CN1740797A - Method and apparatus for taking and putting electronic elements waiting for measurement - Google Patents
Method and apparatus for taking and putting electronic elements waiting for measurement Download PDFInfo
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- CN1740797A CN1740797A CN 200410068314 CN200410068314A CN1740797A CN 1740797 A CN1740797 A CN 1740797A CN 200410068314 CN200410068314 CN 200410068314 CN 200410068314 A CN200410068314 A CN 200410068314A CN 1740797 A CN1740797 A CN 1740797A
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Abstract
The present invention relates to a method for taking out and placing electronic element to be tested and its equipment. Said equipment includes an adsorption device, a base seat and an air-exhausting device. Said invention also provides its working principle and the concrete steps of said method.
Description
Technical field
The present invention particularly produces the method and apparatus of the taking and putting measured electronic elements of two stage compression relevant for a kind of method and apparatus of taking and putting measured electronic elements relevant for the elastic device with two kinds of different elasticity coefficient.
Background technology
Electronic component needs just can determine whether the function that can reach default through test after manufacturing is finished usually.When test, normally electronic component by the gross is positioned in the pallet (tray) of tester table (tester), by the fetching device on the tester table (handler) with one or several electronic component takings to shuttle device (shuttle means), then measured electronic elements is transported to the test section by the shuttle device, fetching device by the test section picks up electronic component again, move socket (socket) again to test, and after test is finished, electronic component is returned the shuttle device transport tray zone back, according to test result electronic component is put into qualified pallet or underproof pallet again.
Traditionally, by fetching device with a soft suction nozzle, the upper surface (being even curface) that adsorbs the measured electronic elements of finishing encapsulation in the vacsorb mode, and then after the electronic component that picks up moved on to tester table, do to contact with calibrating terminal (pogo pins) in the socket once to press, so that carry out the test of electronic component with having the lower surface of multiterminal (pads) in the electronic component.For cooperating aforesaid test process, the conditional electronic element concentrates on lower surface with terminal in design usually, and keeps upper surface smooth.Generally speaking, quite accurate in the configuration of each terminal of electronic component, but because the degree of accuracy of electronic component when encapsulation might be not enough, make the in uneven thickness of electronic component, thereby cause electronic component in the process that is adsorbed, may guarantee upper surface maintenance level, and lower surface there is the error on the vertical angle.
For solving such problem, device one spring assembly on fetching device usually, the elasticity of utilizing spring pushes away the lower surface of measured electronic elements flat with the socket on the applying tester table.Simultaneously, for guaranteeing that electronic component can not cause the skew of level because of rotation or the changing of the relative positions in when absorption, therefore one group of positioning guide plate (floating site) can be installed around adsorption head, allow electronics to be measured unit when being adsorbed, can slip into the zone that positioning guide plate surrounds, measured electronic elements is limited in a fixed position.
Shown in Figure 1A, fetching device 10 includes adsorption head 12, positioning guide plate 14 and spring assembly 16.Fetching device 10 utilizes the vacuum suction mode, produces suction with measured electronic elements 18 absorption by adsorption head 12, and measured electronic elements 18 can be adsorbed and slip into positioning guide plate 14 and be fixed in the ad-hoc location, shown in Figure 1B.In addition, spring assembly 16 can be when measured electronic elements 18 be pressed down, and the pressure of sharing out equally measured electronic elements 18 surfaces lowers the impaired situation of terminal with as buffering.
In addition, measured electronic elements 18 is when slipping into positioning guide plate 14, may produce crooked situation, therefore the adsorption head 12 among Figure 1B be a kind of soft adsorption head, so after measured electronic elements 18 is being attracted, Yi Bian cause when slipping into positioning guide plate 14 earlier because of stressed inequality, shown in Fig. 1 C, soft adsorption head 12 can produce the deformation measured electronic elements 18 of fitting because of having elasticity, and then other of measured electronic elements 18 partly evened up, shown in Figure 1B.Therefore, positioning guide plate is used for limiting to the scope of electronic component need reserve the space bigger slightly than measured electronic elements 18, avoiding when the absorption, make owing to the space is too small measured electronic elements 18 and positioning guide plate 14 between the excessive friction of generation block or crooked.Yet, now, along with the terminals of electronic components number rolls up, so require more and more higher to the precision between each terminal, cause the tolerance that positioning guide plate 14 can headspaces also more and more littler, it is also more and more difficult also therefore to cause moment of absorption to allow measured electronic elements 18 slip into positioning guide plate 14.
In addition, for cooperating the needs of product diversification, existing many electronic components need upper surface and the lower surface of while in encapsulation, assemble terminal or other special accessory simultaneously, for example beam coupling device 180 (Charge Coupled Device; CCD), its usually at surface configuration one deck photographic layer 184 receiving light, and contact with the external world, shown in Fig. 1 D at another surface configuration terminal 182.Yet when test, needed testing light source needs to be sent by tester table, therefore need be with photographic layer as lower surface, and terminal 182 is as upper surface.At this moment, shown in Fig. 1 E, fetching device 10 also needs assembling and upper surface terminal 182 corresponding calibrating terminals (pogo pins) 102 except adsorption head 12 originally, these calibrating terminals 102 are come to contact to pass on the test signal with tester table by other contact again.In view of the above, when measured electronic elements 18 is adsorbed, just might be when slipping into positioning guide plate 14, because of drawing the deviation of angle, make the terminal 182 of upper surface collide with calibrating terminal 102, cause calibrating terminal 102 impaired or make adsorption head 12 vacuum breakers and cause measured electronic elements 18 to drop, shown in Fig. 1 F.
Therefore how to allow the two sides all assemble the electronic component 18 of accessory, picking and placeing Shi Buhui because the terminal crash tests terminal of upper surface, and can allow measured electronic elements slip into positioning guide plate more accurately smoothly, avoid causing usefulness low, be the big problem of electronic component on testing now because of picking and placeing failure.
Summary of the invention
Based on aforesaid motivation, the present invention proposes a kind of method and apparatus of taking and putting measured electronic elements, to be used for avoiding measured electronic elements in the prior art when slipping into positioning guide plate, because of the crooked terminal of upper surface that makes strikes calibrating terminal, and then cause terminal or calibrating terminal is impaired or measured electronic elements drops problem.
A fundamental purpose of the present invention be for fear of fetching device in adsorption process, because of colliding calibrating terminal, the terminal on the measured electronic elements upper surface cause terminal impaired or cause measured electronic elements to drop, therefore the present invention is when electronic component is adsorbed, allow terminal and calibrating terminal keep a segment distance, avoid the problem of colliding.
For reaching above-mentioned purpose, the device of a kind of taking and putting measured electronic elements of the present invention is characterized in that, comprises:
One adsorbent equipment, this adsorbent equipment is located in the airtight space, and it comprises at least one suction pipe, and an end of this suction pipe is used for adsorbing a measured electronic elements, the other end then is communicated with this airtight space, and the surface that this measured electronic elements is adsorbed comprises a plurality of terminals;
One pedestal, this pedestal comprises this airtight space, a location guide plate and an a plurality of calibrating terminal, the both ends open of this airtight space contacts to form this airtight space with a getter device and this adsorbent equipment respectively, wherein this adsorbent equipment is limited in moving between the primary importance in this airtight space and a second place, and keeps airtight with this airtight space and contact; And
One exhaust apparatus, produce a suction in order to bleed, respectively this suction pipe adsorbs this measured electronic elements by this suction, after this measured electronic elements is adsorbed, this adsorbent equipment of related pulling and this measured electronic elements are to a fixed position that this positioning guide plate limited, and after this suction disappeared, this airtight space recovered this adsorbent equipment to this primary importance;
Wherein, this getter device produces a thrust to blow, and is used for recovering compressed airtight space, and this terminal and this calibrating terminal keep a segment distance when this adsorbent equipment is moved to this second place.
Another fundamental purpose of the present invention provides a kind of method of taking and putting measured electronic elements, this method is in order to allow measured electronic elements can slip into the more and more littler positioning guide plate of error range more accurately, suction when therefore the present invention utilizes absorption causes the contraction of phase one, to draw in positioning guide plate after the electronic component absorption, when avoiding measured electronic elements to be adsorbed, the situation that causes a deviation because of the reacting force that touches location guiding.
For reaching above-mentioned purpose, the method for a kind of taking and putting measured electronic elements of the present invention is characterized in that, comprises:
Form one and attract strength, make an adsorbent equipment adsorb a measured electronic elements by the getter device suction that is produced of bleeding, and then form this attraction strength, and comprise a plurality of terminals on the surface that is adsorbed of this measured electronic elements by an airtight space;
Form first section contraction, this adsorbent equipment is moved in this airtight space,, this measured electronic elements is imported in the fixed position to form this first section contraction by this attraction strength;
Form second section contraction, make a plurality of terminals of this measured electronic elements form by amount of pressure once and contact, to test with corresponding a plurality of calibrating terminals; And
Recover this airtight space.
In sum, the present invention utilizes the elastic device of two kinds of different elasticity coefficient to produce two stage compression, wherein the compression with the phase one moves to positioning guide plate (floating site) with adsorbed measured electronic elements, in order to the fixing position of measured electronic elements, this moment, the terminal (pads) of measured electronic elements did not contact with calibrating terminal (pogo pins), therefore the terminal and the calibrating terminal of measured electronic elements can not collide or conflict mutually, and make adsorption head by vacuum breaker and the problem that causes measured electronic elements to drop.In addition, when measured electronic elements is moved to calibrating terminal on the tester table, makes the terminal of measured electronic elements contact with second section compression again and finish test with calibrating terminal.After test finishes, discharge the compression of subordinate phase, make the terminal of measured electronic elements separate with calibrating terminal, again measured electronic elements is moved to tray district vacuum breaker and discharge, also discharge the compression of phase one simultaneously.
Description of drawings
The present invention is to incite somebody to action easier manifesting after following accompanying drawing of reference and specific embodiment are relatively with respect to the advantage and the benefit of prior art, wherein:
Figure 1A to Fig. 1 F is the device synoptic diagram of prior art;
Fig. 2 A to Fig. 2 D is the device synoptic diagram of a specific embodiment of the present invention
Fig. 3 is another device synoptic diagram of specific embodiments of the invention; And
Fig. 4 is the schematic flow sheet of another specific embodiment of the present invention.
Symbol description among the figure:
10,100 fetching devices
102 calibrating terminals
12 adsorption heads
14 positioning guide plates
16 elastic devices
18 electronic components
180 CCD
182 terminals
184 photographic layers
22 adsorbent equipments
222 suction pipes
224 links
24 pedestals
242 airtight spaces
244 positioning guide plates
246 calibrating terminals
26 getter devices
28 electronic components
282 terminals
30 first elastic devices
32 second elastic devices
Embodiment
Some embodiments of the invention are described in detail as follows.Yet except describing in detail, the present invention can also be widely implements at other embodiment, and scope of the present invention do not limited, and it is as the criterion with described claim.
Moreover for clearer description being provided and being more readily understood the present invention, each several part is not drawn according to its relative size in the accompanying drawing, and some size is compared with other scale dependent and exaggerated; Incoherent detail section is not drawn fully yet, succinct in the hope of accompanying drawing.
The present invention utilizes one or more suction pipes to come stick electronic components, each suction pipe is fixed on the adsorbent equipment, and a wherein end of each suction pipe is used to stick electronic components, and the other end leads to an airtight space, and utilize getter device (for example: pump) airtight space is bled to form vacuum, make each suction pipe produce suction with the absorption measured electronic elements.Because after measured electronic elements was adsorbed, each suction pipe formed airtight, it is airtight to make that airtight space also forms, and then compression airtight space and form first section contraction, and measured electronic elements is drawn in the scope that positioning guide plate limits.Therefore measured electronic elements is after being adsorbed earlier, in the scope that just is drawn into positioning guide plate and is limited, so, unbalance stress causes crooked situation when having avoided because of absorption, in the scope that simultaneously also allows measured electronic elements slip into positioning guide plate more accurately to be limited, in the scope that is also meaning positioning guide plate and limited, the space that is used for reserving can be littler.In addition, many terminals may gather on the surface that measured electronic elements is used for being adsorbed, available a plurality of suction pipe disposes on the stick electronic components surface locating of terminal, be used for sharing the suction of stick electronic components, thus the present invention the electronic component that can adsorb can not limit to some extent because of the terminal position that electronic component is adsorbed the surface.In addition, when finishing the test of measured electronic elements, getter device is promptly no longer air-breathing, and needs airtight space is reverted to size (being so-called vacuum breaker) originally, can utilize the air blowing of getter device to reach this moment, or utilize an elastic device (as spring or elastic foam) to recover.
In view of the above, the fetching device 100 that a specific embodiment of the present invention is a kind of measured electronic elements, shown in Fig. 2 A, it includes a pedestal 24, an adsorbent equipment 22 and a getter device 26.Adsorbent equipment 22 is arranged in an airtight space 242 of pedestal 24, includes one or a plurality of suction pipe 222 respectively, and this suction pipe 222 can be the pipe that a soft materials or has Telescopic.When getter device 26 carries out when air-breathing, can make airtight space 242 and suction pipe 222 form negative pressure, thereby produce the surface that attractive force is adsorbed measured electronic elements 28 with terminal.Finish the absorption of measured electronic elements 28 when suction pipe 222 after, can further make airtight space 242 produce bigger negative pressure, so can make whole adsorbent equipment 22 and measured electronic elements 28 be attracted to the top of airtight space 242 together, finish first section contraction.
In addition, dispose positioning guide plate 244, a plurality of calibrating terminal 246 and an airtight space 242 on the pedestal 24.One first opening of airtight space 242 is used for connecting a getter device 26, another second opening is used for holding adsorbent equipment 22, be airtight the contact between adsorbent equipment 22 and airtight space 242, that is adsorbent equipment 22 and airtight space 242 between spacing very little, gas is difficult or can not therefrom reveal.In addition, a link 224 of adsorbent equipment 22 can move in airtight space 242, but is limited in one " x " scope in move, that is adsorbent equipment 22 only can be movable within the specific limits.Adsorbent equipment 22 is placed in when getter device 26 is not bled near absorption end (being defined as primary importance), when getter device 26 is bled, gas only can the self-priming attaching be put 22 suction pipe 222 and is entered, and at each suction pipe 222 because of absorption measured electronic elements 28 when being plugged, can make form in the airtight space 242 one by first opening to absorption hold airtight space.Because constantly air-breathing, airtight space thereby be compressed makes adsorbent equipment 22 be moved to the second place (being the top of airtight space 242) of getter device 26 by primary importance, shown in Fig. 2 B.Because the displacement of first section contraction is restricted to " x ", so can by to " x " the suitable design and the control of displacement, make terminal 282 and calibrating terminal 246 maintenances one segment distance on the measured electronic elements 28, avoid the problem of colliding.
Moreover, in the adsorbent equipment 22 of the present invention, more comprising first elastic device 30 with first elasticity coefficient, this first elastic device 30 can be formed by spring or elastic foam.Finish the absorption of measured electronic elements 28 when suction pipe 222 after, can make whole adsorbent equipment 22 and measured electronic elements 28 be attracted to the top (being the second place) of airtight space 242 together, to finish first section contraction.Because first elastic device 30 has the effect that absorbs stress, absorb the pressure that first section contraction produced except that can be used as a snubber assembly, to reduce outside the suffered stress of measured electronic elements 28, after also can be used to adjust measured electronic elements 28 and being adsorbed, the attitude of maintenance level, so that the distance between the terminal 282 of control measured electronic elements 28 and calibrating terminal 246, so, can avoid terminal 282 on the measured electronic elements 28 when first section is shunk, direct collision is to calibrating terminal 246, shown in Fig. 2 C.
Above-mentioned fetching device 10 is adsorbed to suction pipe 222 at measured electronic elements 28, and is pulled to one section of second opening again " x " shift length after, at this moment, measured electronic elements 28 has been imported in the scope that positioning guide plate 244 limited accurately.Then, when measured electronic elements 28 is moved to a socket position of tester table when (not showing) in figure, can produce one second section contraction by the action that presses down that tester table provided, measured electronic elements 28 is engaged with socket, simultaneously when this presses down strength greater than this first elasticity coefficient, can further recompress first elastic device 30, allow terminal 282 contact to test, shown in Fig. 2 D with calibrating terminal 246.Same, because first elastic device 30 has the effect that absorbs stress, therefore can be used as a snubber assembly and absorb the pressure that second section contraction produced, make terminal 282 finish with the strength that relaxes and contact, can avoid second section excessive contraction strength to cause the damage of measured electronic elements 28 or calibrating terminal 246 with calibrating terminal 246.
At last, after measured electronic elements 28 was finished test, tester table can stop this strength that presses down, and the strength of drawing on one is provided, so that measured electronic elements 28 breaks away from socket.At this moment, first elastic device 30 also can separate terminal 282 simultaneously with calibrating terminal 246.Then, getter device 26 is blown (being vacuum breaker) and is allowed measured electronic elements 28 fall in the pallet.Because behind the vacuum breaker, getter device 26 allows gas flow into airtight space 242, make the air pressure of airtight space 242 equal outside air pressure, make adsorbent equipment 22 can drop to primary importance.
In addition, in order to determine that adsorbent equipment 22 can be retracted into primary importance accurately, so that can keep the distance of 28 of suction pipe 222 and measured electronic elements, to guarantee that the promptly fixed attractive force of adsorbent equipment 22 can effectively be adsorbed onto measured electronic elements 28, the present invention further proposes another embodiment, as shown in Figure 3.In the present embodiment, in the airtight space 242 of previous fetching device 100, insert second elastic device 32 of concrete second elasticity coefficient, utilize this second elastic device 32 to control the position of adsorbent equipment 22 in airtight channel, wherein second elasticity coefficient of second elastic device 32 must be less than first elasticity coefficient of first elastic device 30, when so just can make the suction of first section contraction that getter device 26 produced compress second elastic device 32, enough do not allow first elastic device 30 shrink, and make terminal 282 and calibrating terminal 246 keep one apart from and do not contact.And after measured electronic elements 28 is finished test back and vacuum breaker, getter device 26 allows air to flow into airtight space 242, make the air pressure of airtight space 242 equal outside air pressure, unfolding of second elasticity coefficient that this moment, adsorbent equipment 22 can be by second elastic device 32, and getter device 26 is pressed to primary importance.
In addition, above-mentioned first elastic device 30 and second elastic device 32 can be made of one or more flexible member, and as constituting with circumferential collar, foam or spring, the present invention is not limited kind and the quantity that constitutes elastic device.
In view of the above, comprehensive above-mentioned announcement, the present invention proposes a kind of specific embodiment of taking and putting measured electronic elements method, as shown in Figure 4.At first, as step 410, in a kind of device of taking and putting measured electronic elements, adsorb a measured electronic elements 28 by a getter device 26 suction that is produced of bleeding, so that an airtight space 242 forms an attractive force, the device of this taking and putting measured electronic elements has been specified in last embodiment, is not described in detail in this.Next, as described in step 420, produce the strength of first section contraction by airtight space 242 formed attractive forces, in the fixed position that airtight space 242 sealings are also limited measured electronic elements 28 importing positioning guide plates 244 simultaneously, wherein calibrating terminal 246 keeps not contacting with the terminal 282 of measured electronic elements.Then, as described in step 430, the strength that presses down that is imposed on by fetching device 100 forms second section contraction, so that finishing with calibrating terminal 246, the terminal 282 on the measured electronic elements 28 contacts, to test, wherein more be used as buffering, so that the terminal 282 on the measured electronic elements 28 can suitable contacting with calibrating terminal 246 by one first elastic device 30.At last, as described in step 440, wait to discharge measured electronic elements 28 after, airtight space 242 is wherein recovered in the position of recovering airtight space 242, can further guarantee that by one second elastic device 32 airtight space 242 positively returns to suitable position.
The above is preferred embodiment of the present invention only, is not in order to limit the right of applying for a patent of the present invention; Simultaneously above description should be understood and be implemented for the special personage who knows the present technique field, so other does not break away from the equivalence of being finished under the disclosed spirit and change or modification, all should be included in the described claim scope.
Claims (10)
1. the device of a taking and putting measured electronic elements is characterized in that, comprises:
One adsorbent equipment, this adsorbent equipment is located in the airtight space, and it comprises at least one suction pipe, and an end of this suction pipe is used for adsorbing a measured electronic elements, the other end then is communicated with this airtight space, and the surface that this measured electronic elements is adsorbed comprises a plurality of terminals;
One pedestal, this pedestal comprises this airtight space, a location guide plate and an a plurality of calibrating terminal, the both ends open of this airtight space contacts to form this airtight space with a getter device and this adsorbent equipment respectively, wherein this adsorbent equipment is limited in moving between the primary importance in this airtight space and a second place, and keeps airtight with this airtight space and contact; And
One exhaust apparatus, produce a suction in order to bleed, respectively this suction pipe adsorbs this measured electronic elements by this suction, after this measured electronic elements is adsorbed, this adsorbent equipment of related pulling and this measured electronic elements are to a fixed position that this positioning guide plate limited, and after this suction disappeared, this airtight space recovered this adsorbent equipment to this primary importance;
Wherein, this getter device produces a thrust to blow, and is used for recovering compressed airtight space, and this terminal and this calibrating terminal keep a segment distance when this adsorbent equipment is moved to this second place.
2. the device of taking and putting measured electronic elements as claimed in claim 1, it is characterized in that, this adsorbent equipment more comprises one first elastic device with first elasticity coefficient, this first elastic device combines with this suction pipe, when this first elastic device when this adsorbent equipment is moved to this second place, by this first elasticity coefficient of this first elastic device control this terminal and this calibrating terminal between distance, so that this terminal does not contact with this calibrating terminal, and when this first elastic device during, because of the contraction of this first elastic device makes this terminal contact with this calibrating terminal in the pressure that is subjected to greater than this first elasticity coefficient.
3. the device of taking and putting measured electronic elements as claimed in claim 2 is characterized in that, this first elastic device is a spring or an elastic foam.
4. the device of taking and putting measured electronic elements as claimed in claim 1, it is characterized in that, this airtight space more comprises one second elastic device with one second elasticity coefficient, be positioned at position between this primary importance and this second place in order to control this adsorbent equipment, when this second elastic device after this measured electronic elements is adsorbed, be subjected to this suction and compress, and after this suction disappeared, this second elastic device was unfolded to recover compressed airtight space.
5. the device of taking and putting measured electronic elements as claimed in claim 4 is characterized in that, above-mentioned this second elastic device is a spring or an elastic foam.
6. as the device of claim 2 or 4 described taking and putting measured electronic elements, it is characterized in that this second elasticity coefficient of this second elastic device is less than this first elasticity coefficient of this first elastic device.
7. the method for a taking and putting measured electronic elements is characterized in that, comprises:
Form one and attract strength, make an adsorbent equipment adsorb a measured electronic elements by the getter device suction that is produced of bleeding, and then form this attraction strength, and comprise a plurality of terminals on the surface that is adsorbed of this measured electronic elements by an airtight space;
Form first section contraction, this adsorbent equipment is moved in this airtight space,, this measured electronic elements is imported in the fixed position to form this first section contraction by this attraction strength;
Form second section contraction, make a plurality of terminals of this measured electronic elements form by amount of pressure once and contact, to test with corresponding a plurality of calibrating terminals; And recover this airtight space.
8. the method for taking and putting measured electronic elements as claimed in claim 7, it is characterized in that, more comprise one first elastic device with first elasticity coefficient in this adsorbent equipment, and this first elastic device is made up of a spring or an elastic foam, after forming this first section contraction, a plurality of terminals of this measured electronic elements are not contacted with corresponding these a plurality of calibrating terminals.
9. the method for taking and putting measured electronic elements as claimed in claim 7 is characterized in that, the strength that presses down of this second section contraction is provided by a tester table, and this presses down the elasticity coefficient of strength greater than this first elastic device.
10. the method for taking and putting measured electronic elements as claimed in claim 7, it is characterized in that, this airtight space more comprises one second elastic device with second elasticity coefficient, and this second elastic device is made up of a spring or an elastic foam, after this measured electronic elements is adsorbed, be subjected to this attraction strength and compress, and after this attracts strength to disappear, unfold to recover compressed airtight space by second elasticity coefficient of this second elastic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100683141A CN100357743C (en) | 2004-08-27 | 2004-08-27 | Method and apparatus for taking and putting electronic elements waiting for measurement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100683141A CN100357743C (en) | 2004-08-27 | 2004-08-27 | Method and apparatus for taking and putting electronic elements waiting for measurement |
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| Publication Number | Publication Date |
|---|---|
| CN1740797A true CN1740797A (en) | 2006-03-01 |
| CN100357743C CN100357743C (en) | 2007-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100683141A Expired - Fee Related CN100357743C (en) | 2004-08-27 | 2004-08-27 | Method and apparatus for taking and putting electronic elements waiting for measurement |
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| CN101259920B (en) * | 2007-03-05 | 2011-11-09 | 京元电子股份有限公司 | Chip suction nozzle structure with elastic pad and manufacturing method thereof |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002082144A (en) * | 2000-09-06 | 2002-03-22 | Toshiba Microelectronics Corp | Measuring method for electrical characteristics of semiconductor package, and test handler for the same |
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| JP2003004800A (en) * | 2001-06-22 | 2003-01-08 | Ando Electric Co Ltd | Device carrier and autohandler |
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| CN1215545C (en) * | 2002-03-29 | 2005-08-17 | 株式会社东芝 | Semiconductor test device, contacting substrate for semiconductor device testing, semiconductor device testing method, semiconductor device and manufacturing method |
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2004
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| TWI619952B (en) * | 2015-11-30 | 2018-04-01 | Isc股份有限公司 | Pusher apparatus |
| CN108427043A (en) * | 2017-02-13 | 2018-08-21 | 华邦电子股份有限公司 | Rotary type tower test equipment and its rotary type tower test method |
| CN108427043B (en) * | 2017-02-13 | 2020-07-03 | 华邦电子股份有限公司 | Turret type test equipment and turret type test method thereof |
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| Publication number | Publication date |
|---|---|
| CN100357743C (en) | 2007-12-26 |
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