CN1734804A - 发光二极管及其制造方法 - Google Patents
发光二极管及其制造方法 Download PDFInfo
- Publication number
- CN1734804A CN1734804A CN200510090208.8A CN200510090208A CN1734804A CN 1734804 A CN1734804 A CN 1734804A CN 200510090208 A CN200510090208 A CN 200510090208A CN 1734804 A CN1734804 A CN 1734804A
- Authority
- CN
- China
- Prior art keywords
- light
- reed
- support component
- emitting diode
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
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- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 19
- 239000000470 constituent Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000005452 bending Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 238000003754 machining Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 244000273256 Phragmites communis Species 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 241000278713 Theora Species 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004233084 | 2004-08-10 | ||
JP2004233084A JP2006054234A (ja) | 2004-08-10 | 2004-08-10 | 発光ダイオード及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1734804A true CN1734804A (zh) | 2006-02-15 |
CN100505340C CN100505340C (zh) | 2009-06-24 |
Family
ID=35520634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200510090208.8A Active CN100505340C (zh) | 2004-08-10 | 2005-08-10 | 发光二极管及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7619260B2 (zh) |
EP (1) | EP1633006A3 (zh) |
JP (1) | JP2006054234A (zh) |
CN (1) | CN100505340C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103378262A (zh) * | 2012-04-26 | 2013-10-30 | 展晶科技(深圳)有限公司 | 发光二极管及其封装方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008258530A (ja) * | 2007-04-09 | 2008-10-23 | Rohm Co Ltd | 半導体発光装置 |
EP3138734B1 (en) | 2015-09-03 | 2020-04-15 | SMR Patents S.à.r.l. | Light module, light assembly and rear view device for a vehicle |
JP2015012212A (ja) * | 2013-07-01 | 2015-01-19 | 株式会社ディスコ | 発光チップ |
JP6467206B2 (ja) * | 2014-01-28 | 2019-02-06 | 株式会社小糸製作所 | 光源ユニット |
TWI559577B (zh) | 2014-11-06 | 2016-11-21 | Sinogerman Entpr Co Ltd | SMT type LED package element, its manufacturing method and light emitting device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0685328A (ja) * | 1992-08-28 | 1994-03-25 | Stanley Electric Co Ltd | 表面実装型ledの製造方法 |
JP3113104B2 (ja) * | 1992-11-20 | 2000-11-27 | ローム株式会社 | 半導体装置の製造方法 |
JPH0794008A (ja) | 1993-09-24 | 1995-04-07 | Chiyatani Sangyo Kk | 面照明装置 |
JP3331720B2 (ja) | 1994-01-14 | 2002-10-07 | 松下電器産業株式会社 | 発光ダイオード |
US6710373B2 (en) * | 1999-09-27 | 2004-03-23 | Shih-Yi Wang | Means for mounting photoelectric sensing elements, light emitting diodes, or the like |
US6552368B2 (en) * | 2000-09-29 | 2003-04-22 | Omron Corporation | Light emission device |
US6561680B1 (en) * | 2000-11-14 | 2003-05-13 | Kelvin Shih | Light emitting diode with thermally conductive structure |
US20020070387A1 (en) * | 2000-12-07 | 2002-06-13 | Bily Wang | Focusing cup on a folded frame for surface mount optoelectric semiconductor package |
JP2002246650A (ja) * | 2001-02-13 | 2002-08-30 | Agilent Technologies Japan Ltd | 発光ダイオード及びその製造方法 |
JP2003008070A (ja) | 2001-06-22 | 2003-01-10 | Toyoda Gosei Co Ltd | 発光ダイオード |
DE60318611T2 (de) * | 2002-11-05 | 2008-06-05 | Matsushita Electric Industrial Co., Ltd., Kadoma | Lichtemittierende Diode |
JP4254214B2 (ja) | 2002-11-27 | 2009-04-15 | 日亜化学工業株式会社 | 半導体装置およびその製造方法 |
US7420271B2 (en) * | 2003-02-20 | 2008-09-02 | Tsung Hsin Chen | Heat conductivity and brightness enhancing structure for light-emitting diode |
TW560813U (en) * | 2003-03-06 | 2003-11-01 | Shang-Hua You | Improved LED seat |
-
2004
- 2004-08-10 JP JP2004233084A patent/JP2006054234A/ja active Pending
-
2005
- 2005-07-22 EP EP05106750A patent/EP1633006A3/en not_active Withdrawn
- 2005-07-25 US US11/188,413 patent/US7619260B2/en active Active
- 2005-08-10 CN CN200510090208.8A patent/CN100505340C/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103378262A (zh) * | 2012-04-26 | 2013-10-30 | 展晶科技(深圳)有限公司 | 发光二极管及其封装方法 |
CN103378262B (zh) * | 2012-04-26 | 2017-02-01 | 青岛青扬众创新能源科技有限公司 | 发光二极管及其封装方法 |
Also Published As
Publication number | Publication date |
---|---|
US7619260B2 (en) | 2009-11-17 |
EP1633006A2 (en) | 2006-03-08 |
JP2006054234A (ja) | 2006-02-23 |
EP1633006A3 (en) | 2008-07-23 |
US20060033117A1 (en) | 2006-02-16 |
CN100505340C (zh) | 2009-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: AVAGO TECHNOLOGIES GENERAL IP Free format text: FORMER OWNER: ANJELEN SCI. + TECH. INC. Effective date: 20061117 Owner name: ANHUA HIGH SCIENCE ECBU IP (SINGAPORE)PRIVATE CO. Free format text: FORMER OWNER: AVAGO TECHNOLOGIES GENERAL IP Effective date: 20061117 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20061117 Address after: Singapore Singapore Applicant after: ANHUA HIGH TECHNOLOGY ECBUIP (SINGAPORE) PRIVATE Ltd. Address before: Singapore Singapore Applicant before: Avago Technologies General IP (Singapore) Pte. Ltd. Effective date of registration: 20061117 Address after: Singapore Singapore Applicant after: Avago Technologies General IP (Singapore) Pte. Ltd. Address before: California, USA Applicant before: AGILENT TECHNOLOGIES, Inc. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: YINGDI CO., LTD. Effective date: 20130621 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130621 Address after: Seoul, South Kerean Patentee after: INTELLECTUAL DISCOVERY Co.,Ltd. Address before: Singapore Singapore Patentee before: Annwa hi tech GeneralIP (Singapore) Pte. Ltd. Effective date of registration: 20130621 Address after: Singapore Singapore Patentee after: Annwa hi tech GeneralIP (Singapore) Pte. Ltd. Address before: Singapore Singapore Patentee before: ANHUA HIGH TECHNOLOGY ECBUIP (SINGAPORE) PRIVATE Ltd. |