CN1734762A

CN1734762A - Matrix type LED and manufacturing method thereof

Info

Publication number: CN1734762A
Application number: CN 200510087759
Authority: CN
Inventors: 陈炎成; 曾庆霖; 郭云涛; 张铭利
Original assignee: Bright Led Electronics Corp
Current assignee: Bright Led Electronics Corp
Priority date: 2005-08-08
Filing date: 2005-08-08
Publication date: 2006-02-15
Anticipated expiration: 2025-08-08
Also published as: CN100409440C

Abstract

The array-type light-emitting diode comprises a base plate, a circuit layer, a reflection cap, a plurality of wafers of light-emitting diode, at least a positive/negative connection foot, and a lens mould group. The corresponding manufacture method comprises, first, providing base plate; then, arranging circuit with positive/negative electrodes on base; arranging reflection cap with a plurality of array-type openings on circuit layer; following, arranging every light-emitting diode on opening with positive/negative connection foot connected with corresponding electrical property; then, arranging the said foot on base plate with foot connected with positive/negative electrode of circuit layer; finally, arranging lens mould group on reflection cap to close over the light-emitting diode wafer.

Description

Matrix type LED and manufacture method thereof

Technical field:

The invention relates to a kind of matrix type LED and preparation method thereof, it is convenient to the assembling use, to improve the efficient that assembling is used.

Background technology:

Electric consumption on lighting power in the whole world is about 40% of total electricity consumption now, this shows the demand of people for illumination, yet electric power still need be developed other prior purposes except illumination, therefore how the exploiting economy power supply of environmental protection effectively again is the science and technology that the whole world is all craved for; But before this science and technology does not break through as yet, probably have only electrical energy saving to be only important effectively electricity consumption measure again.In recent years, the rapid technological improvement of light-emittingdiode, the following lighting apparatus that replaces now with light-emittingdiode is not a dream, the present light-emittingdiode made from the optoelectronic semiconductor technology, volume is little, power consumption is low, the life-span is long, and following its will become the lighting source that has power saving and environmental protection notion concurrently, now in order to improve irradiation brightness and the irradiated area that uses light-emittingdiode, so plural light-emittingdiode can be arranged as one, arrange as matrix form.

Current matrix formula light-emittingdiode, manufacturing process is provided with plural opening at a substrate earlier, one LED Chips for Communication so is set in each opening, each LED Chips for Communication just/negative pole is a mode of utilizing routing, and be connected to substrate set just/negative electrode, yet when matrix type LED is set to control circuit board, for example: when using matrix type LED as lighting apparatus, promptly must make by the mode of bonding wire matrix type LED just/negative pole is electrically connected at control circuit board, because of welding manner expends time in, so have the low problem of installation effectiveness, and the matrix type LED of commonly using is difficult for heat radiation, so the high heat that matrix type LED is produced when using is difficult for preventing, cause light-emittingdiode to reduce useful life easily.

Therefore, the invention provides a kind of matrix type LED and preparation method thereof, is to can be easily installed in control circuit board, improves installation effectiveness, and can improve radiating efficiency, and then prolong the useful life of matrix type LED, to address the above problem.

Summary of the invention:

Main purpose of the present invention, be to provide a kind of matrix type LED and preparation method thereof, its be by with each LED Chips for Communication just/negative pole be electrically connected at circuit layer just/negative electrode, and just/negative electrode with just/the negative pole pin electrically connects, for being inserted in control circuit board, so can be convenient to install and use, improve installation effectiveness.

Another object of the present invention is to provide a kind of matrix type LED and preparation method thereof, and it is to install radiator easily additional, promotes the radiating efficiency of matrix type LED, and then improves useful life.

Another purpose of the present invention is to provide a kind of matrix type LED and preparation method thereof, and it is by at substrate groove being set, and so that LED Chips for Communication to be set, so can improve the radiating efficiency and the collection efficiency of matrix type LED.

Matrix type LED of the present invention and preparation method thereof, matrix type LED includes a substrate, a circuit layer, a reflection lid, plural LED Chips for Communication and just at least one/negative pole pin, when making matrix type LED, at first provide substrate; Then, circuit layer is set in substrate, this circuit layer is provided with at least one positive pole and negative pole; Then, reflection is set is covered on circuit layer, the reflection lid is provided with the plural opening of arranged; Afterwards, each LED Chips for Communication is set in each opening, LED Chips for Communication just/negative pole and circuit layer just/negative pole is electrically connected; At last, just be provided with/the negative pole pin is in substrate and wore substrate, just/negative pole pin and circuit layer just/negative pole is electrically connected; So when matrix type LED of the present invention is installed, only need be just/the negative pole pin is inserted in the control circuit board of desire configuration, can uses, so can improve installation effectiveness and minimizing installation time.

Description of drawings:

Fig. 1 is the stereogram of preferred embodiment of the present invention;

Fig. 2 is the exploded view of preferred embodiment of the present invention;

Fig. 3 A is the top view that circuit layer of the present invention is located at substrate;

Fig. 3 B is the cutaway view of the A-A direction of Fig. 3 A;

Fig. 4 A is the top view that circuit layer of the present invention, reflection are covered on substrate;

Fig. 4 B is the cutaway view of the B-B direction of Fig. 4 A;

Fig. 4 C is the top view that LED Chips for Communication of the present invention is arranged at Fig. 4 A;

Fig. 5 is provided with top view anodal and negative pole for the circuit layer of another embodiment of the present invention;

Fig. 6 A is the top view that the circuit layer of further embodiment of this invention is located at substrate;

Fig. 6 B is the cutaway view of the C-C direction of Fig. 6 A;

Fig. 7 is the flow chart of preferred embodiment of the present invention.

The figure number explanation:

5 radiators, 7 double-screw bolts, 10 substrates

13 perforation, 14 fixing holes, 15 pilot holes

17 grooves, 20 circuit layers, 21 positive poles

22 negative poles, 23 holes, 24 fixing holes

27 perforation of 25 pilot holes, 26 connection electrode

28 look edge posts, 30 anodal pin 35 negative pole pins

41 openings, 42 cylinders are covered in 40 reflections

45 pilot holes, 50 LED Chips for Communication, 60 lens modules

71 anodal 72 negative poles

Execution mode:

Now further understand and understanding for your juror is had architectural feature of the present invention and the effect reached, sincerely help with preferred embodiment and cooperate detailed explanation, illustrate as after:

See also Fig. 1 and Fig. 2, be the stereogram and the exploded view of preferred embodiment of the present invention; As shown in the figure, the present invention includes that a substrate 10, a circuit layer 20, plural anodal pin 30, plural negative pole pin 35, a reflection cover 40, plural LED Chips for Communication 50 and a lens module 60, substrate 10 of the present invention, it can be metal substrate, and be provided with plural hole 13, plural fixing hole 14 and a pilot hole 15, circuit layer 20 is located at substrate 10, and circuit layer 20 is provided with anodal 21 and one negative pole 22 and plural connection electrode 26.

In addition, shown in Fig. 3 A and Fig. 3 B, circuit layer 20 is with respect to the position of hole 13, fixing hole 14 and the pilot hole 15 of substrate 10, also be provided with plural hole 23, plural fixing hole 24 and a pilot hole 25 respectively, reflection lid 40 of the present invention, be to be located on this circuit layer 20, this reflection lid 40 is provided with plural opening 41,41 one-tenth matrix forms of this opening are arranged, shown in Fig. 4 A and Fig. 4 B, the position of this opening 41 is with respect between the positive pole 21 of circuit layer 20 and the connection electrode 26 and with respect between negative pole 22 and the connection electrode 26.

In addition, reflection covers 40 with respect to the hole 13 of substrate 10 with

circuit layer

20,23, be provided with plural cylinder 42, cylinder 42 is arranged in

hole

13,23, make substrate 10, circuit layer 20 covers 40 groups with reflection and is made as one, because of the lower diameter of cylinder 42 greater than upper diameter, so with hole 13, during 23 cooperations, can make substrate 10, circuit layer 20 covers 40 with reflection and closely cooperates, so can avoid the situation of separating, and then influence is used, reflection is covered 40 pilot holes 25 with respect to circuit layer 20 and is provided with a pilot hole 45 in addition, can make the present invention by pilot hole 45,25,15 assemblings, one radiator 5, it is a metallic object, radiator 5 is provided with a double-screw bolt 7, and pilot hole 45,25,15 is a screw, so radiator 5 spiral shells can be located at substrate 10, and then prevents and use when of the present invention, the heat energy that is produced, the present invention also can only have substrate 10 to be provided with pilot hole 15.

In addition, reflection covers 40 when being arranged at circuit layer 20, one insulated column 28 that will wear hollow is in each

fixing hole

14,24, for plugging anodal pin 30 and negative pole pin 35, anodal pin 30 passes substrate 10 with negative pole pin 35, and the positive pole 21 with circuit layer 20 is electrically connected with negative pole 22 respectively, when can making anodal pin 30 plug with negative pole pin 35, this insulated column 28 do not contact with substrate 10, avoid anodal pin 30, negative pole pin 35 contacts with the substrate 10 of tool conduction and is short-circuited, the setting of anodal pin 30 and negative pole pin 35, can be for being inserted in control circuit board, to connect the usefulness of establishing external power source.

See also Fig. 4 C, as shown in the figure, each LED Chips for Communication 50, be arranged at each this opening 41 respectively, being positioned at the positive pole of this LED Chips for Communication 50 on circuit layer 20 right sides and this positive pole 21 of circuit layer 20 is electrically connected, and the connection electrode 26 of negative pole and circuit layer 20 is electrically connected, in addition, the positive pole that is positioned at the LED Chips for Communication 50 in circuit layer 20 left sides is that the connection electrode 26 with circuit layer 20 is electrically connected, and being negative pole 22 with circuit layer 20, negative pole is electrically connected, so be equivalent to the LED Chips for Communication 50 of both sides is connected in series mutually, the mode of above-mentioned electric connection can be utilized the routing mode.

Lens module 60 is located at reflection and cover 40 and be used for capping LED Chips for Communication 50, and lens module 60 is used for concentrating reflection cover 40 reflecting LED Chips for Communication 50 issued light lines, with the raising luminous efficiency.

See also Fig. 5, the top view of anodal and negative pole is set for the circuit layer of another embodiment of the present invention, the embodiment that this embodiment is different from above-mentioned Fig. 3 A is, the set connection electrode 26 of Fig. 3 A is for being used to be connected in series the usefulness of all LED Chips for Communication 50, and this embodiment circuit layer 70 only is provided with two anodal 71 and one negative poles 72, and reflection is covered 40 opening 41 promptly with respect to positive pole 71 and negative pole 72, the positive pole of each LED Chips for Communication 50 and negative pole are electrically connected at the positive pole 71 and negative pole 72 of circuit layer 20 respectively, make LED Chips for Communication 50 all mutually and connect, the electrode of hence one can see that circuit layer 20 can be according to user demand, and changes design.

From the above, the present invention is by circuit layer 20 being set in substrate 10, and plural electrode is set in circuit layer 20, be electrically connected at electrode for LED Chips for Communication 50, and utilize anodal pin 30 to be arranged in circuit layer 20 and to wear substrate 10 with negative pole pin 35, and and the electrode of circuit layer 20 is electrically connected, so when using matrix type LED of the present invention, the circuit board that can directly anodal pin 30 and negative pole pin 35 be inserted in the desire installing can use, and must must not utilize the bonding wire mode as the matrix type LED of commonly using, to be electrically connected with circuit board, so matrix type LED facility that the present invention commonly uses on using, in addition, the present invention is provided with pilot hole 15 in substrate 10, can conveniently set up a radiator 5, uses the radiating efficiency that increases matrix type LED, bad can improve the heat radiation of classical matrix formula light-emittingdiode, the problem that causes the light-emitting diodes body life time to lower.

Again, in order to improve the radiating efficiency of LED Chips for Communication 50 more, shown in Fig. 6 A and Fig. 6 B, substrate 10 and circuit layer 20 covers 40 opening 41 with respect to reflection position is respectively equipped with a groove 17 and bores a hole 27, promptly prolong and stretch to substrate 10 as opening 41, and LED Chips for Communication 50 promptly is arranged at groove 17, directly contact with substrate 10, the heat energy that LED Chips for Communication 50 is produced in using can easierly see through substrate 10 conduction, does not need an as above embodiment, see through circuit layer 20 and transfer to substrate 10 again, dispel the heat, and can promote the reflection efficiency of reflection LED Chips for Communication 50 issued light lines simultaneously, and then increase collection efficiency.

See also Fig. 7, it is for the flow chart of preferred embodiment of the present invention; As shown in the figure, when making is of the present invention, at first carry out step S1, substrate 10 is provided, it is provided with fixing hole 14, more can be provided with pilot hole 15 in addition, for installing radiator 5; Then, carry out step S2, circuit layer 20 is set in substrate 10, circuit layer 20 is provided with fixing hole 24, and is provided with positive pole 21, negative pole 22 and connection electrode 26, with serial connection LED Chips for Communication 50, perhaps as shown in Figure 5, only be provided with anodal 71 with negative pole 72, with and sending and receiving near-infrafed photodiodes wafer 50.

Then, carry out step S3, reflection is set covers 40 in circuit layer 20, cover 40 and come off after being provided with for fear of reflection, set-up mode can be provided with

hole

13,23 at substrate 10 and circuit layer 20, covers 40 and is provided with cylinder 42 and reflect, and be located at

hole

13,23, and insulated column 28 is set in substrate 10 and circuit layer 20, insulated column 28 promptly is set, also can only insulated column 28 be arranged in substrate 10 in

fixing hole

14,24; Continue, carry out step S4, LED Chips for Communication 50 is set covers 40 opening 41 in reflection; Afterwards, carry out step S5, anodal pin 30 and negative pole pin 35 are set in substrate 10, and anodal pin 30 wore insulated column 28 and substrate 10 with negative pole pin 35, anodal pin 30 is electrically connected with the positive pole 21 of circuit layer 20, and the negative pole 22 of negative pole pin 35 and circuit layer 20 is electrically connected.

At last, carry out step S6, lens module 60 is set covers 40, with capping LED Chips for Communication 50 in reflection; In addition, conducted by substrate 10 for the heat energy that LED Chips for Communication 50 is produced in using is easier, more can be before carrying out step S4, plurality of through holes 27 is set in circuit layer 20, each perforation 27 more is provided with plural groove 17 in substrate 10 in addition with respect to each opening 41, each groove 17 is also with respect to each opening 41, make LED Chips for Communication 50 be arranged at groove 17, directly contact, so can improve the radiating efficiency and the collection efficiency of LED Chips for Communication 50 with substrate 10.

In sum, matrix type LED of the present invention and preparation method thereof, be by circuit layer being set at substrate and being provided with electrode, for the serial connection or and sending and receiving near-infrafed photodiodes wafer, in addition, more electrical anodal pin and the negative pole pin of being provided with of the positive pole of circuit layer and negative pole, anodal pin and negative pole pin wore substrate, so when using matrix type LED of the present invention, can directly be inserted in the circuit board of desire installing, conveniently installing and using, and then improve installation effectiveness and reduce installation time, more can pilot hole be set in addition in substrate, conveniently to set up radiator, perhaps groove is set and places LED Chips for Communication,, and then increase useful life with the raising radiating efficiency in substrate.

The above, it only is preferred embodiment of the present invention, be not to be used for limiting scope of the invention process, all according to the described shape of the present patent application claim, structure, feature and principle etc. change and modify, all should be contained in the claim of the present invention.

Claims

1, a kind of matrix type LED, it includes:

One substrate;

One circuit layer is located at this substrate, and this circuit layer is provided with at least one positive pole and at least one negative pole;

One reflection lid is located at this circuit layer, and this reflection is covered with plural opening, and this opening is arranged;

The plural number LED Chips for Communication is arranged at each this opening respectively, and each this LED Chips for Communication all has an anodal and negative pole, and this positive pole of this LED Chips for Communication and this positive pole of this negative pole and this circuit layer and this negative pole are electrically connected;

At least one anodal pin wore this substrate and electrically connected with this positive pole of this circuit layer;

At least one negative pole pin wore this substrate and electrically connected with this negative pole of this circuit layer.

2, as the 1st described matrix type LED of claim, wherein this substrate can be a metal substrate.

3, as the 1st described matrix type LED of claim, wherein this substrate more is provided with a pilot hole, and this pilot hole can assemble a radiator.

4, as the 1st described matrix type LED of claim, wherein this substrate and this circuit layer more are provided with plural hole, this reflection lid then is provided with a cylinder with respect to each this hole, and the lower diameter of this cylinder is greater than upper diameter, and this cylinder is located at this hole.

5, as the 1st described matrix type LED of claim, wherein this circuit layer more is provided with a perforation with respect to the position of each this opening, this substrate then is respectively equipped with a groove with respect to the position of each this opening, and this LED Chips for Communication is arranged at this groove.

6, as the 1st described matrix type LED of claim, wherein this circuit layer more is provided with at least one connection electrode, and it is positioned between this positive pole and this negative pole of this circuit layer, is connected in series mutually for this LED Chips for Communication.

7, as the 1st described matrix type LED of claim, more include a lens module, it is this reflection lid and this LED Chips for Communication of capping.

8, as the 1st described matrix type LED of claim, wherein this substrate more is equipped with plural insulated column, and this positive pole pin and this negative pole pin are arranged in this insulated column respectively.

9, a kind of manufacture method of matrix type LED includes the following step:

One substrate is provided;

One circuit layer is set in this substrate, this circuit layer is provided with at least one positive pole and at least one negative pole;

One reflection is set is placed on this circuit layer, this reflection is covered with plural hole, and this opening is matrix form and arranges;

Plural LED Chips for Communication this opening in this reflection lid is set, and each this LED Chips for Communication all has an anodal and negative pole, and this positive pole of this LED Chips for Communication and this positive pole of this negative pole and this circuit layer and this negative pole are electrically connected;

At least one anodal pin and at least one negative pole pin are set in this substrate, this positive pole pin and this negative pole pin are electrically connected with this positive pole and this negative pole of this circuit layer respectively.

10, as the manufacture method of the 9th described matrix type LED of claim, wherein in the step that a substrate is provided, more include a step, it is provided with a pilot hole in this substrate, and this pilot hole can assemble a radiator.

11, as the manufacture method of the 9th described matrix type LED of claim, wherein in a circuit layer being set in the step of this substrate, this circuit layer more is provided with at least one connection electrode between this positive pole and this negative pole, is connected in series mutually for this LED Chips for Communication.

12, as the manufacture method of the 9th described matrix type LED of claim, wherein, a reflection is placed in the step of this circuit layer in being set, more include a step, it wears plural insulated column in this substrate, wears for this positive pole pin and this negative pole pin.

13, as the manufacture method of the 9th described matrix type LED of claim, wherein be placed in the step of this circuit layer, more include the following step in a reflection is set:

Plural hole is set in this circuit layer and this substrate;

Plural cylinder is set in this reflection lid, the lower diameter of this cylinder is greater than upper diameter, and this cylinder is located at this hole.

14, as the manufacture method of the 9th described matrix type LED of claim, wherein, more include the following step in plural LED Chips for Communication being set before the step of this opening of this reflection lid:

Plurality of through holes is set in this circuit layer, each should be bored a hole with respect to each this opening;

Plural groove is set in this substrate, each this groove is with respect to each this opening, and this LED Chips for Communication is arranged at this groove.

15, as the manufacture method of the 9th described matrix type LED of claim, wherein at least one anodal pin and at least one negative pole pin being set after the step of this substrate, more include a step, it is provided with a lens module in this reflection lid, this LED Chips for Communication of capping.