CN1731916A - Print circuit board with improved heat rejection structure and electronic device - Google Patents
Print circuit board with improved heat rejection structure and electronic device Download PDFInfo
- Publication number
- CN1731916A CN1731916A CN 200510096506 CN200510096506A CN1731916A CN 1731916 A CN1731916 A CN 1731916A CN 200510096506 CN200510096506 CN 200510096506 CN 200510096506 A CN200510096506 A CN 200510096506A CN 1731916 A CN1731916 A CN 1731916A
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- CN
- China
- Prior art keywords
- fin
- circuit board
- base plate
- radiator structure
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
This invention discloses a printed circuit board to improve dissipating heat structure, suitable for a packing base plate of multiply packing blocks, which comprises a base plate and a dissipating heat, wherein, dissipating sheets are located on the base plate with a first part located under the pack base plate of multi-pack block, and a second part next to the first part and bearing no less than a fin. The invention also discloses a electron device to better dissipating structure.
Description
Technical field
The present invention relates to a kind of electronic installation, particularly have the radiator structure of improvement and multiple package module (multi-package module, electronic installation MPM) relevant for a kind of.
Background technology
Portable electronic product, for example mobile phone (cell phone), brain machine (mobile computing) and other consumer products need present high-effect (performance) and function (functionality) under the limiting factor cheaply, thereby order about the integrated level that the manufacturer must increase semiconductor chip thin thickness, in light weight reaching.That is the manufacturer begins to turn to three-dimensional (3D) encapsulation, by packaging technology such as lead-in wire bonding (wirebonding) method or flip-chip (flip chip) method with multiple chip stack in an encapsulation.
Therefore, multiple package module (multi-package module, MPM) more and more attracted attention recently, it can integrate the chip of difference in functionality on a base plate for packaging, for example microprocessor or internal memory, logic and optical integrated circuit etc., the printed circuit board (PCB) (printed circuit board, PCB) mode on that other chip are positioned over large-size have been replaced.Yet compared to individual other single-chip package, multiple package module has higher power density, and makes heat management (thermal management) become even more important and become the key factor of its successful development.
Fig. 1 shows traditional 100 generalized sections of the electronic installation with multiple package module.This electronic installation 100 comprises a multiple package module 20, and it is assembled on the printed circuit board (PCB) (PCB) 101, and it comprises a base plate for packaging 12.The upper surface of base plate for packaging 12 and lower surface respectively are assembled with the chip 16 and 14 and constitute multiple package module 20 of difference in functionality.For example, chip 16 is assembled in the upper surface of base plate for packaging 12 by the salient point (or tin ball) 10 ' of a base plate for packaging 12 '.14 lower surfaces that are assembled in base plate for packaging 12 by the flip-chip method of chip.Base plate for packaging 12 lower surfaces have a plurality of salient points 10, and its correspondence is connected to the welded gasket (bonding pad) (not illustrating) on the printed circuit board (PCB) 101, make chip 16 and 14 and printed circuit board (PCB) 101 be electrically connected.In multiple package module 20, the heat that chip 16 is produced can be discharged it by radiation (radiation) and convection current (convection) dual mode.Yet because the narrow and small relation in gap between chip 14 and the printed circuit board (PCB) 101, the heat that makes chip 14 be produced is difficult to by radiation (radiation) and convection current (convection) dual mode it be discharged.Therefore, chip 14 can only dispel the heat by conduction (conduction) mode.Generally speaking, the position of corresponding chip 14 can form a metal level 102 on the printed circuit board (PCB) 101, and is connected with chip 14 by thermal grease (heat conductive paste) 22.Therefore, chip 14 can dispel the heat by the heat conduction path that thermal grease 22, metal level 102 and printed circuit board (PCB) 101 are constituted.
Yet for the high-power die that meeting produces high heat, above-mentioned passive heat radiation (passivecooling) is that preferred radiating effect and higher rate of heat dispation can't be provided.That is, the heat that chip produced is conducted to printed circuit board (PCB) via thermal grease and metal level also can't effectively and in time dispel the heat.
Summary of the invention
In view of this, the technical problem to be solved in the present invention provides a kind of electronic installation that improves radiator structure that has, and wherein puts the salient point of base plate for packaging and forms a heat conduction path by arranging again.Moreover base plate for packaging bottom side chip provides active (active) and passive heat radiation by heat conduction path and heat is effectively discharged.
According to above-mentioned purpose, one embodiment of the invention provide a kind of printed circuit board (PCB) that improves radiator structure that has, and are applicable to the base plate for packaging of a multiple package module, and it comprises a substrate and a fin.Fin is arranged on the substrate, and it has one first one and one second one, and wherein first correspondence is arranged at the base plate for packaging below of multiple package module, and second one adjacent to first one and have at least one fin.
According to above-mentioned purpose, one embodiment of the invention provide a kind of electronic installation that improves radiator structure that has again, and it comprises: a base plate for packaging, a circuit board and a fin.Base plate for packaging comprises: a substrate has a chip region and at least one passage of heat district extend out to substrate from chip region a edge.A plurality of salient points, row places the chip region of substrate and the zone outside the passage of heat district according to array.Circuit board has a plurality of welded gasket correspondences and is connected to salient point.Fin is arranged between circuit board and the base plate for packaging, and it comprises: one first one, and corresponding to chip region.One second one, adjacent to first one and extend to along passage of heat district on the circuit board in the base plate for packaging outside, second one that wherein is positioned at the base plate for packaging outside has at least one fin.
According to above-mentioned purpose, another embodiment of the present invention provides a kind of electronic installation that improves radiator structure that has again, and it comprises: a base plate for packaging and a circuit board.Base plate for packaging comprises: a substrate has a chip region and at least one passage of heat district extend out to substrate from chip region a edge.A plurality of salient points, row places the chip region of substrate and the zone outside the passage of heat district according to array.Circuit board comprises: a plurality of welded gaskets, correspondence is connected to salient point.One metal level is positioned at the base plate for packaging below, and it comprises: one first one, corresponding to chip region; One second one, adjacent to first one and extend to along passage of heat district on the circuit board in the base plate for packaging outside, second one that wherein is positioned at the base plate for packaging outside has at least one fin.One the 3rd one, and be positioned at second one of the base plate for packaging outside terminal adjacent.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 shows traditional electronic installation generalized section with multiple package module;
Fig. 2 A shows the end view plane schematic diagram that improves the electronic installation of radiator structure according to having of the embodiment of the invention;
Fig. 2 B shows along the generalized section of 2B-2B line among Fig. 2 A;
Fig. 2 C shows the fin floor map with fin of alternately arranging according to the embodiment of the invention;
Fig. 2 D illustrates the fin floor map with triangle fin according to the embodiment of the invention;
Fig. 2 E shows the fin floor map with rectangle fin according to the embodiment of the invention;
Fig. 3 A shows the end view plane schematic diagram that improves the multiple package module of radiator structure according to having of the embodiment of the invention;
Fig. 3 B shows along the generalized section of 3B-3B line among Fig. 3 A;
Fig. 3 C shows the end view plane schematic diagram that improves the multiple package module of radiator structure according to having of the embodiment of the invention;
Fig. 4 A shows the end view plane schematic diagram that improves the electronic installation of radiator structure according to having of the embodiment of the invention;
Fig. 4 B shows along the generalized section of 4B-4B line among Fig. 4 A;
Fig. 4 C shows the metal layer plane schematic diagram with fin of alternately arranging according to the embodiment of the invention;
Fig. 4 D illustrates the metal layer plane schematic diagram with triangle fin according to the embodiment of the invention;
Fig. 4 E shows the metal layer plane schematic diagram with rectangle fin according to the embodiment of the invention.
Description of reference numerals
Prior art
10,10 '～salient point; 12,12 '～base plate for packaging; 14,16～chip; 20～multilayer package module; 22～thermal grease; 100～electronic installation; 101～printed circuit board (PCB); 102～metal level.
The present invention
30～salient point; The 32a chip region; 32b passage of heat district; 32～base plate for packaging; 34,36～chip; 40～multilayer package module; 42～thermal grease; 200～circuit board; 201～substrate; 202～welded gasket; 203～fin; First one of 204～fin; 205～thermal component; Second one of 206～fin; 206a, 212a～fin; 207～fan; 208～radiating module; 209～metal level; First one of 210～metal level; Second one of 212～metal level; The 3rd one of 214～metal level.
Embodiment
The electronic installation that improves radiator structure that has that below cooperates Fig. 2 A and the 2B explanation embodiment of the invention, wherein Fig. 2 A shows the end view plane schematic diagram that improves the electronic installation of radiator structure according to having of the embodiment of the invention, and Fig. 2 B shows along the generalized section of 2B-2B line among Fig. 2 A.Electronic installation comprises: one has multiple package module 40, a circuit board 200 and a fin (heat sink) 203 that improves radiator structure.
Please refer to Fig. 3 A and 3B, wherein Fig. 3 A shows the end view plane schematic diagram that improves the multiple package module 40 of radiator structure according to having of the embodiment of the invention, and Fig. 3 B shows along the generalized section of 3B-3B line among Fig. 3 A.Multiple package module 40 comprises a base plate for packaging 32.The lower surface of base plate for packaging 32 has a chip region 32a and its upper surface of at least one passage of heat district 32b then has a chip region (not illustrating) equally.Herein, " lower surface " refers to towards the circuit board surface of (as, printed circuit board (PCB)), and " upper surface " refers to the surface back on lower surface.In the present embodiment, base plate for packaging 32 can be plastic base, ceramic substrate, inorganic substrate or organic substrate.Typical chip region 32a is positioned at base plate for packaging 32 central parts substantially.And being different from traditional base plate for packaging, base plate for packaging 32 has passage of heat district 32b extends out to base plate for packaging 32 from chip region 32a a edge.In other embodiments, passage of heat district 32b can stride across chip region 32a and extend to another edge of base plate for packaging 32, shown in Fig. 3 C.Those skilled in the art can understand base plate for packaging 32 easily can have one or more passage of heat district and extend to base plate for packaging 32 edges from chip region 32a along different directions and be not limited to the kenel of Fig. 3 A and 3C.
A plurality of salient points (bump) 30, for example metal salient point, tin ball or signal ball etc., row places the chip region 32a of base plate for packaging 32 and the zone outside the passage of heat district 32b according to array, in order to transferring to external circuit from the signal of chip 34 and 36, the spacing between its bumps 30 is less than the width of passage of heat district 32b.
Improve the electronic installation of radiator structure according to having of present embodiment, passage of heat district 32b can put salient point 30 and form it by row again.Moreover, because fin 203 can extend to base plate for packaging 32 outsides along passage of heat district 32b, thereby be positioned at the heat that the chip 34 of base plate for packaging 32 bottom sides produced and can carry out passive heat radiation in modes such as radiation and convection current by fin 206a.Simultaneously, can in modes such as radiation, convection current and conduction heat be expelled in the external environment effectively and in time by thermal component 205, shown in arrow among Fig. 3 B.In addition, if chip 34 is a high-power die, also can carries out active heat radiation heat is discharged rapidly by fan 207.Conduct heat to circuit board compared to existing, the electronic installation with multiple package module 40 of present embodiment has preferred radiating effect and higher radiating efficiency.
The electronic installation that improves radiator structure that has that below cooperates Fig. 4 A and 4B explanation another embodiment of the present invention, wherein Fig. 4 A shows the end view plane schematic diagram that improves the electronic installation of radiator structure according to having of the embodiment of the invention, and Fig. 4 B shows along the generalized section of 4B-4B line among Fig. 4 A, and the parts that wherein are same as Fig. 2 A and 2B use identical label and omit relevant explanation.The embodiment that is different from Fig. 2 A and 2B, present embodiment form heat conduction path by the metal level 209 in the definition circuit plate 200.Herein, circuit board 200, for example a printed circuit board (PCB) comprises a substrate 201 and a metal level 209.Metal level 209 is arranged at substrate 201 tops and comprises one first one 210,1 second one 212 and 1 the 3rd one 214.First one 210 correspondence of metal level 209 is arranged at chip region 32b below and is connected with chip 34 by thermal grease 42.Second one 212 of metal level 209 is adjacent to first one 210 and extend to along passage of heat district 32b on the circuit board 200 in base plate for packaging 32 outsides, and second one 212 that wherein is positioned on the circuit board 200 in base plate for packaging 32 outsides has at least one fin 212a.The 3rd one 214 of metal level 209 with the circuit board 200 that is positioned at base plate for packaging 32 outsides on second one 212 terminal adjacent.For example, second one 212 that is positioned on the circuit board 200 in base plate for packaging 32 outsides has a plurality of circles (round) fin 212a, and its symmetric arrays is in second one 212 two opposite sides.Moreover fin 212a extends substantially abreast towards substrate 201 surfaces.And in other embodiments, these fins 212a alternately is arranged in second one 212 two opposite sides, shown in the metal level 209 of Fig. 4 C.In addition, in other embodiments, fin 212a can be triangle (shown in the metal level 209 of Fig. 4 D), rectangle (shown in the metal level 209 of Fig. 4 E) or other polygon.Those skilled in the art can be easily the fin 212a of solving a triangle or rectangle alternately be arranged in second one 212 two opposite sides and be not limited to the kenel of Fig. 4 D and 4E.Herein, first one 210 and second ones 212 of metal level 209 as a fin, to base plate for packaging 32 outsides, and carries out passive heat radiation by second one 212 fin 212a as thermal component with heat conduction that chip 34 is produced.Moreover the 3rd one 214 of metal level 209 as thermal component, and the fan 207 that is arranged at its top with utilization carries out active heat radiation, heat is expelled in the external environment, shown in arrow among Fig. 4 B.
Similarly, improve the electronic installation of radiator structure according to having of present embodiment, metal level 209 can extend to base plate for packaging 32 outsides along passage of heat district 32b, thereby the heat that chip 34 produced that is arranged in base plate for packaging 32 bottom sides can be expelled to external environment in modes such as radiation, convection current and conduction effectively and in time.Conduct heat to circuit board compared to existing, the electronic installation with multiple package module 40 of present embodiment has preferred radiating effect and higher radiating efficiency.Moreover, because metal level 209 provided by circuit board 200 institute itself, reduce manufacturing cost so need not additionally to provide fin and thermal component.
Though the present invention discloses as above with preferred embodiment; right its is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing to change and retouching, so protection scope of the present invention is as the criterion when looking appended the claim person of defining.
Claims (13)
1. one kind has the electronic installation that improves radiator structure, comprising:
One base plate for packaging, it comprises:
One substrate has a chip region and at least one passage of heat district extend out to this substrate from this chip region a edge; And
A plurality of salient points, row places this chip region of this substrate and the zone outside this passage of heat district according to array;
One circuit board has a plurality of welded gasket correspondences and is connected to these salient points; And
One fin is arranged between this circuit board and this base plate for packaging, and it comprises:
One first one, corresponding to this chip region; And
One second one, adjacent to this first one and extend to along this passage of heat district on this circuit board in this base plate for packaging outside, this second one that wherein is positioned at this base plate for packaging outside has at least one fin.
2. as claimed in claim 1 have an electronic installation that improves radiator structure, and wherein this fin extends substantially abreast towards this circuit board surface.
3. as claimed in claim 1 have an electronic installation that improves radiator structure, more comprises a radiating module, is arranged at this terminal top of second one in this base plate for packaging outside.
4. as claimed in claim 3 have an electronic installation that improves radiator structure, and wherein this radiating module comprises that this second one of a hot plate or a heat pipe and this fin contacts.
5. as claimed in claim 1 have an electronic installation that improves radiator structure, and wherein this fin is made of gold, silver or copper metal.
6. as claimed in claim 1 have an electronic installation that improves radiator structure, and wherein this fin is circle, triangle, rectangle or polygon.
7. as claimed in claim 1 have an electronic installation that improves radiator structure, and wherein second one of this of this fin has a plurality of fins symmetries or alternately be arranged in this two opposite sides of second one.
8. as claimed in claim 1 have an electronic installation that improves radiator structure, and wherein first one of this of this fin is local or overlapping fully with this chip region.
9. one kind has the printed circuit board (PCB) that improves radiator structure, is applicable to that the base plate for packaging of a multiple package module comprises:
One substrate; And
One fin is arranged on this substrate, and it has one first one and one second one, and wherein this first correspondence is arranged at this base plate for packaging below, and this second one adjacent to this first one and have at least one fin.
10. as claimed in claim 9 have a printed circuit board (PCB) that improves radiator structure, and wherein this fin extends substantially abreast towards this substrate surface.
11. as claimed in claim 9 have a printed circuit board (PCB) that improves radiator structure, wherein this fin is circle, triangle, rectangle or polygon.
12. as claimed in claim 9 have a printed circuit board (PCB) that improves radiator structure, wherein second one of this of this fin has a plurality of fins symmetries or alternately is arranged in this two opposite sides of second one.
13. as claimed in claim 9 have a printed circuit board (PCB) that improves radiator structure, wherein this fin is a metal level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100965068A CN100361296C (en) | 2005-08-22 | 2005-08-22 | Print circuit board with improved heat rejection structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100965068A CN100361296C (en) | 2005-08-22 | 2005-08-22 | Print circuit board with improved heat rejection structure and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1731916A true CN1731916A (en) | 2006-02-08 |
| CN100361296C CN100361296C (en) | 2008-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100965068A Active CN100361296C (en) | 2005-08-22 | 2005-08-22 | Print circuit board with improved heat rejection structure and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100361296C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7608923B2 (en) | 2007-08-15 | 2009-10-27 | Via Technologies, Inc. | Electronic device with flexible heat spreader |
| CN101114623B (en) * | 2007-08-30 | 2010-06-16 | 威盛电子股份有限公司 | Packaging module and electronic device |
| CN102064157A (en) * | 2009-11-18 | 2011-05-18 | 智邦科技股份有限公司 | System encapsulation module of wireless local area network |
| CN108513515A (en) * | 2018-06-11 | 2018-09-07 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
| CN112397472A (en) * | 2019-08-13 | 2021-02-23 | 富士电机株式会社 | Semiconductor device with a plurality of semiconductor chips |
| CN113764451A (en) * | 2021-09-06 | 2021-12-07 | 上海集成电路研发中心有限公司 | Packaging structure, camera and manufacturing method of packaging structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE59003026D1 (en) * | 1990-07-09 | 1993-11-11 | Siemens Ag | Electrically insulating circuit carrier with integrated coolants. |
| JP3101179B2 (en) * | 1995-06-19 | 2000-10-23 | 沖電気工業株式会社 | Heat dissipation structure of switching element |
| JP2004095760A (en) * | 2002-08-30 | 2004-03-25 | Optrex Corp | Printed wiring board |
| CN1218377C (en) * | 2003-01-30 | 2005-09-07 | 威盛电子股份有限公司 | Integrated circuit packaging device with heat dissipation wiring design |
-
2005
- 2005-08-22 CN CNB2005100965068A patent/CN100361296C/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7608923B2 (en) | 2007-08-15 | 2009-10-27 | Via Technologies, Inc. | Electronic device with flexible heat spreader |
| CN101114623B (en) * | 2007-08-30 | 2010-06-16 | 威盛电子股份有限公司 | Packaging module and electronic device |
| CN102064157A (en) * | 2009-11-18 | 2011-05-18 | 智邦科技股份有限公司 | System encapsulation module of wireless local area network |
| CN108513515A (en) * | 2018-06-11 | 2018-09-07 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
| CN112397472A (en) * | 2019-08-13 | 2021-02-23 | 富士电机株式会社 | Semiconductor device with a plurality of semiconductor chips |
| CN113764451A (en) * | 2021-09-06 | 2021-12-07 | 上海集成电路研发中心有限公司 | Packaging structure, camera and manufacturing method of packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100361296C (en) | 2008-01-09 |
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