate on the upper strata copper circuit of copper face circuit turn-on.During manufacturing, exempted the trouble that connects two-tier circuit, and exempted headspace, thereby reached the purpose of dwindling board area; Moreover, owing to, can increase the distance between the copper face circuit that adds Copper Foil and substrate, can reduce the interference between the circuit by the thickness that thickens dielectric materials layer, reach the requirement of impedance Control.Not only make simply, and effectively dwindle board area, thereby reach purpose of the present invention.
Description of drawings
Fig. 1, for manufacturing process schematic diagram of the present invention.
Embodiment
As shown in Figure 1, the present invention comprises following steps:
(a) be coated on the substrate 1 with copper face circuit 11 with the dielectric material that is dry film or ink-like epoxy resin.
(b) again the substrate with copper face circuit 11 1 that applies dielectric material is toasted, make dielectric material polymerization on substrate 1 form dielectric materials layer 2.
(c) pressing has the Copper Foil 3 of gum 31 on dielectric materials layer 2.
(d) again in the tie point position of Copper Foil 3 with thunder laser beam scorification pore-forming position 32, the copper face circuit 11 on the substrate 1 is revealed.
(e) last, form upper strata copper circuit 4 again in the surface metalation and the plating of position, hole 32, and through chemical etching, make copper face circuit 11 conductings on upper strata copper circuit 4 and the substrate 1.
According to above-mentioned manufacture method, because copper face circuit 11 moulding in advance on the substrate 1, applying one deck again in type copper face circuit 11 is the dielectric material of epoxy resin, so that dielectric material polymerization on substrate 1 forms dielectric materials layer 2, pressing has the Copper Foil 3 of gum 31 on dielectric materials layer 2 then, the tie point position of presetting on Copper Foil 3 reveals the copper face circuit 11 on the substrate 1 with thunder laser beam scorification pore-forming position 32 again; At last, form upper strata copper circuit 4, make copper face circuit 11 conductings on upper strata copper circuit 4 and the substrate 1 again in the surface metalation and the plating of position, hole 32, and through chemical etching; Thereby exempted the trouble that connects two-tier circuit, and because of forming upper strata copper circuit 4 with surface metalation and plating, so exempted headspace, thus reach the purpose of dwindling board area.
Moreover, because by the thickness that thickens dielectric materials layer 2, can increase the distance between the copper face circuit 11 that adds Copper Foil 3 and substrate 1, so as to the interference between the reduction circuit, thereby reach the requirement of impedance Control.
Claims (6)
1, a kind of multilayer circuit board fabrication method of thunder laser beam scorifying thickened dielectric material is characterized in that it comprises the steps:
(a) on substrate, apply dielectric material with copper face circuit;
(b) again the substrate with copper face circuit that applies dielectric material is toasted, make dielectric material polymerization on substrate form dielectric materials layer;
(c) pressing has the Copper Foil of gum on dielectric materials layer;
(d) form the position, hole in the tie point position of Copper Foil again, the copper face circuit on the substrate is revealed;
(e) again in the surface of position, hole form with substrate on the upper strata copper circuit of copper face circuit turn-on.
2, the multilayer circuit board fabrication method of thunder laser beam scorifying thickened dielectric material according to claim 1 is characterized in that described dielectric material is an epoxy resin.
3, the multilayer circuit board fabrication method of thunder laser beam scorifying thickened dielectric material according to claim 1 and 2 is characterized in that describedly being the dry film shape for the dielectric material of Araldite.
4, the multilayer circuit board fabrication method of thunder laser beam scorifying thickened dielectric material according to claim 1 and 2 is characterized in that describedly being ink-like for the dielectric material of Araldite.
5, the multilayer circuit board fabrication method of thunder laser beam scorifying thickened dielectric material according to claim 1 is characterized in that the Kong Weiwei at described Copper Foil tie point position becomes with the thunder laser beam scorification.
6, the multilayer circuit board fabrication method of thunder laser beam scorifying thickened dielectric material according to claim 1, it is characterized in that on described and the substrate copper face circuit turn-on upper strata copper circuit in the surface of position, hole with metallization and electroplate, and form through chemical etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410057060 CN1741716A (en) | 2004-08-25 | 2004-08-25 | Method for producing multi-layer circuit board by scorifying thickened dielectric material of laser beam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410057060 CN1741716A (en) | 2004-08-25 | 2004-08-25 | Method for producing multi-layer circuit board by scorifying thickened dielectric material of laser beam |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1741716A true CN1741716A (en) | 2006-03-01 |
Family
ID=36093892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410057060 Pending CN1741716A (en) | 2004-08-25 | 2004-08-25 | Method for producing multi-layer circuit board by scorifying thickened dielectric material of laser beam |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1741716A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113435156A (en) * | 2021-07-08 | 2021-09-24 | 苏州悦谱半导体有限公司 | Method for adjusting copper surface data interval of printed circuit board and intelligently judging copper bridge supplement |
-
2004
- 2004-08-25 CN CN 200410057060 patent/CN1741716A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113435156A (en) * | 2021-07-08 | 2021-09-24 | 苏州悦谱半导体有限公司 | Method for adjusting copper surface data interval of printed circuit board and intelligently judging copper bridge supplement |
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